BZA962A [NEXPERIA]

Quadruple ESD transient voltage suppressorProduction;


型号：	BZA962A
厂家：	Nexperia
描述：	Quadruple ESD transient voltage suppressorProduction
文件：	总10页 (文件大小：341K)
中文：	中文翻译
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Important notice

Dear Customer,

On 7 February 2017 the former NXP Standard Product business became a new company with the

tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS

semiconductors with its focus on the automotive, industrial, computing, consumer and wearable

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In data sheets and application notes which still contain NXP or Philips Semiconductors references, use

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Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on

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DISCRETE SEMICONDUCTORS

DATA SHEET

M3D743

BZA900A-series

Quadruple ESD transient voltage

suppressor

Product data sheet

2001 Sep 03

NXP Semiconductors

Product data sheet

Quadruple ESD transient voltage

suppressor

BZA900A-series

FEATURES

PINNING

• ESD rating >8 kV, according to IEC61000-4-2

• SOT665 surface mount package

DESCRIPTION

cathode 1

• Common anode configuration.

common anode

cathode 2

APPLICATIONS

cathode 3

cathode 4

• Computers and peripherals

• Audio and video equipment

• Communication systems

DESCRIPTION

handbook, halfpage

Monolithic transient voltage suppressor diode in a five lead

SOT665 package for 4-bit wide ESD transient

suppression.

MARKING

MGW315

TYPE NUMBER

BZA956A

MARKING CODE

BZA962A

BZA968A

Fig.1 Simplified outline (SOT665) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL

Per diode

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

I_Z

working current

continuous forward current

non-repetitive peak forward current t_p= 1 ms; square pulse

T_amb= 25 °C

−

note 1

200

I_F

T_amb= 25 °C

I_FSM

P_tot

P_ZSM

total power dissipation

T_amb= 25 °C; note 2; see Fig.5

335

non repetitive peak reverse power square pulse; t_p= 1 ms; see Fig.3

dissipation:

BZA956A

−

°C

BZA962A

BZA968A

T_stg

T_j

storage temperature

junction temperature

−65

+150

150

−

Notes

1. DC working current limited by P_tot(max)

2. Device mounted on standard printed-circuit board.

2001 Sep 03

NXP Semiconductors

Product data sheet

Quadruple ESD transient voltage

suppressor

BZA900A-series

THERMAL CHARACTERISTICS

SYMBOL

R_{th j-a}

PARAMETER

CONDITIONS

VALUE

370

UNIT

K/W

thermal resistance from junction to ambient all diodes loaded

R_{th j-s}

thermal resistance from junction to solder

point; note 1

one diode loaded

all diodes loaded

135

125

Note

1. Solder point of common anode (pin 2).

ELECTRICAL CHARACTERISTICS

T_j= 25 °C unless otherwise specified.

SYMBOL

PARAMETER

forward voltage

CONDITIONS

MAX.

UNIT

V_F

I_R

I_F= 200 mA

1.3

reverse current

BZA956A

V_R= 3 V

V_R= 4 V

V_R= 4.3 V

1000

500

BZA962A

BZA968A

100

Table 1 Per type; BZ956A to BZA968A

T_j= 25 °C unless otherwise specified.

TYPE

WORKING VOLTAGE

V_Z(V)

DIFFERENTIAL

RESISTANCE

r_dif(Ω)

TEMP.

COEFF.

S_Z(mV/K) at at f = 1 MHz;

DIODE CAP.

C_d(pF)

NON-REPETITIVE

PEAK REVERSE

CURRENT

at I_Z= 1 mA

I_Z= 1 mA

V_R= 0

I_ZSM(A) at t_p= 1 ms;

T_amb= 25 ×°C

MIN.

TYP.

5.6

MAX.

400

TYP.

0.3

MAX.

125

105

MAX.

2.2

BZA956A

BZA962A

BZA968A

5.32

5.89

6.46

5.88

6.51

7.14

6.2

300

1.6

2.1

6.8

200

2.2

2.0

2001 Sep 03

NXP Semiconductors

Product data sheet

Quadruple ESD transient voltage

suppressor

BZA900A-series

GRAPHICAL DATA

MGW318

MGW319

handbook, halfpage

ZSM

(A)

(W)

BZA956A

BZA962A

BZA968A

BZA962A

BZA968A

−1

−2

−1

−2

−1

(ms)

P_ZSM= V_ZSM× I_ZSM

V_ZSMis the non-repetitive peak reverse voltage at I_ZSM

Fig.3 Maximum non-repetitive peak reverse

power dissipation as a function of pulse

duration (square pulse).

Fig.2 Maximum non-repetitive peak reverse

current as a function of pulse time.

MGW320

MGT586

120

400

handbook, halfpage

tot

(pF)

(mW)

300

200

100

BZA956A

BZA962A

BZA968A

100

150

(V)

(°C)

amb

T_j= 25 °C; f = 1 MHz.

