LM25115AMTX [NSC]

Secondary Side Post Regulator/DC-DC Converter with Power-Up/Power-Down Tracking; 次级侧后稳压器/ DC -DC转换器上电/断电跟踪
LM25115AMTX
型号: LM25115AMTX
厂家: National Semiconductor    National Semiconductor
描述:

Secondary Side Post Regulator/DC-DC Converter with Power-Up/Power-Down Tracking
次级侧后稳压器/ DC -DC转换器上电/断电跟踪

转换器 稳压器
文件: 总20页 (文件大小:403K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
February 2007  
LM25115A  
Secondary Side Post Regulator/DC-DC Converter with  
Power-Up/Power-Down Tracking  
General Description  
Features  
The LM25115A controller contains all of the features neces-  
sary to produce multiple tracking outputs using the Secondary  
Side Post Regulation (SSPR) technique. The SSPR tech-  
nique develops a highly efficient and well regulated auxiliary  
output from the secondary side switching waveform of an iso-  
lated power converter. LM25115A can be also used as a  
standalone DC/DC synchronous buck controller (Refer to  
Synchronous Buck section). Regulation of the auxiliary  
output voltage is achieved by leading edge pulse width mod-  
ulation (PWM) of the main channel duty cycle. Leading edge  
modulation is compatible with either current mode or voltage  
mode control of the main output. The LM25115A drives ex-  
ternal high-side and low-side NMOS power switches config-  
ured as a synchronous buck regulator. A current sense  
amplifier provides overload protection and operates over a  
wide common mode input range. Additional features include  
a low dropout (LDO) bias regulator, error amplifier, precision  
reference, adaptive dead time control of the gate signals and  
thermal shutdown.  
Power-up/Power-down Tracking  
Self-synchronization to main channel output  
Leading edge pulse width modulation  
Valley current Mode control  
Standalone DC/DC synchronous buck mode  
Operates from AC or DC input up to 42V  
Wide 4.5V to 30V bias supply range  
Wide 0.75V to 13.5V output range.  
Top and bottom gate drivers sink 2.5A peak  
Adaptive gate driver dead-time control  
Wide bandwidth error amplifier (4MHz)  
Programmable soft-start  
Thermal shutdown protection  
TSSOP-16 package  
Typical Application Circuit  
30008301  
FIGURE 1. Simplified Multiple Output Power Converter Utilizing SSPR Technique  
© 2007 National Semiconductor Corporation  
300083  
www.national.com  
Connection Diagram  
16-Lead TSSO3P0008302  
See NS Package Numbers MTC16  
Ordering Information  
Ordering Number  
LM25115AMT  
Package Type  
Nsc Package Drawing  
MTC16  
Supplied As  
TSSOP-16  
TSSOP-16  
92 Units Per Anti-Static Tube  
2500 units shipped as Tape & Reel  
LM25115AMTX  
MTC16  
Pin Descriptions  
Pin  
Name  
Description  
Application Information  
1
CS  
Current Sense amplifier positive input  
A low inductance current sense resistor is connected between CS  
and VOUT. Current limiting occurs when the differential voltage  
between CS and VOUT exceeds 45mV (typical).  
2
VOUT  
Current sense amplifier negative input  
Connected directly to the output voltage. The current sense  
amplifier operates over a voltage range from 0V to 13.5V at the  
VOUT pin.  
3
4
AGND  
CO  
Analog ground  
Connect directly to the power ground pin (PGND).  
Current limit output  
For normal current limit operation, connect the CO pin to the  
COMP pin through a diode. CO pin is connected to ground through  
a resistor in series with a capacitor to provide adequate control  
loop compensation for the current limit gm amplifier. Leave this  
pin open to disable the current limit function.  
5
6
COMP  
FB  
Compensation. Error amplifier output  
Feedback. Error amplifier inverting input  
COMP pin pull-up is provided by an internal 300uA current source.  
Connected to the regulated output through the feedback resistor  
divider and compensation components. The non-inverting input of  
the error amplifier is internally connected to the SS pin.  
7
8
TRK/SS  
RAMP  
Tracking/Soft-start control  
PWM Ramp signal  
Non-inverting input to error amp with 15 µA pull-up current source.  
Can be used with capacitor for soft-start or tied to external divider  
of a master output for tracking. TRK/SS is the reference input to  
the amplifier when the voltage applied to the pin is < 0.75V. For  
higher inputs, the internal reference controls the amplifier.  
An external capacitor connected to this pin sets the ramp slope  
for the voltage mode PWM. The RAMP capacitor is charged with  
a current that is proportional to current into the SYNC pin. The  
capacitor is discharged at the end of every cycle by an internal  
MOSFET.  
