LM27313 [NSC]

1.6 MHz Boost Converter With 30V Internal FET Switch in SOT-23; 1.6 MHz的升压转换器30V内部FET开关采用SOT -23
LM27313
型号: LM27313
厂家: National Semiconductor    National Semiconductor
描述:

1.6 MHz Boost Converter With 30V Internal FET Switch in SOT-23
1.6 MHz的升压转换器30V内部FET开关采用SOT -23

转换器 开关 升压转换器
文件: 总12页 (文件大小:523K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
December 2006  
LM27313  
1.6 MHz Boost Converter With 30V Internal FET Switch in  
SOT-23  
General Description  
The LM27313 switching regulator is a current-mode boost  
converter with a fixed operating frequency of 1.6 MHz.  
The use of the SOT-23 package, made possible by the mini-  
mal losses of the 800 mA switch, and small inductors and  
capacitors result in extremely high power density. The 30V  
internal switch makes these solutions perfect for boosting to  
voltages of 5V to 28V.  
Features  
30V DMOS FET switch  
1.6 MHz switching frequency  
Low RDS(ON) DMOS FET  
Switch current up to 800 mA  
Wide input voltage range (2.7V–14V)  
Low shutdown current (<1 µA)  
5-Lead SOT-23 package  
This part has a logic-level shutdown pin that can be used to  
reduce quiescent current and extend battery life.  
Uses tiny capacitors and inductors  
Protection is provided through cycle-by-cycle current limiting  
and thermal shutdown. Internal compensation simplifies de-  
sign and reduces component count.  
Cycle-by-cycle current limiting  
Internally compensated  
Applications  
White LED Current Source  
PDA’s and Palm-Top Computers  
Digital Cameras  
Portable Phones, Games and Media Players  
GPS Devices  
Typical Application Circuits  
20216824  
20216857  
20216801  
20216858  
© 2007 National Semiconductor Corporation  
202168  
www.national.com  
Connection Diagram  
Top View  
20216802  
5-Lead SOT-23 Package  
See NS Package Number MF05A  
Ordering Information  
Order  
Number  
Package  
Type  
Package  
Drawing  
Supplied  
As  
Package  
Marking  
LM27313XMF  
1K Tape and Reel  
3K Tape and Reel  
SRPB  
SRPB  
SOT23-5  
MF05A  
LM27313XMFX  
Pin Descriptions  
Pin  
1
Name  
SW  
Function  
Drain of the internal FET switch.  
Analog and power ground.  
2
GND  
FB  
3
Feedback point that connects to external resistive divider to set VOUT  
Shutdown control input. Connect to VIN if this feature is not used.  
Analog and power input.  
.
4
SHDN  
VIN  
5
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2
Shutdown Input Voltage  
(Survival)  
ESD Rating (Note 3)  
Human Body Model  
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
−0.4V to +14.5V  
±2 kV  
Storage Temperature Range  
Lead Temp. (Soldering, 5 sec.)  
Power Dissipation (Note 2)  
FB Pin Voltage  
SW Pin Voltage  
Input Supply Voltage  
−65°C to +150°C  
300°C  
Internally Limited  
−0.4V to +6V  
−0.4V to +30V  
−0.4V to +14.5V  
Operating Ratings  
VIN  
2.7V to 14V  
30V  
VSW(MAX)  
VSHDN  
0V to VIN  
Junction Temperature, TJ  
(Note 2)  
-40°C to 125°C  
265°C/W  
θ
J-A (SOT23-5)  
Electrical Characteristics  
Unless otherwise specified: VIN = 5V, VSHDN = 5V, IL = 0 mA, and TJ = 25°C. Limits in standard typeface are for TJ = 25°C, and  
limits in boldface type apply over the full operating temperature range (−40°C TJ +125°C). Minimum and Maximum limits are  
guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C,  
and are provided for reference purposes only.  
Symbol  
VIN  
Parameter  
Input Voltage  
Conditions  
Min  
2.7  
Typical  
Max  
14  
Units  
V
ISW  
Switch Current Limit  
(Note 4)  
0.80  
1.25  
500  
A
RDS(ON)  
ISW = 100 mA  
Device ON  
Device OFF  
VSHDN = 0  
Switch ON Resistance  
650  
mΩ  
1.5  
VSHDN(TH)  
Shutdown Threshold  
V
µA  
V
0.50  
0
0
ISHDN  
VFB  
IFB  
Shutdown Pin Bias Current  
VSHDN = 5V  
2
Feedback Pin Reference  
Voltage  
VIN = 3V  
1.205  
1.230  
1.255  
VFB = 1.23V  
Feedback Pin Bias Current  
60  
2.1  
nA  
VSHDN = 5V, Switching  
VSHDN = 5V, Not Switching  
VSHDN = 0  
3.0  
500  
1
mA  
IQ  
Quiescent Current  
400  
0.024  
0.02  
1.6  
µA  
ΔVFBVIN FB Voltage Line Regulation  
%/V  
MHz  
%
2.7V VIN 14V  
fSW  
DMAX  
IL  
Switching Frequency  
Maximum Duty Cycle  
Switch Leakage  
1.15  
80  
1.90  
88  
Not Switching, VSW = 5V  
1
µA  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
to be functional, but does not guarantee specific limits. For guaranteed specifications and conditions see the Electrical Characteristic table.  
