DS90CF364A_07 [NSC]

+3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link-65MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link-65MHz; + 3.3V LVDS接收器24位平板显示器( FPD )链路的65MHz , + 3.3V LVDS接收器18位平板显示器( FPD )链路的65MHz
DS90CF364A_07
型号: DS90CF364A_07
厂家: National Semiconductor    National Semiconductor
描述:

+3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link-65MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link-65MHz
+ 3.3V LVDS接收器24位平板显示器( FPD )链路的65MHz , + 3.3V LVDS接收器18位平板显示器( FPD )链路的65MHz

显示器 光电二极管
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中文:  中文翻译
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July 2007  
DS90CF384A/DS90CF364A  
+3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link  
—65 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display  
(FPD) Link—65 MHz  
This chipset is an ideal means to solve EMI and cable size  
problems associated with wide, high speed TTL interfaces.  
General Description  
The DS90CF384A receiver converts the four LVDS data  
streams (Up to 1.8 Gbps throughput or 227 Megabytes/sec  
bandwidth) back into parallel 28 bits of CMOS/TTL data (24  
Features  
20 to 65 MHz shift clock support  
bits of RGB and 4 bits of Hsync, Vsync, DE and CNTL). Also  
available is the DS90CF364A that converts the three LVDS  
data streams (Up to 1.3 Gbps throughput or 170 Megabytes/  
sec bandwidth) back into parallel 21 bits of CMOS/TTL data  
(18 bits of RGB and 3 bits of Hsync, Vsync and DE). Both  
Receivers' outputs are Falling edge strobe. A Rising edge or  
Falling edge strobe transmitter (DS90C383A/DS90C363A)  
will interoperate with a Falling edge strobe Receiver without  
any translation logic.  
50% duty cycle on receiver output clock  
Best–in–Class Set & Hold Times on RxOUTPUTs  
Rx power consumption <142 mW (typ) @65MHz  
Grayscale  
Rx Power-down mode <200μW (max)  
ESD rating >7 kV (HBM), >700V (EIAJ)  
Supports VGA, SVGA, XGA and Dual Pixel SXGA.  
PLL requires no external components  
The DS90CF384A / DS90CF364A devices are enhanced  
over prior generation receivers and provided a wider data  
valid time on the receiver output.  
Compatible with TIA/EIA-644 LVDS standard  
Low profile 56-lead or 48-lead TSSOP package  
The DS90CF384A is also offered in a 64 ball, 0.8mm fine pitch  
ball grid array (FBGA) package which provides a 44 % re-  
duction in PCB footprint compared to the 56L TSSOP pack-  
age.  
DS90CF384A is also available in a 64 ball, 0.8mm fine  
pitch ball grid array (FBGA) package  
Block Diagrams  
DS90CF384A  
DS90CF364A  
10087027  
10087028  
Order Number DS90CF384AMTD or DS90CF384ASLC  
Order Number DS90CF364AMTD  
See NS Package Number MTD48  
See NS Package Number MTD56 or SLC64A  
TRI-STATE® is a registered trademark of National Semiconductor Corporation.  
© 2007 National Semiconductor Corporation  
100870  
www.national.com  
SLC (FBGA) Package:  
DS90CF384A  
Absolute Maximum Ratings (Note 1)  
2.0 W  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Package Derating:  
