PDTA143XMB [NEXPERIA]

PNP resistor-equipped transistor; R1 = 4.7 kΩ, R2 = 10 kΩProduction;


型号：	PDTA143XMB
厂家：	Nexperia
描述：	PNP resistor-equipped transistor; R1 = 4.7 kΩ, R2 = 10 kΩProduction 开关晶体管
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中文：	中文翻译
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PDTA143XMB

SOT883B

PNP resistor-equipped transistor; R1 = 4.7 kΩ, R2 = 10 kΩ

Rev. 1 — 1 June 2012

Product data sheet

1. Product profile

1.1 General description

PNP Resistor-Equipped Transistor (RET) in a leadless ultra small SOT883B

Surface-Mounted Device (SMD) plastic package.

NPN complement: PDTC143XMB.

1.2 Features and benefits

 100 mA output current capability

 Reduces component count

 Built-in bias resistors

 Simplifies circuit design

 AEC-Q101 qualified

 Leadless ultra small SMD plastic

package

 Reduces pick and place costs

 Low package height of 0.37 mm

1.3 Applications

 Low-current peripheral driver

 Control of IC inputs

 Replaces general-purpose transistors

in digital applications

 Mobile applications

1.4 Quick reference data

Table 1.

Symbol

V_CEO

Quick reference data

Parameter

Conditions

Min

Typ

Max

Unit

collector-emitter

voltage

open base

-50

I_O

output current

-100

6.1

bias resistor 1 (input)

bias resistor ratio

T_amb= 25 °C

3.3

1.7

4.7

2.1

kΩ

R2/R1

2.6

PDTA143XMB

NXP Semiconductors

PNP resistor-equipped transistor; R1 = 4.7 kΩ, R2 = 10 kΩ

2. Pinning information

Table 2.

Pinning information

Symbol Description

Simplified outline

Graphic symbol

input (base)

GND (emitter)

output (collector)

Transparent

top view

SOT883B (DFN1006B-3)

sym003

3. Ordering information

Table 3.

Ordering information

Type number

Package

Name

Description

Version

PDTA143XMB

DFN1006B-3

Leadless ultra small plastic package; 3 solder lands;

body 1.0 x 0.6 x 0.37 mm

SOT883B

4. Marking

Table 4.

Marking codes

Type number

PDTA143XMB

Marking code

0010 1001

PIN 1 INDICATION

READING DIRECTION

READING EXAMPLE:

0111

1011

MARKING CODE

(EXAMPLE)

READING DIRECTION

006aac673

Fig 1. DFN1006B-3 (SOT883B) binary marking code description

PDTA143XMB

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 1 June 2012

2 of 11

PDTA143XMB

NXP Semiconductors

PNP resistor-equipped transistor; R1 = 4.7 kΩ, R2 = 10 kΩ

5. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_CBO

V_CEO

V_EBO

V_I

Parameter

Conditions

open emitter

open base

open collector

positive

Min

Max

-50

-7

Unit

collector-base voltage

collector-emitter voltage

emitter-base voltage

input voltage

negative

-20

-100

250

150

I_O

output current

°C

I_CM

P_tot

T_j

peak collector current

total power dissipation

junction temperature

ambient temperature

storage temperature

pulsed; t_p≤ 1 ms

T_amb≤ 25 °C

[1]

T_amb

T_stg

-65

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

006aad009

300

tot

(mW)

200

100

-75

-25

125

175

(°C)

amb

FR4 PCB, standard footprint

Fig 2. Power derating curve for DFN1006B-3 (SOT883B)

6. Thermal characteristics

Table 6.

Symbol

R_th(j-a)

Thermal characteristics

Parameter

Conditions

Min

Typ

Max

Unit

[1]

thermal resistance

from junction to

ambient

in free air

500

K/W

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

PDTA143XMB

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Product data sheet

Rev. 1 — 1 June 2012

3 of 11

PDTA143XMB

NXP Semiconductors

PNP resistor-equipped transistor; R1 = 4.7 kΩ, R2 = 10 kΩ

006aab603

duty cycle =

th(j-a)

0.75

0.33

(K/W)

0.5

0.2

0.1

0.05

0.02

0.01

−5

−4

−3

−2

−1

(s)

FR4 PCB, standard footprint

Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

7. Characteristics

Table 7.

