PESD1USB3S [NEXPERIA]
ESD protection for differential data linesProduction;
| 型号： | PESD1USB3S |
| 厂家： | 
Nexperia |
| 描述： | ESD protection for differential data linesProduction |
| 文件： | 总16页 (文件大小：996K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PESDxUSB3S series
ESD protection for differential data lines
Rev. 4 — 30 January 2019
Product data sheet
1. Product profile
1.1. General description
The devices are ElectroStatic Discharge (ESD) protection for one, two and three differential
channels.
The devices are footprint compatible to PCMFxUSB3S common mode filters with ESD protection.
Diodes provide protection to downstream components from ESD voltages up to ±15 kV on each
signal line.
Table 1. Product overview
Type number
PESD1USB3S
PESD2USB3S
PESD3USB3S
Number of channels Package Name
1
2
3
WLCSP5
WLCSP10
WLCSP15
1.2. Features and benefits
•
•
•
•
Allows switching between PCMFxUSB3S common mode filters with ESD protection and
PESDxUSB3S ESD protection in the same footprint
TrEOS protection process for very high system-level ESD robustness: superior protection of
sensitive Systems on Chips (SoCs)
ESD protection for one, two and three differential channels up to ±15 kV contact discharge
according to IEC 61000-4-2
Industry-standard WLCSP5, 10 and 15 packages for smallest footprint
1.3. Applications
•
•
•
•
•
Smartphone, cellular and cordless phone
USB3.1, USB2.0, HDMI2.0, HDMI1.4
General-purpose downstream ESD protection for differential data lines
Tablet PC and Mobile Internet Device (MID)
MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)
Nexperia
PESDxUSB3S series
ESD protection for differential data lines
2. Pinning information
Table 2. Pinning
Pin
Symbol
Description
Simplified outline
Graphic symbol
PESD1USB3S (WLCSP5_2-1-2)
A1
A2
C1
C2
A1
A2
B1
C1
C2
CH1_IN+
channel 1+, external
channel 1-, external
ground channel 1
2
CH1_IN-
B1
GND_CH1
CH1_OUT+
CH1_OUT-
1
channel 1+, internal
channel 1-, internal
C
A
B
Transparent top view
WLCSP5_2-1-2
B1
aaa-021381
PESD2USB3S (WLCSP10_4-2-4)
A1, 3
C1, 3
C2, 4
A1
A2
A3
A4
B1
B2
C1
C2
C3
C4
CH1_IN+
channel 1+, external
channel 1-, external
channel 2+, external
channel 2-, external
ground channel 1
4
3
2
A2, 4
CH1_IN-
B2
B1
CH2_IN+
CH2_IN-
GND_CH1
GND_CH2
CH1_OUT+
CH1_OUT-
CH2_OUT+
CH2_OUT-
ground channel 2
1
B1, B2 - no internal connection
channel 1+, internal
channel 1-, internal
channel 2+, internal
channel 2-, internal
C
A
B
aaa-021384
Transparent top view
WLCSP10_4-2-4
PESD3USB3S (WLCSP15_6-3-6)
A1, 3, 5
A2, 4, 6
C1, 3, 5
C2, 4, 6
A1
A2
A3
A4
A5
A6
B1
B2
B3
C1
C2
C3
C4
C5
C6
CH1_IN+
channel 1+, external
channel 1-, external
channel 2+, external
channel 2-, external
channel 3+, external
channel 3-, external
ground channel 1
6
CH1_IN-
B3
B2
CH2_IN+
5
4
3
2
1
CH2_IN-
CH3_IN+
CH3_IN-
B1, B2, B3 - no internal connection
GND_CH1
GND_CH2
GND_CH3
CH1_OUT+
CH1_OUT-
CH2_OUT+
CH2_OUT-
CH3_OUT+
CH3_OUT-
aaa-021385
ground channel 2
B1
B
ground channel 3
channel 1+, internal
channel 1-, internal
channel 2+, internal
channel 2-, internal
channel 3+, internal
channel 3-, internal
C
A
Transparent top view
WLCSP15_6-3-6
©
PESDXUSB3S_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
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Nexperia
PESDxUSB3S series
ESD protection for differential data lines
3. Ordering information
Table 3. Ordering information
Type number
Package
Name
Description
PESD1USB3S
PESD2USB3S
PESD3USB3S
WLCSP5
WLCSP10
WLCSP15
wafer level chip-size package; 5 bumps (2-1-2)
wafer level chip-size package; 10 bumps (4-2-4)
wafer level chip-size package; 15 bumps (6-3-6)
4. Marking
Table 4. Marking codes
Type number
Marking code
PD1S
PESD1USB3S
PESD2USB3S
PESD3USB3S
PD2S
PD3S
5. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VI
Parameter
