PBSS5130T [NEXPERIA]

30 V; 1 A PNP low VCEsat (BISS) transistorProduction;
PBSS5130T
型号: PBSS5130T
厂家: Nexperia    Nexperia
描述:

30 V; 1 A PNP low VCEsat (BISS) transistorProduction

开关 光电二极管 晶体管
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Important notice  
Dear Customer,  
On 7 February 2017 the former NXP Standard Product business became a new company with the  
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS  
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable  
application markets  
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use  
the references to Nexperia, as shown below.  
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,  
use http://www.nexperia.com  
Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use  
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Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on  
the version, as shown below:  
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights  
reserved  
Should be replaced with:  
- © Nexperia B.V. (year). All rights reserved.  
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail  
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understanding,  
Kind regards,  
Team Nexperia  
3
2
T
O
S
PBSS5130T  
30 V; 1 A PNP low VCEsat (BISS) transistor  
9 July 2013  
Product data sheet  
1. General description  
PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a small SOT23  
Surface-Mounted Device (SMD) plastic package.  
2. Features and benefits  
Small SMD plastic package  
Low collector-emitter saturation voltage VCEsat  
High collector current capability: IC and ICM  
Higher efficiency due to less heat generation  
AEC-Q101 qualified  
3. Applications  
DC-to-DC conversion  
Supply line switching  
Battery charger  
LCD backlighting  
Driver in low supply voltage applications (e.g. lamps and LEDs)  
4. Quick reference data  
Table 1.  
Symbol  
Quick reference data  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
VCEO  
collector-emitter  
voltage  
open base  
-
-
-30  
V
IC  
collector current  
-
-
-
-
-
-
-1  
A
ICM  
peak collector current single pulse; tp ≤ 1 ms  
-3  
A
RCEsat  
collector-emitter  
IC = -500 mA; IB = -50 mA; pulsed;  
tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C  
220  
mΩ  
saturation resistance  
Scan or click this QR code to view the latest information for this product  
 
 
 
 
NXP Semiconductors  
PBSS5130T  
30 V; 1 A PNP low VCEsat (BISS) transistor  
5. Pinning information  
Table 2.  
Pin  
Pinning information  
Symbol Description  
Simplified outline  
Graphic symbol  
3
C
1
2
3
B
E
C
base  
emitter  
collector  
B
1
2
E
sym132  
TO-236AB (SOT23)  
6. Ordering information  
Table 3.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
PBSS5130T  
TO-236AB  
plastic surface-mounted package; 3 leads  
SOT23  
7. Marking  
Table 4.  
Marking codes  
Type number  
Marking code  
[1]  
PBSS5130T  
%3E  
[1] % = placeholder for manufacturing site code  
PBSS5130T  
All information provided in this document is subject to legal disclaimers.  
© NXP N.V. 2013. All rights reserved  
Product data sheet  
9 July 2013  
2 / 11  
 
 
 
 
NXP Semiconductors  
PBSS5130T  
30 V; 1 A PNP low VCEsat (BISS) transistor  
8. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Parameter  
Conditions  
open emitter  
open base  
Min  
Max  
-30  
-30  
-5  
Unit  
V
collector-base voltage  
collector-emitter voltage  
emitter-base voltage  
collector current  
-
-
V
open collector  
-
V
-
-1  
A
ICM  
peak collector current  
peak base current  
total power dissipation  
single pulse; tp ≤ 1 ms  
Tamb ≤ 25 °C  
-
-3  
A
IBM  
-
-300  
300  
480  
150  
150  
150  
mA  
mW  
mW  
°C  
°C  
°C  
Ptot  
[1]  
[2]  
-
-
Tj  
junction temperature  
ambient temperature  
storage temperature  
-
Tamb  
Tstg  
-55  
-65  
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.  
[2]  
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.  
9. Thermal characteristics  
Table 6.  
Symbol  
Thermal characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
417  
260  
Unit  
K/W  
K/W  
Rth(j-a)  
thermal resistance  
from junction to  
ambient  
in free air  
[1]  
[2]  
-
-
-
-
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.  
[2]  
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.  
PBSS5130T  
All information provided in this document is subject to legal disclaimers.  
© NXP N.V. 2013. All rights reserved  
Product data sheet  
9 July 2013  
3 / 11  
 
 
 
