NXS0506UP_技术文档

NXS0506

SD 3.0-compatible memory card integrated auto-direction

control and level translator with EMI filter and ESD protection

Rev. 2 — 8 March 2022

Product data sheet

1. General description

The NXS0506 is an SD 3.0-compatible bidirectional dual supply level translator with auto-direction

control. It is designed to interface between a memory card operating at 1.7 V to 3.6 V signal levels

and a host with a nominal supply voltage of 1.1 V to 1.95 V. The device supports SD 3.0: SDR104,

SDR50, DDR50, SDR25, SDR12 and SD 2.0 High-Speed (50 MHz) and Default-Speed (25 MHz)

modes. The device has a built-in EMI filter and robust ESD protection (IEC 61000-4-2, level 4).

2. Features and benefits

•

Supports up to 208 MHz clock rate

•

SD 3.0 specification-compatible voltage translation to support: SDR104, SDR50, DDR50,

SDR25, SDR12, High-Speed and Default-Speed modes

•

1.1 V to 1.95 V host side interface voltage support

Auto-direction sensing

Low power consumption

Integrated pull-up resistors: no external resistors required

Integrated EMI filters suppress higher harmonics of digital I/Os

Level shifting buffers keep ESD stress away from the host (zero-clamping concept)

16-bumps WLCSP package; pitch 0.35 mm

ESD protection:

•

HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV

CDM ANSI/ESDA/JEDEC JS-002 Class C3 exceeds 1 kV

IEC61000-4-2, level 4, contact discharge on all memory card-side pins exceeds 8 kV

IEC61000-4-2, level 4, air discharge on all memory card-side pins exceeds 15 kV

•

Specified from -40 °C to +85 °C

3. Applications

•

Smartphone

Mobile handsets

Digital cameras

Tablet PCs

Laptop computers

SD, MMC or microSD card readers

Nexperia

NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

4. Ordering information

Table 1. Ordering information

Type number

Package

Temperature range Name

Description

Version

NXS0506UP

-40 °C to +85 °C

WLCSP16 wafer level chip-scale package; 16 bumps;

1.455 mm x 1.455 mm x 0.43 mm body

SOT8025-1

5. Marking

Table 2. Marking codes

Type number

Marking code

NXS0506UP

m5

6. Block diagram

NXS0506

V

CCA

CCB

CONTROL LOGIC

CLKA

CLKFB

CMDA

CLKB

CMDB

DAT0B

DAT1B

DAT2B

DAT3B

8 kV ESD

PROTECTION

DAT0A

DAT1A

DAT2A

DAT3A

HOST/

BASE

BAND

EMI

2 kV ESD

PROTECTION

MEMORY

CARD

EMI FILTER

RESISTOR

NETWORK

aaa-034247

Fig. 1. Block diagram

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Product data sheet

Rev. 2 — 8 March 2022

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NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

7. Functional diagram

R1

R2

CLKA

CLKB

CLKFB

V

CCB

R

pu

R2

CMDB

V

CCA

R

pu

R1

CMDA

V

CCB

R

pu

R2

DATnB

V

CCA

R

pu

R1

DATnA

V

CCB

CCA

aaa-034248

Only one data input/output channel (DATnA/DATnB) shown.

Fig. 2. Functional diagram

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NXS0506

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Product data sheet

Rev. 2 — 8 March 2022

3 / 17

Nexperia

NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

8. Pinning information

8.1. Pinning

NXS0506

bump A1

index area

NXS0506

1

2

3

4

1

2

3

4

A

B

C

D

DAT2A

V

DAT2B

CCA

CCB

A

B

C

D

DAT3A CMDA CMDB DAT3B

DAT0A CLKFB GND DAT0B

DAT1A CLKA CLKB DAT1B

aaa-034250

Transparent top view

aaa-034249

Transparent top view

Bump CLKFB (C2) can be left floating.