DS90CF384AMTD  
DS90CF364AMTD  
DS90CF384ASLC  
ESD Rating  
12.4 mW/°C above +25°C  
15 mW/°C above +25°C  
10.2 mW/°C above +25°C  
Supply Voltage (VCC  
)
−0.3V to +4V  
−0.3V to (VCC + 0.3V)  
−0.3V to (VCC + 0.3V)  
−0.3V to (VCC + 0.3V)  
+150°C  
CMOS/TTL Input Voltage  
CMOS/TTL Output Voltage  
LVDS Receiver Input Voltage  
Junction Temperature  
(HBM, 1.5 k, 100 pF)  
(EIAJ, 0, 200 pF)  
> 7 kV  
> 700V  
Storage Temperature  
Lead Temperature  
(Soldering, 4 sec)  
Solder Reflow Temperature  
(20 sec for FBGA)  
Maximum Package Power  
Dissipation Capacity @ 25°C  
MTD56 (TSSOP) Package:  
DS90CF384A  
MTD48 (TSSOP) Package:  
DS90CF364A  
−65°C to +150°C  
Recommended Operating  
Conditions  
+260°C  
+220°C  
Min Nom Max Units  
Supply Voltage (VCC  
Operating Free Air  
Temperature (TA )  
)
3.0  
3.3  
3.6  
V
−10  
0
+25  
+70  
2.4  
°C  
V
Receiver Input Range  
1.61 W  
1.89 W  
Supply Noise Voltage (VCC  
)
100  
mVPP  
Electrical Characteristics  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol Parameter Conditions  
CMOS/TTL DC SPECIFICATIONS (For Power Down Pin)  
Min  
Typ  
Max  
Units  
VIH  
VIL  
VCL  
IIN  
High Level Input Voltage  
Low Level Input Voltage  
Input Clamp Voltage  
Input Current  
2.0  
VCC  
0.8  
V
V
GND  
ICL = −18 mA  
−0.79 −1.5  
V
V IN = 0.4V, 2.5V or VCC  
V IN = GND  
+1.8  
0
+10  
μA  
μA  
−10  
2.7  
CMOS/TTL DC SPECIFICATIONS  
VOH  
VOL  
IOS  
High Level Output Voltage  
Low Level Output Voltage  
Output Short Circuit Current  
IOH = −0.4 mA  
IOL = 2 mA  
VOUT = 0V  
3.3  
0.06  
−60  
V
V
0.3  
−120  
mA  
LVDS RECEIVER DC SPECIFICATIONS  
VTH  
VTL  
IIN  
Differential Input High Threshold  
Differential Input Low Threshold  
Input Current  
V CM = +1.2V  
+100  
mV  
mV  
μA  
−100  
V IN = +2.4V, VCC = 3.6V  
V IN = 0V, VCC = 3.6V  
±10  
±10  
μA  
RECEIVER SUPPLY CURRENT  
ICCRW  
Receiver Supply Current  
Worst Case  
CL = 8 pF,  
f = 32.5 MHz  
f = 37.5 MHz  
f = 65 MHz  
49  
53  
81  
65  
70  
mA  
mA  
mA  
Worst Case Pattern,  
DS90CF384A (Figures 1,  
105  
4 )  
ICCRW  
Receiver Supply Current  
Worst Case  
CL = 8 pF,  
f = 32.5 MHz  
f = 37.5 MHz  
f = 65 MHz  
49  
53  
78  
55  
60  
90  
mA  
mA  
mA  
Worst Case Pattern,  
DS90CF364A (Figures 1,  
4 )  
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2
Symbol  
Parameter  
Receiver Supply Current,  
16 Grayscale  
Conditions  
Min  
Typ  
28  
Max  
45  
Units  
mA  
mA  
mA  
μA  
ICCRG  
CL = 8 pF,  
f = 32.5 MHz  
f = 37.5 MHz  
f = 65 MHz  
16 Grayscale Pattern,  
(Figures 2, 3, 4 )  
30  
47  
43  
60  
ICCRZ  
Receiver Supply Current  
Power Down  
Power Down = Low  
Receiver Outputs Stay Low during  
Power Down Mode  
10  
55  
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device  
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.  
Note 2: Typical values are given for VCC = 3.3V and TA = +25C.  
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise  
specified (except VOD and ΔV OD).  