NXP Semiconductors  
PBSS5130T  
30 V; 1 A PNP low VCEsat (BISS) transistor  
10. Characteristics  
Table 7.  
Symbol  
Characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
-100  
-50  
Unit  
nA  
ICBO  
collector-base cut-off  
VCB = -30 V; IE = 0 A; Tamb = 25 °C  
VCB = -30 V; IE = 0 A; Tj = 150 °C  
VEB = -4 V; IC = 0 A; Tamb = 25 °C  
-
-
-
-
-
-
current  
µA  
IEBO  
emitter-base cut-off  
current  
-100  
nA  
hFE  
DC current gain  
VCE = -2 V; IC = -100 mA; pulsed;  
tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C  
300  
450  
-
VCE = -2 V; IC = -500 mA; pulsed;  
tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C  
260  
350  
-
VCE = -2 V; IC = -1 A; pulsed;  
210  
290  
-
tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C  
VCEsat  
collector-emitter  
IC = -100 mA; IB = -1 mA; pulsed;  
tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C  
-
-
-100  
-225  
220  
-1.1  
-0.75  
-
mV  
mV  
mΩ  
V
saturation voltage  
IC = -1 A; IB = -50 mA; pulsed;  
-
-
tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C  
RCEsat  
VBEsat  
VBEon  
fT  
collector-emitter  
IC = -500 mA; IB = -50 mA; pulsed;  
tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C  
-
-
saturation resistance  
base-emitter saturation IC = -2 A; IB = -200 mA; pulsed;  
-
-
voltage  
tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C  
base-emitter turn-on  
voltage  
VCE = -2 V; IC = -100 mA; pulsed;  
tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C  
-
-
V
transition frequency  
VCE = -10 V; IC = -100 mA;  
f = 100 MHz; Tamb = 25 °C  
100  
-
200  
-
MHz  
pF  
Cc  
collector capacitance  
VCB = -10 V; IE = 0 A; ie = 0 A;  
f = 1 MHz; Tamb = 25 °C  
28  
PBSS5130T  
All information provided in this document is subject to legal disclaimers.  
© NXP N.V. 2013. All rights reserved  
Product data sheet  
9 July 2013  
4 / 11  
 
NXP Semiconductors  
PBSS5130T  
30 V; 1 A PNP low VCEsat (BISS) transistor  
aaa-006394  
aaa-006395  
1000  
-1.0  
C
I
(mA) = -3  
B
h
FE  
I
(A)  
-2.7  
-2.4  
-2.1  
800  
-0.8  
(1)  
-1.8  
-1.5  
600  
400  
200  
0
-0.6  
-0.4  
-0.2  
0
-1.2  
-0.9  
(2)  
(3)  
-0.6  
-0.3  
-1  
-10  
2
3
4
-1  
-10  
-10  
-10  
-10  
(mA)  
0
-1  
-2  
-3  
-4  
-5  
I
C
V
(V)  
CE  
VCE = -2 V  
Tamb = 25 °C  
(1) Tamb = 150 °C  
(2) Tamb = 25 °C  
(3) Tamb = -55 °C  
Fig. 2. Collector current as a function of collector-  
emitter voltage; typical values  
Fig. 1. DC current gain as a function of collector  
current; typical values  
aaa-006396  
aaa-006397  
-1200  
-1200  
V
BE  
(mV)  
V
BEsat  
(mV)  
(1)  
(2)  
(1)  
(2)  
-800  
-800  
(3)  
-400  
-400  
(3)  
0
0
-1  
-10  
2
3
4
-1  
-10  
2
3
4
-1  
-10  
-10  
-10  
-10  
(mA)  
-1  
-10  
-10  
-10  
-10  
I (mA)  
C
I
C
VCE = -2 V  
IC/IB = 20  
(1) Tamb = 150 °C  
(2) Tamb = 25 °C  
(3) Tamb = -55 °C  
(1) Tamb = -55 °C  
(2) Tamb = 25 °C  
(3) Tamb = 150 °C  
Fig. 3. Base-emitter voltage as a function of collector Fig. 4. Base-emitter saturation voltage as a function of  
current; typical values collector current; typical values  
PBSS5130T  
All information provided in this document is subject to legal disclaimers.  
© NXP N.V. 2013. All rights reserved  
Product data sheet  
9 July 2013  
5 / 11  
NXP Semiconductors  
PBSS5130T  
30 V; 1 A PNP low VCEsat (BISS) transistor  
aaa-006398  
aaa-006406  
3
3
-10  
10  
R
CEsat  
(Ω)  
V
(mV)  
CEsat  
2
(1)  
(2)  
10  
2
-10  
(3)  
10  
-10  
(1)  
(2)  
1
(3)  
-1  
-1  
10  
-1  
-10  
2
3
4
-1  
2
3
4
-1  
-10  
-10  
-10  
-10  
(mA)  
-10  
-1  
-10  
-10  
-10  
-10  
I (mA)  
C
I
C
IC/IB = 20  
IC/IB = 20  
(1) Tamb = 150 °C  
(2) Tamb = 25 °C  
(3) Tamb = -55 °C  
(1) Tamb = 150 °C  
(2) Tamb = 25 °C  
(3) Tamb = -55 °C  
Fig. 5. Collector-emitter saturation voltage as a  
function of collector current; typical values  
Fig. 6. Collector-emitter saturation resistance as a  
function of collector current; typical values  
11. Test information  
11.1 Quality information  
This product has been qualified in accordance with the Automotive Electronics Council  
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is  
suitable for use in automotive applications.  
12. Package outline  
3.0  
2.8  
1.1  
0.9  
3
0.45  
0.15  
2.5 1.4  
2.1 1.2  
1
2
0.48  
0.38  
0.15  
0.09  
1.9  
Dimensions in mm  
04-11-04  
Fig. 7. Package outline TO-236AB (SOT23)  
PBSS5130T  
All information provided in this document is subject to legal disclaimers.  
© NXP N.V. 2013. All rights reserved  
Product data sheet  
9 July 2013  
6 / 11  
 