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2
Pin  
Name  
Description  
Synchronization input  
Application Information  
9
SYNC  
A low impedance current input pin. The current into this pin sets  
the RAMP capacitor charge current and the frequency of an  
internal oscillator that provides a clock for the free-run (DC input)  
mode .  
10  
11  
PGND  
LO  
Power Ground  
Connect directly to the analog ground pin (AGND).  
Low-side gate driver output  
Connect to the gate of the low-side synchronous MOSFET  
through a short low inductance path.  
12  
VCC  
Output of bias regulator  
Nominal 7V output from the internal LDO bias regulator. Locally  
decouple to PGND using a low ESR/ESL capacitor located as  
close to controller as possible.  
13  
14  
15  
HS  
HO  
HB  
High-side MOSFET source connection  
High-side gate driver output  
Connect to negative terminal of the bootstrap capacitor and the  
source terminal of the high-side MOSFET.  
Connect to the gate of high-side MOSFET through a short low  
inductance path.  
High-side gate driver bootstrap rail  
Connect to the cathode of the bootstrap diode and the positive  
terminal of the bootstrap capacitor. The bootstrap capacitor  
supplies current to charge the high-side MOSFET gate and should  
be placed as close to controller as possible.  
16  
VBIAS  
Supply Bias Input  
Input to the LDO bias regulator and current sense amplifier that  
powers internal blocks. Input range of VBIAS is 4.5V to 30V.  
3
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Junction Temperature  
ESD Rating  
HBM (Note 2)  
+150°C  
2 kV  
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Operating Ratings  
VBIAS supply voltage  
VCC supply voltage  
HS voltage  
VBIAS to GND  
VCC to GND  
–0.3V to 32V  
–0.3V to 9V  
5V to 30V  
5V to 7.5V  
0V to 42V  
HS to GND  
–1V to 45V  
VOUT, CS to GND  
All other inputs to GND  
Storage Temperature Range  
– 0.3V to 15V  
−0.3V to 7.0V  
–55°C to +150°C  
HB voltage  
Operating Junction Temperature  
VCC + HS  
–40°C to +125°C  
Typical Operating Conditions  
Min  
Parameter  
Typ  
Max  
30  
7
Units  
V
Supply Voltage, VBIAS  
4.5  
4.5  
Supply Voltage, VCC  
V
Supply voltage bypass, CVBIAS  
Reference bypass capacitor, CVCC  
HB-HS bootstrap capacitor  
0.1  
1
1
µF  
µF  
µF  
µA  
V
0.1  
10  
0.047  
50  
SYNC Current Range (VCC = 4.5V)  
RAMP Saw Tooth Amplitude  
150  
1.75  
13.5  
1
VOUT regulation voltage (VBIAS min = 3V + VOUT)  
0.75  
V
Electrical Characteristics (Note 3) Unless otherwise specified, TJ = –40°C to +125°C, VBIAS = 12V, No Load  
on LO or HO.  
Symbol  
Parameter  
Conditions  
FSYNC = 200kHz  
Min  
Typ  
Max  
4
Units  
VBIAS SUPPLY  
Ibias  
VBIAS Supply Current  
mA  
VCC LOW DROPOUT BIAS REGULATOR  
VccReg  
VCC Regulation  
VCC open circuit. Outputs not switching  
(Note 4)  
6.65  
7
7.15  
V
mA  
V
VCC Current Limit  
40  
VCC Under-voltage Lockout Voltage Positive going VCC  
VCC Under-voltage Hysteresis  
4
4.5  
0.3  
0.2  
0.25  
V
TRACK / SOFT-START  
SS Pull-up Source  
10  
15  
20  
µA  
SS Discharge Impedance  
140  
ERROR AMPLIFIER and FEEDBACK REFERENCE  
VREF  
FB Reference Voltage  
FB Input Bias Current  
COMP Source Current  
Open Loop Voltage Gain  
Gain Bandwidth Product  
Input Offset Voltage  
COMP Offset  
Measured at FB pin  
FB = 2V  
.737  
.750  
0.2  
300  
60  
4
.763  
0.5  
V
µA  
µA  
dB  
MHz  
mV  
V
GBW  
Vio  
22  
2
Threshold for VHO = high RAMP = CS =  
VOUT = 0V  
RAMP Offset  
Threshold for VHO = high COMP = 1.5V,  
CS = VOUT = 0V  
1.0  
V
V
CURRENT SENSE AMPLIFIER  
Current Sense Amplifier Headroom Headroom = Vbias – Vout  
Vbias= 4.5 V and Vout= 1.5 V  
3
Current Sense Amplifier Gain  
16  
V/V  
V
Output DC Offset  
1.27  
500  
Amplifier Bandwidth  
kHz  
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4
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
CURRENT LIMIT  
Slow ILIMIT Amp Transconductance  
Overall Transconductance  
Slow ILimit Threshold  
5
mA / V  
mA / V  
mV  
90  
45  
VCL = VCS - VVOUT  
39  
34  
51  
46  
VOUT = 6V and CO/COMP = 1.5V  
VCL = VCS - VVOUT  
Slow ILimit Foldback  
39  
mV  
VOUT = 0V and CO/COMP = 1.5V  
Vds = 2V  
Fast ILimit Pull-Down Current  
Fast ILimit Threshold  
45  
60  
mA  
mV  
mV  
VCLNEG  
Negative Current Limit  
VOUT = 6V  
-17  
VCL = VCS - VVOUT to cause LO to shutoff  
CO Clamp Voltage  
ICO Pull-Up Current  
5.5  
6
6.5  
V
15  
µA  
RAMP GENERATOR  
SYNC Input Impedance  
2.5  
20  
kΩ  
µA  
V
SYNC Threshold  
End of cycle detection threshold  
Free Run Mode Peak Threshold  
RAMP peak voltage with dc current  
applied to SYNC.  
