LM25115MT [NSC]

Secondary Side Post Regulator Controller; 次级侧后稳压器控制器
LM25115MT
型号: LM25115MT
厂家: National Semiconductor    National Semiconductor
描述:

Secondary Side Post Regulator Controller
次级侧后稳压器控制器

稳压器 控制器
文件: 总17页 (文件大小:725K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
November 2005  
LM25115  
Secondary Side Post Regulator Controller  
General Description  
Features  
n Self-synchronization to main channel output  
n Free-run mode for buck regulation of DC input  
n Leading edge pulse width modulation  
n Voltage-mode control with current injection and input line  
feed-forward  
The LM25115 controller contains all of the features neces-  
sary to implement multiple output power converters utilizing  
the Secondary Side Post Regulation (SSPR) technique. The  
SSPR technique develops a highly efficient and well regu-  
lated auxiliary output from the secondary side switching  
waveform of an isolated power converter. Regulation of the  
auxiliary output voltage is achieved by leading edge pulse  
width modulation (PWM) of the main channel duty cycle.  
Leading edge modulation is compatible with either current  
mode or voltage mode control of the main output. The  
LM25115 drives external high side and low side NMOS  
power switches configured as a synchronous buck regulator.  
A current sense amplifier provides overload protection and  
operates over a wide common mode input range. Additional  
features include a low dropout (LDO) bias regulator, error  
amplifier, precision reference, adaptive dead time control of  
the gate signals and thermal shutdown.  
n Operates from AC or DC input up to 42V  
n Wide 4.5V to 30V bias supply range  
n Wide 0.75V to 13.5V output range.  
n Top and bottom gate drivers sink 2.5A peak  
n Adaptive gate driver dead-time control  
n Wide bandwidth error amplifier (4MHz)  
n Programmable soft-start  
n Thermal shutdown protection  
n TSSOP-16 or thermally enhanced LLP-16 packages  
Typical Application Circuit  
20172601  
FIGURE 1. Simplified Multiple Output Power Converter Utilizing SSPR Technique  
© 2005 National Semiconductor Corporation  
DS201726  
www.national.com  
Connection Diagram  
20172602  
16-Lead TSSOP, LLP  
See NS Package Numbers MTC16 and SDA16A  
Ordering Information  
Ordering Number  
Package Type  
NSC Package Drawing  
Supplied As  
92 Units Per Anti-Static Tube  
2500 shipped as Tape & Reel  
Available Soon  
LM25115MT  
TSSOP-16  
MTC16  
MTC16  
LM25115MTX  
LM25115SD  
LM25115SDX  
TSSOP-16  
LLP-16  
SDA16A  
SDA16A  
LLP-16  
Available Soon  
Pin Descriptions  
Pin  
Name  
Description  
Application Information  
1
CS  
Current Sense amplifier positive input  
A low inductance current sense resistor is connected between  
CS and VOUT. Current limiting occurs when the differential  
voltage between CS and VOUT exceeds 45mV (typical).  
Connected directly to the output voltage. The current sense  
amplifier operates over a voltage range from 0V to 13.5V at the  
VOUT pin.  
2
VOUT  
Current sense amplifier negative input  
3
4
AGND  
CO  
Analog ground  
Connect directly to the power ground pin (PGND).  
For normal current limit operation, connect the CO pin to the  
COMP pin. Leave this pin open to disable the current limit  
function.  
Current limit output  
5
6
COMP  
FB  
Compensation. Error amplifier output  
COMP pin pull-up is provided by an internal 300uA current  
source.  
Feedback. Error amplifier inverting input Connected to the regulated output through the feedback resistor  
divider and compensation components. The non-inverting input  
of the error amplifier is internally connected to the SS pin.  
7
8
SS  
Soft-start control  
An external capacitor and the equivalent impedance of an  
internal resistor divider connected to the bandgap voltage  
reference set the soft-start time. The steady state operating  
voltage of the SS pin equal to 0.75V (typical).  
RAMP  
PWM Ramp signal  
An external capacitor connected to this pin sets the ramp slope  
for the voltage mode PWM. The RAMP capacitor is charged  
with a current that is proportional to current into the SYNC pin.  
