LH0101C [NSC]
;
| 型号： | LH0101C |
| 厂家： | 
National Semiconductor |
| 描述： |
|
| 文件： | 总12页 (文件大小：281K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
February 1995
LH0101 Power Operational Amplifier
General Description
Features
Y
5 Amp peak, 2 Amp continuous output current
300 kHz power bandwidth
The LH0101 is a wideband power operational amplifier fea-
turing FET inputs, internal compensation, virtually no cross-
over distortion, and rapid settling time. These features make
the LH0101 an ideal choice for DC or AC servo amplifiers,
deflection yoke drives, programmable power supplies, and
disk head positioner amplifiers. The LH0101 is packaged in
an 8 pin TO-3 hermetic package, rated at 60 watts with a
suitable heat sink.
Y
Y
Y
Y
Y
Y
Y
g
850 mW standby power ( 15V supplies)
300 pA input bias current
10 V/ms slew rate
Virtually no crossover distortion
2 ms settling time to 0.01%
5 MHz gain bandwidth
Schematic and Connection Diagrams
TL/K/5558–2
Top View
Order Numbers LH0101K,
LH0101K-MIL, LH0101CK,
LH0101AK,
LH0101AK-MIL or LH0101ACK
See NS Package Number K08A
Note: Electrically connected internally, no
connection should be made to pin.
TL/K/5558–1
C
1995 National Semiconductor Corporation
TL/K/5558
RRD-B30M115/Printed in U. S. A.
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
(Note 5)
Peak Output Current (50 ms pulse), I
5A
O(PK)
Output Short Circuit Duration
(within rated power dissipation,
e
e
25 C)
R
0.35X, T
Continuous
§
Operating Temperature Range, T
SC
A
g
Supply Voltage, V
22V
5W
S
A
e
Power Dissipation at T
Derate linearly at 25 C/W to zero at 150 C,
b a
25 C to 85 C
25 C, P
LH0101AC, LH0101C
LH0101A, LH0101
§
§
55 C to 125 C
§
A
D
b a
§
C
§
§
§
§
e
Derate linearly at 2 C/W to zero at 150 C
b
a
65 C to 150 C
Power Dissipation at T
25 C
§
62W
Storage Temperature Range, T
§
STG
§
Differential Input Voltage, V
§
Maximum Junction Temperature, T
150 C
§
J
k
k
g
g
g
40V but
20V but
V
V
k
Lead Temperature (Soldering 10 sec.)
IN
S
260 C
§
g
Input Voltage Range, V
Thermal ResistanceÐ
CM
S
ESD rating to be determined.
See Typical Performance Characteristics
e
e
g
DC Electrical Characteristics (Note 1) V
15V, T
25 C unless otherwise noted
§
S
A
LH0101AC
LH0101A
LH0101C
LH0101
Symbol
Parameter
Conditions
Units
Min
Typ Max Min
Typ Max
V
Input Offset Voltage
1
3
7
5
10
15
OS
mV
s
s
T
T
T
0
MIN
A
MAX
DV /DP Change in
OS
(Note 2)
D
Input Offset Voltage
150
10
300
10
mV/W
with Dissipated Power
e
DV /DT Change in
OS
V
CM
Input Offset Voltage
mV/ C
§
with Temperature
I
I
Input Bias Current
300
60
1000 pA
B
LH0101C/AC
LH0101/A
60
nA
1000
s
s
T
T
A
MAX
300
75
Input Offset Current
250 pA
OS
LH0101C/AC
LH0101/A
15
15
nA
250
T
A
T
MAX
75
e
e
10X
g
A
V
Large Signal
Voltage Gain
V
10V R
L
VOL
O
50
200
50
200
V/mV
e
e
e
e
g
g
g
g
12.5
Output Voltage Swing R
SC
0
R
L
R
L
R
L
100X
10X
5X
12
12.5
12
O
e a
g
g
11.25 11.6
g
g
11.25 11.6
A
1
V
V
g
g
g
g
11
Note 3
10.5
11
10.5
CMRR
PSRR
Common Mode
Rejection Ratio
e
g
DV
DV
10V
85
100
100
28
85
100
100
28
IN
S
dB
Power Supply
e
g
g
5V to 15V
85
85
Rejection Ratio
I
Quiescent Supply
Current
S
35
35
mA
2
e
e
25 C
g
AC Electrical Characteristics (Note 1), V
15V, T
§
S
A
LH0101
LH0101C
Symbol
Parameter
Conditions
LH0101A
LH0101AC
Units
Min
Typ
Max
Min
Typ
Max
e
e
e
Equivalent Input
Noise Voltage
f
f
1 kHz
n
25
25
nV Hz
0
C
Input Capacitance
1 MHz
3.0
300
10
3.0
300
10
pF
IN
b
Power Bandwidth, 3 dB
kHz
SR
Slew Rate
7.5
V/ms
(Note 4)
e
R
L
10X
t , t
r f
Small Signal Rise or
Fall Time
200
200
ns
e a
A
V
1
Small Signal Overshoot
Gain-Bandwidth Product
10
10
%
GBW
4.0
5.0
5.0
MHz
(Note 4)
e %
R
L
o
t
s
Large Signal Settling
Time to 0.01%
2.0
2.0
ms
e
e
e
1 kHz
THD
Total Harmonic Distortion
P
10W, f
0.008
0.008
%
R
10X
L
e
operating junction temperature will rise approximately 20 C without heat sinking. Accordingly, V
e
g
25 C value. When supply voltages are 15V, quiescent
§
Note 1: Specification is at T
25 C. Actual values at operating temperature may differ from the T
§
A
A
may change 0.5 mV and I and I
will change significantly
OS
§
OS
B
g
during warm-ups. Refer to the I vs. temperature and power dissipation graphs for expected values. Power supply voltage is 15V. Temperature tests are made
B
only at extremes.
