NSSA123BT [NICHIA]
Single Color LED,;
| 型号： | NSSA123BT |
| 厂家： | 
NICHIA CORPORATION |
| 描述： | Single Color LED, 光电 |
| 文件： | 总17页 (文件大小：290K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NICHIA STS-DA1-2110 <Cat.No.111228>
SPECIFICATIONS FOR AMBER LED
NICHIA CORPORATION
NSSA123BT
● Pb-free Reflow Soldering Application
● Built-in ESD Protection Device
● RoHS Compliant
NICHIA STS-DA1-2110 <Cat.No.111228>
SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Symbol
Absolute Maximum Rating
Unit
mA
mA
mA
mW
°C
Forward Current
IF
IFP
IR
150
200
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
85
PD
540
Operating Temperature
Storage Temperature
Junction Temperature
Topr
Tstg
TJ
-40~100
-40~100
135
°C
°C
* Absolute Maximum Ratings at TS=25°C.
* IFP conditions with pulse width ≤10ms and duty cycle ≤10%.
(2) Initial Electrical/Optical Characteristics
Item
Forward Voltage
Symbol
VF
Condition
IF=80mA
IF=80mA
IF=80mA
IF=80mA
Typ
3.2
Unit
V
Φv
Luminous Flux
12
lm
-
x
y
-
-
0.57
0.42
Chromaticity Coordinate
-
* Characteristics at TS=25°C.
* Luminous Flux value as per CIE 127:2007 standard.
* Chromaticity Coordinates as per CIE 1931 Chromaticity Chart.
1
NICHIA STS-DA1-2110 <Cat.No.111228>
RANKS
Item
Rank
Min
2.8
Max
3.6
Unit
V
Forward Voltage
-
P7
P6
P5
P4
15.1
12.7
10.7
9.0
18.0
15.1
12.7
10.7
Luminous Flux
lm
Color Rank
Rank L3
x
0.576
0.407
0.549
0.425
0.562
0.438
0.589
0.411
y
* Ranking at TS=25°C.
* Tolerance of measurements of the Forward Voltage is ±3%.
* Tolerance of measurements of the Luminous Flux is ±7%.
* Tolerance of measurements of the Chromaticity Coordinate is ±0.01.
* A shipment shall consist of LEDs in a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
2
NICHIA STS-DA1-2110 <Cat.No.111228>
CHROMATICITY DIAGRAM
0.50
580
585
0.45
0.40
0.35
590
L3
595
600
0.30
0.45
0.50
0.55
x
0.60
0.65
3
NICHIA STS-DA1-2110 <Cat.No.111228>
OUTLINE DIMENSIONS
NSxx123x
管理番号 No. STS-DA7-0448A
*
本製品はRoHS指令に適合しております。
This product complies with RoHS Directive.
(単位 Unit: mm, 公差 Tolerance: ±0.2)
Cathode Mark
(2.6)
3
項目 Item
内容 Description
パッケージ材質
Package Materials
セラミックス
Ceramics
シリコーン樹脂
（拡散剤+蛍光体入り）
Silicone Resin
封止樹脂材質
Encapsulating Resin
Materials
(with diffuser and phosphor)
電極材質
Electrodes Materials
銀メッキ
Ag-plated
質量
Weight
0.013g(TYP)
0.8
Cathode
Anode
2.74
K
A
保護素子
Protection Device
4
NICHIA STS-DA1-2110 <Cat.No.111228>
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
• Recommended Hand Soldering Condition
Temperature
350°C Max
3sec Max
Soldering Time
1 to 5°C per sec
260°C Max
10sec Max
Pre-heat
180 to 200°C
60sec Max
Above 220°C
120sec Max
• Recommended Soldering Pad Pattern
3.6
0.6
(単位 Unit: mm)
* This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* When soldering, do not apply stress to the LED while the LED is hot.
5
NICHIA STS-DA1-2110 <Cat.No.111228>
Nxxx123x
TAPE AND REEL DIMENSIONS
テーピング部 Tape
管理番号 No.