The capacitor is discharged at the end of every cycle by an  
internal MOSFET.  
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2
Pin Descriptions (Continued)  
Pin  
Name  
Description  
Synchronization input  
Application Information  
9
SYNC  
A low impedance current input pin. The current into this pin sets  
the RAMP capacitor charge current and the frequency of an  
internal oscillator that provides a clock for the free-run (DC  
input) mode .  
10  
11  
PGND  
LO  
Power Ground  
Connect directly to the analog ground pin (AGND).  
Connect to the gate of the low side synchronous MOSFET  
through a short, low inductance path.  
Low side gate driver output  
12  
VCC  
Output of bias regulator  
Nominal 7V output from the internal LDO bias regulator. Locally  
decouple to PGND using a low ESR/ESL capacitor located as  
close to controller as possible.  
13  
14  
15  
HS  
HO  
HB  
High side MOSFET source connection  
High side gate driver output  
Connect to negative terminal of the bootstrap capacitor and the  
source terminal of the high side MOSFET.  
Connect to the gate of high side MOSFET through a short, low  
inductance path.  
High side gate driver bootstrap rail  
Connect to the cathode of the bootstrap diode and the positive  
terminal of the bootstrap capacitor. The bootstrap capacitor  
supplies current to charge the high side MOSFET gate and  
should be placed as close to controller as possible.  
Input to the LDO bias regulator and current sense amplifier that  
powers internal blocks. Input range of VBIAS is 4.5V to 30V.  
16  
-
VBIAS  
Supply Bias Input  
Exposed Pad Exposed Pad, underside of LLP package Internally bonded to the die substrate. Connect to system  
(LLP  
Package  
Only)  
ground for low thermal impedance.  
3
www.national.com  
Block Diagram  
20172603  
www.national.com  
4
Absolute Maximum Ratings (Note 1)  
ESD Rating  
HBM (Note 2)  
2 kV  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Operating Ratings  
VBIAS supply voltage  
VCC supply voltage  
HS voltage  
VBIAS to GND  
–0.3V to 32V  
–0.3V to 9V  
–1V to 45V  
5V to 30V  
5V to 7.5V  
VCC to GND  
HS to GND  
0V to 42V  
VOUT, CS to GND  
All other inputs to GND  
Storage Temperature Range  
Junction Temperature  
– 0.3V to 15V  
−0.3V to 7.0V  
–55˚C to +150˚C  
+150˚C  
HB voltage  
VCC + HS  
Operating Junction Temperature  
–40˚C to +125˚C  
Typical Operating Conditions  
Min  
Parameter  
Typ  
Max  
30  
7
Units  
V
Supply Voltage, VBIAS  
4.5  
4.5  
Supply Voltage, VCC  
V
Supply voltage bypass, CVBIAS  
Reference bypass capacitor, CVCC  
HB-HS bootstrap capacitor  
0.1  
1
1
µF  
µF  
µF  
µA  
V
0.1  
10  
0.047  
50  
SYNC Current Range (VCC = 4.5V)  
RAMP Saw Tooth Amplitude  
150  
1.75  
13.5  
1
VOUT regulation voltage (VBIAS min = 3V + VOUT)  
0.75  
V
Electrical Characteristics Unless otherwise specified, TJ = –40˚C to +125˚C, VBIAS = 12V, No Load on  
LO or HO.  
