DS90LV032A [NSC]

3V LVDS Quad CMOS Differential Line Receiver; 3V LVDS四通道CMOS差分线路接收器
DS90LV032A
型号: DS90LV032A
厂家: National Semiconductor    National Semiconductor
描述:

3V LVDS Quad CMOS Differential Line Receiver
3V LVDS四通道CMOS差分线路接收器

文件: 总9页 (文件大小:196K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
July 1999  
DS90LV032A  
3V LVDS Quad CMOS Differential Line Receiver  
General Description  
Features  
>
n
400 Mbps (200 MHz) switching rates  
The DS90LV032A is a quad CMOS differential line receiver  
designed for applications requiring ultra low power dissipa-  
tion and high data rates. The device is designed to support  
data rates in excess of 400 Mbps (200 MHz) utilizing Low  
Voltage Differential Signaling (LVDS) technology.  
n 0.1 ns channel-to-channel skew (typical)  
n 0.1 ns differential skew (typical)  
n 3.3 ns maximum propagation delay  
n 3.3V power supply design  
The DS90LV032A accepts low voltage (350 mV typical) dif-  
ferential input signals and translates them to 3V CMOS out-  
put levels. The receiver supports a TRI-STATE® function that  
may be used to multiplex outputs. The receiver also supports  
open, shorted and terminated (100) input Fail-safe. The re-  
ceiver output will be HIGH for all fail-safe conditions.  
n Power down high impedance on LVDS inputs  
n Low Power design (40mW 3.3V static)  
n Interoperable with existing 5V LVDS networks  
n Accepts small swing (350 mV typical) VID  
n Supports open, short and terminated input fail-safe  
n Compatible with ANSI/TIA/EIA-644  
The DS90LV032A and companion LVDS line driver (eg.  
n Industrial temp. operating range (-40˚C to +85˚C)  
n Available in SOIC and TSSOP Packaging  
DS90LV031A) provide  
a new alternative to high power  
PECL/ECL devices for high speed point-to-point interface  
applications.  
Connection Diagram  
Functional Diagram  
Dual-in-Line  
DS100067-1  
Order Number DS90LV032ATM  
or DS90LV032ATMTC  
See NS Package Number M16A or MTC16  
DS100067-2  
ENABLES  
INPUTS  
RIN+ − RIN−  
X
OUTPUT  
EN  
EN*  
ROUT  
L
H
Z
H
L
All other combinations  
of ENABLE inputs  
VID 0.1V  
VID −0.1V  
Full Fail-safe  
OPEN/SHORT  
or Terminated  
H
© 1999 National Semiconductor Corporation  
DS100067  
www.national.com  
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
(Soldering 4 sec.)  
+260˚C  
+150˚C  
Maximum Junction Temperature  
ESD Rating (Note 10)  
(HBM 1.5 k, 100 pF)  
(EIAJ 0 , 200 pF)  
4.5 kV  
250 V  
Supply Voltage (VCC  
Input Voltage (RIN+, RIN−  
Enable Input Voltage (EN, EN*)  
Output Voltage (ROUT  
)
−0.3V to +4V  
−0.3V to +3.9V  
)
−0.3V to (VCC + 0.3V)  
−0.3V to (VCC + 0.3V)  
Recommended Operating  
Conditions  
)
Maximum Package Power Dissipation +25˚C  
M Package  
Min  
+3.0  
GND  
Typ  
Max  
Units  
1025 mW  
866 mW  
Supply Voltage (VCC  
)
+3.3  
+3.6  
+3.0  
V
V
MTC Package  
Receiver Input Voltage  
Operating Free Air  
Temperature (TA)  
Derate M Package  
8.2 mW/˚C above +25˚C  
6.9 mW/˚C above +25˚C  
−65˚C to +150˚C  
Derate MTC Package  
−40  
25  
+85  
˚C  
Storage Temperature Range  
Lead Temperature Range  
Electrical Characteristics  
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Note 2)  
Symbol  
VTH  
Parameter  
Conditions  
Pin  
Min  
Typ  
+20  
−20  
Max  
Units  
mV  
mV  
V
Differential Input High Threshold VCM = +1.2V  