STS-DA7-0177
0.25±0.05
(単位 Unit: mm)
4±0.1
+0.1
Φ1.5
2±0.05
-0
Cathode Mark
4±0.1
0.92±0.1
+0.2
-0
Φ1
2.35±0.1
エンボスキャリアテープ
Embossed Carrier Tape
トレーラ部/リーダ部 Trailer and Leader
トップカバーテープ
Top Cover Tape
引き出し方向
Feed
Direction
LED装着部
Loaded Pockets
トレーラ部最小160mm（空部）
Trailer 160mm MIN(Empty Pockets)
引き出し部最小100mm（空部）
Leader with Top Cover Tape
100mm MIN(Empty Pocket)
リーダ部最小400mm
Leader without Top Cover Tape 400mm MIN
リール部 Reel
11.4±1
9±0.3
+0
180
-3
数量は1リールにつき 4000個入りです。
Quantity per reel=4000pcs
*
*
JIS C 0806電子部品テーピングに準拠しています。
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).
ラベル
Label
6
NICHIA STS-DA1-2110 <Cat.No.111228>
PACKAGING - TAPE & REEL
Nxxxxxxx
管理番号 No. STS-DA7-0006B
シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。
Reels are shipped with desiccants in heat-sealed moisture-proof bags.
ラベル Label
リール
Reel
シリカゲル
Desiccants
XXXX LED
TYPE Nxxxxxxx
*******
LOT YMxxxx-RRR
QTY.
PCS
RoHS
NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
熱シール
Seal
アルミ防湿袋
Moisture-proof Bag
アルミ防湿袋を並べて入れ、ダンボールで仕切ります。
Moisture-proof bags are packed in cardboard boxes
with corrugated partitions.
ラベル Label
XXXX LED
TYPE Nxxxxxxx
*******
RANK RRR
QTY.
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
*
*
*
客先型名を*******で示します。
客先型名が設定されていない場合は空白です。
******* is the customer part number.
If not provided, it is not indicated on the label.
Nichia LED
ロット表記方法についてはロット番号の項を
参照して下さい。
For details, see "LOT NUMBERING SCHEME"
in this document.
ランク分けがない場合はランク表記はありません。
The label does not have the RANK field for
un-ranked products.
*
本製品はテーピングしたのち、輸送の衝撃から保護するためダンボールで梱包します。
Products shipped on tape and reel are packed in a moisture-proof bag.
They are shipped in cardboard boxes to protect them from external forces during transportation.
*
*
*
取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。
Do not drop or shock the box. It may damage the products.
ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。
Do not expose to water, the box is not water-resistant.
輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。
Using an original packaging material or equivalent in transit is recommended.
7
NICHIA STS-DA1-2110 <Cat.No.111228>
LOT NUMBERING SCHEME
Lot Number is presented by using the following alphanumeric code.
YMxxxx - RRR
Y - Year
Year
2009
2010
2011
2012
2013
2014
Y
9
A
B
C
D
E
M - Month
Month
M
1
2
3
4
5
6
Month
7
M
7
8
9
A
B
C
1
2
3
4
5
6
8
9
10
11
12
xxxx-Nichia's Product Number
RRR-Ranking by Color Coordinates, Ranking by Luminous Flux
8
NICHIA STS-DA1-2110 <Cat.No.111228>
NSSx123B
DERATING CHARACTERISTICS
No. STS-DA7-0901A
管理番号
周囲温度-許容順電流特性
カソード側はんだ接合部温度-許容順電流特性
Solder Temperature(Cathode Side) vs
Allowable Forward Current
Ambient Temperature vs
Allowable Forward Current
RθJA =110°C/W
Derating1
Derating2
250
250
200
150
100
50
200
150
100
50
(100, 150)
(73, 150)
(100, 84.8)
0
0
0
20
40
60
80
100
120
0
20
40
60
周囲温度
Ambient Temperature(°C)
80
100
120
カソード側はんだ接合部温度
Solder Temperature(Cathode Side)(°C)
デューティー比-許容順電流特性
Duty Ratio vs
Allowable Forward Current
Duty
TA=25°C
1000
200
150
100
10
1
10
100
デューティー比
Duty Ratio(%)
9
NICHIA STS-DA1-2110 <Cat.No.111228>
NSSA123B
OPTICAL CHARACTERISTICS
本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
*
No. STS-DA7-1974
管理番号
発光スペクトル
Spectrum
TA=25°C
I =
80mA
F
Spectrum
1.0
0.8
0.6
0.4
0.2
0.0
400
450
500
550
600
650
700
750
800
波長
Wavelength(nm)
Directivity1
指向特性
Directivity
TA=25°C
I =
80mA
FP
0°
-10°
10°
-20°
20°
30°
-30°
40°
-40°
50°
-50°
-60°
60°
-70°
70°
80°
-80°
-90°
90°
1
0.5
0
0.5
1
相対照度
Relative Illuminance(a.u.)