Symbol  
Parameter  
Conditions  
FSYNC = 200kHz  
Min  
Typ  
Max  
4
Units  
mA  
V
VBIAS SUPPLY  
Ibias  
VBIAS Supply Current  
VCC LOW DROPOUT BIAS REGULATOR  
VccReg  
VCC Regulation  
VCC open circuit. Outputs not  
switching  
6.65  
7
7.15  
VCC Current Limit  
(Note 4)  
40  
mA  
V
VCC Under-voltage Lockout Voltage Positive going VCC  
VCC Under-voltage Hysteresis  
4
4.5  
0.3  
0.2  
0.25  
V
SOFT-START  
SS Source Impedance  
43  
60  
77  
k  
SS Discharge Impedance  
100  
ERROR AMPLIFIER and FEEDBACK REFERENCE  
VREF  
FB Reference Voltage  
FB Input Bias Current  
COMP Source Current  
Open Loop Voltage Gain  
Gain Bandwidth Product  
Input Offset Voltage  
COMP Offset  
Measured at FB pin  
FB = 2V  
0.737  
0.75  
0.2  
300  
60  
4
0.763  
0.5  
V
µA  
µA  
dB  
MHz  
mV  
V
GBW  
Vio  
-7  
0
7
Threshold for VHO = high RAMP = CS  
= VOUT = 0V  
2
RAMP Offset  
Threshold for VHO = high COMP =  
1.5V, CS = VOUT = 0V  
1.1  
V
CURRENT SENSE AMPLIFIER  
Current Sense Amplifier Gain  
16  
V/V  
V
Output DC Offset  
1.27  
500  
Amplifier Bandwidth  
kHz  
5
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Electrical Characteristics Unless otherwise specified, TJ = –40˚C to +125˚C, VBIAS = 12V, No Load on LO  
or HO. (Continued)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
CURRENT LIMIT  
ILIMIT Amp Transconductance  
Overall Transconductance  
Positive Current Limit  
16  
237  
45  
mA / V  
mA / V  
mV  
VCL = VCS - VVOUT  
37  
31  
53  
45  
VOUT = 6V and CO/COMP = 1.5V  
VCL = VCS - VVOUT  
Positive Current Limit Foldback  
Negative Current Limit  
38  
mV  
mV  
VOUT = 0V and CO/COMP = 1.5V  
VOUT = 6V  
VCLneg  
-17  
VCL = VCS - VVOUT to cause LO to  
shutoff  
RAMP GENERATOR  
SYNC Input Impedance  
2.5  
15  
kΩ  
µA  
V
SYNC Threshold  
End of cycle detection threshold  
RAMP peak voltage with dc current  
applied to SYNC.  
Free Run Mode Peak Threshold  
2.3  
3.3  
Current Mirror Gain  
Ratio of RAMP charge current to  
SYNC input current.  
2.7  
A/A  
Discharge Impedance  
100  
LOW SIDE GATE DRIVER  
VOLL  
VOHL  
LO Low-state Output Voltage  
LO High-state Output Voltage  
LO Rise Time  
ILO = 100mA  
0.2  
0.4  
15  
12  
2
0.5  
0.8  
V
V
ILO = -100mA, VOHL = VCC -VLO  
CLOAD = 1000pF  
CLOAD = 1000pF  
VLO = 0V  
ns  
ns  
A
LO Fall Time  
IOHL  
IOLL  
Peak LO Source Current  
Peak LO Sink Current  
VLO = 12V  
2.5  
A
HIGH SIDE GATE DRIVER  
VOLH  
VOHH  
HO Low-state Output Voltage  
IHO = 100mA  
0.2  
0.4  
15  
12  
2
0.5  
0.8  
V
V
HO High-state Output Voltage  
HO Rise Time  
IHO = -100mA, VOHH = VHB –VHO  
CLOAD = 1000pF  
CLOAD = 1000pF  
VHO = 0V  
ns  
ns  
A
HO High Side Fall Time  
Peak HO Source Current  
Peak HO Sink Current  
IOHH  
IOLH  
VHO = 12V  
2.5  
A
SWITCHING CHARACTERISITCS  
LO Fall to HO Rise Delay  
HO Fall to LO Rise Delay  
SYNC Fall to HO Fall Delay  
SYNC Rise to LO Fall Delay  
THERMAL SHUTDOWN  
CLOAD = 0  
CLOAD = 0  
CLOAD = 0  
CLOAD = 0  
70  
50  
ns  
ns  
ns  
ns  
120  
50  
TSD  
Thermal Shutdown Temp.  
150  
165  
25  
˚C  
˚C  
Thermal Shutdown Hysteresis  
THERMAL RESISTANCE  
θJA  
θJA  
Junction to Ambient  
Junction to Ambient  
MTC Package  
SDA Package  
125  
32  
˚C/W  
˚C/W  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of  
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the  
Electrical Characteristics tables.  
