IP4233CZ6 [NEXPERIA]

Ultra low capacitance ESD protection for Ethernet portsProduction;


型号：	IP4233CZ6
厂家：	Nexperia
描述：	Ultra low capacitance ESD protection for Ethernet portsProduction 光电二极管
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中文：	中文翻译
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IP4233CZ6

Ultra low capacitance ESD protection for Ethernet ports

Rev. 3 — 17 June 2010

Product data sheet

1. Product profile

1.1 General description

The IP4233CZ6 is designed to protect Input/Output (I/O) ports that are sensitive to

capacitive loads, such as Ethernet, from destruction by ElectroStatic Discharge (ESD).

The IP4233CZ6 incorporates two pairs of ultra low capacitance back-to-back diodes

which protect components from ESD voltages as high as ±8 kV contact discharge

according to IEC 61000-4-2, level 4.

The back-to-back diodes prevent negative clipping of AC signals and voltages below zero.

The IP4233CZ6 is fabricated using monolithic silicon technology integrating two ultra low

capacitance back-to-back ESD protection diodes in a very small 6-lead SOT363 package.

1.2 Features and benefits

Pb-free and Restriction of Hazardous Substances (RoHS) compliant

ESD protection compliant to IEC 61000-4-2 level 4, ±8 kV contact discharge

Two low input capacitance (0.9 pF typical) back-to-back ESD protection diodes

Very small 6-lead SOT363 package

1.3 Applications

ESD protection high-frequency AC-coupled Ethernet ports

1.4 Quick reference data

Table 1.

Quick reference data

T_amb= 25 °C unless otherwise specified.

Symbol Parameter Conditions

Min

Typ

Max Unit

V_ESD

electrostatic

discharge voltage

all pins; IEC 61000-4-2,

level 4; contact discharge

±8

[1][2]

C_(I/O-GND)input/output to

ground capacitance

V_I= 0 V; f = 1 MHz

0.9

1.3

[1] Guaranteed by design.

[2] Pins 2 to 6 and pins 3 to 5.

IP4233CZ6

Nexperia

Ultra low capacitance ESD protection for Ethernet ports

2. Pinning information

Table 2.

Pinning

Description

Simplified outline

Graphic symbol

not connected

ESD protection I/O channel 1

ESD protection I/O channel 2

not connected

ESD protection I/O channel 2

ESD protection I/O channel 1

018aaa013

3. Ordering information

Table 3.

Ordering information

Type number

Package

Name

Description

Version

IP4233CZ6

SC-88

plastic surface-mounted package; 6 leads SOT363

4. Limiting values

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_I

Parameter

Conditions

Min

Max

±5.5

±8

Unit

input voltage

V_ESD

electrostatic discharge all pins; IEC 61000-4-2,

voltage

level 4; contact discharge

T_stg

storage temperature

ambient temperature

−55

−40

+125

+85

°C

T_amb

5. Characteristics

Table 5.

Characteristics

T_amb= 25 °C unless otherwise specified.

Symbol

C_(I/O-GND)input/output to

ground capacitance

reverse leakage current V_I= 3.0 V

Parameter

Conditions

Min

Typ

Max Unit

[1][2]

[2]

V_I= 0 V; f = 1 MHz

0.9

1.3

I_RM

100

9.5

V_BR

breakdown voltage

back-to-back diode;

I = 5 mA

[1] Guaranteed by design.

[2] Pins 2 to 6 and pins 3 to 5.

IP4233CZ6

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 17 June 2010

2 of 11

IP4233CZ6

Nexperia

Ultra low capacitance ESD protection for Ethernet ports

6. Application information

A typical application for protecting a 10/100 Mbit/s Ethernet transceiver against ESD is

shown in Figure 1.

not used

PTC

TX+

PTC

TX−

Primary-Secondary

Coordinating

Elements (Opt)

RJ45

10/100

BASE-T

ETHERNET

IP4233CZ6

PTC

RX+

RX−

not used

RX−

not used

EMI

GND

018aaa014

Fig 1. Typical application for ESD protection of a 10/100 Mbit/s Ethernet transceiver