2.35  
3.3  
Current Mirror Gain  
Ratio of RAMP charge current to SYNC  
input current.  
2.7  
A/A  
Discharge Impedance  
100  
LOW-SIDE GATE DRIVER  
VOLL  
VOHL  
LO Low-state Output Voltage  
LO High-state Output Voltage  
LO Rise Time  
ILO = 100mA  
0.15  
0.35  
15  
0.5  
0.8  
V
V
ILO = -100mA, VOHL = VCC -VLO  
CLOAD = 1000pF  
CLOAD = 1000pF  
VLO = 0V  
ns  
ns  
A
LO Fall Time  
12  
IOHL  
IOLL  
Peak LO Source Current  
Peak LO Sink Current  
2
VLO = 12V  
2.5  
A
HIGH-SIDE GATE DRIVER  
VOLH  
VOHH  
HO Low-state Output Voltage  
IHO = 100mA  
0.15  
0.35  
15  
0.5  
0.8  
V
V
HO High-state Output Voltage  
HO Rise Time  
IHO = -100mA, VOHH = VHB –VHO  
CLOAD = 1000pF  
CLOAD = 1000pF  
VHO = 0V  
ns  
ns  
A
HO High-side Fall Time  
Peak HO Source Current  
Peak HO Sink Current  
12  
IOHH  
IOLH  
2
VHO = 12V  
2.5  
A
SWITCHING CHARACTERISITCS  
LO Fall to HO Rise Delay  
CLOAD = 0  
CLOAD = 0  
CLOAD = 0  
CLOAD = 0  
40  
50  
ns  
ns  
ns  
ns  
HO Fall to LO Rise Delay  
SYNC Fall to HO Fall Delay  
SYNC Rise to LO Fall Delay  
120  
80  
5
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Symbol  
Parameter  
Conditions  
Min  
150  
Typ  
Max  
Units  
THERMAL SHUTDOWN  
TSD  
Thermal Shutdown Temp.  
165  
25  
°C  
°C  
Thermal Shutdown Hysteresis  
THERMAL RESISTANCE  
Junction to Ambient  
Junction to Ambient  
MTC Package  
SDA Package  
125  
32  
°C/W  
°C/W  
θJA  
θJA  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation  
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,  
see the Electrical Characteristics tables.  
Note 2: The human body model is a 100 pF capacitor discharged through a 1.5kresistor into each pin.  
Note 3: Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical  
Quality Control (SQC) methods. Limits are used to calculate National’s Average Outgoing Quality Level (AOQL).  
Note 4: Device thermal limitations may limit usable range.  
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6
Typical Performance Characteristics  
Efficiency vs. Load Current and Vphase  
(VOUT = 2.5V)  
VCC Regulator Start-up Characteristics, VCC vs. VBIAS  
30008322  
30008304  
Current Value (CV) vs. Current Limit (VCL  
)
Current Sense Amplifier Gain and Phase vs. Frequency  
30008307  
30008306  
Current Error Amplifier Transconductance  
Overall Current Amplifier Transconductance  
30008309  
30008308  
7
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Common Mode Output Voltage vs. Positive Current Limit Common Mode Output Voltage vs. Negative Current Limit  
(Room Temp)  
30008310  
30008311  
VCC Load Regulation to Current Limit  
30008305  
www.national.com  
8
Block Diagram  
30008303  
9
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Detailed Operating Description  
Synchronization (SYNC) and Feed-  
Forward (RAMP)  
The LM25115A controller contains all of the features neces-  
sary to implement multiple output power converters utilizing  
the Secondary Side Post Regulation (SSPR) technique. The  
SSPR technique develops a highly efficient and well regulat-  
ed auxiliary output from the secondary side switching wave-  
form of an isolated power converter. Regulation of the  
auxiliary output voltage is achieved by leading edge pulse  
width modulation (PWM) of the main channel duty cycle.  