Note 2: The human body model is a 100 pF capacitor discharged through a 1.5kresistor into each pin.  
Note 3: Min and Max limits are 100% production tested at 25˚C. Limits over the operating temperature range are guaranteed through correlation using Statistical  
Quality Control (SQC) methods. Limits are used to calculate National’s Average Outgoing Quality Level (AOQL).  
Note 4: Device thermal limitations may limit usable range.  
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6
Typical Performance Characteristics  
VCC Regulator Start-Up Characteristics, VCC vs VBIAS  
VCC Load Regulation to Current Limit  
20172605  
20172604  
Current Value (CV) vs Current Limit (VCL  
)
Current Sense Amplifier Gain and Phase vs Frequency  
20172606  
20172607  
Current Error Amplifier Transconductance  
Overall Current Amplifier Transconductance  
20172608  
20172609  
7
www.national.com  
Typical Performance Characteristics (Continued)  
Common Mode Output Voltage vs Negative Current  
Limit (Room Temp)  
Common Mode Output Voltage vs Positive Current Limit  
20172610  
20172611  
www.national.com  
8
former secondary winding before rectification (Figure 1). A  
resistor connected from the phase signal to the low imped-  
ance SYNC pin produces a square wave current (ISYNC) as  
shown in Figure 2. A current comparator at the SYNC input  
monitors ISYNC relative to an internal 15µA reference. When  
ISYNC exceeds 15µA, the internal clock signal (CLK) is reset  
and the capacitor connected to the RAMP begins to charge.  
The current source that charges the RAMP capacitor is  
equal to 3 times the ISYNC current. The falling edge of the  
phase signal sets the CLK signal and discharges the RAMP  
capacitor until the next rising edge of the phase signal. The  
RAMP capacitor is discharged to ground by a low imped-  
ance (100) n-channel MOSFET. The input impedance at  
SYNC pin is 2.5kwhich is normally much less than the  
external SYNC pin resistance.  
Detailed Operating Description  
The LM25115 controller contains all of the features neces-  
sary to implement multiple output power converters utilizing  
the Secondary Side Post Regulation (SSPR) technique. The  
SSPR technique develops a highly efficient and well regu-  
lated auxiliary output from the secondary side switching  
waveform of an isolated power converter. Regulation of the  
auxiliary output voltage is achieved by leading edge pulse  
width modulation (PWM) of the main channel duty cycle.  
Leading edge modulation is compatible with either current  
mode or voltage mode control of the main output. The  
LM25115 drives external high side and low side NMOS  
power switches configured as a synchronous buck regulator.  
A current sense amplifier provides overload protection and  
operates over a wide common mode input range from 0V to  
13.5V. Additional features include a low dropout (LDO) bias  
regulator, error amplifier, precision reference, adaptive dead  
time control of the gate driver signals and thermal shutdown.  
A programmable oscillator provides a PWM clock signal  
when the LM25115 is powered by a dc input (free-run mode)  
instead of the phase signal of the main channel converter  
(SSPR mode).  
Low Drop-out Bias Regulator  
(VCC)  
The LM25115 contains an internal LDO regulator that oper-  
ates over an input supply range from 4.5V to 30V. The output  
of the regulator at the VCC pin is nominally regulated at 7V  
and is internally current limited to 40mA. VCC is the main  
supply to the internal logic, PWM controller, and gate driver  
circuits. When power is applied to the VBIAS pin, the regu-  
lator is enabled and sources current into an external capaci-  
tor connected to the VCC pin. The recommended output  
capacitor range for the VCC regulator is 0.1uF to 100uF.  
When the voltage at the VCC pin reaches the VCC under-  
voltage lockout threshold of 4.25V, the controller is enabled.  
The controller is disabled if VCC falls below 4.0V (250mV  
hysteresis). In applications where an appropriate regulated  
dc bias supply is available, the LM25115 controller can be  
powered directly through the VCC pin instead of the VBIAS  
pin. In this configuration, it is recommended that the VCC  
and the VBIAS pins be connected together such that the  
external bias voltage is applied to both pins. The allowable  
VCC range when biased from an external supply is 4.5V to  
7V.  