10
NICHIA STS-DA1-2110 <Cat.No.111228>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NSSA123B
No. STS-DA7-1975
本特性は参考です。
*
管理番号
All characteristics shown are for reference only and are not guaranteed.
順電圧-順電流特性
周囲温度-順電圧特性
Forward Voltage vs
Forward Current
Ambient Temperature vs
Forward Voltage
VfIf
TaVf
TA=25°C
I =
80mA
FP
1000
4.5
4.0
3.5
3.0
2.5
2.0
200
100
80
10
2.0
2.5
3.0
3.5
4.0
4.5
-60 -40 -20
0
20 40 60 80 100 120
順電圧
周囲温度
Forward Voltage(V)
Ambient Temperature(°C)
周囲温度-相対光束特性
順電流-相対光束特性
Forward Current vs
Relative Luminous Flux
Ambient Temperature vs
Relative Luminous Flux
TaIv
IfIv
I =
FP
80mA
TA=25°C
1.4
1.2
1.0
0.8
0.6
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-60 -40 -20
0
20 40 60 80 100 120
0
50
100
150
200
250
順電流
Forward Current(mA)
周囲温度
Ambient Temperature(°C)
11
NICHIA STS-DA1-2110 <Cat.No.111228>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NSSA123B
No. STS-DA7-1976
本特性は参考です。
*
管理番号
All characteristics shown are for reference only and are not guaranteed.
順電流-色度特性
Forward Current vs
Chromaticity Coordinate
Ifxy
TA=25°C
0.430
0.425
80mA
10mA
0.420
0.415
0.410
200mA
0.560
0.565
0.570
x
0.575
0.580
周囲温度-色度特性
Ambient Temperature vs
Chromaticity Coordinate
Taxy
I =
FP
80mA
0.430
0.425
0.420
0.415
0.410
-40°C
100°C
0°C
25°C
50°C
0.560
0.565
0.570
0.575
0.580
x
12
NICHIA STS-DA1-2110 <Cat.No.111228>
RELIABILITY
(1) Tests and Results
Test
Failure
Reference
Standard
Test
Units
Test Conditions
Criteria
#
Duration
Failed/Tested
Resistance to
JEITA ED-4701
300 301
Tsld=260°C, 10sec, 2reflows,
Soldering Heat
(Reflow Soldering)
Solderability
#1
#2
#1
0/22
0/22
0/50
Precondition: 30°C, 70%RH, 168hr
JEITA ED-4701
303 303A
Tsld=245±5°C, 5sec,
(Reflow Soldering)
Lead-free Solder(Sn-3.0Ag-0.5Cu)
-40°C to 100°C, 1min dwell,
10sec transfer,
JEITA ED-4701
300 307
Thermal Shock
100cycles
Precondition: 30°C, 70%RH, 168hr
-40°C(30min)~25°C(5min)~
100°C(30min)~25°C(5min)
25°C~65°C~-10°C, 90%RH,
24hr per cycle
JEITA ED-4701
100 105
Temperature Cycle
100cycles
10cycles
#1
#1
#1
#1
#1
#1
#1
#1
#1
#1
#1
#1
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/22
0/10
0/22
Moisture Resistance
(Cyclic)
JEITA ED-4701
200 203
High Temperature
Storage
JEITA ED-4701
200 201
TA=100°C
1000hours
1000hours
1000hours
1000hours
1000hours
500hours
1000hours
1time
Temperature Humidity
Storage
JEITA ED-4701
100 103
TA=60°C, RH=90%
TA=-40°C
Low Temperature
Storage
JEITA ED-4701
200 202
Room Temperature
Operating Life
High Temperature
Operating Life
Temperature Humidity
Operating Life
Low Temperature
Operating Life
TA=25°C, IF=150mA
Test board: See NOTES below
TA=100°C, IF=80mA
Test board: See NOTES below
60°C, RH=90%, IF=150mA
Test board: See NOTES below
TA=-40°C, IF=80mA
Test board: See NOTES below
Isopropyl Alcohol, 23±5°C,
Dipping Time: 5min
200m/s2, 100~2000~100Hz,
4cycles, 4min, each X, Y, Z
HBM, 2kV, 1.5kΩ, 100pF, 3pulses,
alternately positive or negative
JEITA ED-4701
500 501
Permanence of Marking
Vibration
JEITA ED-4701
400 403
48minutes
JEITA ED-4701
300 304
Electrostatic Discharges
NOTES:
1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RθJA≈110°C/W