Fig.4 Diode capacitance as a function of reverse

voltage; typical values.

Fig.5 Power derating curve.

2001 Sep 03

NXP Semiconductors

Product data sheet

Quadruple ESD transient voltage

suppressor

BZA900A-series

handbook, full pagewidth

ESD TESTER

RG 223/U

DIGITIZING

50 Ω coax

OSCILLOSCOPE

450 Ω

10×

ATTENUATOR

50 Ω

note 1

1/4 BZA900A

IEC 61000-4-2 network

= 150 pF; R = 330 Ω

Note 1: attenuator is only used for open

socket high voltage measurements

vertical scale = 5 V/div

horizontal scale = 50 ns/div

vertical scale = 100 V/div

horizontal scale = 50 ns/div

BZA968A

BZA962A

BZA956A

GND

unclamped +1 kV ESD voltage waveform

(IEC 61000-4-2 network)

clamped +1 kV ESD voltage waveform

(IEC 61000-4-2 network)

GND

vertical scale = 100 V/div

horizontal scale = 50 ns/div

vertical scale = 5 V/div

horizontal scale = 50 ns/div

unclamped −1 kV ESD voltage waveform

(IEC 61000-4-2 network)

clamped −1 kV ESD voltage waveform

(IEC 61000-4-2 network)

MGW321

Fig.6 ESD clamping test set-up and waveforms.

2001 Sep 03

NXP Semiconductors

Product data sheet

Quadruple ESD transient voltage

suppressor

BZA900A-series

APPLICATION INFORMATION

Typical common anode application

A quadruple transient suppressor in a SOT665 package makes it possible to protect four separate lines using only one

package. A simplified example is shown in Fig.7.

handbook, full pagewidth

keyboard,

terminal,

printer,

etc.

I/O

FUNCTIONAL

DECODER

BZA900A

GND

MGW316

Fig.7 Computer interface protection.

Device placement and printed-circuit board layout

Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA900A is

determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further

add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a

minimum. This includes the lead length of the suppression element.

In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended:

1. Place the suppression element close to the input terminals or connectors

2. Keep parallel signal paths to a minimum

3. Avoid running protection conductors in parallel with unprotected conductors

4. Minimize all printed-circuit board loop areas including power and ground loops

5. Minimize the length of the transient return path to ground

6. Avoid using shared transient return paths to a common ground point.

2001 Sep 03

NXP Semiconductors

Product data sheet

Quadruple ESD transient voltage

suppressor

BZA900A-series

PACKAGE OUTLINE

Plastic surface mounted package; 5 leads

SOT665

w M

detail X

2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

0.6

0.5

0.27

0.17

0.18

0.08

1.7

1.5

1.3

1.1

1.7

1.5

0.3

0.1

1.0

0.5

0.1

REFERENCES

JEDEC

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

EIAJ

01-01-04

01-08-27

SOT665

2001 Sep 03

NXP Semiconductors

Product data sheet

Quadruple ESD transient voltage

suppressor

BZA900A-series

DATA SHEET STATUS

DOCUMENT

STATUS⁽¹⁾

PRODUCT

STATUS⁽²⁾

DEFINITION

Objective data sheet

Development

This document contains data from the objective specification for product

development.

Preliminary data sheet

Product data sheet

Qualification

Production

This document contains data from the preliminary specification.

This document contains the product specification.

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DISCLAIMERS

above those given in the Characteristics sections of this

document is not implied. Exposure to limiting values for

extended periods may affect device reliability.

General ⎯ Information in this document is believed to be

accurate and reliable. However, NXP Semiconductors

does not give any representations or warranties,

expressed or implied, as to the accuracy or completeness

of such information and shall have no liability for the

consequences of use of such information.

Terms and conditions of sale ⎯ NXP Semiconductors

products are sold subject to the general terms and

conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, including those

pertaining to warranty, intellectual property rights

infringement and limitation of liability, unless explicitly

otherwise agreed to in writing by NXP Semiconductors. In

case of any inconsistency or conflict between information

in this document and such terms and conditions, the latter

will prevail.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this document, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Suitability for use ⎯ NXP Semiconductors products are

not designed, authorized or warranted to be suitable for

use in medical, military, aircraft, space or life support

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to result in personal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at

the customer’s own risk.

Export control ⎯ This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national authorities.

Quick reference data ⎯ The Quick reference data is an

extract of the product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaustive or legally binding.

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) may cause permanent damage to

the device. Limiting values are stress ratings only and

operation of the device at these or any other conditions

2001 Sep 03

NXP Semiconductors

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimers. No changes were made to the technical content, except for package outline

drawings which were updated to the latest version.

Contact information

For additional information please visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

613514/1000/01/pp9

Date of release: 2001 Sep 03

Document order number: 9397 750 08542

BZA962A [NEXPERIA]

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