Leading edge modulation is compatible with either current  
mode or voltage mode control of the main output. The  
LM25115A drives external high-side and low-side NMOS  
power switches configured as a synchronous buck regulator.  
A current sense amplifier provides overload protection and  
operates over a wide common mode input range from 0V to  
13.5V. Additional features include a low dropout (LDO) bias  
regulator, error amplifier, precision reference, adaptive dead  
time control of the gate driver signals and thermal shutdown.  
The pulsing “phase signal” from the main converter synchro-  
nizes the PWM ramp and gate drive outputs of the LM25115A.  
The phase signal is the square wave output from the trans-  
former secondary winding before rectification (Figure 1). A  
resistor connected from the phase signal to the low  
impedance SYNC pin produces a square wave current  
(ISYNC) as shown in Figure 2. A current comparator at the  
SYNC input monitors ISYNC relative to an internal 15µA refer-  
ence. When ISYNC exceeds 15µA, the internal clock signal  
(CLK) is reset and the capacitor connected to the RAMP be-  
gins to charge. The current source that charges the RAMP  
capacitor is equal to 3 times the ISYNC current. The falling edge  
of the phase signal sets the CLK signal and discharges the  
RAMP capacitor until the next rising edge of the phase signal.  
The RAMP capacitor is discharged to ground by a low  
impedance (100) n-channel MOSFET. The input  
impedance at SYNC pin is 2.5kwhich is normally much  
smaller than the external SYNC pin resistance.  
Low Drop-Out Bias Regulator (VCC)  
The LM25115A contains an internal LDO regulator that op-  
erates over an input supply range from 4.5V to 30V. The  
output of the regulator at the VCC pin is nominally regulated  
at 7V and is internally current limited to 40mA. VCC is the  
main supply to the internal logic, PWM controller, and gate  
driver circuits. When power is applied to the VBIAS pin, the  
regulator is enabled and sources current into an external ca-  
pacitor connected to the VCC pin. The recommended output  
capacitor range for the VCC regulator is 0.1uF to 100uF.  
When the voltage at the VCC pin reaches the VCC under-  
voltage lockout threshold of 4.25V, the controller is enabled.  
The controller is disabled if VCC falls below 4.0V (250mV  
hysteresis). In applications where an appropriate regulated dc  
bias supply is available, the LM25115A controller can be  
powered directly through the VCC pin instead of the VBIAS  
pin. In this configuration, it is recommended that the VCC and  
the VBIAS pins be connected together such that the external  
bias voltage is applied to both pins. The allowable VCC range  
when biased from an external supply is 4.5V to 7V.  
The RAMP and SYNC functions illustrated in Figure 2 provide  
line voltage feed-forward to improve the regulation of the aux-  
iliary output when the input voltage of the main converter  
changes. Varying the input voltage to the main converter pro-  
duces proportional variations in amplitude of the phase signal.  
The main channel PWM controller adjusts the pulse width of  
the phase signal to maintain constant volt*seconds and a  
regulated main output as shown in Figure 3. The variation of  
the phase signal amplitude and duration are reflected in the  
slope and duty cycle of the RAMP signal of the LM25115A  
(ISYNC α phase signal amplitude). As a result, the duty cycle  
of the LM25115A is automatically adjusted to regulate the  
auxiliary output voltage with virtually no change in the PWM  
threshold voltage. Transient line regulation is improved be-  
cause the PWM duty cycle of the auxiliary converter is imme-  
diately corrected, independent of the delays of the voltage  
regulation loop.  
30008312  
FIGURE 2. Line Feed-Forward Diagram  
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10  
30008313  
FIGURE 3. Line Feed-Forward Waveforms  
The recommended SYNC input current range is 50µA to  
VOUT(final) = regulator output set point  
150µA. The SYNC pin resistor (RSYNC) should be selected to  
set the SYNC current (ISYNC) to 150µA with the maximum  
phase signal amplitude, VPHASE(max). This will guarantee that  
ISYNC stays within the recommended range over a 3:1 change  
in phase signal amplitude. The SYNC pin resistor is therefore:  
Pull-up current for the error amplifier output is provided by an  
internal 300µA current source. The PWM threshold signal at  
the COMP pin can be controlled by either the open drain error  
amplifier or the open drain current amplifier connected  
through the CO pin to COMP. Since the internal error amplifier  
is configured as an open drain output it can be disabled by  
connecting FB to ground. The current sense amplifier and  
current limiting function will be described in a later section.  