IP4233CZ6

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 17 June 2010

3 of 11

IP4233CZ6

Nexperia

Ultra low capacitance ESD protection for Ethernet ports

7. Package outline

Plastic surface-mounted package; 6 leads

SOT363

pin 1

index

M B

detail X

2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

max

0.30

0.20

1.1

0.8

0.25

0.10

2.2

1.8

1.35

1.15

2.2

2.0

0.45

0.15

0.25

0.15

0.1

1.3

0.65

0.2

0.1

REFERENCES

JEDEC JEITA

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

04-11-08

06-03-16

SOT363

SC-88

Fig 2. Package outline SOT363 (SC-88)

IP4233CZ6

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 17 June 2010

4 of 11

IP4233CZ6

Nexperia

Ultra low capacitance ESD protection for Ethernet ports

8. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

8.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

8.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

8.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath specifications, including temperature and impurities

IP4233CZ6

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 17 June 2010

5 of 11

IP4233CZ6

Nexperia

Ultra low capacitance ESD protection for Ethernet ports

8.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 3) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 6 and 7

Table 6.

SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm³)

< 350

≥ 350

220

< 2.5

235

220

≥ 2.5

220

Table 7.

Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm³)

< 350

260

350 to 2000

> 2000

260

< 1.6

260

250

245

1.6 to 2.5

> 2.5

260

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 3.

IP4233CZ6

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 17 June 2010

6 of 11

IP4233CZ6

Nexperia

Ultra low capacitance ESD protection for Ethernet ports

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 3. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

IP4233CZ6

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 17 June 2010

7 of 11

IP4233CZ6

Nexperia

Ultra low capacitance ESD protection for Ethernet ports

9. Revision history

Table 8.

Revision history

Document ID

IP4233CZ6 v.3

Modifications:

Release date

Data sheet status

Change notice

Supersedes

20100617

Product data sheet

IP4233CZ6 v.2

• Figure 1: corrected

• Section 10 “Legal information”: updated

IP4233CZ6 v.2

IP4233CZ6_1

20100506

Preliminary data sheet

IP4233CZ6_1

20090330

Objective data sheet

IP4233CZ6

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 17 June 2010

8 of 11

IP4233CZ6

Nexperia

Ultra low capacitance ESD protection for Ethernet ports

10. Legal information

10.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nexperia.com.

malfunction of a Nexperia product can reasonably be expected

10.2 Definitions

to result in personal injury, death or severe property or environmental

damage. Nexperia accepts no liability for inclusion and/or use of

Nexperia products in such equipment or applications and

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. Nexperia does not give any

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. Nexperia makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local Nexperia sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Customers are responsible for the design and operation of their applications

and products using Nexperia products, and Nexperia

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the Nexperia

product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

Nexperia and its customer, unless Nexperia and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the Nexperia product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

Nexperia does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using Nexperia

products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). Nexperia does not accept any liability in this respect.

10.3 Disclaimers

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, Nexperia does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall Nexperia be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — Nexperia

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nexperia.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. Nexperia hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of Nexperia products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, Nexperia’s aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of Nexperia.

Right to make changes — Nexperia reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Suitability for use — Nexperia products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

IP4233CZ6

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 17 June 2010

9 of 11

IP4233CZ6

Nexperia

Ultra low capacitance ESD protection for Ethernet ports

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

Nexperia’s specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies Nexperia for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond Nexperia’s

standard warranty and Nexperia’s product specifications.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific Nexperia product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. Nexperia

accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

10.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without Nexperia’s warranty of the

11. Contact information

For more information, please visit: http://www.nexperia.com

For sales office addresses, please send an email to: salesaddresses@nexperia.com

IP4233CZ6

All information provided in this document is subject to legal disclaimers.

10 of 11

Product data sheet

Rev. 3 — 17 June 2010

IP4233CZ6

Nexperia

Ultra low capacitance ESD protection for Ethernet ports

12. Contents

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

General description . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits. . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . 1

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2

Application information. . . . . . . . . . . . . . . . . . . 3

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4

Soldering of SMD packages . . . . . . . . . . . . . . . 5

Introduction to soldering . . . . . . . . . . . . . . . . . . 5

Wave and reflow soldering . . . . . . . . . . . . . . . . 5

Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . . 5

Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . . 6

8.1

8.2

8.3

8.4

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8

Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

10.1

10.2

10.3

10.4

Contact information. . . . . . . . . . . . . . . . . . . . . 10

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

For more information, please visit: http://www.nexperia.com

For sales office addresses, please send an email to: salesaddresses@nexperia.com

Date of release: 17 June 2010

IP4233CZ6 [NEXPERIA]

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