74F823PCQR [NSC]

IC F/FAST SERIES, 9-BIT DRIVER, TRUE OUTPUT, PDIP24, PLASTIC, DIP-24, Bus Driver/Transceiver;
74F823PCQR
型号: 74F823PCQR
厂家: National Semiconductor    National Semiconductor
描述:

IC F/FAST SERIES, 9-BIT DRIVER, TRUE OUTPUT, PDIP24, PLASTIC, DIP-24, Bus Driver/Transceiver

触发器
文件: 总8页 (文件大小:160K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
December 1994  
54F/74F823  
9-Bit D-Type Flip-Flop  
General Description  
The ’F823 is a 9-bit buffered register. It features Clock En-  
able and Clear which are ideal for parity bus interfacing in  
high performance microprogramming systems.  
Features  
Y
TRI-STATE outputs  
É
Clock Enable and Clear  
Y
Y
Direct replacement for AMD’s Am29823  
The ’F823 is functionally and pin compatible with AMD’s  
Am29823.  
Package  
Commercial  
74F823SPC  
Military  
Package Description  
Number  
N24C  
J24F  
24-Lead (0.300 Wide) Molded Dual-In-Line  
×
54F823SDM (Note 2)  
24-Lead (0.300 Wide) Ceramic Dual-In-Line  
×
74F823SC (Note 1)  
M24B  
W24C  
E28A  
24-Lead (0.300 Wide) Molded Small Outline, JEDEC  
×
54F823FM (Note 2)  
54F823LM (Note 2)  
24-Lead Cerpack  
24-Lead Ceramic Chip Carrier, Type C  
e
Note 1: Devices also available in 13 reel. Use suffix  
SCX.  
×
Note 2: Military grade device with environmental and burn-in processing. Use suffix  
e
SDMQB, FMQB and LMQB.  
Logic Symbols  
Connection Diagrams  
Pin Assignment for  
DIP, SOIC and Flatpak  
Pin Assignment  
for LCC  
TL/F/9596–2  
IEEE/IEC  
TL/F/9596–4  
TL/F/9596–3  
TL/F/9596–1  
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.  
C
1995 National Semiconductor Corporation  
TL/F/9596  
RRD-B30M75/Printed in U. S. A.  
Unit Loading/Fan Out  
54F/74F  
Pin Names  
Description  
U.L.  
Input I /I  
IH IL  
Output I /I  
HIGH/LOW  
OH OL  
b
20 mA/ 0.6 mA  
b
20 mA/ 0.6 mA  
b
20 mA/ 0.6 mA  
b
20 mA/ 1.2 mA  
D D  
0
Data Inputs  
1.0/1.0  
1.0/1.0  
8
OE  
CLR  
CP  
Output Enable Input  
Clear  
1.0/1.0  
Clock Input  
1.0/2.0  
b
EN  
Clock Enable  
TRI-STATE Outputs  
1.0/1.0  
20 mA/ 0.6 mA  
b
O O  
0
150/40 (33.3)  
3 mA/24 mA (20 mA)  
8
2
Functional Description  
The ’F823 device consists of nine D-type edge-triggered  
flip-flops. It has TRI-STATE true outputs and is organized in  
broadside pinning. The buffered Clock (CP) and buffered  
Output Enable (OE) are common to all flip-flops. The flip-  
flops will store the state of their individual D inputs that meet  
the setup and hold times requirements on the LOW-to-HIGH  
CP transition. With the OE LOW the contents of the flip-  
flops are available at the outputs. When the OE is HIGH, the  
outputs go to the high impedance state. Operation of the  
OE input does not affect the state of the flip-flops. In addi-  
tion to the Clock and Output Enable pins, the ’F823 has  
Clear (CLR) and Clock Enable (EN) pins.  
When the CLR is LOW and the OE is LOW, the outputs are  
LOW. When CLR is HIGH, data can be entered into the flip-  
flops. When EN is LOW, data on the inputs is transferred to  
the outputs on the LOW to HIGH clock transition. When the  
EN is HIGH, the outputs do not change state regardless of  
the data or clock inputs transitions. This device is ideal for  
parity bus interfacing in high performance systems.  