RSYNC = (VPHASE(max) / 150µA) - 2.5kΩ  
Once ISYNC has been established by selecting RSYNC, the  
RAMP signal slope/amplitude may be programmed by se-  
lecting the proper RAMP pin capacitor value. The RAMP  
signal slope should be selected to provide adequate slope  
compensation for the Valley current mode control scheme  
(Please refer to the Valley current mode section). The rec-  
ommended peak amplitude of the ramp waveform is 1.75V.  
Power-Up/Power-Down Tracking  
The LM25115A can track the output of a master power supply  
during soft start by connecting a resistor divider to the TRACK  
pin (Figure 4). Therefore, the output voltage slew rate of the  
LM25115A will be controlled by the master supply for loads  
that require precise sequencing. In order to track properly the  
output voltage of the LM25115A must be lower than the output  
voltage of the master supply.  
Error Amplifier and Soft-Start (FB,  
CO, COMP & TRK/SS)  
One way to use the tracking feature is to design the tracking  
resistor divider so that the master supply output voltage  
(VOUT1) and the LM25115A output voltage (VOUT2) both  
rise together and reach their target values at the same time.  
For this case, the equation governing the values of the track-  
ing divider resistors RT1 and RT2 is:  
An internal wide bandwidth error amplifier is provided within  
the LM25115A for voltage feedback to the PWM controller.  
The amplifier’s inverting input is connected to the FB pin. The  
output of the auxiliary converter is regulated by connecting a  
voltage setting resistor divider between the output and the FB  
pin. Loop compensation networks are connected between the  
FB pin and the error amplifier output (COMP). The amplifier  
has two non-inverting inputs. The first non-inverting input  
connects to a 0.75V bandgap reference while the second non-  
inverting input connects to the TRK/SS pin and it has 15 µA  
pull-up current source. The TRK/SS pin can be tied to an ex-  
ternal resistor divider from the master output for tracking, or  
it can be tied to a capacitor for soft-start . TRK/SS is the ref-  
erence input to the amplifier when the voltage applied to the  
pin is < 0.75V. For higher inputs, the internal reference con-  
trols the amplifier. When the VCC voltage is below the UVLO  
threshold, the TRK/SS pin is discharged to ground. When  
VCC rises and exceeds the positive going UVLO threshold  
(4.25V), the TRK/SS pin is released and allowed to rise. If an  
external capacitor is connected to the TRK/SS pin, it will be  
charged by the internal 15uA pull-up current source to grad-  
ually increase the non-inverting input of the error amplifier to  
0.75V. During start-up, the output of the LM25115A converter  
will follow the following equation:  
A value of 10kΩ (1%) is recommended for RT2 as a good  
compromise between high precision and low quiescent cur-  
rent through the divider. If the master supply voltage was 3.3V  
and the LM25115A output voltage was 2.5 V, then the value  
of RT1 needed to give the two supplies identical soft start  
times would be 2.94 kΩ (1%). The timing diagram and wave-  
forms for the equal soft start time configuration are shown in  
Figure 5 and Figure 6.  
VOUT(t) = VOUT(final) x15 µA x t /(.75 Vx Css )  
Where  
Css = external Soft-Start capacitor  
11  
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Alternatively, the tracking feature can be used to create equal  
slew rates between the output voltages of the master supply  
and the LM25115A. This method ensures that the output volt-  
age of the LM25115A always reaches regulation before the  
output voltage of the master supply. In this case, the tracking  
resistors can be determined based on the following equation:  
Again, a value of 10k1% is recommended for RT2. For the  
case of VOUT1 = 3.3V and VOUT2 = 2.5V, RT1 should be  
4.32 k1%. The timing diagram and the waveforms for equal  
slew rates configuration are shown in Figure 7 and Figure 8.  
30008329  
FIGURE 4.  
30008330  
FIGURE 7.  
30008331  
FIGURE 5.  