RIN+  
RIN−  
,
+100  
(Note 13)  
VTL  
Differential Input Low Threshold  
−100  
0.1  
=
VCMR Common-Mode Voltage Range  
VID 200 mV peak to peak (Note 5)  
2.3  
+10  
+10  
+20  
±
±
IIN  
Input Current  
VIN = +2.8V  
VIN = 0V  
VCC = 3.6V or 0V  
−10  
−10  
-20  
2.7  
1
1
µA  
µA  
µA  
V
VIN = +3.6V  
VCC = 0V  
VOH  
Output High Voltage  
IOH = −0.4 mA, VID = +200 mV  
IOH = −0.4 mA, Input terminated  
IOH = −0.4 mA, Input shorted  
IOL = 2 mA, VID = −200 mV  
Enabled, VOUT = 0V (Note 11)  
Disabled, VOUT = 0V or VCC  
ROUT  
3.0  
3.0  
3.0  
0.1  
−48  
2.7  
V
2.7  
V
VOL  
IOS  
IOZ  
VIH  
VIL  
II  
Output Low Voltage  
Output Short Circuit Current  
Output TRI-STATE Current  
Input High Voltage  
0.25  
−120  
+10  
VCC  
0.8  
V
−15  
−10  
2.0  
mA  
µA  
V
±
1
EN,  
EN*  
Input Low Voltage  
GND  
−10  
V
±
Input Current  
VIN = 0V or VCC, Other Input = VCC or  
GND  
1
+10  
µA  
VCL  
ICC  
Input Clamp Voltage  
No Load Supply Current  
Receivers Enabled  
ICL = −18 mA  
−1.5  
−0.8  
10  
10  
3
V
EN, EN* = VCC or GND, Inputs Open  
EN, EN* = 2.4V or 0.5V, Inputs Open  
EN = GND, EN* = VCC, Inputs Open  
VCC  
15  
15  
5
mA  
mA  
mA  
ICCZ  
No Load Supply Current  
Receivers Disabled  
Switching Characteristics  
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 3, 4, 7, 8)  
Symbol  
tPHLD  
tPLHD  
tSKD1  
Parameter  
Conditions  
CL = 10 pF  
Min  
1.8  
1.8  
0
Typ  
Max  
3.3  
Units  
ns  
Differential Propagation Delay High to Low  
Differential Propagation Delay Low to High  
Differential Pulse Skew |tPHLD − tPLHD| (Note 6)  
VID = 200 mV  
3.3  
ns  
(Figure 1 and Figure 2)  
0.1  
0.1  
0.35  
0.5  
ns  
tSKD2  
Differential Channel-to-Channel Skew-same device  
(Note 7)  
0
ns  
tSKD3  
tSKD4  
tTLH  
Differential Part to Part Skew (Note 8)  
Differential Part to Part Skew (Note 9)  
Rise Time  
1.0  
1.5  
1.2  
1.2  
ns  
ns  
ns  
ns  
0.35  
0.35  
tTHL  
Fall Time  
www.national.com  
2
Switching Characteristics (Continued)  
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 3, 4, 7, 8)  
Symbol  
tPHZ  
Parameter  
Conditions  
RL = 2 kΩ  
Min  
Typ  
8
Max  
12  
Units  
ns  
Disable Time High to Z  
Disable Time Low to Z  
Enable Time Z to High  
Enable Time Z to Low  
tPLZ  
CL = 10 pF  
6
12  
ns  
tPZH  
(Figure 3 and Figure 4)  
11  
11  
250  
17  
ns  
tPZL  
17  
ns  
fMAX  
Maximum Operating Frequency (Note 14)  
All Channels Switching  
200  
MHz  
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices  
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.  
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise speci-  
fied.  
Note 3: All typicals are given for: V  
CC  
= +3.3V, T = +25˚C.  
A
Note 4: Generator waveform for all tests unless otherwise specified: f = 1 MHz, Z = 50, t and t (0% to 100%) 3 ns for R  
.
IN  
O
r
f
=
Note 5: The VCMR range is reduced for larger VID. Example: if VID 400mV, the VCMR is 0.2V to 2.2V. The fail-safe condition with inputs shorted is valid over  
a common-mode range of 0V to 2.3V. A VID up to V − 0V may be applied to the R / R inputs with the Common-Mode voltage set to V /2. Propagation delay  
CC IN+ IN− CC  
and Differential Pulse skew decrease when VID is increased from 200mV to 400mV. Skew specifications apply for 200mV VID 800mV over the common-mode  
range .  