Note 2: The maximum power dissipation which can be safely dissipated for any application is a function of the maximum junction temperature, TJ(MAX) = 125°C,  
the junction-to-ambient thermal resistance for the SOT-23 package, θJ-A = 265°C/W, and the ambient temperature, TA. The maximum allowable power dissipation  
at any ambient temperature for designs using this device can be calculated using the formula:  
If power dissipation exceeds the maximum specified above, the internal thermal protection circuitry will protect the device by reducing the output voltage as  
required to maintain a safe junction temperature.  
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 kresistor into each pin. Test method is per JESD22-A114.  
Note 4: Switch current limit is dependent on duty cycle. Limits shown are for duty cycles 50%. See Figure 3 in Application Information MAXIMUM SWITCH  
CURRENT section.  
3
www.national.com  
Typical Performance Characteristics Unless otherwise specified: VIN = 5V, SHDN pin is tied to VIN,  
TJ = 25°C.  
Iq VIN (Active) vs Temperature  
Max. Duty Cycle vs Temperature  
RDS(ON) vs Temperature  
Oscillator Frequency vs Temperature  
20216808  
20216810  
Feedback Voltage vs Temperature  
20216855  
20216806  
Current Limit vs Temperature  
20216809  
20216807  
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4
RDS(ON) vs VIN  
Efficiency vs Load Current (VOUT = 12V)  
20216814  
20216823  
Efficiency vs Load Current (VOUT = 15V)  
Efficiency vs Load Current (VOUT = 20V)  
20216846  
20216845  
Efficiency vs Load Current (VOUT = 25V)  
20216847  
5
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Block Diagram  
20216803  
Theory of Operation  
Application Information  
The LM27313 is a switching converter IC that operates at a  
fixed frequency of 1.6 MHz using current-mode control for fast  
transient response over a wide input voltage range and in-  
corporate pulse-by-pulse current limiting protection. Because  
this is current mode control, a 50 msense resistor in series  
with the switch FET is used to provide a voltage (which is  
proportional to the FET current) to both the input of the pulse  
width modulation (PWM) comparator and the current limit  
amplifier.  
SELECTING THE EXTERNAL CAPACITORS  
The LM27313 requires ceramic capacitors at the input and  
output to accommodate the peak switching currents the part  
needs to operate. Electrolytic capacitors have resonant fre-  
quencies which are below the switching frequency of the  
device, and therefore can not provide the currents needed to  
operate. Electrolytics may be used in parallel with the ceram-  
ics for bulk charge storage which will improve transient re-  
sponse.  
At the beginning of each cycle, the S-R latch turns on the FET.  
As the current through the FET increases, a voltage (propor-  
tional to this current) is summed with the ramp coming from  
the ramp generator and then fed into the input of the PWM  
comparator. When this voltage exceeds the voltage on the  
other input (coming from the Gm amplifier), the latch resets  
and turns the FET off. Since the signal coming from the Gm  
amplifier is derived from the feedback (which samples the  
voltage at the output), the action of the PWM comparator  
constantly sets the correct peak current through the FET to  
keep the output voltage in regulation.  
When selecting a ceramic capacitor, only X5R and X7R di-  
electric types should be used. Other types such as Z5U and  
Y5F have such severe loss of capacitance due to effects of  
temperature variation and applied voltage, they may provide  
as little as 20% of rated capacitance in many typical applica-  
tions. Always consult capacitor manufacturer’s data curves  
before selecting a capacitor. High-quality ceramic capacitors  
can be obtained from Taiyo-Yuden, AVX, and Murata.  
SELECTING THE OUTPUT CAPACITOR  
A single ceramic capacitor of value 4.7 µF to 10 µF will provide  
sufficient output capacitance for most applications. For output  
voltages below 10V, a 10 µF capacitance is required. If larger  
amounts of capacitance are desired for improved line support  
and transient response, tantalum capacitors can be used in  
parallel with the ceramics. Aluminum electrolytics with ultra  
low ESR such as Sanyo Oscon can be used, but are usually  
prohibitively expensive. Typical AI electrolytic capacitors are  