Conditions
Min
Max
Unit
input voltage
-0.5
5
V
VESD
electrostatic discharge IEC 61000-4-2, level 4; all
voltage
input pins to ground
-15
-15
15
15
kV
kV
•
•
contact discharge
air discharge
IEC 61000-4-2, level 4; all
output pins to ground
-2
-2
-8
2
2
8
kV
kV
A
•
•
contact discharge
air discharge
IPPM
rated peak-pulse
current
tp = 8/20 μs
Tstg
storage temperature
ambient temperature
-40
-40
+125
+125
°C
°C
Tamb
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PESDXUSB3S_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
3 / 16
Nexperia
PESDxUSB3S series
ESD protection for differential data lines
6. Characteristics
6.1. Channel characteristics
Table 6. Channel characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
[1] -
Typ
0.45
1
Max Unit
Cd
diode capacitance
f = 1 MHz; VI = 2.5 V
-
pF
nA
V
IRM
VBR
VF
reverse leakage current per line; VI = 5 V
-
100
breakdown voltage
forward voltage
IR = 1 mA
IF = 10 mA
TLP
6
-
9
-
-
0.8
V
Rdyn
dynamic resistance
[2]
[3]
-
-
0.16
0.16
-
-
Ω
Ω
•
•
positive transient
negative transient
surge
-
-
0.25
0.25
-
-
Ω
Ω
•
•
positive transient
negative transient
[1] This parameter is guaranteed by design.
[2] 100 ns Transmission Line Pulse (TLP); 50 Ω; pulser at 70 to 90 ns.
[3] According to IEC 61000-4-5 (8/20 μs).
6.2. Frequency characteristics
Table 7. Frequency characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
Differential mode: Sdd21
f-3dB
cut-off frequency
[1] -
17
-
GHz
[1] Normalized to attenuation at 1 MHz.
aaa-021319
aaa-021320
1
0
S
dd21
S
dd21
(dB)
(dB)
-1
-20
S
A3-A4 > C1-C2
dd21
-3
-5
-7
-40
-60
-80
S
pin 1 - 2
pin 5 - 6
S
A5-A6 > C1-C2
dd21
dd21
dd21
S
9
7
8
10
11
8
9
10
11
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
Fig. 1. Differential mode insertion loss; typical values Fig. 2. Differential cross-talk; typical values
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PESDXUSB3S_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
4 / 16
Nexperia
PESDxUSB3S series
ESD protection for differential data lines
aaa-021321
115
Z
dif
(Ω)
105
Z reference
Z DUT
95
85
40.70
40.90
40.11
4.13
t (ns)
tr = 200 ps
Fig. 3. Differential Time Domain Reflectometer (TDR) plot; typical values
aaa-021322
Fig. 4. USB3.1 eye diagram 10 Gbps, test board with PESD3USB3S; typical values
aaa-021323
Fig. 5. USB3.1 eye diagram 10 Gbps, test board without device; typical values
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PESDXUSB3S_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
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Nexperia
PESDxUSB3S series
ESD protection for differential data lines
aaa-021324
Fig. 6. HDMI 2.0 eye diagram TP1, test board with PESD3USB3S; typical values
aaa-021325
Fig. 7. HDMI 2.0 eye diagram TP1, test board without device; typical values
aaa-021326
aaa-021327
25
0
I
I
(A)
(A)
20
-5
15
10
5
-10
-15
-20
-25
0
0
5
10
15
20
25
-25
-20
-15
-10
-5
0
V
(V)
V
(V)
CL
CL
Transmission Line Pulse (TLP) = 100 ns
Transmission Line Pulse (TLP) = 100 ns
Fig. 8. Dynamic resistance with positive clamping;
typical values
Fig. 9. Dynamic resistance with negative; typical
values
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PESDXUSB3S_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
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Nexperia
PESDxUSB3S series
ESD protection for differential data lines
aaa-021328
aaa-021329
25
0
I
I
(A)
(A)
20
15
10
5
-5
-10
-15
-20
-25
0
0
5
10
15
20
25
-25
-20
-15
-10
-5
0
V
(V)
V
(V)
CL
CL
Transmission Line Pulse (TLP) = 5 ns
Transmission Line Pulse (TLP) = 5 ns
Fig. 10. Dynamic resistance with positive clamping;
typical values
Fig. 11. Dynamic resistance with negative clamping;
typical values
The device uses an advanced clamping structure showing a negative dynamic resistance.