 
 
NXP Semiconductors  
PBSS5130T  
30 V; 1 A PNP low VCEsat (BISS) transistor  
13. Soldering  
3.3  
2.9  
1.9  
solder lands  
solder resist  
2
3
1.7  
solder paste  
occupied area  
0.6  
0.7  
(3×)  
(3×)  
Dimensions in mm  
0.5  
(3×)  
0.6  
(3×)  
1
sot023_fr  
Fig. 8. Reflow soldering footprint for TO-236AB (SOT23)  
2.2  
1.2  
(2×)  
1.4  
(2×)  
solder lands  
solder resist  
2.6  
4.6  
occupied area  
Dimensions in mm  
1.4  
preferred transport direction during soldering  
2.8  
4.5  
sot023_fw  
Fig. 9. Wave soldering footprint for TO-236AB (SOT23)  
PBSS5130T  
All information provided in this document is subject to legal disclaimers.  
© NXP N.V. 2013. All rights reserved  
Product data sheet  
9 July 2013  
7 / 11  
 
NXP Semiconductors  
PBSS5130T  
30 V; 1 A PNP low VCEsat (BISS) transistor  
14. Revision history  
Table 8.  
Revision history  
Data sheet ID  
PBSS5130T v.2  
Modifications:  
Release date  
Data sheet status  
Change notice  
Supersedes  
20130709  
Product data sheet  
-
PBSS5130T v.1  
The format of this document has been redesigned to comply with the new identity guidelines  
of NXP Semiconductors.  
Legal texts have been adapted to the new company name where appropriate.  
Sections "General description", "Features and benefits" and "Applications": updated  
Section "Marking": updated  
Table "Limiting values": ambient temperature Tamb updated  
Table "Characteristics": base-emitter saturation voltage VBEsat added  
Figures 1 to 6: added  
Section "Test information": added  
Figure "Package outline TO-236AB (SOT23)": replaced by minimized outline drawing  
Section "Soldering": added  
Section "Legal information": updated  
PBSS5130T v.1  
20031212  
Product data sheet  
-
-
PBSS5130T  
All information provided in this document is subject to legal disclaimers.  
© NXP N.V. 2013. All rights reserved  
Product data sheet  
9 July 2013  
8 / 11  
 
