PZU24B3A [NEXPERIA]

Single Zener diodesProduction;


型号：	PZU24B3A
厂家：	Nexperia
描述：	Single Zener diodesProduction 测试光电二极管
文件：	总15页 (文件大小：226K)
中文：	中文翻译
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Important notice

Dear Customer,

On 7 February 2017 the former NXP Standard Product business became a new company with the

tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS

semiconductors with its focus on the automotive, industrial, computing, consumer and wearable

application markets

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use

the references to Nexperia, as shown below.

Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,

use http://www.nexperia.com

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salesaddresses@nexperia.com (email)

Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on

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reserved

Should be replaced with:

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Kind regards,

Team Nexperia

PZUxBA series

Single Zener diodes

Rev. 01 — 19 September 2008

Product data sheet

1. Product proﬁle

1.1 General description

General-purpose Zener diodes in a SOD323 (SC-76) very small Surface-Mounted

Device (SMD) plastic package.

1.2 Features

I Non-repetitive peak reverse power

dissipation: P_ZSM≤ 40 W

I Low reverse current I_Rrange

I Total power dissipation: P_tot≤ 320 mW I Small plastic package suitable for

surface-mounted design

I Tolerance series:

I AEC-Q101 qualiﬁed

B: approximately ±5 %;

B1, B2, B3: approximately ±2 %

I Wide working voltage range:

nominal 2.4 V to 36 V (E24 range)

1.3 Applications

I General regulation functions

1.4 Quick reference data

Table 1.

Quick reference data

Symbol Parameter

Conditions

I_F= 100 mA

Min

Typ

Max

1.1

Unit

[1]

[2]

V_F

forward voltage

P_ZSM

non-repetitive peak reverse

power dissipation

[3]

P_tot

total power dissipation

_amb≤ 25 °C

320

[1] Pulse test: t_p≤ 300 µs; δ ≤ 0.02.

[2] t_p= 100 µs; square wave; T_j= 25 °C prior to surge

[3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

PZUxBA series

NXP Semiconductors

Single Zener diodes

2. Pinning information

Table 2.

Pinning

Description

cathode

Simpliﬁed outline

Graphic symbol

[1]

anode

006aaa152

[1] The marking bar indicates the cathode.

3. Ordering information

Table 3.

Ordering information

Type number

Package

Name

Description

plastic surface-mounted package; 2 leads

Version

PZU2.4BA to

PZU36BA^[1]

SC-76

SOD323

PZU2.4BA/DG to

PZU36BA/DG^[1][2]

[1] The series consists of 97 types with nominal working voltages from 2.4 V to 36 V.

[2] /DG: halogen-free

PZUXBA_SER_1

Product data sheet

Rev. 01 — 19 September 2008

2 of 14

PZUxBA series

NXP Semiconductors

Single Zener diodes

4. Marking

Table 4.

Marking codes

Type number^[1]Marking code

Type number^[1]