not suitable for switching frequencies above 500 kHz due to  
significant ringing and temperature rise due to self-heating  
from ripple current. An output capacitor with excessive ESR  
can also reduce phase margin and cause instability.  
Q1 and Q2 along with R3 - R6 form a bandgap voltage refer-  
ence used by the IC to hold the output in regulation. The  
currents flowing through Q1 and Q2 will be equal, and the  
feedback loop will adjust the regulated output to maintain this.  
Because of this, the regulated output is always maintained at  
a voltage level equal to the voltage at the FB node "multiplied  
up" by the ratio of the output resistive divider.  
The current limit comparator feeds directly into the flip-flop,  
that drives the switch FET. If the FET current reaches the limit  
threshold, the FET is turned off and the cycle terminated until  
the next clock pulse. The current limit input terminates the  
pulse regardless of the status of the output of the PWM com-  
parator.  
SELECTING THE INPUT CAPACITOR  
An input capacitor is required to serve as an energy reservoir  
for the current which must flow into the inductor each time the  
switch turns ON. This capacitor must have extremely low ESR  
and ESL, so ceramic must be used. We recommend a nom-  
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6
inal value of 2.2 µF, but larger values can be used. Since this  
capacitor reduces the amount of voltage ripple seen at the  
input pin, it also reduces the amount of EMI passed back  
along that line to other circuitry.  
SETTING THE OUTPUT VOLTAGE  
The output voltage is set using the external resistors R1 and  
R2 (see Typical Application Circuits). A minimum value of  
13.3 kis recommended for R2 to establish a divider current  
of approximately 92 µA. R1 is calculated using the formula:  
FEED-FORWARD COMPENSATION  
R1 = R2 x ( (VOUT / VFB) − 1 )  
Although internally compensated, the feed-forward capacitor  
Cf is required for stability (see Typical Application Circuits).  
Adding this capacitor puts a zero in the loop response of the  
converter. Without it, the regulator loop can oscillate. The  
recommended frequency for the zero fz should be approxi-  
mately 8 kHz. Cf can be calculated using the formula:  
DUTY CYCLE  
The maximum duty cycle of the switching regulator deter-  
mines the maximum boost ratio of output-to-input voltage that  
the converter can attain in continuous mode of operation. The  
duty cycle for a given boost application is defined as:  
Cf = 1 / (2 x π x R1 x fz)  
SELECTING DIODES  
The external diode used in the typical application should be  
a Schottky diode. If the switch voltage is less than 15V, a 20V  
diode such as the MBR0520 is recommended. If the switch  
voltage is between 15V and 25V, a 30V diode such as the  
MBR0530 is recommended. If the switch voltage exceeds  
25V, a 40V diode such as the MBR0540 should be used.  
This applies for continuous mode operation.  
The equation shown for calculating duty cycle incorporates  
terms for the FET switch voltage and diode forward voltage.  
The actual duty cycle measured in operation will also be af-  
fected slightly by other power losses in the circuit such as wire  
losses in the inductor, switching losses, and capacitor ripple  
current losses from self-heating. Therefore, the actual (effec-  
tive) duty cycle measured may be slightly higher than calcu-  
lated to compensate for these power losses. A good  
approximation for effective duty cycle is :  
The MBR05xx series of diodes are designed to handle a max-  
imum average current of 500mA. For applications with load  
currents to 800mA, a Microsemi UPS5817 can be used.  
LAYOUT HINTS  
High frequency switching regulators require very careful lay-  
out of components in order to get stable operation and low  
noise. All components must be as close as possible to the  
LM27313 device. It is recommended that a 4-layer PCB be  
used so that internal ground planes are available.  
DC (eff) = (1 - Efficiency x (VIN / VOUT))  
Where the efficiency can be approximated from the curves  
provided.  
As an example, a recommended layout of components is  
shown:  
INDUCTANCE VALUE  
The first question we are usually asked is: “How small can I  
make the inductor?” (because they are the largest sized com-  
ponent and usually the most costly). The answer is not simple  
and involves trade-offs in performance. More inductance  
