74F10SJ [NSC]
Triple 3-Input NAND Gate; 三路3输入与非门型号: | 74F10SJ |
厂家: | National Semiconductor |
描述: | Triple 3-Input NAND Gate |
文件: | 总6页 (文件大小:143K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
December 1994
54F/74F10
Triple 3-Input NAND Gate
General Description
This device contains three independent gates, each of
which performs the logic NAND function.
Package
Commercial
74F10PC
Military
Package Description
Number
N14A
J14A
14-Lead (0.300 Wide) Molded Dual-In-Line
×
54F10DM (Note 2)
14-Lead Ceramic Dual-In-Line
74F10SC (Note 1)
74F10SJ (Note 1)
M14A
M14D
W14B
E20A
14-Lead (0.150 Wide) Molded Small Outline, JEDEC
×
14-Lead (0.300 Wide) Molded Small Outline, EIAJ
×
54F10FM (Note 2)
54F10LM (Note 2)
14-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier, Type C
e
Note 1: Devices also available in 13 reel. Use suffix
SCX and SJX.
×
Note 2: Military grade device with environmental and burn-in processing. Use suffix
e
DMQB, FMQB and LMQB.
Logic Symbol
Connection Diagrams
IEEE/IEC
Pin Assignment for
DIP, SOIC and Flatpak
Pin Assignment
for LCC
TL/F/9458–2
TL/F/9458–3
TL/F/9458–1
Unit Loading/Fan Out
54F/74F
Pin Names
Description
U.L.
Input I /I
IH IL
Output I /I
HIGH/LOW
OH OL
b
20 mA/ 0.6 mA
b
1 mA/20 mA
A , B , C
n
Inputs
1.0/1.0
50/33.3
n
n
O
Outputs
n
FASTÉ and TRI-STATEÉ are registered trademarks of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation
TL/F/9458
RRD-B30M75/Printed in U. S. A.
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
Commercial
b
a
55 C to 125 C
§
0 C to 70 C
§
§
b
b
a
65 C to 150 C
Storage Temperature
§
§
§
§
§
a
§
a
55 C to 125 C
Ambient Temperature under Bias
§
Supply Voltage
Military
Commercial
b
b
a
a a
4.5V to 5.5V
a a
4.5V to 5.5V
Junction Temperature under Bias
Plastic
55 C to 175 C
§
§
a
55 C to 150 C
V
Pin Potential to
CC
Ground Pin
b
a
0.5V to 7.0V
b
a
0.5V to 7.0V
Input Voltage (Note 2)
Input Current (Note 2)
Voltage Applied to Output
b
a
30 mA to 5.0 mA
e
in HIGH State (with V
Standard Output
0V)
CC
b
0.5V to 5.5V
0.5V to V
CC
b
a
TRI-STATE Output
É
Current Applied to Output
in LOW State (Max)
twice the rated I (mA)
OL
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
54F/74F
Symbol
Parameter
Units
V
CC
Conditions
Min
Typ
Max
V
V
V
V
Input HIGH Voltage
2.0
V
V
V
Recognized as a HIGH Signal
Recognized as a LOW Signal
IH
Input LOW Voltage
0.8
IL
b
e b
18 mA
Input Clamp Diode Voltage
1.2
Min
Min
I
IN
CD
OH
e b
e b
e b
Output HIGH
Voltage
54F 10% V
2.5
2.5
2.7
I
I
I
1 mA
1 mA
1 mA
CC
OH
OH
OH
74F 10% V
74F 5% V
V
CC
CC
e
e
V
Output LOW
Voltage
54F 10% V
74F 10% V
0.5
I
I
20 mA
20 mA
OL
CC
OL
V
Min
Max
Max
Max
0.0
0.5
CC
OL
I
I
I
Input HIGH
Current
54F
74F
20.0
5.0
IH
e
e
mA
mA
mA
V
V
V
V
2.7V
7.0V
IN
Input HIGH Current
Breakdown Test
54F
74F
100
7.0
BVI
IN
Output HIGH
54F
74F
250
50
CEX
e
V
CC
OUT
Leakage Current
e
All other pins grounded
V
ID
Input Leakage
Test
I
ID
1.9 mA
74F
74F
4.75
e
IOD
I
Output Leakage
Circuit Current
V
150 mV
OD
3.75
mA
0.0
All other pins grounded
b
e
0.5V
I
I
I
I
Input LOW Current
0.6
mA
mA
mA
mA
Max
Max
Max
Max
V
V
V
V
IL
IN
b
b
e
Output Short-Circuit Current
Power Supply Current
Power Supply Current
60
150
0V
HIGH
LOW
OS
OUT
e
1.4
5.1
2.1
7.7
CCH
CCL
O
e
O
2
AC Electrical Characteristics
74F
54F
74F
e a
T
A
25 C
§
5.0V
e
50 pF
e
T
, V
CC
e
Mil
T
, V
Com
e
50 pF
A
A CC
e a
Symbol
Parameter
V
Units
CC
C
C
L
L
e
C
50 pF
L
Min
Typ
Max
Min
Max
Min
Max
t
t
Propagation Delay
2.4
1.5
3.7
3.2
5.0
4.3
2.0
1.5
7.0
6.5
2.4
1.5
6.0
5.3
PLH
PHL
ns
A , B , C to O
n
n
n
n
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F 10
S
C
X
Temperature Range Family
Special Variations
e
e
e
74F
54F
Commercial
Military
QB
Military grade device with
environmental and burn-in
processing
Device Type
e
X
Devices shipped in 13 reels
×
Package Code
Temperature Range
e
e
e
e
e
e
P
D
F
L
S
SJ
Plastic DIP
Ceramic DIP
Flatpak
Leadless Chip Carrier (LCC)
Small Outline Package SOIC JEDEC
Small Outline Package SOIC EIAJ
e
e
a
C
M
Commercial (0 C to 70 C)
§
§
b a
Military ( 55 C to 125 C)
§
§
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
3
Physical Dimensions inches (millimeters) (Continued)
14-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J14A
14-Lead (0.150 Wide) Molded Small Outline Package, JEDEC (S)
×
NS Package Number M14A
4
Physical Dimensions inches (millimeters) (Continued)
14-Lead (0.300 Wide) Molded Small Outline Package, EIAJ (SJ)
×
NS Package Number M14D
14-Lead (0.300 Wide) Molded Dual-In-Line Package (P)
×
NS Package Number N14A
5
Physical Dimensions inches (millimeters) (Continued)
14-Lead Ceramic Flatpak (F)
NS Package Number W14B
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
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failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
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to the user.
2. A critical component is any component of a life
support device or system whose failure to perform can
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