Marking code

PZU2.4*A

PZU2.7*A

PZU3.0*A

PZU3.3*A

PZU3.6*A

PZU3.9*A

PZU4.3*A

PZU4.7*A

PZU5.1*A

PZU5.6*A

PZU6.2*A

PZU6.8*A

PZU7.5*A

PZU8.2*A

PZU9.1*A

PZU10*A

PZU11*A

PZU12*A

PZU13*A

PZU14*A

PZU15*A

PZU16*A

PZU18*A

PZU20*A

PZU22*A

PZU24*A

PZU27*A

PZU30*A

PZU33*A

PZU36*A

PZU2.4*A/DG

PZU2.7*A/DG

PZU3.0*A/DG

PZU3.3*A/DG

PZU3.6*A/DG

PZU3.9*A/DG

PZU4.3*A/DG

PZU4.7*A/DG

PZU5.1*A/DG

PZU5.6*A/DG

PZU6.2*A/DG

PZU6.8*A/DG

PZU7.5*A/DG

PZU8.2*A/DG

PZU9.1*A/DG

PZU10*A/DG

PZU11*A/DG

PZU12*A/DG

PZU13*A/DG

PZU14*A/DG

PZU15*A/DG

PZU16*A/DG

PZU18*A/DG

PZU20*A/DG

PZU22*A/DG

PZU24*A/DG

PZU27*A/DG

PZU30*A/DG

PZU33*A/DG

PZU36*A/DG

WW WX

[1] * = B: tolerance series B, approximately ±5 %

* = B1, B2, B3: tolerance series B1, B2, B3: approximately ±2 %

PZUXBA_SER_1

Product data sheet

Rev. 01 — 19 September 2008

3 of 14

PZUxBA series

NXP Semiconductors

Single Zener diodes

5. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

I_F

Parameter

Conditions

Min

Max

Unit

forward current

200

[1]

I_ZSM

non-repetitive peak reverse

current

see

Table 8

and 9

P_ZSM

P_tot

non-repetitive peak reverse

power dissipation

[2]

[3]

total power dissipation

T_amb≤ 25 °C

320

°C

490

T_j

junction temperature

ambient temperature

storage temperature

150

T_amb

T_stg

−55

−65

+150

°C

[1] t_p= 100 µs; square wave; T_j= 25 °C prior to surge

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm².

6. Thermal characteristics

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max Unit

[1]

[2]

[3]

R_th(j-a)

thermal resistance from

junction to ambient

in free air

390

255

K/W

R_th(j-sp)

thermal resistance from

junction to solder point

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm².

[3] Soldering point of cathode tab.

7. Characteristics

Table 7.

Characteristics

T_j= 25 °C unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max Unit

[1]

V_F

forward voltage

I_F= 10 mA

0.9

1.1

I_F= 100 mA

[1] Pulse test: t_p≤ 300 µs; δ ≤ 0.02.

PZUXBA_SER_1

Product data sheet

Rev. 01 — 19 September 2008

4 of 14

PZUxBA series

NXP Semiconductors

Single Zener diodes

Table 8.

Characteristics per type; PZU2.4BA to PZU5.6B3A and PZU2.4BA/DG to PZU5.6B3A/DG

T_j= 25 °C unless otherwise speciﬁed.

PZUxBA Sel

Working

voltage

V_Z(V)

Differentialresistance Reverse

Temperature Diode

Non-repetitive

r_dif(Ω)

current

coefﬁcient

S_Z(mV/K)

capacitance peak reverse

C_d(pF)^[1]

I_R(µA)

current

_ZSM(A)^[2]

I_Z= 5 mA

I_Z= 0.5 mA I_Z= 5 mA

Max

I_Z= 5 mA

Min

2.3

2.5

Max Max

Max

V_R(V) Typ

Max

450

440

Max

2.4

2.7

2.6

1000

100

−1.6

−2.0

2.9

2.75

2.65 2.9

3.0

3.3

3.6

3.9

4.3

2.8

3.2

1000

−2.1

−2.4

−2.5

425

410

390

370

350

3.05

2.95 3.2

3.1

3.5

3.35

3.25 3.5

3.4

3.8

3.65

3.55 3.8

3.7

4.1

3.97

3.87 4.10

4.01 4.48 1000

4.01 4.21

4.15 4.34

4.28 4.48

4.7

5.1

5.6

4.42 4.9

4.42 4.61

4.55 4.75

4.69 4.9

800

−1.4

0.3

325

300

275

4.84 5.37 250

4.84 5.04

1.5

2.5

5.5

4.98 5.2

5.14 5.37

5.31 5.92 100

5.31 5.55

1.9

5.49 5.73

5.67 5.92

[1] f = 1 MHz; V_R= 0 V

[2] t_p= 100 µs; square wave; T_j= 25 °C prior to surge

PZUXBA_SER_1

Product data sheet

Rev. 01 — 19 September 2008

5 of 14

PZUxBA series

NXP Semiconductors

Single Zener diodes

Table 9.

Characteristics per type; PZU6.2BA to PZU36BA and PZU6.2BA/DG to PZU36BA/DG

T_j= 25 °C unless otherwise speciﬁed.