20172612  
FIGURE 2. Line Feed-forward Diagram  
The RAMP and SYNC functions illustrated in Figure 2 pro-  
vide line voltage feed-forward to improve the regulation of  
the auxiliary output when the input voltage of the main  
converter changes. Varying the input voltage to the main  
converter produces proportional variations in amplitude of  
the phase signal. The main channel PWM controller adjusts  
the pulse width of the phase signal to maintain constant  
volt*seconds and a regulated main output as shown in Fig-  
ure 3. The variation of the phase signal amplitude and dura-  
tion are reflected in the slope and duty cycle of the RAMP  
signal of the LM25115 (ISYNC α phase signal amplitude). As  
a result, the duty cycle of the LM25115 is automatically  
adjusted to regulate the auxiliary output voltage with virtually  
no change in the PWM threshold voltage. Transient line  
regulation is improved because the PWM duty cycle of the  
auxiliary converter is immediately corrected, independent of  
the delays of the voltage regulation loop.  
Synchronization (SYNC) and  
Feed-forward (RAMP)  
The pulsing “phase signal” from the main converter synchro-  
nizes the PWM ramp and gate drive outputs of the LM25115.  
The phase signal is the square wave output from the trans-  
9
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Synchronization (SYNC) and Feed-forward (RAMP) (Continued)  
20172613  
FIGURE 3. Line Feed-forward Waveforms  
The recommended SYNC input current range is 50µA to  
Error Amplifier and Soft-Start (FB,  
CO, & COMP, SS)  
150µA. The SYNC pin resistor (RSYNC) should be selected to  
set the SYNC current (ISYNC) to 150µA with the maximum  
phase signal amplitude, VPHASE(max). This will guarantee  
that ISYNC stays within the recommended range over a 3:1  
change in phase signal amplitude. The SYNC pin resistor is  
therefore:  
An internal wide bandwidth error amplifier is provided within  
the LM25115 for voltage feedback to the PWM controller.  
The amplifier’s inverting input is connected to the FB pin.  
The output of the auxiliary converter is regulated by connect-  
ing a voltage setting resistor divider between the output and  
the FB pin. Loop compensation networks are connected  
between the FB pin and the error amplifier output (COMP).  
The amplifier’s non-inverting input is internally connected to  
the SS pin. The SS pin is biased at 0.75V by a resistor  
divider connected to the internal 1.27V bandgap reference.  
When the VCC voltage is below the UVLO threshold, the SS  
pin is discharged to ground. When VCC rises and exceeds  
the positive going UVLO threshold (4.25V), the SS pin is  
released and allowed to rise. If an external capacitor is  
connected to the SS pin, it will be charged by the internal  
resistor divider to gradually increase the non-inverting input  
of the error amplifier to 0.75V. The equivalent impedance of  
the SS resistor divider is nominally 60kwhich determines  
the charging time constant of the SS capacitor. During start-  
up, the output of the LM25115 converter will follow the  
exponential equation:  
RSYNC = (VPHASE(max) / 150µA) - 2.5kΩ  
Once ISYNC has been established by selecting RSYNC, the  
RAMP signal amplitude may be programmed by selecting  
the proper RAMP pin capacitor value. The recommended  
peak amplitude of the RAMP waveform is 1V to 1.75V. The  
CRAMP capacitor is chosen to provide the desired RAMP  
amplitude with the nominal phase signal voltage and pulse  
width.  
CRAMP = (3 x ISYNC x TON ) / VRAMP  
Where  
CRAMP = RAMP pin capacitance  
ISYNC = SYNC pin current current  
TON = corresponding phase signal pulse width  
VRAMP = desired RAMP amplitude (1V to 1.75V)  
For example,  
Main channel output = 3.3V. Phase signal maximum ampli-  
tude = 12V. Phase signal frequency = 250kHz  
VOUT(t) = VOUT(final) x (1 - exp(-t/RSS x CSS))  
Where  
Set ISYNC = 150µA with phase signal at maximum ampli-  
tude (12V):  
Rss = internal resistance of SS pin (60k)  
Css = external Soft-Start capacitor  
VOUT(final) = regulator output set point  
ISYNC = 150µA = VPHASE(max) / (RSYNC + 2.5 k) = 12V /  
(RSYNC + 2.5 k)  
RSYNC = 12V/150µA - 2.5k= 77.5kΩ  
TON = Main channel duty cycle / Phase frequency =  
(3.3V/12V) / 250kHz = 1.1µs  
The initial v / t of the output voltage is VOUT(final) / Rss x  
Css and VOUT will be within 1% of the final regulation level  
after 4.6 time constants or when t = 4.6 x Rss x Css.  