Receiver Switching Characteristics  
Over recommended operating supply and temperature ranges unless otherwise specified  
Symbol  
CLHT  
Parameter  
Min  
Typ  
2
Max  
5
Units  
ns  
CMOS/TTL Low-to-High Transition Time (Figure 4 )  
CMOS/TTL High-to-Low Transition Time (Figure 4 )  
CHLT  
1.8  
1.96  
5
ns  
RSPos0  
Receiver Input Strobe Position for Bit 0 (Figure 11,  
f = 25 MHz  
1.20  
2.82  
ns  
Figure 12 )  
RSPos1  
RSPos2  
RSPos3  
RSPos4  
RSPos5  
RSPos6  
RSPos0  
Receiver Input Strobe Position for Bit 1  
Receiver Input Strobe Position for Bit 2  
Receiver Input Strobe Position for Bit 3  
Receiver Input Strobe Position for Bit 4  
Receiver Input Strobe Position for Bit 5  
Receiver Input Strobe Position for Bit 6  
6.91  
12.62  
18.33  
24.04  
29.75  
35.46  
0.7  
7.67  
13.38  
19.09  
24.80  
30.51  
36.22  
1.1  
8.53  
14.24  
19.95  
25.66  
31.37  
37.08  
1.4  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Receiver Input Strobe Position for Bit 0 (Figure 11,  
f = 65 MHz  
Figure 12 )  
RSPos1  
RSPos2  
RSPos3  
RSPos4  
RSPos5  
RSPos6  
RSKM  
Receiver Input Strobe Position for Bit 1  
Receiver Input Strobe Position for Bit 2  
Receiver Input Strobe Position for Bit 3  
Receiver Input Strobe Position for Bit 4  
Receiver Input Strobe Position for Bit 5  
Receiver Input Strobe Position for Bit 6  
RxIN Skew Margin (Note 4) (Figure 13 )  
2.9  
5.1  
7.3  
9.5  
11.7  
13.9  
750  
500  
15  
3.3  
5.5  
3.6  
5.8  
ns  
ns  
ns  
ns  
ns  
ns  
ps  
ps  
ns  
ns  
ns  
ns  
ns  
ns  
ms  
μs  
7.7  
8.0  
9.9  
10.2  
12.4  
14.6  
12.1  
14.3  
f = 25 MHz  
f = 65 MHz  
RCOP  
RCOH  
RCOL  
RSRC  
RHRC  
RCCD  
RPLLS  
RPDD  
RxCLK OUT Period (Figure 5)  
T
50  
9.0  
9.0  
RxCLK OUT High Time (Figure 5 )  
RxCLK OUT Low Time (Figure 5)  
RxOUT Setup to RxCLK OUT (Figure 5 )  
RxOUT Hold to RxCLK OUT (Figure 5 )  
f = 65 MHz  
5.0  
5.0  
4.5  
4.0  
3.5  
7.6  
6.3  
7.3  
6.3  
5.0  
RxCLK IN to RxCLK OUT Delay @ 25°C, VCC = 3.3V (Figure 6 )  
Receiver Phase Lock Loop Set (Figure 7 )  
7.5  
10  
1
Receiver Power Down Delay (Figure 10 )  
Note 4: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account the DS90C383B transmitter  
pulse positions (min and max) and the receiver input setup and hold time (internal data sampling window - RSPos). The RSKM will change when different  
transmitters are used. This margin allows for LVDS interconnect skew, inter-symbol interference (both dependent on type/length of cable), and clock jitter (less  
than 250 ps).  
3
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AC Timing Diagrams  
10087002  
FIGURE 1. “Worst Case” Test Pattern  
10087012  
FIGURE 2. “16 Grayscale” Test Pattern (DS90CF384A)(Notes 5, 6, 7, 8)  
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4
10087003  
FIGURE 3. “16 Grayscale” Test Pattern (DS90CF364A)(Notes 5, 6, 7, 8)  
Note 5: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.  
Note 6: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed  
to produce groups of 16 vertical stripes across the display.  
Note 7: Figures 1, 3 show a falling edge data strobe (TxCLK IN/RxCLK OUT).  
Note 8: Recommended pin to signal mapping. Customer may choose to define differently.  
10087004  
FIGURE 4. DS90CF384A/DS90CF364A (Receiver) CMOS/TTL Output Load and Transition Times  
10087005  
FIGURE 5. DS90CF384A/DS90CF364A (Receiver) Setup/Hold and High/Low Times  
5
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10087006  
FIGURE 6. DS90CF384A/DS90CF364A (Receiver) Clock In to Clock Out Delay  
10087007  
FIGURE 7. DS90CF384A/DS90CF364A (Receiver) Phase Lock Loop Set Time  
10087009  
FIGURE 8. 28 Parallel TTL Data Inputs Mapped to LVDS Outputs - DS90CF384A  
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6
10087010  
FIGURE 9. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs - DS90CF364A  
10087008  
FIGURE 10. DS90CF384A/DS90CF364A (Receiver) Power Down Delay  
7
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10087025  
FIGURE 11. DS90CF384A (Receiver) LVDS Input Strobe Position  
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8
10087026  
FIGURE 12. DS90CF364A (Receiver) LVDS Input Strobe Position  
9
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10087011  
C—Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and max  
Tppos—Transmitter output pulse position (min and max)  
RSKM = Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) + ISI (Inter-symbol interference)  
Cable Skew—typically 10 ps–40 ps per foot, media dependent  
Note 9: Cycle-to-cycle jitter is less than 250 ps at 65 MHz.  
Note 10: ISI is dependent on interconnect length; may be zero.  