Note 6:  
Note 7:  
t
t
is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel  
, Channel-to-Channel Skew, is defined as the difference between the propagation delay of one channel and that of the others on the same chip with  
SKD1  
SKD2  
any event on the inputs.  
Note 8: , part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices at the same V  
t
,
S
K
D
3
C
C
and within 5˚C of each other within the operating temperature range.  
Note 9: , part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over recommended  
t
SKD4  
operating temperature and voltage ranges, and across process distribution. t  
is defined as |Max − Min| differential propagation delay.  
SKD4  
Note 10: ESD Rating:  
HBM (1.5 k, 100 pF) 4.5kV  
EIAJ (0, 200 pF) 250V  
Note 11: Output short circuit current (I ) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not  
OS  
exceed maximum junction temperature specification.  
Note 12:  
Note 13:  
C includes probe and jig capacitance.  
L
V
is always higher than R  
IN+  
and R  
IN−  
voltage. R  
IN−  
and R  
IN+  
are allowed to have a voltage range −0.2V to V − VID/2. However, to be compliant with  
CC  
CC  
AC specifications, the common voltage range is 0.1V to 2.3V  
=
<
t
f
Note 14:  
f
generator input conditions: t  
1ns (0% to 100%), 50% duty cycle, differential (1.05V to 1.35V peak to peak). Output Criteria: 60%/40% duty cycle,  
(min 2.7V), Load 10 pF (stray plus probes)  
OH  
MAX  
(max 0.4V), V  
r
=
V
OL  
Parameter Measurement Information  
DS100067-3  
FIGURE 1. Receiver Propagation Delay and Transition Time Test Circuit  
DS100067-4  
FIGURE 2. Receiver Propagation Delay and Transition Time Waveforms  
3
www.national.com  
Parameter Measurement Information (Continued)  
DS100067-5  
C
S
S
includes load and test jig capacitance.  
L
1
1
= V  
CC  
for t , and t  
PZL PLZ  
measurements.  
measurements.  
= GND for t  
PZH  
and t  
PHZ  
FIGURE 3. Receiver TRI-STATE Delay Test Circuit  
DS100067-6  
FIGURE 4. Receiver TRI-STATE Delay Waveforms  
Typical Application  
Balanced System  
DS100067-7  
FIGURE 5. Point-to-Point Application  
Applications Information  
General application guidelines and hints for LVDS drivers  
and receivers may be found in the following application  
notes: LVDS Owner’s Manual (lit #550062-001), AN808,  
AN1035, AN977, AN971, AN916, AN805, AN903.  
the media is in the range of 100. A termination resistor of  
100should be selected to match the media, and is located  
as close to the receiver input pins as possible. The termina-  
tion resistor converts the driver output (current mode) into a  
voltage that is detected by the receiver. Other configurations  
are possible such as a multi-receiver configuration, but the  
effects of a mid-stream connector(s), cable stub(s), and  
other impedance discontinuities as well as ground shifting,  
noise margin limits, and total termination loading must be  
taken into account.  
LVDS drivers and receivers are intended to be primarily used  
in an uncomplicated point-to-point configuration as is shown  
in Figure 5. This configuration provides a clean signaling en-  
vironment for the fast edge rates of the drivers . The receiver  
is connected to the driver through a balanced media which  
may be a standard twisted pair cable, a parallel pair cable, or  
simply PCB traces. Typically the characteristic impedance of  
www.national.com  
4
Termination:  
Applications Information (Continued)  
Use a resistor which best matches the differential impedance  
or your transmission line. The resistor should be between  
90and 130. Remember that the current mode outputs  
need the termination resistor to generate the differential volt-  
age. LVDS will not work without resistor termination. Typi-  
cally, connect a single resistor across the pair at the receiver  
end.  