Fig. 3. Bump configuration SOT8025-1 (WLCSP16)

Fig. 4. Bump mapping SOT8025-1 (WLCSP16)

8.2. Pin description

Table 3. Pin description

Symbol[1]

DAT2A

DAT3A

DAT0A

DAT1A

V_CCA

Bump

A1

B1

C1

D1

A2

B2

C2

D2

A3

B3

C3

D3

A4

B4

C4

D4

Description

data 2 input or output on host side

data 3 input or output on host side

data 0 input or output on host side

data 1 input or output on host side

supply voltage A (host side)

CMDA

CLKFB

CLKA

command input or output on host side

clock feedback signal on host side, this pin can be left floating

clock signal input on host side

V_CCB

supply voltage B (memory card side)

command input or output on memory card side

supply ground

CMDB

GND

CLKB

clock signal input on memory card side

data 2 input or output on memory card side

data 3 input or output on memory card side

data 0 input or output on memory card side

data 1 input or output on memory card side

DAT2B

DAT3B

DAT0B

DAT1B

[1] The pin names relate particularly to SD memory cards, but also apply to microSD and MMC memory cards.

See Section 9.6 for options to swap identical channels.

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Product data sheet

Rev. 2 — 8 March 2022

4 / 17

Nexperia

NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

9. Functional description

9.1. Level translator

The bidirectional level translator shifts the data between the I/O supply levels of the host and

the memory card. Auto direction sensing circuitry determines if a command and data signals are

transferred from the memory card to the host (card read mode) or from the host to the memory

card (card write mode). The voltage translator has to support several clock and data transfer rates

at the signaling levels specified in the SD 3.0 standard specification.

Table 4. Supported modes

Bus speed mode

Default-Speed

High-Speed

SDR12

Signal level (V)

Clock rate (MHz)

Data rate (MB/s)

3.3

1.8

25

12.5

25

50

25

12.5

25

SDR25

50

SDR50

100

208

50

SDR104

104

50

DDR50

9.2. Enable and direction control

The device contains an auto-enable feature. If V_CCBrises above 1.5 V, the level translator logic

is enabled automatically. As soon as V_CCBdrops below 0.65 V, the memory card side drivers and

the level translator logic are disabled. All pins on the host side, excluding CLKA are configured as

inputs with a 70 kΩ resistor pulled up to V_CCA

.

The device features an auto correction control for all data channels except CLK. For these pins the

direction of data flow is sensed by the direction control logic and the output drivers are controlled

accordingly. There is no need for the host interface to indicate the direction of data flow.

9.3. Feedback clock channel

The clock is transmitted from the host to the memory card side. The voltage translator and the

Printed-Circuit Board (PCB) tracks introduce some amount of delay. It reduces timing margin for

data read back from memory card, especially at higher data rates. Therefore, a feedback path is

provided to compensate the delay. The reasoning behind this approach is the fact that the clock is

always delivered by the host, while the data in the timing critical read mode comes from the card.

9.4. EMI filter

All input/output driver stages are equipped with EMI filters to reduce interference towards sensitive

mobile communication.

9.5. ESD protection

The device has robust ESD protections on all memory card pins. The architecture prevents any

stress for the host: the voltage translator discharges any stress to supply ground.

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Product data sheet

Rev. 2 — 8 March 2022

5 / 17

Nexperia

NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

9.6. Pin and channel naming

The channel naming as shown in Fig. 2 and in the Pinning information (Section 8) aims at using

NXS0506 for SD-card interfaces. The sequence of the channels is chosen to easily connect to

SD-card connectors. As the internal design of channels DAT0 (pins DAT0A and DAT0B), DAT1

(pins DAT1A and DAT1B), DAT2 (pins DAT2A and DAT2B), DAT3 (pins DAT3A and DAT3B) and

CMD (pins CMDA and CMDB) is identical, these channels can be exchanged. Swapping channels

in the above mentioned group can help ease PCB layout issues. E.g. DAT0 can be swapped with

DAT1 or DAT3 with CMD without impact on functionality of NXS0506.

10. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter

Conditions

Min

-0.5

-

Max Unit

V_CC

supply voltage

4 ms transient; on pin V_CCA

4 ms transient; on pin V_CCB

4 ms transient at I/O pins

T_amb= -40 °C to 85 °C

4.6

V

V_I

input voltage

P_tot

T_stg

I_lu(IO)

total power dissipation

storage temperature

input/output latch-up current

250 mW

150 °C

100 mA

-55

-100

JESD78B: -0.5 x V_CC< V_I< 1.5 x V_CC; T_j< 125 °C

11. Recommended operating conditions

Table 6. Operating conditions

Symbol Parameter

Conditions

on pin V_CCA

on pin V_CCB

host side

Min

1.1

Typ

Max

Unit

V_CC

supply voltage

[1]

-

1.95

3.6

V

1.7

-

V

V_I

input voltage

-0.3

-40

-

V_CCA+ 0.3

V_CCB+ 0.3

+85

V

memory card side

[2]

V

T_amb

ambient temperature

+25

°C

[1] V_CCB≥ V_CCA

[2] The voltage must not exceed 3.6 V.