Symbol

I_CBO

Characteristics

Parameter

Conditions

Min

Typ

Max

Unit

collector-base cut-off

current

V_CB= -50 V; I_E= 0 A; T_amb= 25 °C

-100

I_CEO

collector-emitter cut-off V_CE= -30 V; I_B= 0 A; T_amb= 25 °C

-1

µA

current

V_CE= -30 V; I_B= 0 A; T_j= 150 °C

-5

I_EBO

emitter-base cut-off

current

V_EB= -5 V; I_C= 0 A; T_amb= 25 °C

-600

h_FE

DC current gain

V_CE= -5 V; I_C= -10 mA; T_amb= 25 °C

I_C= -10 mA; I_B= -0.5 mA; T_amb= 25 °C

V_CEsat

collector-emitter

-100

saturation voltage

V_I(off)

V_I(on)

off-state input voltage V_CE= -5 V; I_C= -100 µA; T_amb= 25 °C

on-state input voltage V_CE= -0.3 V; I_C= -20 mA; T_amb= 25 °C

-0.9

-1.5

4.7

2.1

-0.3

-2.5

3.3

1.7

bias resistor 1 (input)

bias resistor ratio

T_amb= 25 °C

6.1

2.6

kΩ

R2/R1

C_C

collector capacitance

V_CB= -10 V; I_E= 0 A; i_e= 0 A;

f = 1 MHz; T_amb= 25 °C

[1]

f_T

transition frequency

V_CE= -5 V; I_C= -10 mA; f = 100 MHz;

T_amb= 25 °C

180

MHz

[1] Characteristics of built-in transistor.

PDTA143XMB

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Product data sheet

Rev. 1 — 1 June 2012

4 of 11

PDTA143XMB

NXP Semiconductors

PNP resistor-equipped transistor; R1 = 4.7 kΩ, R2 = 10 kΩ

006aac846

006aac847

-1

(1)

(2)

(3)

CEsat

(V)

-1

-10

(1)

(2)

(3)

-2

-10

-1

-10

-1

-10

(mA)

I (mA)

V_CE= -5 V

I_C/I_B= 20

(1) T_amb= 100 °C

(2) T_amb= 25 °C

(3) T_amb= -40 °C

(1) T_amb= 100 °C

(2) T_amb= 25 °C

(3) T_amb= -40 °C

Fig 4. DC current gain as a function of collector

current; typical values

Fig 5. Collector-emitter saturation voltage as a

function of collector current; typical values

006aac848

006aac849

-10

I(off)

I(on)

(V)

(1)

(2)

-1

(2)

(3)

-1

-10

-1

-10

-1

-10

-1

-10

(mA)

I (mA)

V_CE= -0.3 V

_CE= -5 V

(1) T_amb= -40 °C

(2) T_amb= 25 °C

(3) T_amb= 100 °C

(1) T_amb= -40 °C

(2) T_amb= 25 °C

(3) T_amb= 100 °C

Fig 6. On-state input voltage as a function of collector

current; typical values

Fig 7. Off-state input voltage as a function of collector

current; typical values

PDTA143XMB

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Product data sheet

Rev. 1 — 1 June 2012

5 of 11

PDTA143XMB

NXP Semiconductors

PNP resistor-equipped transistor; R1 = 4.7 kΩ, R2 = 10 kΩ

006aac850

006aac763

(pF)

(MHz)

-10

-1

-10

-20

-30

-40

-50

(V)

-1

-10

I (mA)

f = 1 MHz; T_amb= 25 °C

V_CE= -5 V; T_amb= 25 °C

Fig 8. Collector capacitance as a function of

collector-base voltage; typical values

Fig 9. Transition frequency as a function of collector

current; typical values of built-in transistor

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in automotive applications.

