BAS16DY [NEXPERIA]

High-speed dual switching diodeProduction;


型号：	BAS16DY
厂家：	Nexperia
描述：	High-speed dual switching diodeProduction
文件：	总9页 (文件大小：207K)
中文：	中文翻译
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BAS16DY

High-speed dual switching diode

20 April 2023

Product data sheet

1. General description

High-speed switching, electrically isolated dual diode, encapsulated in an ultra small SOT363

Surface-Mounted Device (SMD) plastic package.

2. Features and benefits

•

High switching speed: t_rr≤ 4 ns

•

Low capacitance

Low leakage current

Reverse voltage: V_R≤ 100 V

Repetitive peak reverse voltage: V_RRM≤ 100 V

3. Applications

•

High-speed switching

General-purpose switching

4. Quick reference data

Table 1. Quick reference data

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per diode

V_R

I_R

reverse voltage

reverse current

100

0.5

V_R= 80 V; T_amb= 25 °C

µA

t_rr

reverse recovery time I_F= 10 mA; I_R= 10 mA; R_L= 100 Ω;

I_R(meas)= 1 mA; T_amb= 25 °C

5. Pinning information

Table 2. Pinning information

Symbol

Description

Simplified outline

Graphic symbol

anode (diode 1)

not connected

cathode (diode 2)

anode (diode 2)

not connected

cathode (diode 1)

n.c.

TSSOP6 (SOT363)

aaa-033905

Nexperia

BAS16DY

High-speed dual switching diode

6. Ordering information

Table 3. Ordering information

Type number

Package

Name

Description

Version

BAS16DY

TSSOP6

plastic, surface-mounted package; 6 leads; 0.65 mm pitch; SOT363

2.1 mm x 1.25 mm x 0.95 mm body

7. Marking

Table 4. Marking codes

Type number

Marking code[1]

M3%

BAS16DY

[1] % = placeholder for manufacturing site code

8. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Per diode

V_RRM

Parameter

Conditions

Min

Max

Unit

repetitive peak reverse

voltage

100

V_R

I_F

reverse voltage

forward current

100

110

[1] [2]

I_FSM

non-repetitive peak

forward current

t_p= 50 µs; square wave; T_j(init)= 25 °C

t_p= 10 ms; square wave; T_j(init)= 25 °C

t_p≤ 0.5 ms; δ ≤ 0.25

I_FRM

P_tot

repetitive peak forward

current

700

total power dissipation

T_amb≤ 25 °C

[1] [2]

[2] [3]

260

290

Per device

T_j

junction temperature

ambient temperature

storage temperature

150

°C

T_amb

T_stg

-55

-65

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

[2] Single diode loaded.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm².

BAS16DY

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Product data sheet

20 April 2023

2 / 9

Nexperia

BAS16DY

High-speed dual switching diode

9. Thermal characteristics

Table 6. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

480

430

185

Unit

K/W

R_th(j-a)

thermal resistance from in free air

junction to ambient

[1]

[2]

[3]

R_th(j-sp)

thermal resistance from

junction to solder point

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm².

[3] Soldering points at pins 3 and 6.

10. Characteristics

Table 7. Characteristics

Symbol

Per diode

V_F

Parameter

Conditions

Min

Typ

Max

Unit

forward voltage

I_F= 1 mA; t_p≤ 300 µs; δ ≤ 0.02;

pulsed; T_amb= 25 °C

715

855

I_F= 10 mA; t_p≤ 300 µs; δ ≤ 0.02;

pulsed; T_amb= 25 °C

I_F= 50 mA; t_p≤ 300 µs; δ ≤ 0.02;

pulsed; T_amb= 25 °C

I_F= 150 mA; t_p≤ 300 µs; δ ≤ 0.02;

pulsed; T_amb= 25 °C

1.25

I_R

reverse current

V_R= 25 V; T_amb= 25 °C

V_R= 80 V; T_amb= 25 °C

V_R= 25 V; T_j= 150 °C

0.5

1.5

µA

V_R= 80 V; T_j= 150 °C

C_d

t_rr

diode capacitance

V_R= 0 V; f = 1 MHz; T_amb= 25 °C

reverse recovery time I_F= 10 mA; I_R= 10 mA; R_L= 100 Ω;

I_R(meas)= 1 mA; T_amb= 25 °C

V_FRM

peak forward recovery I_F= 10 mA; t_r= 20 ns; T_amb= 25 °C

voltage

1.75

BAS16DY

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Product data sheet

20 April 2023

3 / 9

Nexperia

BAS16DY

High-speed dual switching diode

006aab132

aaa-036406

(mA)

FSM

(A)

(1) (2) (3) (4)

-1

0.2

0.4

0.6

0.8

1.0

1.2

1.4

(V)

(µs)

(1) T_amb= 150 °C

(2) T_amb= 85 °C

(3) T_amb= 25 °C

(4) T_amb= -40 °C

Based on square wave currents.