means less inductor ripple current and less output voltage  
ripple (for a given size of output capacitor). More inductance  
also means more load power can be delivered because the  
energy stored during each switching cycle is:  
E = L/2 x (lp)2  
Where “lp” is the peak inductor current. An important point to  
observe is that the LM27313 will limit its switch current based  
on peak current. This means that since lp(max) is fixed, in-  
creasing L will increase the maximum amount of power avail-  
able to the load. Conversely, using too little inductance may  
limit the amount of load current which can be drawn from the  
output.  
20216822  
Best performance is usually obtained when the converter is  
operated in “continuous” mode at the load current range of  
interest, typically giving better load regulation and less output  
ripple. Continuous operation is defined as not allowing the in-  
ductor current to drop to zero during the cycle. It should be  
noted that all boost converters shift over to discontinuous op-  
eration as the output load is reduced far enough, but a larger  
inductor stays “continuous” over a wider load current range.  
FIGURE 1. Recommended PCB Component Layout  
Some additional guidelines to be observed:  
1. Keep the path between L1, D1, and C2 extremely short.  
Parasitic trace inductance in series with D1 and C2 will  
increase noise and ringing.  
2. The feedback components R1, R2 and CF must be kept  
close to the FB pin of the LM27313 to prevent noise  
injection on the high impedance FB pin.  
To better understand these tradeoffs, a typical application cir-  
cuit (5V to 12V boost with a 10 µH inductor) will be analyzed.  
3. If internal ground planes are available (recommended)  
use vias to connect directly to the LM27313 ground at  
device pin 2, as well as the negative sides of capacitors  
C1 and C2.  
Since the LM27313 typical switching frequency is 1.6 MHz,  
the typical period is equal to 1/fSW(TYP), or approximately  
0.625 µs.  
We will assume: VIN = 5V, VOUT = 12V, VDIODE = 0.5V, VSW  
0.5V. The duty cycle is:  
=
7
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Duty Cycle = ((12V + 0.5V - 5V) / (12V + 0.5V - 0.5V)) = 62.5%  
The typical ON time of the switch is:  
CALCULATING LOAD CURRENT  
As shown in the figure which depicts inductor current, the load  
current is related to the average inductor current by the rela-  
tion:  
(62.5% x 0.625 µs) = 0.390 µs  
It should be noted that when the switch is ON, the voltage  
across the inductor is approximately 4.5V.  
ILOAD = IIND(AVG) x (1 - DC)  
Where "DC" is the duty cycle of the application. The switch  
current can be found by:  
Using the equation:  
V = L (di/dt)  
ISW = IIND(AVG) + ½ (IRIPPLE  
)
We can then calculate the di/dt rate of the inductor which is  
found to be 0.45 A/µs during the ON time. Using these facts,  
we can then show what the inductor current will look like dur-  
ing operation:  
Inductor ripple current is dependent on inductance, duty cy-  
cle, input voltage and frequency:  
IRIPPLE = DC x (VIN - VSW) / (fSW x L)  
Combining all terms, we can develop an expression which  
allows the maximum available load current to be calculated:  
The equation shown to calculate maximum load current takes  
into account the losses in the inductor or turn-OFF switching  
losses of the FET and diode. For actual load current in typical  
applications, we took bench data for various input and output  
voltages and displayed the maximum load current available  
for a typical device in graph form:  
20216812  
FIGURE 2. 10 µH Inductor Current, 5V–12V Boost  
During the 0.390 µs ON time, the inductor current ramps up  
0.176A and ramps down an equal amount during the OFF  
time. This is defined as the inductor “ripple current”. It can also  
be seen that if the load current drops to about 33 mA, the  
inductor current will begin touching the zero axis which means  
it will be in discontinuous mode. A similar analysis can be  
performed on any boost converter, to make sure the ripple  
current is reasonable and continuous operation will be main-  
tained at the typical load current values.  
MAXIMUM SWITCH CURRENT  
The maximum FET switch current available before the current  
limiter cuts in is dependent on duty cycle of the application.  
This is illustrated in Figure 3 below which shows typical values  