Table 7. Integrated resistors

Symbol Parameter

Conditions

T_amb= -40 °C to 85 °C

Unit

Min

Typ[1]

70

Max

R_pu

R_s

pull-up resistance

series resistance

42

-

100

kΩ

Ω

host side; R1

card side; R2

[2]

22.5

15

-

Ω

[1] Typical values are measured at T_amb= 25 °C.

[2] Guaranteed by design and characterization

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Product data sheet

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NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

12. Static characteristics

Table 8. Static characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); unless otherwise specified.

Symbol Parameter

Conditions

T_amb= -40 °C to 85 °C

Unit

Min

Typ[1]

Max

Automatic enable feature: V_CCB

V_en

device enable V_CCA≥ 1.0 V; V_CCBrising edge

voltage level

0.9

1.2

1.0

1.5

1.3

V

V_dis

device disable V_CCA≥ 1.0 V; V_CCBfalling edge

voltage level

0.65

Host-side input signals: CMDA, DAT0A to DAT3A and CLKA

V_IH

V_IL

I_I

HIGH-level

input voltage

1.1 V ≤ V_CCA≤ 1.95 V

0.65V_CCA

-

V_CCA+ 0.3

0.35V_CCA

1

V

LOW-level

input voltage

1.1 V ≤ V_CCA≤ 1.95 V

-0.3

-

V

input leakage CLKA; V_CCA= 1.8 V; V_I= 0 V to 1.95 V

current

µA

Host-side output signals: CMDA and DAT0A to DAT3A

V_OH

HIGH-level

output voltage 1.1 V ≤ V_CCA≤ 1.95 V

I_O= -2 µA; V_I= V_IH(card side)

0.8V_CCA

-0.3

-

V_CCA+ 0.3

0.15V_CCA

V

V_OL

LOW-level

I_O= 2 mA; V_I= V_IL(card side)

output voltage 1.1 V ≤ V_CCA≤ 1.95 V

Host-side output signals: CLKFB

V_OH

HIGH-level

output voltage 1.1 V ≤ V_CCA≤ 1.95 V

I_O= -2 mA; V_I= V_IH(host side)

0.8V_CCA

-0.3

-

V_CCA+ 0.3

0.15V_CCA

V

V_OL

LOW-level

I_O= 2 mA; V_I= V_IL(host side)

output voltage 1.1 V ≤ V_CCA≤ 1.95 V

Card-side input signals: CMDB and DAT0B to DAT3B

V_IH

HIGH-level

1.7 V ≤ V_CCB≤ 3.6 V

0.625V_CCB

-

V_CCB+ 0.3

V

input voltage

V_IL

LOW-level

input voltage

1.7 V ≤ V_CCB≤ 1.95 V

2.7 V ≤ V_CCB≤ 3.6 V

-0.3

-

0.35V_CCB

0.30V_CCB

V

Card-side output signal: CMDB, DAT0B to DAT3B and CLKB

V_OHHIGH-level CLKB; V_CCB= 1.7 V; I_O= -2 mA;

output voltage V_I= V_IH(host side)

CLKB; V_CCB= 2.7 V; I_O= -4 mA;

0.85V_CCB

-0.3

-

2.0

V

V_CCB+ 0.3

2.0

V_I= V_IH(host side)

CMDB, DATnB; V_CCB= 1.7 V;

I_O= -2 µA; V_I= V_IH(host side)

V_OL

Low-level

I_O= 2 mA; V_I= V_IL(host side);

0.125V_CCB

output voltage V_CCB= 1.7 V

I_O= 4 mA; V_I= V_IL(host side);

V_CCB= 2.7 V

-0.3

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Product data sheet

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Nexperia

NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

Symbol Parameter

Conditions

T_amb= -40 °C to 85 °C

Unit

Min

Typ[1]

Max

Current consumption

I_CC

supply current host side; all inputs = HIGH

V_I= V_CCA; V_CCA= 1.95 V; V_CCB= 3.6 V

-

4

7

µA

card side; all inputs = HIGH

V_I= V_CCA; V_CCA= 1.7 V; V_CCB= 1.7 V

card side; all inputs = HIGH

20

V_I= V_CCA; V_CCA= 1.95 V; V_CCB= 3.6 V

[1] Typical values are measured at T_amb= 25 °C.