PZUxBA Sel

Working

voltage

V_Z(V)

Differentialresistance Reverse

Temperature Diode

Non-repetitive

r_dif(Ω)

current

I_R(nA)

coefﬁcient

S_Z(mV/K)

capacitance peak reverse

C_d(pF)^[1]

current

_ZSM(A)^[2]

I_Z= 5 mA

I_Z= 0.5 mA I_Z= 5 mA

Max

I_Z= 5 mA

Min

Max Max

Max

V_R(V) Typ

Max

6.2

6.8

7.5

8.2

9.1

5.86 6.53 80

5.86 6.12

500

2.7

3.4

4.0

4.6

5.5

6.4

7.4

8.4

9.4

250

5.5

6.06 6.33

6.26 6.53

6.47 7.14 60

6.47 6.73

500

100

3.5

215

170

150

120

110

108

105

103

5.5

3.5

6.65 6.93

6.86 7.14

7.06 7.84 60

7.06 7.36

7.28 7.60

7.52 7.84

7.76 8.64 60

7.76 8.1

8.02 8.36

8.28 8.64

8.56 9.55 60

8.56 8.93

8.85 9.23

9.15 9.55

9.45 10.55 60

9.45 9.87

9.77 10.21

10.11 10.55

10.44 11.56 60

10.44 10.88

10.76 11.22

11.1 11.56

11.42 12.6 80

11.42 11.9

11.74 12.24

12.08 12.6

12.47 13.96 80

12.47 13.03

12.91 13.49

13.37 13.96

2.5

PZUXBA_SER_1

Product data sheet

Rev. 01 — 19 September 2008

6 of 14

PZUxBA series

NXP Semiconductors

Single Zener diodes

Table 9.

Characteristics per type; PZU6.2BA to PZU36BA and PZU6.2BA/DG to PZU36BA/DG …continued

T_j= 25 °C unless otherwise speciﬁed.

PZUxBA Sel

Working

voltage

V_Z(V)

Differentialresistance Reverse

Temperature Diode

Non-repetitive

r_dif(Ω)

current

I_R(nA)

coefﬁcient

S_Z(mV/K)

capacitance peak reverse

C_d(pF)^[1]

current

_ZSM(A)^[2]

I_Z= 5 mA

I_Z= 0.5 mA I_Z= 5 mA

Max

I_Z= 5 mA

Min

Max Max

Max

100

V_R(V) Typ

Max

101

Max

13.70 14.30 80

13.84 15.52 80

13.84 14.46

10.4

11.4

14.34 14.98

14.85 15.52

15.37 17.09 80

15.37 16.01

12.4

14.4

16.4

18.4

20.4

1.5

1.3

15.85 16.51

16.35 17.09

16.94 19.03 80

16.94 17.7

17.56 18.35

18.21 19.03

18.86 21.08 100

18.86 19.7

19.52 20.39

20.21 21.08

20.88 23.17 100

20.88 21.77

21.54 22.47

22.23 23.17

22.93 25.57 120

22.93 23.96

23.72 24.78

24.54 25.57

25.1 28.9 150

23.4

26.6

29.7

33.0

200

250

300

0.9

0.8

[1] f = 1 MHz; V_R= 0 V

[2] t_p= 100 µs; square wave; T_j= 25 °C prior to surge

PZUXBA_SER_1

Product data sheet

Rev. 01 — 19 September 2008

7 of 14

PZUxBA series

NXP Semiconductors

Single Zener diodes

006aab215

mbg781

300

(W)

ZSM

(mA)

200

100

0.6

−4

−3

−2

0.8

(s)

V (V)

T_j= 25 °C (prior to surge)

T_j= 25 °C

Fig 1. Non-repetitive peak reverse power dissipation

as a function of pulse duration; maximum

values

Fig 2. Forward current as a function of forward

voltage; typical values

mgl274

mgl273

4.3

(mV/K)

9.1

−1

8.2

7.5

6.8

3.9

3.6

6.2

5.6

5.1

−2

−3

3.3

4.7

3.0

2.4

2.7

−5

(mA)