Note 2: Change in offset voltage with dissipated power is due entirely to average device temperature rise and not to differential thermal feedback effects. Test is
performed without any heat sink.
Note 3: At light loads, the output swing may be limited by the second stage rather than the output stage. See the application section under ‘‘Output swing
enhancement’’ for hints on how to obtain extended operation.
Note 4: These parameters are sample tested to 10% LTPD.
Note 5: Refer to RETS0101AK for the LH0101AK military specifications and RETS0101K for the LH0101K military specifications.
3
Typical Performance Characteristics
Quiescent Power Supply
Current
Maximum Power Dissipation
Safe Operating Area
TL/K/5558–3
4
Typical Performance Characteristics (Continued)
Total Harmonic
Distortion vs. Gain
Output Voltage Swing
with Swing Enhancement
Equivalent Input Noise Voltage
TL/K/5558–4
e
10X)
Small Signal Pulse Response (No Load)
Large Signal Pulse Response (R
L
TL/K/5558–5
TL/K/5558–6
5
Application Hints
Input Voltages
Electrostatic shielding of high impedance circuitry is advisa-
ble.
The LH0101 operational amplifier contains JFET input de-
vices which exhibit high reverse breakdown voltages from
gate to source or drain. This eliminates the need for input
clamp diodes, so that high differential input voltages may be
applied without a large increase in input current. However,
neither input voltage should be allowed to exceed the nega-
tive supply as the resultant high current flow may destroy
the unit.
Error voltages can also be generated in the external circuit-
ry. Thermocouples formed between dissimilar metals can
cause hundreds of microvolts of error in the presence of
temperature gradients.
Since the LH0101 can deliver large output currents, careful
attention should be paid to power supply, power supply by-
passing and load currents. Incorrect grounding of signal in-
puts and load can cause significant errors.
Exceeding the negative common-mode limit on either input
will cause a reversal of the phase to the output and force
the amplifier output to the corresponding high or low state.
Exceeding the negative common-mode limit on both inputs
will force the amplifier output to a high state. In neither case
does a latch occur since raising the input back within the
common-mode range again puts the input stage and thus
the amplifier in a normal operating mode.
Every attempt should be made to achieve a single point
ground system as shown in the figure below.
Exceeding the positive common-mode limit on a single input
will not change the phase of the output however, if both
inputs exceed the limit, the output of the amplifier will be
forced to a high state.
These amplifiers will operate with the common-mode input
voltage equal to the positive supply. In fact, the common-
mode voltage may exceed the positive supply by approxi-
mately 100 mV, independent of supply voltage and over the
full operating temperature range. The positive supply may
therefore be used as a reference on an input as, for exam-
ple, in a supply current monitor and/or limiter.
With the LH0101 there is a temptation to remove the bias
current compensation resistor normally used on the non-in-
verting input of a summing amplifier. Direct connection of
the inputs to ground or a low-impedance voltage source is
not recommended with supply voltages greater than 3V.
The potential problem involves loss of one supply which can
cause excessive current in the second supply. Destruction
of the IC could result if the current to the inputs of the de-
vice is not limited to less than 100 mA or if there is much
more than 1 mF bypass on the supply buss.
