BAS16QA-Q [NEXPERIA]

High-speed switching diodeProduction;


型号：	BAS16QA-Q
厂家：	Nexperia
描述：	High-speed switching diodeProduction
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中文：	中文翻译
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BAS16QA-Q

High-speed switching diode

14 April 2023

Product data sheet

1. General description

Single high-speed switching diode encapsulated in a leadless ultra small DFN1010D-3 (SOT1215)

Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.

2. Features and benefits

•

High switching speed: t_rr≤ 4 ns

•

Low leakage current: I_R≤ 0.5 µA

Reverse voltage V_R≤ 100 V

Low capacitance C_d≤ 1.5 pF

Ultra small SMD plastic package

Low package height of 0.37 mm

Suitable for Automatic Optical Inspection (AOI) of solder joint

Qualified according to AEC-Q101 and recommended for use in automotive applications

3. Applications

•

High-speed switching

General-purpose switching

4. Quick reference data

Table 1. Quick reference data

Symbol

Parameter

Conditions

Min

Typ

Max

290

100

1.25

0.5

Unit

I_F

forward current

reverse voltage

forward voltage

reverse current

T_amb= 25 °C

[1]

V_R

V_F

I_R

T_j= 25 °C

I_F= 150 mA; T_j= 25 °C

V_R= 80 V; T_j= 25 °C

µA

t_rr

reverse recovery time I_F= 10 mA; I_R= 10 mA; I_R(meas)= 1 mA;

R_L= 100 Ω; T_j= 25 °C

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

Nexperia

BAS16QA-Q

High-speed switching diode

5. Pinning information

Table 2. Pinning information

Symbol

Description

anode

Simplified outline

Graphic symbol

n.c.

not connected

cathode

n.c.

Transparent top view

aaa-021941

DFN1010D-3 (SOT1215)

6. Ordering information

Table 3. Ordering information

Type number

Package

Name

Description

Version

BAS16QA-Q

DFN1010D-3 plastic, leadless thermal enhanced ultra thin small outline SOT1215

package with side-wettable flanks (SWF); 3 terminals; 0.75

mm pitch; 1.1 mm x 1 mm x 0.37 mm body

7. Marking

Table 4. Marking codes

Type number

Marking code

BAS16QA-Q

101

READING

DIRECTION

MARKING CODE

(EXAMPLE)

YEAR DATE

CODE

PIN 1

INDICATION MARK

VENDOR CODE

READING EXAMPLE:

A 110

MARK-FREE AREA

aaa-020723

Fig. 1. DFN1010D-3 (SOT1215) binary marking code description

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Product data sheet

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BAS16QA-Q

High-speed switching diode

8. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_R

Parameter

Conditions

Min

Max

100

290

700

Unit

reverse voltage

forward current

T_j= 25 °C

I_F

T_amb= 25 °C

t_p≤ 0.5 ms; δ ≤ 0.25

[1]

I_FRM

repetitive peak forward

current

I_FSM

non-repetitive peak

forward current

t_p= 100 µs; square wave; T_j(init)= 25 °C

t_p= 1 ms; square wave; T_j(init)= 25 °C

t_p= 1 s; square wave; T_j(init)= 25 °C

T_amb≤ 25 °C

1.5

0.5

305

470

150

P_tot

total power dissipation

[1]

[2]

°C

T_j

junction temperature

ambient temperature

storage temperature

T_amb

T_stg

-55

-65

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm².

aaa-021942

0.3

(A)

0.2

0.1

0.0

100

125

150

(°C)

175

amb

Fig. 2. Forward current as a function of ambient temperature; derating curve

BAS16QA-Q

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Product data sheet

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BAS16QA-Q

High-speed switching diode

9. Thermal characteristics

Table 6. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

410

265

Unit

K/W

R_th(j-a)

thermal resistance from in free air

junction to ambient

[1]

[2]

[3]

R_th(j-sp)

thermal resistance from

junction to solder point

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm².

[3] Soldering point of cathode tab.

aaa-021943

duty cycle =

th(j-a)

(K/W)

0.75

0.5

0.33

0.2

0.25

0.1

0.05

0.02

0.01

-5

-4

-3

-2

-1

(s)

FR4 PCB, standard footprint

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

aaa-021944

th(j-a)

(K/W)

duty cycle =

0.75

0.5

0.33

0.2

0.25

0.1

0.05

0.02

0.01

-5

-4

-3

-2

-1

(s)