PDTA143XMB

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Product data sheet

Rev. 1 — 1 June 2012

6 of 11

PDTA143XMB

NXP Semiconductors

PNP resistor-equipped transistor; R1 = 4.7 kΩ, R2 = 10 kΩ

9. Package outline

0.65

0.55

0.40

0.34

0.35

0.20

0.04 max

0.12

0.30

0.22

1.05

0.95

0.65

0.30

0.22

0.55

0.47

Dimensions in mm

11-11-02

Fig 10. Package outline SOT883B (DFN1006B-3)

10. Soldering

Footprint information for reflow soldering

SOT883B

1.3

0.7

R0.05 (8x)

0.9

0.6 0.7

0.25

(2x)

0.3

(2x)

0.3

0.4

(2x)

solder land

solder land plus solder paste

solder paste deposit

occupied area

solder resist

Dimensions in mm

sot883b_fr

Fig 11. Reflow soldering footprint for SOT883B (DFN1006B-3)

PDTA143XMB

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Product data sheet

Rev. 1 — 1 June 2012

7 of 11

PDTA143XMB

NXP Semiconductors

PNP resistor-equipped transistor; R1 = 4.7 kΩ, R2 = 10 kΩ

11. Revision history

Table 8.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

PDTA143XMB v.1

20120601

Product data sheet

PDTA143XMB

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Product data sheet

Rev. 1 — 1 June 2012

8 of 11

PDTA143XMB

NXP Semiconductors

PNP resistor-equipped transistor; R1 = 4.7 kΩ, R2 = 10 kΩ

12. Legal information

12.1 Data sheet status

Document status^{[1] [2]}

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term 'short data sheet' is explained in section "Definitions".

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product

status information is available on the Internet at URLhttp://www.nxp.com.

Right to make changes — NXP Semiconductors reserves the right to make

12.2 Definitions

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modifications or additions.

NXP Semiconductors does not give any representations or warranties as to

the accuracy or completeness of information included herein and shall have

no liability for the consequences of use of such information.

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

applications. Unless otherwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer's own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

12.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with theTerms and conditions of commercial sale of NXP Semiconductors.

PDTA143XMB

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Product data sheet

Rev. 1 — 1 June 2012

9 of 11

PDTA143XMB

NXP Semiconductors

PNP resistor-equipped transistor; R1 = 4.7 kΩ, R2 = 10 kΩ

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published athttp://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

12.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G

reenChip,HiPerSmart,HITAG,I²C-bus

logo,ICODE,I-CODE,ITEC,Labelution,MIFARE,MIFARE Plus,MIFARE

Ultralight,MoReUse,QLPAK,Silicon

Tuner,SiliconMAX,SmartXA,STARplug,TOPFET,TrenchMOS,TriMedia

andUCODE — are trademarks of NXP B.V.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

HD Radio andHD Radio logo — are trademarks of iBiquity Digital

Corporation.

Export control — This document as well as the item(s) described herein may

be subject to export control regulations. Export might require a prior

authorization from competent authorities.

13. Contact information

For more information, please visit:http://www.nxp.com

For sales office addresses, please send an email to:salesaddresses@nxp.com

PDTA143XMB

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Product data sheet

Rev. 1 — 1 June 2012

10 of 11

PDTA143XMB

NXP Semiconductors

PNP resistor-equipped transistor; R1 = 4.7 kΩ, R2 = 10 kΩ

14. Contents

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1

General description . . . . . . . . . . . . . . . . . . . . . .1

Features and benefits. . . . . . . . . . . . . . . . . . . . .1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Quick reference data . . . . . . . . . . . . . . . . . . . . .1

1.1

1.2

1.3

1.4

Pinning information. . . . . . . . . . . . . . . . . . . . . . .2

Ordering information. . . . . . . . . . . . . . . . . . . . . .2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3

Thermal characteristics . . . . . . . . . . . . . . . . . . .3

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .4

Test information. . . . . . . . . . . . . . . . . . . . . . . . . .6

Quality information . . . . . . . . . . . . . . . . . . . . . . .6

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .7

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . .8

8.1

Legal information. . . . . . . . . . . . . . . . . . . . . . . . .9

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .9

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .10

12.1

12.2

12.3

12.4

Contact information. . . . . . . . . . . . . . . . . . . . . .10

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 1 June 2012

Document identifier: PDTA143XMB

PDTA143XMB [NEXPERIA]

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