30008328  
Vphase = 10V  
CH1 = Master output, 1V/Div  
CH2 = COMP, 5/Div  
CH3 = Iout, 1A/Div  
CH4 = SSPR Output (Slave), 1V/Div  
Horizontal Resolution= 200 µs/Div  
30008327  
Vphase = 10V  
CH1 = Master output, 1V/Div  
CH2 = COMP, 5/Div  
CH3 = Iout, 1A/Div  
FIGURE 8. Tracking with Equal Slew Rate  
CH4 = SSPR Output (Slave), 1V/Div  
Horizontal Resolution= 200 µs/Div  
FIGURE 6. Tracking with Equal Soft Start Time  
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12  
Leading edge modulation of the auxiliary PWM controller is  
required if the main converter uses peak current mode con-  
trol. If trailing edge modulation were used, the additional load  
on the transformer secondary from the auxiliary channel  
would be drawn only during the first portion of the phase signal  
pulse. Referring to Figure 10, the turn-off of the high- side  
MOSFET of the auxiliary regulator would create a non-mono-  
tonic negative step in the transformer current. This negative  
current step would produce instability in a peak current mode  
controller. With leading edge modulation, the additional load  
presented by the auxiliary regulator on the transformer sec-  
ondary will be present during the latter portion of the phase  
signal. This positive step in the phase signal current can be  
accommodated by a peak current mode controller without in-  
stability.  
Leading Edge Pulse Width  
Modulation  
Unlike conventional voltage mode controllers, the LM25115A  
implements leading edge pulse width modulation. A current  
source equal to 3 times the ISYNC current is used to charge  
the capacitor connected to the RAMP pin as shown in Figure  
9. The ramp signal and the output of the error amplifier  
(COMP) are combined through a resistor network to produce  
a voltage ramp with variable dc offset (CRMIX in Figure 9).  
The high-side MOSFET which drives the HS pin is held in the  
off state at the beginning of the phase signal. When the volt-  
age of CRMIX exceeds the internal threshold voltage CV, the  
PWM comparator turns on the high-side MOSFET. The HS  
pin rises and the MOSFET delivers current from the main  
converter phase signal to the output of the auxiliary regulator.  
The PWM cycle ends when the phase signal falls and power  
is no longer supplied to the drain of the high-side MOSFET.  
30008314  
FIGURE 9. Synchronization and Leading Edge Modulation  
30008320  
FIGURE 10. Leading versus Trailing Edge Modulation  
13  
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old (CV), the PWM comparator turns on the high-side MOS-  
FET. Insure that the Vbias voltage is at least 3V above the  
regulated output voltage (VOUT) to provide enough head-  
room for the current sense amplifier.  
Valley Current Mode Control  
The LM25115A controller uniquely utilizes the elements and  
benefits of valley current mode control in conjunction with  
leading edge modulation to correct changes in output voltage  
due to line and load transients. Contrary to peak current mode  
control, valley current mode control turns on the high-side  
MOSFET when the inductor valley current reaches a pro-  
grammable threshold. This programmable threshold (CRMIX)  
is the sum of the output of voltage error amplifier and the  
RAMP signal generated at the RAMP pin. Valley current  
mode control experiences sub-harmonic oscillation when the  
duty ratio, D, is less than or equal to 50%. Therefore, ade-  
quate slope compensation is needed for the proper operation  
across the full range of the duty ratio. The RAMP signal is  
proportional to the input voltage and it provides the required  
slope compensation for the valley current mode scheme. The  
desired RAMP pin capacitance can be calculated from the  
following equation:  
Valley current mode control improves the control loop stability  
and bandwidth. It also eliminates the R-C lead network in the  
feedback path that is normally required with voltage mode  
control (Figure 12). Eliminating the lead network not only sim-  
plifies the compensation, but also reduces sensitivity to output  
noise that could pass through the lead network to the error  
amplifier.  
The design of the voltage feedback path through the error  
amp begins with the selection of R1 and R2 in Figure 12 to  
set the regulated output voltage. The steady state output volt-  
age after soft-start is determined by the following equation:  
VOUT(final) = 0.75V x (1+R1/R2)  
The parallel impedance of the R1, R2 resistor divider should  
be approximately 2kΩ (between 0.5kand 5k). Lower re-  
sistance values may not be properly driven by the error am-  
plifier output and higher feedback resistances can introduce  
noise sensitivity. The next step in the design process is se-  
lection of R3, which sets the ac gain of the error amplifier.  
CRAMP = (0.05 x L) /(RSYNC x RSENSE  
)
Where L is the power inductor, RSYNC is the SYNC pin resistor  
and RSENSE is the current sense resistor.  
The current sense amplifier shown in Figure 11 monitors the  
inductor current as it flows through a sense resistor connected  
between CS and VOUT. The voltage gain of the sense am-  
plifier is nominally equal to 16. The current sense output  
signal is shifted by 1.27V to produce the internal CV reference  
signal. The CV signal is applied to the negative input of the  
PWM comparator and compared to CRMIX as illustrated in  
Figure 11. Therefore when CRMIX exceeds the PWM thresh-  
The capacitor C1 is connected in series with R3 to increase  
the dc gain of the voltage regulation loop and improve output  
voltage accuracy. The corner frequency set by R3 x C1 should  
be less than 1/10th of the cross-over frequency of the overall  
converter such that capacitor C1 does not add phase lag at  
the crossover frequency.  