13. Dynamic characteristics

13.1. Level translator

Table 9. Level translator dynamic characteristics

At recommended operating conditions; For waveform and test circuit see Fig. 5 and Fig. 6.

Symbol Parameter Conditions

T_amb= -40 °C to 85 °C Unit

Min

Typ[1] Max

Host-side output transition times

t_t

transition time

V_CCA= 1.2 V to V_CCA= 1.8 V

output transition time between V_X= 0.35V_CCAand

V_Y= 0.65V_CCA.

[2]

-

0.3

0.4

1.0 ns

Host-side input rise and fall times

t_r, t_frise and fall time V_CCA= 1.2 V to 1.8 V;

-

1.0 ns

1.32 ns

input rise and fall time between V_X= 0.35V_CCAand

V_Y= 0.65V_CCA.

Card-side output transition times

t_t

transition time

V_CCB= 1.8 V;

[2] 0.4

0.88

output transition time between V_X= 0.45 V and

V_Y= 1.4 V

Card-side input rise and fall times

t_r

t_f

rise time

fall time

V_CCB= 1.8 V; input rise time between 0.58 V and 1.27 V

V_CCB= 1.8 V; input fall time between 0.58 V and 1.27 V

0.2

0.5

0.96 ns

0.45

Host-side to card-side propagation delay; DATnA to DATnB, CMDA to CMDB and CLKA to CLKB

t_pd

propagation

delay

V_CCA= 1.2 V; V_CCB= 1.8 V

V_CCA= 1.2 V; V_CCB= 3.3 V

V_CCA= 1.8 V; V_CCB= 1.8 V

V_CCA= 1.8 V; V_CCB= 3.3 V

[3]

-

3.1

2.2

2.7

1.7

5.4 ns

4.0 ns

4.8 ns

3.1 ns

Card-side to host-side propagation delay; DATnB to DATnA and CMDB to CMDA

t_pd

propagation

delay

V_CCA= 1.2 V; V_CCB= 1.8 V

V_CCA= 1.2 V; V_CCB= 3.3 V

V_CCA= 1.8 V; V_CCB= 1.8 V

V_CCA= 1.8 V; V_CCB= 3.3 V

[3]

-

2.7

1.7

2.7

1.6

4.6 ns

3.0 ns

4.6 ns

2.7 ns

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Product data sheet

Rev. 2 — 8 March 2022

8 / 17

Nexperia

NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

Symbol Parameter

Conditions

T_amb= -40 °C to 85 °C Unit

Min

Typ[1] Max

Host-side to host-side propagation delay; CLKA to CLKFB

t_pd

propagation

delay

V_CCA= 1.2 V; V_CCB= 1.8 V

V_CCA= 1.2 V; V_CCB= 3.3 V

V_CCA= 1.8 V; V_CCB= 1.8 V

V_CCA= 1.8 V; V_CCB= 3.3 V

[3]

-

5.8

3.9

5.4

3.3

10

ns

7.0 ns

9.4 ns

5.8 ns

Bus signal equivalent capacitance

C_I/O

input/output

capacitance

V_I= 0 V; f_i= 1 MHz; V_CCA= 1.8 V; host side

V_I= 0 V; f_i= 1 MHz; V_CCB= 1.8 V; card side

[4]

-

5

-

pF

12

[1] Typical values are measured at T_amb= 25 °C.

[2] t_tis the same as t_THLand t_TLH

[3] t_pdis the same as t_PLHand t_PHL

[4] EMI filter line capacitance from I/O driver to pin; C_I/Ois guaranteed by design.

.

V

I

V

Y

input

GND

V

M

V

X

t

r

f

t

PLH

PHL

V

OH

V

Y

V

output

M

V

X

t

V

OL

t

THL

TLH

aaa-034251

Measurement points are given in Table 10.