FIGURE 13. Receiver LVDS Input Skew Margin  
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10  
DS90CF384A Pin Descriptions — 56L TSSOP Package — 24-Bit FPD Link  
Receiver  
Pin Name  
RxIN+  
I/O No.  
Description  
I
I
4
4
Positive LVDS differentiaI data inputs.  
Negative LVDS differential data inputs.  
RxIN−  
RxOUT  
O
28 TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 3 control lines—FPLINE, FPFRAME,  
DRDY (also referred to as HSYNC, VSYNC, Data Enable).  
RxCLK IN+  
RxCLK IN−  
RxCLK OUT  
PWR DOWN  
VCC  
I
I
1
1
1
1
4
5
1
2
1
3
Positive LVDS differential clock input.  
Negative LVDS differential clock input.  
TTL Ievel clock output. The falling edge acts as data strobe.  
TTL level input. When asserted (low input) the receiver outputs are low.  
Power supply pins for TTL outputs.  
Ground pins for TTL outputs.  
O
I
I
GND  
I
PLL VCC  
I
Power supply for PLL.  
PLL GND  
LVDS VCC  
LVDS GND  
I
Ground pin for PLL.  
I
Power supply pin for LVDS inputs.  
Ground pins for LVDS inputs.  
I
DS90CF364A Pin Descriptions — 48L TSSOP Package — 18-Bit FPD Link  
Receiver  
Pin Name  
RxIN+  
I/O No.  
Description  
I
I
3
3
Positive LVDS differentiaI data inputs.  
Negative LVDS differential data inputs.  
RxIN−  
RxOUT  
O
21 TTL level data outputs. This includes: 6 Red, 6 Green, 6 Blue, and 3 control lines—FPLINE, FPFRAME,  
DRDY (also referred to as HSYNC, VSYNC, Data Enable).  
RxCLK IN+  
RxCLK IN−  
RxCLK OUT  
PWR DOWN  
VCC  
I
I
1
1
1
1
4
5
1
2
1
3
Positive LVDS differential clock input.  
Negative LVDS differential clock input.  
TTL Ievel clock output. The falling edge acts as data strobe.  
TTL level input. When asserted (low input) the receiver outputs are low.  
Power supply pins for TTL outputs.  
Ground pins for TTL outputs.  
O
I
I
GND  
I
PLL VCC  
I
Power supply for PLL.  
PLL GND  
LVDS VCC  
LVDS GND  
I
Ground pin for PLL.  
I
Power supply pin for LVDS inputs.  
Ground pins for LVDS inputs.  
I
11  
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DS90CF384A Pin Summary — 64 ball FBGA Package — FPD Link  
Receiver  
Pin Name  
RxIN+  
I/O No.  
Description  
I
I
4
4
Positive LVDS differentiaI data inputs.  
Negative LVDS differential data inputs.  
RxIN−  
RxOUT  
O
28 TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines—FPLINE, FPFRAME,  
DRDY (also referred to as HSYNC, VSYNC, Data Enable).  
RxCLK IN+  
RxCLK IN−  
RxCLK OUT  
PWR DOWN  
VCC  
I
I
1
1
1
1
4
5
1
2
1
3
6
Positive LVDS differential clock input.  
Negative LVDS differential clock input.  
TTL Ievel clock output. The falling edge acts as data strobe. Also known as FPSHIFT OUT  
TTL level input. When asserted (low input) the receiver outputs are low.  
Power supply pins for TTL outputs.  
O
I
I
GND  
I
Ground pins for TTL outputs.  
PLL VCC  
PLL GND  
LVDS VCC  
LVDS GND  
NC  
I
Power supply for PLL.  
I
Ground pin for PLL.  
I
Power supply pin for LVDS inputs.  
I
Ground pins for LVDS inputs.  
Pins not connected.  