TL/K/5558–7
FIGURE 1. Single-Point Grounding
Bypass capacitor C should be used if the lead lengths of
BX
bypass capacitors C are long. If a single point ground sys-
B
tem is not possible, keep signal, load, and power supply
from intermingling as much as possible. For further informa-
tion on proper grounding techniques refer to ‘‘Grounding
and Shielding Techniques in Instrumentation’’ by Morrison,
and ‘‘Noise Reduction Techniques in Electronic Systems’’
by Ott (both published by John Wiley and Sons).
Although difficulties can be largely avoided by installing
clamp diodes across the supply lines on every PC board, a
conservative design would include enough resistance in the
input lead to limit current to 10 mA if the input lead is pulled
to either supply by internal currents. This precaution is by no
means limited to the LH0101.
Leads or PC board traces to the supply pins, short-circuit
current limit pins, and the output pin must be substantial
enough to handle the high currents that the LH0101 is capa-
ble of producing.
Layout Considerations
Short Circuit Current Limiting
When working with circuitry capable of resolving pico-am-
pere level signals, leakage currents in circuitry external to
the op amp can significantly degrade performance. High
quality insulation is a must (Kel-F and Teflon rate high).
Proper cleaning of all insulating surfaces to remove fluxes
and other residues is also required. This includes the IC
package as well as sockets and printed circuit boards.
a
should be shorted to V and SC should be shorted to
Should current limiting of the output not be necessary, SC
a
b
. Remember that the short circuit current limit is depen-
b
V
dent upon the total resistance seen between the supply and
current limit pins. This total resistance includes the desired
resistor plus leads, PC Board traces, and solder joints.* As-
suming a zero TCR current limit resistor, typical temperature
coefficient of the short circuit current will be approximately
When operating in high humidity environments or near 0 C,
§
some form of surface coating may be necessary to provide
a moisture barrier.
.3%/ C.
§
0.6
*Short circuit current will be limited to approximately
.
The effects of board leakage can be minimized by encircling
the input circuitry with a conductive guard ring operated at a
potential close to that of the inputs.
RSC
6
Application Hints (Continued)
ground set the frequency of the pole. In many instances the
frequency of this pole is much greater than the expected 3
dB frequency of the closed loop gain and consequently
there is negligible effect on stability margin. However, if the
feedback pole is less than approximately six times the ex-
pected 3 dB frequency a lead capacitor should be placed
from the output to the input of the op amp. The value of the
added capacitor should be such that the RC time consistant
of this capacitor and the resistance it parallels is greater
than or equal to the original feedback pole time constant.
Thermal Resistance
The thermal resistance between two points of a conductive
system is expressed as:
b
T
T
2
1
e
i
C/W
§
12
P
D
where subscript order indicates the direction of heat flow. A
simplified heat transfer circuit for a cased semiconductor
and heat sink system is shown in the figure below.
The circuit is valid only if the system is in thermal equilibrium
(constant heat flow) and there are, indeed, single specific
temperatures T , T and T (no temperature distribution in
Some inductive loads may cause output stage oscillation. A
.01 mF ceramic capacitor in series with a 10X resistor from
the output to ground will usually remedy this situation.
J
C
S
junction, case, or heat sink). Nevertheless, this is a reason-
able approximation of actual performance.
TL/K/5558–8
TL/K/5558–9
FIGURE 2. Semiconductor-Heat Sink Thermal Circuit
FIGURE 3. Driving Inductive Loads
The junction-to-case thermal resistance i specified in the
JC
Capacitive loads may be compensated for by traditional
techniques. (See ‘‘Operational Amplifiers: Theory and Prac-
tice’’ by Roberge, published by Wiley):
data sheet depends upon the material and size of the pack-
age, die size and thickness, and quality of the die bond to
the case or lead frame. The case-to-heat sink thermal re-
sistance i depends on the mounting of the device to the
CS
heat sink and upon the area and quality of the contact sur-
face. Typical i for a TO-3 package is 0.5 to 0.7 C/W, and
§
CS
0.3 to 0.5 C/W using silicone grease.
§
The heat sink to ambient thermal resistance i
depends
on the quality of the heat sink and the ambient conditions.
SA
Cooling is normally required to maintain the worst case op-
erating junction temperature T of the device below the
J
specified maximum value T
. T can be calculated
J(MAX)
J
from known operating conditions. Rewriting the above equa-
tion, we find:
b
TL/K/5558–10
T
T
A
J
e
i
C/W
§
JA
FIGURE 4. R and C Selected to
C
C
Compensate for Capacitive Load
P
D
e
a
P
T
T
i
C
§
J
A
D
JA
A similar but alternative technique may be used for the
LH0101:
b
for a DC Signal
a
a b b
(V ) I
Q
Where: P (V
D
V
)I
OUT OUT
V
S
l
l
e
a
a
e
and V Supply Voltage
S
i
i
i
i
JA
JC
CS
SA
i
for the LH0101 is about 2 C/W.