Pull-up current for the error amplifier output is provided by an  
internal 300µA current source. The PWM threshold signal at  
the COMP pin can be controlled by either the open drain  
error amplifier or the open drain current amplifier connected  
through the CO pin to COMP. Since the internal error ampli-  
fier is configured as an open drain output it can be disabled  
by connecting FB to ground. The current sense amplifier and  
current limiting function will be described in a later section.  
Assume desired VRAMP = 1.5V  
CRAMP = (3 x ISYNC x TON ) / VRAMP = (3 x 150µA x 1.1µs)  
/ 1.5V  
CRAMP = 330pF  
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10  
The high side MOSFET which drives the HS pin is held in the  
off state at the beginning of the phase signal. When the  
voltage of CRMIX exceeds the internal threshold voltage CV,  
the PWM comparator turns on the high side MOSFET. The  
HS pin rises and the MOSFET delivers current from the main  
converter phase signal to the output of the auxiliary regula-  
tor. The PWM cycle ends when the phase signal falls and  
power is no longer supplied to the drain of the high side  
MOSFET.  
Leading Edge Pulse Width  
Modulation  
Unlike conventional voltage mode controllers, the LM25115  
implements leading edge pulse width modulation. A current  
source equal to 3 times the ISYNC current is used to charge  
the capacitor connected to the RAMP pin as shown in Figure  
4. The ramp signal and the output of the error amplifier  
(COMP) are combined through a resistor network to produce  
a voltage ramp with variable dc offset (CRMIX in Figure 4).  
20172614  
FIGURE 4. Synchronization and Leading Edge Modulation  
Leading edge modulation of the auxiliary PWM controller is  
required if the main converter is implemented with peak  
current mode control. If trailing edge modulation were used,  
the additional load on the transformer secondary from the  
auxiliary channel would be drawn only during the first portion  
of the phase signal pulse. Referring to Figure 5, the turn off  
the high side MOSFET of the auxiliary regulator would cre-  
ate a non-monotonic negative step in the transformer cur-  
rent. This negative current step would produce instability in a  
peak current mode controller. With leading edge modulation,  
the additional load presented by the auxiliary regulator on  
the transformer secondary will be present during the latter  
portion of the phase signal. This positive step in the phase  
signal current can be accommodated by a peak current  
mode controller without instability.  
20172620  
FIGURE 5. Leading versus Trailing Edge Modulation  
11  
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The design of the voltage feedback path through the error  
amp begins with the selection of R1 and R2 in Figure 7 to set  
the regulated output voltage. The steady state output voltage  
after soft-start is determined by the following equation:  
Voltage Mode Control with Current  
Injection  
The LM25115 controller uniquely combines elements and  
benefits of current mode control in a voltage mode PWM  
controller. The current sense amplifier shown in Figure 6  
monitors the inductor current as it flows through a sense  
resistor connected between CS and VOUT. The voltage gain  
of the sense amplifier is nominally equal to 16. The current  
sense output signal is shifted by 1.27V to produce the inter-  
nal CV reference signal. The CV signal is applied to the  
negative input of the PWM comparator and compared to  
CRMIX as illustrated in Figure 4. Thus the PWM threshold of  
the voltage mode controller (CV) varies with the instanta-  
neous inductor current. Insure that the Vbias voltage is at  
least 3V above the regulated output voltage (VOUT).  