Function Table  
Internal  
Inputs  
EN  
Output  
O
Function  
OE  
CLR  
CP  
D
Q
H
H
H
L
H
H
H
H
L
L
L
H
H
X
X
L
L
L
L
L
L
H
L
X
X
X
X
X
X
H
H
L
NC  
NC  
NC  
NC  
H
Z
Z
Hold  
Hold  
Hold  
Hold  
X
Z
X
NC  
Z
H
L
X
Clear  
L
X
H
L
Clear  
H
H
L
H
H
H
H
H
H
L
L
L
L
H
H
Z
Load  
L
Z
Load  
H
L
Data Available  
Data Available  
No Change in Data  
No Change in Data  
L
H
X
X
L
H
L
NC  
NC  
NC  
NC  
L
L
e
e
e
e
L
LOW Voltage Level  
HIGH Voltage Level  
Immaterial  
H
X
Z
High Impedance  
e
L
NC  
LOW-to-HIGH Transition  
No Change  
e
Logic Diagram  
TL/F/9596–5  
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.  
3
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales  
Office/Distributors for availability and specifications.  
Note 1: Absolute maximum ratings are values beyond which the device may  
be damaged or have its useful life impaired. Functional operation under  
these conditions is not implied.  
Note 2: Either voltage limit or current limit is sufficient to protect inputs.  
b
b
a
65 C to 150 C  
Storage Temperature  
§
§
a
55 C to 125 C  
Ambient Temperature under Bias  
§
§
§
§
§
§
Recommended Operating  
Conditions  
b
b
a
55 C to 175 C  
Junction Temperature under Bias  
Plastic  
a
55 C to 150 C  
Free Air Ambient Temperature  
Military  
Commercial  
V
Pin Potential to  
CC  
Ground Pin  
b
a
55 C to 125 C  
§
0 C to 70 C  
§
b
a
0.5V to 7.0V  
a
§
§
b
a
0.5V to 7.0V  
Input Voltage (Note 2)  
Input Current (Note 2)  
Voltage Applied to Output  
Supply Voltage  
Military  
Commercial  
b
a
30 mA to 5.0 mA  
a
a
a
4.5V to 5.5V  
a
4.5V to 5.5V  
e
in HIGH State (with V  
Standard Output  
TRI-STATE Output  
0V)  
CC  
b
0.5V to 5.5V  
0.5V to V  
CC  
b
a
Current Applied to Output  
in LOW State (Max)  
twice the rated I (mA)  
OL  
DC Electrical Characteristics  
54F/74F  
Symbol  
Parameter  
Units  
V
CC  
Conditions  
Min  
Typ  
Max  
V
V
V
V
Input HIGH Voltage  
2.0  
V
V
V
Recognized as a HIGH Signal  
Recognized as a LOW Signal  
IH  
Input LOW Voltage  
0.8  
IL  
b
e b  
18 mA  
Input Clamp Diode Voltage  
1.2  
Min  
Min  
I
IN  
CD  
OH  
e b  
e b  
e b  
e b  
e b  
e b  
54F 10% V  
2.5  
2.4  
2.5  
2.4  
2.7  
2.7  
I
I
I
I
I
I
1 mA  
3 mA  
1 mA  
3 mA  
1 mA  
3 mA  
CC  
CC  
CC  
CC  
OH  
OH  
OH  
OH  
OH  
OH  
54F 10% V  
74F 10% V  
74F 10% V  
Output HIGH  
Voltage  
V
74F 5% V  
74F 5% V  
CC  
CC  
e
e
V
Output LOW  
Voltage  
54F 10% V  
74F 10% V  
0.5  
I
I
20 mA  
24 mA  
OL  
CC  
OL  
OL  
V
Min  
Max  
Max  
Max  
0.0  
0.5  
CC  
e
I
I
I
Input HIGH  
Current  
54F  
74F  
20.0  
5.0  
V
V
V
2.7V  
IH  
IN  
mA  
mA  
mA  
V
e
Input HIGH Current  
Breakdown Test  
54F  
74F  
100  
7.0  
7.0V  
BVI  
IN  
e
V
CC  
Output HIGH  
54F  
74F  
250  
50  
CEX  
OUT  
Leakage Current  
e
All Other Pins Grounded  
V
Input Leakage  
Test  
I
1.9 mA  
ID  
OD  
IL  
ID  
74F  
74F  
4.75  
e
All Other Pins Grounded  
I
I
Output Leakage  
Circuit Current  
V
150 mV  
IOD  
3.75  
mA  
0.0  
b
b
e
e
Input LOW  
Current  
0.6  
1.2  
mA  
mA  
Max  
Max  
V
V
0.5V (OE, CLR, EN)  
0.5V (CP)  
IN  
IN  
e
I
I
I
I
I
Output Leakage Current  
Output Leakage Current  
Output Short-Circuit Current  
Buss Drainage Test  
50  
mA  
mA  
mA  
mA  
mA  
Max  
Max  
Max  
0.0V  
Max  
V
V
V