NXP Semiconductors  
PBSS5130T  
30 V; 1 A PNP low VCEsat (BISS) transistor  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation -  
lost profits, lost savings, business interruption, costs related to the removal  
or replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
15. Legal information  
15.1 Data sheet status  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Document  
Product  
Definition  
status [1][2] status [3]  
Objective  
[short] data  
sheet  
Development This document contains data from  
the objective specification for product  
development.  
Right to make changes — NXP Semiconductors reserves the right to  
make changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Preliminary  
[short] data  
sheet  
Qualification This document contains data from the  
preliminary specification.  
Suitability for use in automotive applications — This NXP  
Semiconductors product has been qualified for use in automotive  
applications. Unless otherwise agreed in writing, the product is not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer's own  
risk.  
Product  
[short] data  
sheet  
Production  
This document contains the product  
specification.  
[1] Please consult the most recently issued document before initiating or  
completing a design.  
[2] The term 'short data sheet' is explained in section "Definitions".  
[3] The product status of device(s) described in this document may have  
changed since this document was published and may differ in case of  
multiple devices. The latest product status information is available on  
the Internet at URL http://www.nxp.com.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
15.2 Definitions  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Preview — The document is a preview version only. The document is still  
subject to formal approval, which may result in modifications or additions.  
NXP Semiconductors does not give any representations or warranties as to  
the accuracy or completeness of information included herein and shall have  
no liability for the consequences of use of such information.  
Customers are responsible for the design and operation of their  
applications and products using NXP Semiconductors products, and NXP  
Semiconductors accepts no liability for any assistance with applications or  
customer product design. It is customer’s sole responsibility to determine  
whether the NXP Semiconductors product is suitable and fit for the  
customer’s applications and products planned, as well as for the planned  
application and use of customer’s third party customer(s). Customers should  
provide appropriate design and operating safeguards to minimize the risks  
associated with their applications and products.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences  
of use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is  
intended for quick reference only and should not be relied upon to contain  
detailed and full information. For detailed and full information see the  
relevant full data sheet, which is available on request via the local NXP  
Semiconductors sales office. In case of any inconsistency or conflict with the  
short data sheet, the full data sheet shall prevail.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default  
in the customer’s applications or products, or the application or use by  
customer’s third party customer(s). Customer is responsible for doing all  
necessary testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications  
and the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product  
is deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those  
given in the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
15.3 Disclaimers  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Limited warranty and liability — Information in this document is believed  
to be accurate and reliable. However, NXP Semiconductors does not give  
any representations or warranties, expressed or implied, as to the accuracy  
or completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
PBSS5130T  
All information provided in this document is subject to legal disclaimers.  
© NXP N.V. 2013. All rights reserved  
Product data sheet  
9 July 2013  
9 / 11  
 
 
 
 
 
NXP Semiconductors  
PBSS5130T  
30 V; 1 A PNP low VCEsat (BISS) transistor  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and  
trademarks are the property of their respective owners.  
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,  
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,  
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,  
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,  
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.  
HD Radio and HD Radio logo — are trademarks of iBiquity Digital  
Corporation.  
PBSS5130T  
All information provided in this document is subject to legal disclaimers.  
© NXP N.V. 2013. All rights reserved  
Product data sheet  
9 July 2013  
10 / 11  
 
NXP Semiconductors  
PBSS5130T  
30 V; 1 A PNP low VCEsat (BISS) transistor  
16. Contents  
1
2
3
4
5
6
7
8
9
10  
General description ............................................... 1  
Features and benefits ............................................1  
Applications ........................................................... 1  
Quick reference data ............................................. 1  
Pinning information ...............................................2  
Ordering information .............................................2  
Marking ...................................................................2  
Limiting values .......................................................3  
Thermal characteristics .........................................3  
Characteristics .......................................................4  
11  
Test information .....................................................6  
11.1  
Quality information ............................................... 6  
12  
13  
14  
Package outline ..................................................... 6  
Soldering ................................................................ 7  
Revision history .....................................................8  
15  
Legal information ...................................................9  
Data sheet status ................................................. 9  
Definitions .............................................................9  
Disclaimers ...........................................................9  
Trademarks ........................................................ 10  
15.1  
15.2  
15.3  
15.4  
© NXP N.V. 2013. All rights reserved  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 9 July 2013  
PBSS5130T  
All information provided in this document is subject to legal disclaimers.  
© NXP N.V. 2013. All rights reserved  
Product data sheet  
9 July 2013  
11 / 11  

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PBSS5140D

40 V low VCEsat PNP transistor
NXP

PBSS5140S

40 V low VCEsat PNP transistor
NXP

PBSS5140T

40 V low VCEsat PNP transistor
NXP

PBSS5140T

40 V, 1 A PNP low VCEsat BISS transistorProduction
NEXPERIA

PBSS5140T,215

PBSS5140T - 40 V, 1 A PNP low VCEsat BISS transistor TO-236 3-Pin
NXP

PBSS5140T/ZLR

TRANS BISS TO-236AB
ETC

PBSS5140TTRL

TRANSISTOR 1000 mA, 40 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB, BIP General Purpose Small Signal
NXP

PBSS5140TTRL13

TRANSISTOR 1000 mA, 40 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB, BIP General Purpose Small Signal
NXP

PBSS5140U

40 V low VCEsat PNP transistor
NXP

PBSS5140U

40 V low VCEsat PNP transistorProduction
NEXPERIA

PBSS5140U,115

PBSS5140U - 40 V low VCEsat PNP transistor SC-70 3-Pin
NXP