VOUT(final) = 0.75V x (1+R1/R2)  
The parallel impedance of the R1, R2 resistor divider should  
be approximately 2k(between 0.5kand 5k). Lower  
resistance values may not be properly driven by the error  
amplifier output and higher feedback resistances can intro-  
duce noise sensitivity. The next step in the design process is  
selection of R3, which sets the ac gain of the error amplifier.  
The ac gain is given by the following equation and should be  
set to a value less than 30.  
<
GAIN(ac) = R3/(R1|| R2) 30  
The capacitor C1 is connected in series with R3 to increase  
the dc gain of the voltage regulation loop and improve output  
voltage accuracy. The corner frequency set by R3 x C1  
should be less than 1/10th of the cross-over frequency of the  
overall converter such that capacitor C1 does not add phase  
lag at the crossover frequency. Capacitor C2 is added to  
reduce the noise in the voltage control loop. The value of C2  
should be less than 500pF and C2 may not be necessary  
with very careful PC board layout.  
Injecting a signal proportional to the instantaneous inductor  
current into a voltage mode controller improves the control  
loop stability and bandwidth. This current injection eliminates  
the lead R-C lead network in the feedback path that is  
normally required with voltage mode control (see Figure 7).  
Eliminating the lead network not only simplifies the compen-  
sation, but also reduces sensitivity to output noise that could  
pass through the lead network to the error amplifier.  
20172615  
FIGURE 6. Current Sensing and Limiting  
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12  
Voltage Mode Control with Current Injection (Continued)  
20172616  
FIGURE 7. Voltage Sensing and Feedback  
Current Limiting (CS, CO and  
VOUT)  
Negative Current Limit  
When inductor current flows from the regulator output  
through the low side MOSFET, the input to the current sense  
comparator becomes negative. The intent of the negative  
current comparator is to protect the low-side MOSFET from  
excessive currents. Negative current can lead to large nega-  
tive voltage spikes on the output at turn off which can dam-  
age circuitry powered by the output. The negative current  
comparator threshold is sufficiently negative to allow induc-  
tor current to reverse at no load or light load conditions. It is  
not intended to support discontinuous conduction mode with  
diode emulation by the low-side MOSFET. The negative  
current comparator illustrated in Figure 6 monitors the CV  
signal and compares this signal to a fixed 1V threshold. This  
corresponds to a negative VCL voltage between CS and  
VOUT of -17mV. The negative current limit comparator turns  
off the low-side MOSFET for the remainder of the cycle when  
the VCL input falls below this threshold.  
Current limiting is implemented through the current sense  
amplifier as illustrated in Figure 6. The current sense ampli-  
fier monitors the inductor current that flows through a sense  
resistor connected between CS and VOUT. The voltage gain  
of the current sense amplifier is nominally equal to 16. The  
output of current sense amplifier is level shifted by 1.27V to  
produce the internal CV reference signal. The CV signal  
drives a current limit amplifier with nominal transconduc-  
tance of 16mA/V. The current limit amplifier has an open  
drain (sink only) output stage and its output pin, CO is  
typically connected to the COMP pin. During normal opera-  
tion, the voltage error amplifier controls the COMP pin volt-  
age which adjusts the PWM duty cycle by varying the inter-  
nal CRMIX level (Figure 4). However, when the current  
sense input voltage VCL exceeds 45mV, the current limit  
amplifier pulls down on COMP through the CO pin. Pulling  
COMP low reduces the CRMIX signal below the CV signal  
level. When CRMIX does not exceed the CV signal, the  
PWM comparator inhibits output pulses until the CRMIX  
signal increases to a normal operating level.  
Gate Drivers Outputs (HO & LO)  
The LM25115 provides two gate driver outputs, the floating  
high-side gate driver HO and the synchronous rectifier low-  
side driver LO. The low-side driver is powered directly by the  
VCC regulator. The high-side gate driver is powered from a  
bootstrap capacitor connected between HB and HS. An  
external diode connected between VCC and HB charges the  
bootstrap capacitor when the HS is low. When the high-side  
MOSFET is turned on, HB rises with HS to a peak voltage  
equal to VCC + VHS - VD where VD is the forward drop of the  
external bootstrap diode. Both output drivers have adaptive  
dead-time control to avoid shoot through currents. The adap-  
tive dead-time control circuit monitors the state of each  
driver to ensure that the opposing MOSFET is turned off  
before the other is turned on. The HB and VCC capacitors  
should be placed close to the pins of the LM25115 to mini-  
A current limit fold-back feature is provided by the LM25115  
to reduce the peak output current delivered to a shorted  
load. When the common mode input voltage to the current  
sense amplifier (CS and VOUT pins) falls below 2V, the  
current limit threshold is reduced from the normal level. At  
>
common mode voltages  
2V, the current limit threshold is  
nominally 45mV. When VOUT is reduced to 0V the current  
limit threshold drops to 36mV to reduce stress on the induc-  
tor and power MOSFETs.  