The DS90LV032A differential line receiver is capable of de-  
±
tecting signals as low as 100 mV, over a 1V common-mode  
range centered around +1.2V. This is related to the driver off-  
set voltage which is typically +1.2V. The driven signal is cen-  
±
tered around this voltage and may shift 1V around this cen-  
±
ter point. The 1V shifting may be the result of a ground  
potential difference between the driver’s ground reference  
and the receiver’s ground reference, the common-mode ef-  
fects of coupled noise, or a combination of the two. Both re-  
ceiver input pins have a recommended operating input volt-  
age range of 0V to +2.4V (measured from each pin to  
ground), exceeding these limits may turn on the ESD protec-  
tion circuitry which will clamp the bus voltages.  
Surface mount 1% to 2% resistors are best. PCB stubs,  
component lead, and the distance from the termination to the  
receiver inputs should be minimized. The distance between  
<
the termination resistor and the receiver should be 10mm  
(12mm MAX)  
Probing LVDS Transmission Lines:  
>
Always use high impedance ( 100k), low capacitance  
Power Decoupling Recommendations:  
<
(
2 pF) scope probes with a wide bandwidth (1 GHz)  
Bypass capacitors must be used on power pins. High fre-  
quency ceramic (surface mount is recommended) 0.1µF in  
parallel with 0.01µF, in parallel with 0.001µF at the power  
supply pin as well as scattered capacitors over the printed  
circuit board. Multiple vias should be used to connect the de-  
coupling capacitors to the power planes A 10µF (35V) or  
greater solid tantalum capacitor should be connected at the  
power entry point on the printed circuit board.  
scope. Improper probing will give deceiving results.  
Cables and Connectors, General Comments:  
When choosing cable and connectors for LVDS it is impor-  
tant to remember:  
Use controlled impedance media. The cables and connec-  
tors you use should have a matched differential impedance  
of about 100. They should not introduce major impedance  
discontinuities.  
PC Board considerations:  
Balanced cables (e.g. twisted pair) are usually better than  
unbalanced cables (ribbon cable, simple coax.) for noise re-  
duction and signal quality. Balanced cables tend to generate  
less EMI due to field canceling effects and also tend to pick  
up electromagnetic radiation a common-mode (not differen-  
tial mode) noise which is rejected by the receiver. For cable  
Use at least 4 PCB layers (top to bottom); LVDS signals,  
ground, power, TTL signals.  
Isolate TTL signals from LVDS signals, otherwise the TTL  
may couple onto the LVDS lines. It is best to put TTL and  
LVDS signals on different layers which are isolated by a  
power/ground plane(s).  
<
distances 0.5M, most cables can be made to work effec-  
Keep drivers and receivers as close to the (LVDS port side)  
connectors as possible.  
tively. For distances 0.5M d 10M, CAT 3 (category 3)  
twisted pair cable works well, is readily available and rela-  
tively inexpensive.  
Differential Traces:  
Use controlled impedance traces which match the differen-  
tial impedance of your transmission medium (ie. cable) and  
termination resistor. Run the differential pair trace lines as  
close together as possible as soon as they leave the IC  
Fail-Safe Feature:  
The LVDS receiver is a high gain, high speed device that  
amplifies a small differential signal (20mV) to CMOS logic  
levels. Due to the high gain and tight threshold of the re-  
ceiver, care should be taken to prevent noise from appearing  
as a valid signal.  
<
(stubs should be 10mm long). This will help eliminate re-  
flections and ensure noise is coupled as common-mode. In  
fact, we have seen that differential signals which are 1mm  
apart radiate far less noise than traces 3mm apart since  
magnetic field cancellation is much better with the closer  
traces. Plus, noise induced on the differential lines is much  
more likely to appear as common-mode which is rejected by  
the receiver.  
The receiver’s internal fail-safe circuitry is designed to  
source/sink a small amount of current, providing fail-safe  
protection (a stable known state of HIGH output voltage) for  
floating, terminated or shorted receiver inputs.  
1. Open Input Pins. The DS90LV032A is a quad receiver  
device, and if an application requires only 1, 2 or 3 re-  
ceivers, the unused channel(s) inputs should be left  
OPEN. Do not tie unused receiver inputs to ground or  
any other voltages. The input is biased by internal high  
value pull up and pull down resistors to set the output to  
a HIGH state. This internal circuitry will guarantee a  
HIGH, stable output state for open inputs.  