T_j= 25 °C to 150 °C

V_Z= 2.4 V to 4.3 V

V_Z= 4.7 V to 12 V

Fig 3. Temperature coefﬁcient as a function of

working current; typical values

Fig 4. Temperature coefﬁcient as a function of

working current; typical values

PZUXBA_SER_1

Product data sheet

Rev. 01 — 19 September 2008

8 of 14

PZUxBA series

NXP Semiconductors

Single Zener diodes

006aab246

006aab247

(V) = 4.7

Z(nom)

(mA)

(V) = 2.4

Z(nom)

3.6 4.3

3.9

3.0

3.3

5.6

6.8

9.1

2.7

6.2

8.2

7.5

5.1

−1

−2

−3

V (V)

(V)

T_j= 25 °C

V_Z= 2.4 V to 4.3 V

T_j= 25 °C

V_Z= 4.7 V to 12 V

Fig 5. Working current as a function of working

voltage; typical values

Fig 6. Working current as a function of working

voltage; typical values

006aab248

(V) = 13

Z(nom)

(mA)

−1

−2

−3

(V)

T_j= 25 °C

V_Z= 13 V to 36 V

Fig 7. Working current as a function of working voltage; typical values

PZUXBA_SER_1

Product data sheet

Rev. 01 — 19 September 2008

9 of 14

PZUxBA series

NXP Semiconductors

Single Zener diodes

8. Test information

8.1 Quality information

This product has been qualiﬁed in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualiﬁcation for discrete semiconductors, and is

suitable for use in automotive applications.

9. Package outline

1.35

1.15

1.1

0.8

0.45

0.15

2.7 1.8

2.3 1.6

0.40

0.25

0.10

Dimensions in mm

03-12-17

Fig 8. Package outline SOD323 (SC-76)

10. Packing information

Table 10. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.^[1]

Type number

Package

Description

Packing quantity

3000

10000

PZU2.4BA to

PZU36BA

SOD323

4 mm pitch, 8 mm tape and reel

-115

-135

PZU2.4BA/DG to

PZU36BA/DG

[1] For further information and the availability of packing methods, see Section 13.

PZUXBA_SER_1

Product data sheet

Rev. 01 — 19 September 2008

10 of 14

PZUxBA series

NXP Semiconductors

Single Zener diodes

11. Soldering

3.05

2.1

solder lands

solder resist

1.65 0.95

0.5 (2×) 0.6 (2×)

solder paste

occupied area

2.2

Dimensions in mm

0.5

(2×)

0.6

(2×)

sod323_fr

Fig 9. Reﬂow soldering footprint SOD323 (SC-76)

2.9

1.5 (2×)

solder lands

solder resist

occupied area

1.2

2.75

Dimensions in mm

(2×)

preferred transport

direction during soldering

sod323_fw

Fig 10. Wave soldering footprint SOD323 (SC-76)

PZUXBA_SER_1

Product data sheet

Rev. 01 — 19 September 2008

11 of 14

PZUxBA series

NXP Semiconductors

Single Zener diodes

12. Revision history

Table 11. Revision history

Document ID

Release date

20080919

Data sheet status

Change notice

Supersedes

PZUXBA_SER_1

Product data sheet

PZUXBA_SER_1

Product data sheet

Rev. 01 — 19 September 2008

12 of 14

PZUxBA series

NXP Semiconductors

Single Zener diodes

13. Legal information

13.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

13.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

13.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

PZUXBA_SER_1

Product data sheet

Rev. 01 — 19 September 2008

13 of 14

PZUxBA series

NXP Semiconductors

Single Zener diodes

15. Contents

Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data. . . . . . . . . . . . . . . . . . . . . 1

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Thermal characteristics. . . . . . . . . . . . . . . . . . . 4

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Test information. . . . . . . . . . . . . . . . . . . . . . . . 10

Quality information . . . . . . . . . . . . . . . . . . . . . 10

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

Packing information. . . . . . . . . . . . . . . . . . . . . 10

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12

8.1

Legal information. . . . . . . . . . . . . . . . . . . . . . . 13

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13

Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

13.1

13.2

13.3

13.4

Contact information. . . . . . . . . . . . . . . . . . . . . 13

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 19 September 2008

Document identifier: PZUXBA_SER_1

PZU24B3A [NEXPERIA]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E