FR4 PCB, mounting pad for cathode 1 cm²

Fig. 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

BAS16QA-Q

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Product data sheet

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BAS16QA-Q

High-speed switching diode

10. Characteristics

Table 7. Characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

715

855

Unit

V_F

forward voltage

I_F= 1 mA; T_j= 25 °C

I_F= 10 mA; T_j= 25 °C

I_F= 50 mA; T_j= 25 °C

I_F= 150 mA; T_j= 25 °C

V_R= 25 V; T_j= 25 °C

V_R= 80 V; T_j= 25 °C

V_R= 25 V; T_j= 150 °C

V_R= 80 V; T_j= 150 °C

V_R= 0 V; f = 1 MHz; T_j= 25 °C

1.25

I_R

reverse current

µA

0.5

C_d

t_rr

diode capacitance

1.5

reverse recovery time I_F= 10 mA; I_R= 10 mA; I_R(meas)= 1 mA;

R_L= 100 Ω; T_j= 25 °C

V_FRM

peak forward recovery I_F= 10 mA; T_j= 25 °C; t_r= 20 ns

voltage

1.75

aaa-021945

aaa-021946

-4

(A)

-5

-6

-7

-8

-9

(1)

(2)

(A)

-1

(1)

(2)

-2

-3

-4

(3)

(4)

(3)

(4)

-10

-11

0.0

0.5

1.0

1.5

2.0

100

(V)

V (V)

(1) T_j= 150 °C

(2) T_j= 85 °C

(3) T_j= 25 °C

(4) T_j= −40 °C

(1) T_j= 150 °C

(2) T_j= 85 °C

(3) T_j= 25 °C

(4) T_j= −40 °C

Fig. 5. Forward current as a function of forward

voltage; typical values

Fig. 6. Reverse current as a function of reverse

voltage; typical values

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BAS16QA-Q

High-speed switching diode

aaa-021947

aaa-020909

0.6

(pF)

FSM

(A)

0.4

0.2

0.0

-1

(V)

t (ms)

f = 1MHz; T_amb= 25 °C

Based on square wave currents.

T_amb= 25 °C

Fig. 7. Diode capacitance as a function of reverse

voltage; typical values

Fig. 8. Non-repetitive forward current as a function of

pulse duration; maximum values

11. Test information

D.U.T.

10 %

+ I

= 50 Ω

SAMPLING

OSCILLOSCOPE

= 50 Ω

V = V + I × R

(1)

90 %

mga881

input signal

output signal

(1) I_R= 1 mA

Fig. 9. Reverse recovery time test circuit and waveforms

1 kΩ

450 Ω

90 %

= 50 Ω

OSCILLOSCOPE

= 50 Ω

D.U.T.

10 %

input signal

output signal

mga882

Fig. 10. Forward recovery voltage test circuit and waveforms

Quality information

This product has been qualified in accordance with the Automotive Electronics Council (AEC)

standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in

automotive applications.

BAS16QA-Q

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BAS16QA-Q

High-speed switching diode

12. Package outline

0.87

0.95

0.75

0.22

0.30

0.17

0.25

0.95

1.05

0.16

0.24

0.1

0.195

0.275

0.04

max

0.245

0.325

0.34

0.40

1.05

1.15

Dimensions in mm

13-03-05

Fig. 11. Package outline DFN1010D-3 (SOT1215)

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BAS16QA-Q

High-speed switching diode

13. Soldering

Footprint information for reflow soldering of DFN1010D-3 package

SOT1215

1.2

0.45 (2x)

0.35 (2x)

0.3

1.1

0.25 (2x)

0.4

0.75

0.3 0.4

0.5

0.4

0.5

0.5 1.3

1.5 1.4

0.3 0.4

0.3

0.4

0.5

1.3

solder land

solder land plus solder paste

solder resist

occupied area

Dimensions in mm

12-11-23

Issue date

sot1215_fr

13-03-06

Fig. 12. Reflow soldering footprint for DFN1010D-3 (SOT1215)

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BAS16QA-Q

High-speed switching diode

14. Revision history

Table 8. Revision history

Data sheet ID

Release date

20230414

Data sheet status

Change notice

Supersedes

BAS16QA-Q v.1

Product data sheet

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Product data sheet

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BAS16QA-Q

High-speed switching diode

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15. Legal information

Data sheet status

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

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[1][2]

status [3]

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Production

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the preliminary specification.

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data sheet

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BAS16QA-Q

High-speed switching diode

Contents

1. General description......................................................1

2. Features and benefits.................................................. 1

3. Applications.................................................................. 1

4. Quick reference data....................................................1

5. Pinning information......................................................2

6. Ordering information....................................................2

7. Marking..........................................................................2

8. Limiting values............................................................. 3

9. Thermal characteristics............................................... 4

10. Characteristics............................................................5

11. Test information..........................................................6

12. Package outline.......................................................... 7

13. Soldering..................................................................... 8

14. Revision history..........................................................9

15. Legal information......................................................10

For more information, please visit: http://www.nexperia.com

For sales office addresses, please send an email to: salesaddresses@nexperia.com

Date of release: 14 April 2023

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BAS16QA-Q [NEXPERIA]

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