30008315  
FIGURE 11. Current Sensing and Limiting  
www.national.com  
14  
30008316  
FIGURE 12. Voltage Sensing and Feedback  
comparator will inhibit output pulses. Once the fault condition  
is removed, the fast current limit amplifier will release COMP.  
Therefore, the CRMIX signal will increase to a normal oper-  
ating threshold and the switching will resume (Figure 14). A  
current limit fold-back feature is provided by the LM25115A  
to reduce the peak output current delivered to a shorted load.  
When the common mode input voltage to the current sense  
amplifier (CS and VOUT pins) falls below 2V, the current limit  
threshold is reduced from the normal level. At common mode  
voltages > 2V, the current limit threshold is nominally 45mV.  
When VOUT is reduced to 0 V the current limit threshold drops  
to 39mV to reduce stress on the inductor and power MOS-  
FETs.  
Current Limiting (CS, CO and VOUT)  
Current limiting is implemented through the current sense  
amplifier as illustrated in Figure 11. The current sense ampli-  
fier monitors the inductor current that flows through a sense  
resistor connected between CS and VOUT. The voltage gain  
of the current sense amplifier is nominally equal to 16. The  
output of current sense signal is shifted by 1.27V to produce  
the internal CV reference signal. The CV signal drives two  
current limit amplifiers. Both of the current limit amplifiers  
have open drain (sink only) output stages which are connect-  
ed to the CO pin. The CO pin is typically connected to the  
COMP pin through a diode (the cathode is connected to the  
CO pin and the anode is connected to the COMP pin). The  
slow current limit amplifier has a nominal transconductance  
of 5 mA/V and provides constant current mode operation at  
the desired current limit set point. The fast current limit am-  
plifier has nominal current pull-down capability of 100mA and  
provides protection against fast over-current conditions. Dur-  
ing normal operation, the voltage error amplifier controls the  
COMP pin voltage which adjusts the PWM duty cycle by vary-  
ing the internal CRMIX level. However when the current  
sense input voltage, VCL, exceeds 45mV, the slow current  
limit amplifier gradually pulls down on COMP through the CO  
pin. Pulling COMP low reduces the CRMIX signal and thereby  
reducing the operating duty cycle. By controlling the operating  
duty cycle, the slow current limit amplifier will force a constant  
current mode of operation at the desired current limit set point  
(Figure 13). A resistor in series with a capacitor are connected  
from the CO Pin to ground to provide adequate control loop  
compensation for the slow current limit (Figure 11). The de-  
sired current limit set point, ILimit, can be programmed by  
selecting the proper current sense resistor, RSENSE,using the  
following equation:  
30008325  
Vphase=10V  
CH1 = CO, 5V/Div  
CH2 = COMP, 5/Div  
CH3 = Iout, 5A/Div  
CH4 = SSPR Switch Signal, 5V/Div  
Horizontal Resolution= 2 µs/Div  
RSENSE = 0.045 V/ ILimit  
In the event that the current sense input voltage, VCL, exceeds  
60mV, the fast current limit amplifier will pull down hard on  
COMP through the CO pin. This will reduce the CRMIX signal  
to a voltage below the CV signal level. Therefore, the PWM  
FIGURE 13. SSPR Steady State Current Limit (Output  
Shorted)  
15  
www.national.com  
dead-time control to avoid shoot through currents. The adap-  
tive dead-time control circuit monitors the state of each driver  
to ensure that one MOSFET is turned off before the other is  
turned on. The HB and VCC capacitors should be placed  
close to the pins of the LM25115A to minimize voltage tran-  
sients due to parasitic inductances and the high peak output  
currents of the drivers. The recommended range of the HB  
capacitor is 0.047µF to 0.22µF.  
Both drivers are controlled by the PWM logic signal from the  
PWM latch. When the phase signal is low, the outputs are  
held in the reset state with the low-side MOSFET on and the  
high-side MOSFET off. When the phase signal switches to  
the high state, the PWM latch reset signal is de-asserted. The  
high-side MOSFET remains off until the PWM latch is set by  
the PWM comparator (CRMIX > CV as shown in Figure 9).  
When the PWM latch is set, the LO driver turns off the low-  
side MOSFET and the HO driver turns on the high-side MOS-  
FET. The high-side pulse is terminated when the phase signal  
falls and SYNC input comparator resets the PWM latch.  