2) Measurements are performed after allowing the LEDs to return to room temperature.
(2) Failure Criteria
Criteria #
Items
Conditions
IF=80mA
Failure Criteria
>Initial value×1.1
Forward Voltage(VF)
Luminous Flux(ΦV)
Solderability
#1
#2
IF=80mA
-
<Initial value×0.7
Less than 95% solder coverage
13
NICHIA STS-DA1-2110 <Cat.No.111228>
CAUTIONS
(1) Storage
Conditions
Temperature
≤30°C
Humidity
≤90%RH
Time
Within 1 Year from Delivery Date
≤168hours
Before Opening Aluminum Bag
After Opening Aluminum Bag
Storage
Baking
≤30°C
≤70%RH
65±5°C
-
≥24hours
● Product complies with JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for moisture-sensitivity details.
● Absorbed moisture in LED packages can vaporize and expand during soldering, which can cause interface delamination
and result in optical performance degradation. Products are packed in moisture-proof aluminum bags
to minimize moisture absorption during transportation and storage.
Included silica gel desiccants change from blue to red if moisture had penetrated bags.
● After opening the moisture-proof aluminum bag, the products should go through the soldering process
within the range of the conditions stated above. Unused remaining LEDs should be stored with silica gel desiccants
in a hermetically sealed container, preferably the original moisture-proof bags for storage.
● After the “Period After Opening” storage time has been exceeded or silica gel desiccants are no longer blue,
the products should be baked. Baking should only be done once.
● Customer is advised to keep the LEDs in an airtight container when not in use. Exposure to a corrosive environment
may cause the plated metal parts of the product to tarnish, which could adversely affect soldering and optical characteristics.
It is also recommended to return the LEDs to the original moisture proof bags and reseal.
● After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials
in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere.
The above should be taken into consideration when designing.
Resin materials, in particular, may contain substances which can affect silver plating, such as halogen.
● Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur.
The extremely corroded or contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended
as a material for seals. Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts
inside the products, caused by low molecular weight volatile siloxane.
● To prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions.
(2) Directions for Use
● When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating.
Operating at a constant current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended.
If the LEDs are operated with constant voltage using Circuit A, the current through the LEDs may vary due to the variation
in Forward Voltage characteristics of the LEDs.
(A)
(B)
● LEDs should be operated in forward bias. Driving circuits must not subject LEDs to either forward or reverse voltage while off.
Continuous reverse voltage can cause migration and LED damage.