This snap-back behavior strongly reduces the clamping voltage to the system behind the ESD
protection during an ESD event. Do not connect unlimited DC current sources to the data lines to
avoid keeping the ESD protection device in snap-back state after exceeding breakdown voltage
(due to an ESD pulse for instance).
aaa-021330
aaa-021331
10
0
-2
-4
-6
-8
I
I
(A)
(A)
8
6
4
2
0
-10
-10
0
2
4
6
8
10
-8
-6
-4
-2
0
V
(V)
V
(V)
CL
CL
IEC61000-4-5; tp = 8/20 μs; positive pulse
IEC61000-4-5; tp = 8/20 μs; negative pulse
Fig. 12. Dynamic resistance with positive clamping;
typical values
Fig. 13. Dynamic resistance with negative clamping;
typical values
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PESDXUSB3S_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
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Nexperia
PESDxUSB3S series
ESD protection for differential data lines
7. Application information
The device is designed to provide high-level ESD protection for differential high-speed data line
pairs such as:
•
•
•
•
•
•
USB 3.2
HDMI 2.0
Transition-Minimized Differential Signaling (TMDS)
DisplayPort
external Serial Advanced Technology Attachment (eSATA)
Low Voltage Differential Signaling (LVDS)
When designing the Printed-Circuit Board (PCB), give careful consideration to impedance matching
and signal coupling. Do not connect the protected signal lines to unlimited current sources like, for
example, a battery.
Fig. 14. Application diagram: protecting the differential data lines of a USB Type-C
connector evaluation dongle with PESD1USB3S
Since the SuperSpeed TX/RX lines are separated by GND or VBUS from the Hi-Speed lines,
PESD1USB3S makes it easy to achieve same signal lengths, straight routing, and optimal
positioning for ESD protection directly at the connector.
©
PESDXUSB3S_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
8 / 16
Nexperia
PESDxUSB3S series
ESD protection for differential data lines
8. Package outline
WLCSP5: wafer level chip-size package; 5 bumps (2-1-2)
PESD1USB3S
D
bump A1
index area
A
1
E
A
detail X
e
1/2 e
b
C
e
1
B1
e
B
A
2
1
2
bump A1
index area
X
0
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
max 0.60 0.38 0.31 0.82 1.22
A
A
b
D
E
e
e
e
2
1
1
nom
min
mm
0.57 0.37 0.26 0.77 1.17 0.40 0.40 0.80
0.54 0.36 0.21 0.72 1.12
pesd1usb3s_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
15-12-11
PESD1USB3S
Fig. 15. Package outline WLCSP5
©
PESDXUSB3S_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
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Nexperia
PESDxUSB3S series
ESD protection for differential data lines
WLCSP10: wafer level chip-size package; 10 bumps (4-2-4)
PESD2USB3S
D
bump A1
index area
A
1
E
A
detail X
e
b
C
B
A
e
1
B1
B2
e
2
bump A1
index area
1
2
3
4
e
3
X
1/2 e
0
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
max 0.60 0.38 0.31 1.62 1.22
A
A
b
D
E
e
e
e
2
e
3
1
1
nom
min
mm
0.57 0.37 0.26 1.57 1.17 0.40 0.40 0.80 0.80
0.54 0.36 0.21 1.52 1.12
pesd2usb3s_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
15-12-11
PESD2USB3S
Fig. 16. Package outline WLCSP10
©
PESDXUSB3S_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
10 / 16
Nexperia
PESDxUSB3S series
ESD protection for differential data lines
WLCSP15: wafer level chip-size package; 15 bumps (6-3-6)
PESD3USB3S
D
bump A1
index area
A
1
E
A
detail X
e
1/2 e
b
C
B
A
e
1
B1
B2
B3
e
2
1
2
3
4
5
6
bump A1
index area
e
3
X
0
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
max 0.60 0.38 0.31 2.42 1.22
A
A
b
D
E
e
e
e
2
e
3
1
1
nom
min
mm
0.57 0.37 0.26 2.37 1.17 0.40 0.40 0.80 0.80
0.54 0.36 0.21 2.32 1.12
pesd3usb3s_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
15-12-11
PESD3USB3S
Fig. 17. Package outline WLCSP15
©
PESDXUSB3S_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
11 / 16
Nexperia
PESDxUSB3S series
ESD protection for differential data lines
9. Soldering
WLCSP5: Solder footprint and stencil aperture
PESD1USB3S
Hx
P
see
detail X
P
solder land (SL)
Hy
solder paste deposit (SP)
solder land plus solder paste
solder resist opening (SR)
occupied area
SL = SP
SR
detail X
Dimensions in mm
recommend stencil thickness: 0.1 mm
15-12-11
P
SL SP SR Hx Hy
0.40 0.25 0.25 0.325 1.00 1.40
pesd1usb3s_fr
Fig. 18. Soldering footprint WLCSP5 (PESD1USB3S)
WLCSP10: Solder footprint and stencil aperture
PESD2USB3S
Hx
P
see
detail X
P
solder land (SL)
Hy
solder paste deposit (SP)
solder land plus solder paste
solder resist opening (SR)
occupied area
SL = SP
SR
P1
detail X
Dimensions in mm
recommend stencil thickness: 0.1 mm
P
P1
SL SP SR Hx
Hy
15-12-14
15-12-16
0.40 0.80 0.25 0.25 0.325 1.80 1.40
pesd2usb3s_fr
Fig. 19. Soldering footprint WLCSP10 (PESD2USB3S)
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PESDXUSB3S_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
12 / 16
Nexperia
PESDxUSB3S series
ESD protection for differential data lines
WLCSP15: Solder footprint and stencil aperture
PESD3USB3S
Hx
P
see
detail X
P
solder land (SL)
Hy