30008326  
Vphase=10V  
CH1 = CO, 5V/Div  
CH2 = COMP, 5/Div  
CH3 = Iout, 10A/Div  
CH4 = SSPR Switch Signal, 4V/Div  
Horizontal Resolution= 20 µs/Div  
Thermal Protection  
Internal thermal shutdown circuitry is provided to protect the  
integrated circuit in the event the maximum junction temper-  
ature limit is exceeded. When activated, typically at 165 de-  
grees Celsius, the controller is forced into a low power  
standby state with the output drivers and the bias regulator  
disabled. The device will restart when the junction tempera-  
ture falls below the thermal shutdown hysteresis, which is  
typically 25 degrees. The thermal protection feature is pro-  
vided to prevent catastrophic failures from accidental device  
overheating.  
FIGURE 14. SSPR Short Circuit Transient (No-Load to  
Short-Circuit)  
Negative Current Limit  
Under certain conditions synchronous buck regulators are  
capable of sinking current from the output capacitors. This  
energy is stored in the inductor and returned to the input  
source. The LM25115A detects this current reversal by de-  
tecting a negative voltage being developed across the current  
sense resistor. The intent of this negative current comparator  
is to protect the low-side MOSFET from excessive currents.  
Excessive negative current can also lead to a large positive  
voltage spike on the HS pin at the turn-off of the low-side  
MOSFET. This voltage spike may damage the chip if its mag-  
nitude exceeds the maximum voltage rating of the part. The  
negative current comparator threshold is sufficiently negative  
to allow inductor current to reverse at no load or light load  
conditions. It is not intended to support discontinuous con-  
duction mode with diode emulation by the low-side MOSFET.  
The negative current comparator shown in Figure 11 monitors  
the CV signal and compares this signal to a fixed 1V thresh-  
old. This corresponds to a negative VCL voltage between CS  
and VOUT of -17mV. The negative current limit comparator  
turns off the low-side MOSFET for the remainder of the cycle  
when the VCL input falls below this threshold.  
Standalone DC/DC Synchronous  
Buck Mode  
The LM25115A can be configured as a standalone DC/DC  
synchronous buck controller. In this mode the LM25115A us-  
es leading edge modulation in conjunction with valley current  
mode control to control the synchronous buck power stage.  
The internal oscillator within the LM25115A sets the clock  
frequency for the high and low-side drivers of the external  
synchronous buck power MOSFETs . The clock frequency in  
the synchronous buck mode is programmed by the SYNC pin  
resistor and RAMP pin capacitor. Connecting a resistor be-  
tween a dc bias supply and the SYNC pin produces a current,  
ISYNC, which sets the charging current of the RAMP pin ca-  
pacitor. The RAMP capacitor is charged until its voltage  
reaches the peak ramp threshold of 2.25V. The RAMP ca-  
pacitor is then discharged for 300ns before beginning a new  
PWM cycle. The 300ns reset time of the RAMP pin sets the  
minimum off-time of the PWM controller in this mode. The in-  
ternal clock frequency in the synchronous buck mode is set  
by ISYNC, the ramp capacitor, the peak ramp threshold, and  
the 300ns deadtime.  
Gate Driver Outputs (HO & LO)  
The LM25115A provides two gate driver outputs, the floating  
high-side gate driver HO and the synchronous rectifier low-  
side driver LO. The low-side driver is powered directly by the  
VCC regulator. The high-side gate driver is powered from a  
bootstrap capacitor connected between HB and HS. An ex-  
ternal diode connected between VCC and HB charges the  
bootstrap capacitor when the HS is low. When the high-side  
MOSFET is turned on, HB rises with HS to a peak voltage  
equal to VCC + VHS - VD where VD is the forward drop of the  
external bootstrap diode. Both output drivers have adaptive  
FCLK 1 / ((CRAMP x 2.25V) / (ISYNC x 3) + 300ns)  
See the LM5115 dc evaluation board application note  
(AN-1367) for more details on the synchronous buck mode.  
Please note that LM25115A is similar to LM5115 except for  
the tracking feature.  
www.national.com  
16  
Application Circuit  
17  
www.national.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
TSSOP-16 Outline Drawing  
NS Package Number MTC16  
www.national.com  
18  
Notes  
19  
www.national.com  
Notes  
THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION  
(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY  
OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO  
SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,  
IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS  
DOCUMENT.  
TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT  
NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL  
PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR  
APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND  
APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE  
NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.  
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LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE  
AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR  
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY  
RIGHT.  
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR  
SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL  
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:  
Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and  
whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected  
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Copyright© 2007 National Semiconductor Corporation  
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