Match electrical lengths between traces to reduce skew.  
Skew between the signals of a pair means a phase differ-  
ence between signals which destroys the magnetic field can-  
cellation benefits of differential signals and EMI will result.  
(Note the velocity of propagation, v = c/Er where c (the  
speed of light) = 0.2997mm/ps or 0.0118 in/ps). Do not rely  
solely on the autoroute function for differential traces. Care-  
fully review dimensions to match differential impedance and  
provide isolation for the differential lines. Minimize the num-  
ber or vias and other discontinuities on the line.  
2. Terminated Input. If the driver is disconnected (cable  
unplugged), or if the driver is in a TRI-STATE or power-  
off condition, the receiver output will again be in a HIGH  
state, even with the end of cable 100termination resis-  
tor across the input pins. The unplugged cable can be-  
come a floating antenna which can pick up noise. If the  
cable picks up more than 10mV of differential noise, the  
receiver may see the noise as a valid signal and switch.  
To insure that any noise is seen as common-mode and  
not differential, a balanced interconnect should be used.  
Twisted pair cable will offer better balance than flat rib-  
bon cable.  
Avoid 90˚ turns (these cause impedance discontinuities).  
Use arcs or 45˚ bevels.  
Within a pair of traces, the distance between the two traces  
should be minimized to maintain common-mode rejection of  
the receivers. On the printed circuit board, this distance  
should remain constant to avoid discontinuities in differential  
impedance. Minor violations at connection points are allow-  
able.  
5
www.national.com  
Applications Information (Continued)  
Pin  
No.  
Name  
Description  
3. Shorted Inputs. If a fault condition occurs that shorts  
the receiver inputs together, thus resulting in a 0V differ-  
ential input voltage, the receiver output will remain in a  
HIGH state. Shorted input fail-safe is not supported  
across the common-mode range of the device (GND to  
2.4V). It is only supported with inputs shorted and no ex-  
ternal common-mode voltage applied.  
10, 14  
1, 7,  
9, 15  
3, 5,  
11, 13  
4
RIN−  
Inverting receiver input pin  
ROUT Receiver output pin  
External lower value pull up and pull down resistors (for a  
stronger bias) may be used to boost fail-safe in the presence  
of higher noise levels. The pull up and pull down resistors  
should be in the 5kto 15krange to minimize loading and  
waveform distortion to the driver. The common-mode bias  
point should be set to approximately 1.2V (less than 1.75V)  
to be compatible with the internal circuitry.  
EN  
Active high enable pin, OR-ed with  
EN*  
12  
16  
8
EN*  
VCC  
Active low enable pin, OR-ed with EN  
±
Power supply pin, +3.3V 0.3V  
GND Ground pin  
The footprint of the DS90LV032A is the same as the industry  
standard 26LS32 Quad Differential (RS-422) Receiver.  
Ordering Information  
Operating  
Package Type/  
Order Number  
Temperature  
−40˚C to +85˚C  
−40˚C to +85˚C  
Number  
Pin Descriptions  
SOP/M16A  
DS90LV032ATM  
Pin  
No.  
Name  
Description  
TSSOP/MTC16 DS90LV032ATMTC  
2, 6,  
RIN+  
Non-inverting receiver input pin  
DS100067-8  
FIGURE 6. ICC vs Frequency, four channels switching  
DS100067-9  
FIGURE 7. Typical Common-Mode Range variation with respect to amplitude of differential input  
www.national.com  
6
Applications Information (Continued)  
DS100067-10  
FIGURE 8. Typical Pulse Skew variation versus common-mode voltage  
DS100067-11  
FIGURE 9. Variation in High to Low Propagation Delay versus VCM  
DS100067-12  
FIGURE 10. Variation in Low to High Propagation Delay versus VCM  
7
www.national.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
16-Lead (0.150" Wide) Molded Small Outline Package, JEDEC  
Order Number DS90LV032ATM  
NS Package Number M16A  
www.national.com  
8
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
16-Lead (0.100" Wide) Molded Thin Shrink Small Outline Package, JEDEC  
Order Number DS90LV032ATMTC  
NS Package Number MTC16  
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL  
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and  
whose failure to perform when properly used in  
accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a  
significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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