● For stabilizing the LED characteristics, it is recommended to operate at greater than 10% nominal current.
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
(3) Handling Precautions
● Do not handle LEDs with bare hands, it may contaminate the LED surface and affect optical characteristics.
In the worst case, catastrophic failure from excess pressure through wire-bond breaks and package damage may result.
● When handling the product with tweezers, be careful not to apply excessive force to the resin.
Otherwise, The resin can be cut, chipped, delaminate or deformed, causing wire-bond breaks and catastrophic failures.
● Dropping the product may cause damage.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
delaminated and/or deformed. It may cause wire to break, leading to catastrophic failures.
14
NICHIA STS-DA1-2110 <Cat.No.111228>
(4) Design Consideration
● PCB warpage after mounting the products onto a PCB can cause the package to break.
The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
The LED should be placed in a way to minimize the stress on the LEDs due to board flexing.
● Board separation must be performed using special jigs, not using hands.
● If an aluminum PCB is used, customer is advised to verity the PCB with the products before use.
Thermal stress during use can cause the solder joints to crack.
(5) Electrostatic Discharge (ESD)
● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
When handling the products, the following measures against electrostatic discharge are strongly recommended:
Eliminating the charge
Grounded wriststrap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
● Proper grounding is required for all devices, equipment, and machinery used in product assembly.
Surge protection should be considered when designing of commercial products.
● If tools or equipment contain insulating materials such as glass or plastic,
the following measures against electrostatic discharge are strongly recommended:
Dissipating static charge with conductive materials
Preventing charge generation with moisture
Neutralizing the charge with ionizers
● The customer is advised to check if the LEDs are damaged by ESD
when performing the characteristics inspection of the LEDs in the application.
Damage can be detected with a forward voltage measurement or a light-up test at low current (≤1mA).
● ESD damaged LEDs may have current flow at a low voltage or no longer illuminate at a low current.
Failure Criteria: VF<2.0V at IF=0.5mA
(6) Thermal Management
● Proper thermal management is an important when designing products with LEDs. LED die temperature is affected
by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature
does not exceed the maximum Junction Temperature (TJ).
● Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product.
● The following equations can be used to calculate the junction temperature of the products.
1) TJ=TA+RθJA･W
2) TJ=TS+RθJS･W
*TJ=LED junction temperature: °C
TA=Ambient temperature: °C
TS=Soldering temperature (cathode side): °C
RθJA=Thermal resistance from junction to ambient: °C/W
RθJS=Thermal resistance from junction to TS measuring point≈55°C/W
W=Input power(IF×VF): W
Ts Point
15
NICHIA STS-DA1-2110 <Cat.No.111228>
(7) Cleaning
● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs
due to the damage to the resin portion. The effects of such solvents should be verified prior to use.
In addition, the use of CFCs such as Freon is heavily regulated.
● Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs
depending on the ultrasonic power and how LED is assembled.
If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior to cleaning.
(8) Eye Safety
● In 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiological safety of lamps
and lamp systems, which added LEDs in its scope.
On the other hand, the IEC 60825-1:2007 laser safety standard removed LEDs from its scope.
However, please be advised that some countries and regions have adopted standards
based on the IEC laser safety standard IEC 60825-1:20112001, which still includes LEDs in its scope.
Most of Nichia's LEDs can be classified as belonging into either the Exempt Group or Risk Group 1.
High-power LEDs, that emit light containing blue wavelengths, may be classified as Risk Group 2.
Please proceed with caution when viewing directly any LEDs driven at high current, or viewing LEDs
with optical instruments which may greatly increase the damages to your eyes.
● Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product,
please be careful to avoid adverse effects on the human body caused by light stimulation.
(9) Others
● The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment,
communications equipment, measurement instruments and household appliances).
Consult Nichia's sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or
health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles,
traffic control equipment, life support systems and safety devices).
● The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent
from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis.
● Both the customers and Nichia will agree on official specifications of supplied products before a customer's volume production.
● Specifications and appearance subject to change for improvement without notice.
16
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