V
V
2.7V  
0.5V  
0V  
OZH  
OZL  
OS  
OUT  
OUT  
OUT  
OUT  
b
e
e
e
50  
b
b
60  
150  
500  
100  
5.25V  
ZZ  
e
Power Supply Current  
75  
HIGH Z  
CCZ  
O
4
AC Electrical Characteristics  
74F  
54F  
74F  
e a  
T
25 C  
§
5.0V  
A
e
50 pF  
e
50 pF  
T
, V  
CC  
e
Mil  
T
, V  
A CC  
Com  
A
e a  
Symbol  
Parameter  
V
Units  
CC  
e
C
C
L
L
e
C
50 pF  
L
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
f
Maximum Clock Frequency  
Propagation Delay  
100  
160  
60  
70  
MHz  
ns  
max  
t
t
2.0  
2.0  
5.6  
5.2  
9.5  
9.5  
2.0  
2.0  
10.5  
10.5  
2.0  
2.0  
10.5  
10.5  
PLH  
PHL  
CP to O  
n
t
Propagation Delay  
CLR to O  
PHL  
4.0  
7.1  
12.0  
4.0  
13.0  
4.0  
13.0  
ns  
ns  
n
t
t
Output Enable Time  
OE to O  
2.0  
2.0  
5.8  
5.5  
10.5  
10.5  
2.0  
2.0  
13.0  
13.0  
2.0  
2.0  
11.5  
11.5  
PZH  
PZL  
n
t
t
Output Disable Time  
OE to O  
1.5  
1.5  
2.9  
2.7  
7.0  
7.0  
1.0  
1.0  
7.5  
7.5  
1.5  
1.5  
7.5  
7.5  
PHZ  
PLZ  
n
AC Operating Requirements  
74F  
54F  
74F  
e a  
T
25 C  
§
5.0V  
A
e
e
Symbol  
Parameter  
T
, V  
CC  
Mil  
Max  
T
, V  
A CC  
Com  
Max  
Units  
A
e a  
V
CC  
Min  
Max  
Min  
Min  
t (H)  
s
Setup Time, HIGH or LOW  
2.5  
2.5  
4.0  
4.0  
3.0  
3.0  
t (L)  
s
D to CP  
n
ns  
t (H)  
h
Hold Time, HIGH or LOW  
D to CP  
n
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
t (L)  
h
t (H)  
s
Setup Time, HIGH or LOW  
EN to CP  
4.5  
2.5  
5.0  
3.0  
5.0  
3.0  
t (L)  
s
ns  
ns  
t (H)  
h
Hold Time, HIGH or LOW  
EN to CP  
2.0  
0
3.0  
1.0  
2.0  
0
t (L)  
h
t
t
(H)  
(L)  
CP Pulse Width  
HIGH or LOW  
5.0  
5.0  
6.0  
6.0  
6.0  
6.0  
w
w
t
t
(L)  
CLR Pulse Width, LOW  
CLR Recovery Time  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
ns  
ns  
w
rec  
Ordering Information  
The device number is used to form part of a simplified purchasing code where the package type and temperature range are  
defined as follows:  
74F 823  
S
C
X
Temperature Range Family  
e
e
54F Military  
Special Variations  
e
74F Commercial  
QB  
Military grade device with  
environmental and burn-in  
processing  
Device Type  
Temperature Range  
Package Code  
e
e
a
C
M
Commercial (0 C to 70 C)  
§
§
e
e
e
e
e
SP  
SD  
F
L
S
Slim Plastic DIP  
Slim Ceramic DIP  
Flatpak  
Leadless Chip Carrier (LCC)  
Small Outline (SOIC)  
b a  
Military ( 55 C to 125 C)  
§
§
5
Physical Dimensions inches (millimeters)  
28-Lead Ceramic Leadless Chip Carrier, Type C (L)  
NS Package Number E28A  
24-Lead (0.300 Wide) Ceramic Dual-In-Line Package (SD)  
×
NS Package Number J24F  
6
Physical Dimensions inches (millimeters) (Continued)  
24-Lead (0.300 Wide) Molded Small Outline Package, JEDEC (S)  
×
NS Package Number M24B  
24-Lead (0.300 Wide) Molded Dual-In-Line Package (SP)  
×
NS Package Number N24C  
7
Physical Dimensions inches (millimeters) (Continued)  
24-Lead Ceramic Flatpak (F)  
NS Package Number W24C  
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and whose  
failure to perform, when properly used in accordance  
with instructions for use provided in the labeling, can  
be reasonably expected to result in a significant injury  
to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
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