T_j(init)= 25 °C

Fig. 2. Non-repetitive peak forward current as a

function of pulse duration; typical values

Fig. 1. Forward current as a function of forward

voltage; typical values

mbg446

006aab133

0.8

(1)

(2)

(pF

(µA)

)

0.6

0.4

-1

(3)

(4)

-2

-3

-4

-5

0.2

100

(V)

(1) T_amb= 150 °C

(2) T_amb= 85 °C

(3) T_amb= 25 °C

(4) T_amb= -40 °C

f = 1 MHz; T_amb= 25 °C

Fig. 4. Diode capacitance as a function of reverse

voltage; typical values

Fig. 3. Reverse current as a function of reverse

voltage; typical values

BAS16DY

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Product data sheet

20 April 2023

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Nexperia

BAS16DY

High-speed dual switching diode

11. Test information

D.U.T.

10 %

+ I

= 50 Ω

SAMPLING

OSCILLOSCOPE

= 50 Ω

V = V + I × R

(1)

90 %

mga881

input signal

output signal

(1) I_R= 1 mA

Input signal: reverse pulse rise time t_r= 0.6 ns; reverse voltage pulse duration t_p= 100 ns; duty cycle δ = 0.05

Oscilloscope: rise time t_r= 0.35 ns

Fig. 5. Reverse recovery time test circuit and waveforms

1 kΩ

450 Ω

90 %

= 50 Ω

OSCILLOSCOPE

= 50 Ω

D.U.T.

10 %

input signal

output signal

mga882

Input signal: forward pulse rise time t_r= 20 ns; forward current pulse duration t_p≥ 100 ns; duty cycle δ ≤ 0.005

Fig. 6. Forward recovery voltage test circuit and waveforms

12. Package outline

2.2

1.8

1.1

0.8

0.45

0.15

2.2 1.35

2.0 1.15

pin 1

index

0.25

0.10

0.3

0.2

0.65

1.3

Dimensions in mm

14-10-03

Fig. 7. Package outline TSSOP6 (SOT363)

BAS16DY

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Product data sheet

20 April 2023

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Nexperia

BAS16DY

High-speed dual switching diode

13. Soldering

2.65

solder lands

solder resist

0.4 (2×)

1.5

2.35

0.6

(4×)

0.5

(4×)

solder paste

0.5

(4×)

0.6

(2×)

occupied area

0.6

(4×)

Dimensions in mm

1.8

sot363_fr

Fig. 8. Reflow soldering footprint for TSSOP6 (SOT363)

1.5

solder lands

solder resist

2.5

0.3

4.5

occupied area

1.5

Dimensions in mm

preferred transport

direction during soldering

1.3

2.45

5.3

sot363_fw

Fig. 9. Wave soldering footprint for TSSOP6 (SOT363)

BAS16DY

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Product data sheet

20 April 2023

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Nexperia

BAS16DY

High-speed dual switching diode

14. Revision history

Table 8. Revision history

Data sheet ID

Release date

Data sheet status

Change

notice

Supersedes

BAS16DY v.1

20230420

Product data sheet

BAS16DY

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Product data sheet

20 April 2023

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Nexperia

BAS16DY

High-speed dual switching diode

injury, death or severe property or environmental damage. Nexperia and its

suppliers accept no liability for inclusion and/or use of Nexperia products in

such equipment or applications and therefore such inclusion and/or use is at

the customer’s own risk.

15. Legal information

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Data sheet status

Document status Product

Definition

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. Nexperia makes no representation

or warranty that such applications will be suitable for the specified use

without further testing or modification.

[1][2]

status [3]

Objective [short]

data sheet

Development

This document contains data from

the objective specification for

product development.

Customers are responsible for the design and operation of their applications

and products using Nexperia products, and Nexperia accepts no liability for

any assistance with applications or customer product design. It is customer’s

sole responsibility to determine whether the Nexperia product is suitable

and fit for the customer’s applications and products planned, as well as

for the planned application and use of customer’s third party customer(s).

Customers should provide appropriate design and operating safeguards to

minimize the risks associated with their applications and products.

Preliminary [short]

data sheet

Qualification

Production

This document contains data from

the preliminary specification.

Product [short]

data sheet

This document contains the product

specification.

[1] Please consult the most recently issued document before initiating or

completing a design.

Nexperia does not accept any liability related to any default, damage, costs

or problem which is based on any weakness or default in the customer’s

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customer’s applications and products using Nexperia products in order to

avoid a default of the applications and the products or of the application or

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liability in this respect.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of

multiple devices. The latest product status information is available on

the internet at https://www.nexperia.com.

Definitions

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

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Non-automotive qualified products — Unless this data sheet expressly

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customer (a) shall use the product without Nexperia’s warranty of the

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BAS16DY

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Product data sheet

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Nexperia

BAS16DY

High-speed dual switching diode

Contents

1. General description......................................................1

2. Features and benefits.................................................. 1

3. Applications.................................................................. 1

4. Quick reference data....................................................1

5. Pinning information......................................................1

6. Ordering information....................................................2

7. Marking..........................................................................2

8. Limiting values............................................................. 2

9. Thermal characteristics............................................... 3

10. Characteristics............................................................3

11. Test information..........................................................5

12. Package outline.......................................................... 5

13. Soldering..................................................................... 6

14. Revision history..........................................................7

15. Legal information........................................................8

For more information, please visit: http://www.nexperia.com

For sales office addresses, please send an email to: salesaddresses@nexperia.com

Date of release: 20 April 2023

BAS16DY

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Product data sheet

20 April 2023

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BAS16DY [NEXPERIA]

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