V_OLand V_OHare typical voltage output levels that occur with the output load.

Fig. 5. The input to output propagation delays, input rise and fall times and output transition times

Table 10. Measurement points

Supply voltage

V_CCA

Input

V_I[1]

V_CCI

Output

V_M[2]

V_CCB

V_M[1]

1.1 V to 1.95 V

1.7 V to 3.6 V

0.5V_CCI

0.5V_CCO

[1] V_CCIis the supply voltage associated with the input.

[2] V_CCOis the supply voltage associated with the output.

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Product data sheet

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NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

t

W

V

I

65 %

negative

pulse

V

M

35 %

0 V

t

r

f

t

f

r

V

I

65 %

positive

pulse

V

M

35 %

0 V

t

W

V

CCB

CCA

V

O

I

G

DUT

C

L

aaa-034252

Test data is given in Table 11.

All input pulses are supplied by generators having the following characteristics:

PRR ≤ 10 MHz; Z_O= 50 Ω; input edges (t_r, t_f) are defined in Section 13.

C_L= Load capacitance including jig and probe capacitance.

Fig. 6. Test circuit for measuring switching time

Table 11. Test data

Supply voltage

V_CCA

Input

V_I[1]

V_CCI

Load

V_CCB

C_L(host side)

10 pF

C_L(card side)

1.1 V to 1.95 V

1.7 V to 3.6 V

15 pF

[1] V_CCIis the supply voltage associated with the input.

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Product data sheet

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NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

14. Application information

V

SUPPLY

PMU or DC/DC or LDO

2.8 V 400/800 mA

V

SUPPLY

SEL

PMU or DC/DC or LDO

1.8 V/2.8 V (selectable)

NXS0506

V

CCA

V

CCB

CLKA

CLKFB

CMDA

DAT1B

DAT0B

GND

LEVEL

TRANSLATOR

LOGIC

HOST/

BASEBAND

INTERFACE

CLK_SD

SD-CARD

DAT0A

DAT1A

DAT2A

DAT3A

V

SD

CMDB

DAT3B

DAT2B

V

/V

CCA CCB

see data sheet

for details

basic push-pull driver

implementation

aaa-034253

Fig. 7. Application diagram

14.1. PCB design guidelines

The translator can operate with frequencies up to 208 MHz so the PCB connections between host

and translator and translator and card can start to act as transmission lines, affecting the signal

integrity.

For PCB connections below 8 cm (t_r= 0.4 ns) no degradation of the signal integrity is to be

expected. For longer connections it’s important to take pre-cautions and check the signal integrity

during the development phase of the PCB. If the CLKFB is used to synchronize the data that is

read from the card, it is important to place the translator as close as possible to the card connector.

©

NXS0506

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Product data sheet

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NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

15. Design and assembly recommendations

15.1. PCB design guidelines

For optimum performance, use a Non-Solder Mask PCB Design (NSMD), also known as a

copper-definied design, incorporating laser-drilled micro-vias connecting the ground pads to a

buried ground-plane layer. This results in the lowest possible ground inductance and provides the

best high frequency and ESD performance. For this case, refer to Table 12 for the recommended

PCB design parameters.

Table 12. Recommended PCB design parameters

Parameter

Value or specification

circular

PCB Cu pad shape

PCB Cu pad diameter

PCB solder resist diameter

WLCSP pad diameter (UBM)

200 µm

270 µm

200 µm

15.2. PCB assembly guidelines for Pb-free soldering

Table 13. Assembly recommendations

Parameter

Value or specification

PCB stencil shape

circular

PCB stencil aperture diameter

PCB stencil thickness

Solder paste material

Solder reflow profile

200 µm

80 µm

SnAg₄Cu (Cu 0.5%) (SAC405)

see Fig. 8

T

(°C)

T

reflow(peak)

250

230

217

cooling rate

preheat

t (s)

t

2

1

t

3

4

t

5

001aai943

The device can withstand at least three reflows with this profile.

Fig. 8. Pb-free solder reflow profile

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SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

Table 14. Reflow soldering process characteristics

T_amb= 25 °C; unless otherwise specified.