DS90CF384A Pin Descriptions — 64 ball FBGA Package — FPD Link  
Receiver  
By Pin  
Pin Name  
RxOUT17  
VCC  
By Pin Type  
Pin Name  
GND  
Pin  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
B8  
C1  
C2  
C3  
C4  
C5  
C6  
C7  
C8  
D1  
D2  
Type  
O
Pin  
A4  
B1  
B6  
D8  
E3  
E5  
G3  
G7  
H5  
F6  
G8  
E6  
H6  
H7  
H2  
H3  
F4  
G4  
G5  
F5  
G6  
H8  
E7  
E8  
C8  
D5  
Type  
G
G
G
G
G
G
G
G
G
G
G
I
P
GND  
RxOUT15  
GND  
O
GND  
G
GND  
RxOUT12  
RxOUT8  
RxOUT7  
RxOUT6  
GND  
O
GND  
O
LVDS GND  
LVDS GND  
LVDS GND  
LVDS GND  
PLL GND  
PLL GND  
PWR DWN  
RxCLKIN-  
RxCLKIN+  
RxIN0-  
O
O
G
NC  
RxOUT16  
RxOUT11  
VCC  
O
O
P
I
GND  
G
O
O
O
I
RxOUT5  
RxOUT3  
RxOUT21  
NC  
I
RxIN0+  
I
RxIN1-  
I
RxIN1+  
I
RxOUT18  
RxOUT14  
RxOUT9  
RxOUT4  
NC  
O
O
O
O
RxIN2-  
I
RxIN2+  
I
RxIN3-  
I
RxIN3+  
I
RxCLKOUT  
RxOUT0  
RxOUT1  
RxOUT10  
O
O
O
O
RxOUT1  
VCC  
O
P
RxOUT20  
O
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12  
By Pin  
RxOUT19  
RxOUT13  
RxOUT10  
VCC  
By Pin Type  
RxOUT11  
RxOUT12  
RxOUT13  
RxOUT14  
RxOUT15  
RxOUT16  
RxOUT17  
RxOUT18  
RxOUT19  
RxOUT2  
RxOUT20  
RxOUT21  
RxOUT22  
RxOUT23  
RxOUT24  
RxOUT25  
RxOUT26  
RxOUT27  
RxOUT3  
RxOUT4  
RxOUT5  
RxOUT6  
RxOUT7  
RxOUT8  
RxOUT9  
LVDS VCC  
LVDS VCC  
PLL VCC  
VCC  
D3  
D4  
D5  
D6  
D7  
D8  
E1  
E2  
E3  
E4  
E5  
E6  
E7  
E8  
F1  
F2  
F3  
F4  
F5  
F6  
F7  
F8  
G1  
G2  
G3  
G4  
G5  
G6  
G7  
G8  
H1  
H2  
H3  
H4  
H5  
H6  
H7  
H8  
O
O
O
P
O
G
O
O
G
P
G
I
B4  
A5  
D4  
C4  
A3  
B3  
A1  
C3  
D3  
D7  
D2  
C1  
E1  
F1  
E2  
G1  
F2  
H1  
B8  
C6  
B7  
A8  
A7  
A6  
C5  
E4  
H4  
F7  
A2  
B5  
D1  
D6  
B2  
C2  
C7  
F3  
F8  
G2  
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
P
RxOUT2  
GND  
RxOUT22  
RxOUT24  
GND  
LVDS VCC  
LVDS GND  
PWR DWN  
RxCLKOUT  
RxOUT0  
RxOUT23  
RxOUT26  
NC  
O
O
O
O
RxIN1-  
I
I
RxIN2+  
PLL GND  
PLL VCC  
NC  
G
P
RxOUT25  
NC  
O
LVDS GND  
RxIN1+  
G
I
RxIN2-  
I
P
RxIN3-  
I
P
LVDS GND  
PLL GND  
RxOUT27  
RxIN0-  
G
G
O
I
P
VCC  
P
VCC  
P
VCC  
P
RxIN0+  
I
NC  
LVDS VCC  
LVDS GND  
RxCLKIN-  
RxCLKIN+  
RxIN3+  
P
G
I
NC  
NC  
NC  
I
NC  
I
NC  
G: Ground  
I : Input  
O: Output  
P: Power  
NC: Not connectted  
13  
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DS90CF364A  
Pin Diagram for TSSOP Packages  
DS90CF384A  
10087013  
10087023  
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14  
Physical Dimensions inches (millimeters) unless otherwise noted  
56-Lead Molded Thin Shrink Small Outline Package, JEDEC  
Dimensions shown in millimeters only  
Order Number DS90CF384AMTD  
NS Package Number MTD56  
48-Lead Molded Thin Shrink Small Outline Package, JEDEC  
Dimensions shown in millimeters only  
Order Number DS90CF364AMTD  
NS Package Number MTD48  
15  
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64 ball, 0.8mm Fine Pitch Ball Grid Array (FBGA) Package  
Dimensions shown in millimeters only  
Order Number DS90CF384ASLC  
NS Package Number SLC64A  
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16  
Notes  
17  
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Notes  
THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION  
(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY  
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