§
JC
Stability and Compensation
As with most amplifiers, care should be taken with lead
dress, component placement and supply decoupling in or-
der to ensure stability. For example, resistors from the out-
put to an input should be placed with the body close to the
input to minimize ‘‘pickup’’ and maximize the frequency of
the feedback pole by minimizing the capacitance from the
input to ground.
A feedback pole is created when the feedback around any
amplifier is resistive. The parallel resistance and capaci-
tance from the input device (usually the inverting input) to ac
TL/K/5558–11
FIGURE 5. Alternate Compensation for Capacitive Load
7
Application Hints (Continued)
Output Swing Enhancement
Output Resistance
When the feedback pin is connected directly to the output,
the output voltage swing is limited by the driver stage and
not by output saturation. Output swing can be increased as
shown by taking gain in the output stage as shown in High
Power Voltage Follower with Swing Enhancement below.
Whenever gain is taken in the output stage, as in swing
enhancement, either the output stage, or the entire op amp
must be appropriately compensated to account for the addi-
tional loop gain.
The open loop output resistance of the LH0101 is a function
of the load current. No load output resistance is approxi-
mately 10X. This decreases to under 1X for load currents
exceeding 100 mA.
Typical Applications
See AN261 for more information.
TL/K/5558–12
TL/K/5558–13
FIGURE 6. High Power Voltage Follower
FIGURE 7. High Power Voltage Follower
with Swing Enhancement
TL/K/5558–14
FIGURE 8. Restricting Outputs to Positive Voltages Only
Following is a partial list of sockets and heat dissipators for use with the LH0101. National assumes no responsibility for their
quality or availability.
8-Lead TO-3 Hardware
SOCKETS
Keystone 4626 or 4627
Robinson Nugent 0002011
Azimuth 6028 (test socket)
AAVID Engineering
30 Cook Court
Laconla, New Hampshire 03246
Keystone Electronics Corp.
49 Bleecker St.
New York, NY 10012
HEAT SINKS
Thermalloy 2266B (35 C/W)
Azimuth Electronics
2377 S. El Camino Real
San Clemente, CA 92572
Robinson Nugent Inc.
800 E. 8th St.
New Albany, IN 47150
§
IERC LAIC3B4CB
IERC HP1-TO3-33CB (7 C/W)
AAVID 5791B
§
IERC
135 W. Magnolia Blvd.
Burbank, CA 91502
Thermalloy
P.O. Box 34829
Dallas, TX 75234
MICA WASHERS
Keystone 4658
8
Typical Applications (Continued)
TL/K/5558–15
FIGURE 9. Generating a Split Supply from a Single Voltage Supply
TL/K/5558–16
FIGURE 10. Power DAC
TL/K/5558–17
FIGURE 11. Bridge Audio Amplifier
9
Typical Applications (Continued)
TL/K/5558–18
g
g
FIGURE 12. 5 to 35 Power Source or Sink
TL/K/5558–19
FIGURE 13. Remote Loudspeaker via Infrared Link
TL/K/5558–20
FIGURE 14. CRT Deflection Yoke Driver
10
Typical Applications (Continued)
TL/K/5558–21
FIGURE 15. DC Servo Amplifier
TL/K/5558–22
FIGURE 16. High Current Source/Sink
11
Ý
Lit. 106400
Physical Dimensions inches (millimeters)
8 Lead TO-3 Metal Can (K)
Order Number LH0101K, LH0101K-MIL, LH0101CK, LH0101AK, LH0101AK-MIL or LH0101ACK
NS Package Number K08A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
National Semiconductor
Corporation
National Semiconductor
Europe
National Semiconductor
Hong Kong Ltd.
National Semiconductor
Japan Ltd.
a
1111 West Bardin Road
Arlington, TX 76017
Tel: 1(800) 272-9959
Fax: 1(800) 737-7018
Fax:
(
49) 0-180-530 85 86
@
13th Floor, Straight Block,
Ocean Centre, 5 Canton Rd.
Tsimshatsui, Kowloon
Hong Kong
Tel: (852) 2737-1600
Fax: (852) 2736-9960
Tel: 81-043-299-2309
Fax: 81-043-299-2408
Email: cnjwge tevm2.nsc.com
a
a
a
a
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(
(
(
(
49) 0-180-530 85 85
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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