Symbol Parameter

Conditions

Min

230

Typ Max Unit

t_reflow(peak)peak reflow temperature

-

260 °C

t₁

time 1

time 2

time 3

time 4

time 5

soak time

60

-

180

30

s

t₂

time during T ≥ 250 °C

time during T ≥ 230 °C

time during T ≥ 217 °C

t₃

10

30

-

50

t₄

150

540

t₅

dT/dt

rate of temperature change cooling rate

preheat

-

-6 °C/s

4.0 °C/s

2.5

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Product data sheet

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NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

16. Package outline

WLCSP16: wafer level chip-scale package; 16 bumps; 1.455 mm x 1.455 mm x 0.43 mm body

SOT8025-1

s

C

2x

B

E

A

this surface is

fully covered by

`'Backside Coating''

bump A1

index area

A

2

D

A

1

detail X

s

C

2x

e

C

y

C

1/2 e

C

1

16x

D

C

B

A

e

1/2 e

bump A1

index area

1

2

3

4

M

v

C A B

b

X

w

C

(16x)

0

1 mm

scale

v

Dimensions (mm are the original dimensions)

Unit

max 0.468 0.183 0.285 0.245

A

b

D

E

e

s

w

y

1

2

nom

min

mm

0.430 0.163 0.267 0.225 1.455 1.455 0.35 0.025 0.015 0.05 0.05 0.06

0.392 0.143 0.249 0.205

Note

1. Dimension A includes backside coating thickness.

sot8025-1_po

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

21-06-11

21-06-16

SOT8025-1

Fig. 9. Package outline SOT8025-1 (WLCSP16)

©

NXS0506

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 8 March 2022

14 / 17

Nexperia

NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

17. Abbreviations

Table 15. Abbreviations

Acronym

DUT

Description

Device Under Test

EMI

Electro Magnetic Interface

ElectroStatic Discharge

Flame Retard 4

ESD

FR4

LDO

Low-Dropout

MMC

NSMD

OSP

MultiMedia Card

Non-Solder Mask PCB Design

Organic Solderability Preservation

Printed-Circuit Board

Project Management Unit

Pulse Rate Repetition

Restriction of Hazardous Substances

Secure Digital

PCB

PMU

PRR

RoHS

SD

UBM

WLCSP

Under Bump Metallization

Wafer-Level Chip-Scale Package

18. Revision history

Table 16. Revision history

Data sheet ID

NXS0506 v.2

Modifications:

Release date

20220308

Data sheet status

Change notice Supersedes

Product data sheet

-

NXS0506 v.1

•

Fig. 1 and Fig. 2 have changed (errata).

NXS0506 v.1

20220131 Product data sheet

-

©

NXS0506

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 8 March 2022

15 / 17

Nexperia

NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

injury, death or severe property or environmental damage. Nexperia and its

suppliers accept no liability for inclusion and/or use of Nexperia products in

such equipment or applications and therefore such inclusion and/or use is at

the customer’s own risk.

19. Legal information

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

Data sheet status

document, and as such is not complete, exhaustive or legally binding.

Document status Product

Definition

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. Nexperia makes no representation

or warranty that such applications will be suitable for the specified use

without further testing or modification.

[1][2]

status [3]

Objective [short]

data sheet

Development

This document contains data from

the objective specification for

product development.

Customers are responsible for the design and operation of their applications

and products using Nexperia products, and Nexperia accepts no liability for

any assistance with applications or customer product design. It is customer’s

sole responsibility to determine whether the Nexperia product is suitable

and fit for the customer’s applications and products planned, as well as

for the planned application and use of customer’s third party customer(s).

Customers should provide appropriate design and operating safeguards to

minimize the risks associated with their applications and products.

Preliminary [short]

data sheet

Qualification

Production

This document contains data from

the preliminary specification.

Product [short]

data sheet

This document contains the product

specification.

[1] Please consult the most recently issued document before initiating or

completing a design.

Nexperia does not accept any liability related to any default, damage, costs

or problem which is based on any weakness or default in the customer’s

applications or products, or the application or use by customer’s third party

customer(s). Customer is responsible for doing all necessary testing for the

customer’s applications and products using Nexperia products in order to

avoid a default of the applications and the products or of the application or

use by customer’s third party customer(s). Nexperia does not accept any

liability in this respect.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of

multiple devices. The latest product status information is available on

the internet at https://www.nexperia.com.