solder paste deposit (SP)
solder land plus solder paste
solder resist opening (SR)
occupied area
SL = SP
SR
P1
detail X
Dimensions in mm
recommend stencil thickness: 0.1 mm
P
P1
SL SP SR Hx
Hy
15-12-14
15-12-16
0.40 0.80 0.25 0.25 0.325 2.60 1.40
pesd3usb3s_fr
Fig. 20. Soldering footprint WLCSP15 (PESD3USB3S)
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PESDXUSB3S_SER
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Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
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Nexperia
PESDxUSB3S series
ESD protection for differential data lines
10. Revision history
Table 8. Revision history
Document ID
Release
date
Data sheet status
Change
notice
Supersedes
PESDXUSB3S_SER v.4
Modifications:
20190130
Product data sheet
-
PESDXUSB3S_SER v.3
•
•
Limiting values: maximum value for Tamb updated
Frequency characteristics: table and Fig 2 + 3: S21dd changed to Sdd21
PESDXUSB3S_SER v.3
PESDXUSB3S_SER v.2
PESDXUSB3S_SER v.1
20160426
20160127
20151216
Product data sheet
Product data sheet
-
-
PESDXUSB3S_SER v.2
PESDXUSB3S_SER v.1
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PESDXUSB3S_SER
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Product data sheet
Rev. 4 — 30 January 2019
14 / 16
Nexperia
PESDxUSB3S series
ESD protection for differential data lines
equipment, nor in applications where failure or malfunction of an Nexperia
product can reasonably be expected to result in personal injury, death or
severe property or environmental damage. Nexperia and its suppliers accept
no liability for inclusion and/or use of Nexperia products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
11. Legal information
Data sheet status
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
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Definition
[1][2]
status [3]
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without further testing or modification.
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data sheet
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This document contains data from
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product development.
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Production
This document contains data from
the preliminary specification.
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Product [short]
data sheet
This document contains the product
specification.
[1] Please consult the most recently issued document before initiating or
completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
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trademarks are the property of their respective owners.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Nexperia’s aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with the
Terms and conditions of commercial sale of Nexperia.
Right to make changes — Nexperia reserves the right to make changes
to information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Suitability for use in automotive applications — This Nexperia product
has been qualified for use in automotive applications. Unless otherwise
agreed in writing, the product is not designed, authorized or warranted to
be suitable for use in life support, life-critical or safety-critical systems or
©
PESDXUSB3S_SER
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
15 / 16
Nexperia
PESDxUSB3S series
ESD protection for differential data lines
Contents
1. Product profile..............................................................1
1.1. General description......................................................1
1.2. Features and benefits..................................................1
1.3. Applications................................................................. 1
2. Pinning information......................................................2
3. Ordering information....................................................3
4. Marking..........................................................................3
5. Limiting values............................................................. 3
6. Characteristics..............................................................4
6.1. Channel characteristics............................................... 4
6.2. Frequency characteristics............................................4
7. Application information............................................... 8
8. Package outline............................................................ 9
9. Soldering..................................................................... 12
10. Revision history........................................................14
11. Legal information......................................................15
© Nexperia B.V. 2019. All rights reserved
For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 30 January 2019
©
PESDXUSB3S_SER
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 4 — 30 January 2019
16 / 16
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