13  
www.national.com  
before beginning a new PWM cycle. The 300ns reset time of  
the RAMP pin sets the minimum off time of the PWM con-  
troller in the free-run mode. The internal clock frequency in  
the free-run mode is set by the synchronization current,  
ramp capacitor, free-run peak threshold, and 300ns dead-  
time.  
Gate Drivers Outputs (HO & LO)  
(Continued)  
mize voltage transients due to parasitic inductances and the  
high peak output currents of the drivers. The recommended  
range of the HB capacitor is 0.047µF to 0.22µF.  
FCLK ) 1 / ((CRAMP x 2.25V) / (ISYNC x 3) + 300ns)  
Both drivers are controlled by the PWM logic signal from the  
PWM latch. When the phase signal is low, the outputs are  
held in the reset state with the low-side MOSFET on and the  
high-side MOSFET off. When the phase signal switches to  
the high state, the PWM latch reset signal is de-asserted.  
The high-side MOSFET remains off until the PWM latch is  
Note that the VCC supply can be used as the dc bias to  
produce ISYNC. Note that the input voltage feedforward is no  
longer functional in this operating mode, so the loop gain will  
vary as a function of Vin. The LM25115 controls the buck  
power stage with leading edge pulse width modulaton to  
hold off the high-side driver until the necessary volt*seconds  
is established for regulation. Other features described for the  
secondary side post regulator apply in the free run mode  
operation. They include voltage mode control with current  
injection, positive and negative current limit, programmable  
soft-start, adaptive delays for outputs, and thermal protec-  
tion.  
>
set by the PWM comparator (CRMIX  
CV as shown in  
Figure 4). When the PWM latch is set, the LO driver turns off  
the low-side MOSFET and the HO driver turns on the high-  
side MOSFET. The high-side pulse is terminated when the  
phase signal falls and the SYNC input comparator resets the  
PWM latch.  
Free-Run Mode  
Thermal Protection  
The LM25115 can be operated as a conventional synchro-  
nous buck controller with a dc input supply instead of the  
square wave phase signal. In the dc or free-run mode, the  
LM25115 PWM controller synchronizes to an internal clock  
signal instead of the phase signal pulses. The clock fre-  
quency in the free-run mode is programmed by the SYNC  
pin resistor and RAMP pin capacitor. Connecting a resistor  
between a dc bias supply and the SYNC pin produces a  
current ISYNC which controls the charging current of the  
RAMP pin capacitor . The RAMP capacitor is charged until  
its voltage reaches the free-run mode peak threshold of  
2.25V. The RAMP capacitor is then discharged for 300ns  
Internal thermal shutdown circuitry is provided to protect the  
integrated circuit in the event the maximum junction tem-  
perature limit is exceeded. When activated, typically at 165  
degrees Celsius, the controller is forced into a low power  
standby state with the output drivers and the bias regulator  
disabled. The device will restart when the junction tempera-  
ture falls below the thermal shutdown hysteresis, which is  
typically 25 degrees. The thermal protection feature is pro-  
vided to prevent catastrophic failures from accidental device  
overheating.  
www.national.com  
14  
15  
www.national.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
TSSOP-16 Outline Drawing  
NS Package Number MTC16  
LLP-16 Outline Drawing  
NS Package Number SDA16A  
www.national.com  
16  
Notes  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
BANNED SUBSTANCE COMPLIANCE  
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products  
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain  
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.  
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Fax: +49 (0) 180-530 85 86  
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