Definitions

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. Nexperia does not give any representations or

warranties as to the accuracy or completeness of information included herein

and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is

intended for quick reference only and should not be relied upon to contain

detailed and full information. For detailed and full information see the relevant

full data sheet, which is available on request via the local Nexperia sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Terms and conditions of commercial sale — Nexperia products are

sold subject to the general terms and conditions of commercial sale, as

published at http://www.nexperia.com/profile/terms, unless otherwise agreed

in a valid written individual agreement. In case an individual agreement is

concluded only the terms and conditions of the respective agreement shall

apply. Nexperia hereby expressly objects to applying the customer’s general

terms and conditions with regard to the purchase of Nexperia products by

customer.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

Nexperia and its customer, unless Nexperia and customer have explicitly

agreed otherwise in writing. In no event however, shall an agreement be

valid in which the Nexperia product is deemed to offer functions and qualities

beyond those described in the Product data sheet.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, Nexperia does not give any

representations or warranties, expressed or implied, as to the accuracy

or completeness of such information and shall have no liability for the

consequences of use of such information. Nexperia takes no responsibility

for the content in this document if provided by an information source outside

of Nexperia.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific Nexperia product is automotive qualified, the

product is not suitable for automotive use. It is neither qualified nor tested in

accordance with automotive testing or application requirements. Nexperia

accepts no liability for inclusion and/or use of non-automotive qualified

products in automotive equipment or applications.

In no event shall Nexperia be liable for any indirect, incidental, punitive,

special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal

or replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards,

customer (a) shall use the product without Nexperia’s warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

Nexperia’s specifications such use shall be solely at customer’s own risk,

and (c) customer fully indemnifies Nexperia for any liability, damages or failed

product claims resulting from customer design and use of the product for

automotive applications beyond Nexperia’s standard warranty and Nexperia’s

product specifications.

Notwithstanding any damages that customer might incur for any reason

whatsoever, Nexperia’s aggregate and cumulative liability towards customer

for the products described herein shall be limited in accordance with the

Terms and conditions of commercial sale of Nexperia.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Right to make changes — Nexperia reserves the right to make changes

to information published in this document, including without limitation

specifications and product descriptions, at any time and without notice. This

document supersedes and replaces all information supplied prior to the

publication hereof.

Trademarks

Suitability for use — Nexperia products are not designed, authorized or

warranted to be suitable for use in life support, life-critical or safety-critical

systems or equipment, nor in applications where failure or malfunction

of an Nexperia product can reasonably be expected to result in personal

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

©

NXS0506

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 8 March 2022

16 / 17

Nexperia

NXS0506

SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

ESD protection

Contents

1. General description......................................................1

2. Features and benefits.................................................. 1

3. Applications.................................................................. 1

4. Ordering information....................................................2

5. Marking..........................................................................2

6. Block diagram...............................................................2

7. Functional diagram.......................................................3

8. Pinning information......................................................4

8.1. Pinning.........................................................................4

8.2. Pin description.............................................................4

9. Functional description................................................. 5

9.1. Level translator............................................................5

9.2. Enable and direction control........................................5

9.3. Feedback clock channel..............................................5

9.4. EMI filter...................................................................... 5

9.5. ESD protection............................................................ 5

9.6. Pin and channel naming..............................................6

10. Limiting values........................................................... 6

11. Recommended operating conditions........................6

12. Static characteristics..................................................7

13. Dynamic characteristics............................................ 8

13.1. Level translator..........................................................8

14. Application information........................................... 11

14.1. PCB design guidelines............................................ 11

15. Design and assembly recommendations............... 12

15.1. PCB design guidelines............................................ 12

15.2. PCB assembly guidelines for Pb-free soldering.......12

16. Package outline........................................................ 14

17. Abbreviations............................................................15

18. Revision history........................................................15

19. Legal information......................................................16

For more information, please visit: http://www.nexperia.com

For sales office addresses, please send an email to: salesaddresses@nexperia.com

Date of release: 8 March 2022

©

NXS0506

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 8 March 2022

17 / 17


型号：	NXS0506UP
厂家：	Nexperia
描述：	SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and ESD protectionProduction
文件：	总17页 (文件大小：260K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

NXS0506UP [NEXPERIA]

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