of switch current as a function of effective (actual) duty cycle:  
20216834  
FIGURE 4. Max. Load Current vs VIN  
DESIGN PARAMETERS VSW AND ISW  
The value of the FET "ON" voltage (referred to as VSW in the  
equations) is dependent on load current. A good approxima-  
tion can be obtained by multiplying the "ON Resistance" of  
the FET times the average inductor current.  
FET on resistance increases at VIN values below 5V, since  
the internal N-FET has less gate voltage in this input voltage  
range (see Typical performance Characteristics curves).  
Above VIN = 5V, the FET gate voltage is internally clamped to  
5V.  
The maximum peak switch current the device can deliver is  
dependent on duty cycle. The minimum switch current value  
(ISW) is guaranteed to be at least 800 mA at duty cycles below  
50%. For higher duty cycles, see Typical performance Char-  
acteristics curves.  
20216825  
THERMAL CONSIDERATIONS  
FIGURE 3. Switch Current Limit vs Duty Cycle  
At higher duty cycles, the increased ON time of the FET  
means the maximum output current will be determined by  
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8
power dissipation within the LM27313 FET switch. The switch  
power dissipation from ON-state conduction is calculated by:  
The voltage across the inductor during ON time is 4.8V. Min-  
imum inductance value is found by:  
PSW = DC x IIND(AVG)2 x RDS(ON)  
L = V x (dt/dl)  
There will be some switching losses as well, so some derating  
needs to be applied when calculating IC power dissipation.  
L = 4.8V x (0.524 µs / 0.8 mA) = 3.144 µH  
In this case, a 3.3 µH inductor could be used, assuming it  
provided at least that much inductance up to the 800 mA cur-  
rent value. This same analysis can be used to find the mini-  
mum inductance for any boost application.  
MINIMUM INDUCTANCE  
In some applications where the maximum load current is rel-  
atively small, it may be advantageous to use the smallest  
possible inductance value for cost and size savings. The con-  
verter will operate in discontinuous mode in such a case.  
INDUCTOR SUPPLIERS  
Some of the recommended suppliers of inductors for this  
product include, but are not limited to, Sumida, Coilcraft,  
Panasonic, TDK and Murata. When selecting an inductor,  
make certain that the continuous current rating is high enough  
to avoid saturation at peak currents. A suitable core type must  
be used to minimize core (switching) losses, and wire power  
losses must be considered when selecting the current rating.  
The minimum inductance should be selected such that the  
inductor (switch) current peak on each cycle does not reach  
the 800 mA current limit maximum. To understand how to do  
this, an example will be presented.  
In this example, the LM27313 nominal switching frequency is  
1.6 MHz, and the minimum switching frequency is  
1.15 MHz. This means the maximum cycle period is the re-  
ciprocal of the minimum frequency:  
SHUTDOWN PIN OPERATION  
The device is turned off by pulling the shutdown pin low. If this  
function is not going to be used, the pin should be tied directly  
to VIN. If the SHDN function will be needed, a pull-up resistor  
must be used to VIN (50kto 100 kis recommended), or  
the pin must be actively driven high and low. The SHDN pin  
must not be left unterminated.  
TON(max) = 1/1.15M = 0.870 µs  
We will assume: VIN = 5V, VOUT = 12V, VSW = 0.2V, and  
VDIODE = 0.3V. The duty cycle is:  
Duty Cycle = ((12V + 0.3V - 5V) / (12V + 0.3V - 0.2V)) = 60.3%  
Therefore, the maximum switch ON time is:  
(60.3% x 0.870 µs) = 0.524 µs  
An inductor should be selected with enough inductance to  
prevent the switch current from reaching 800 mA in the 0.524  
µs ON time interval (see below):  
20216813  
FIGURE 5. Discontinuous Design, 5V–12V Boost  
9
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Physical Dimensions inches (millimeters) unless otherwise noted  
5-Lead SOT-23 Package  
Order Number LM27313XMF, or LM27313XMFX  
NS Package Number MF05A  
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10  
Notes  
11  
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TI

LM27313XQMF

LM27313/LM27313-Q1
TI

LM27313XQMF/NOPB

具有 30V 内部 FET 开关并采用 SOT-23 封装的 1.6MHz 升压转换器,符合 AEC-Q100 标准 | DBV | 5 | -40 to 125
TI

LM27313XQMFX

LM27313/LM27313-Q1
TI

LM27313XQMFX/NOPB

具有 30V 内部 FET 开关并采用 SOT-23 封装的 1.6MHz 升压转换器,符合 AEC-Q100 标准 | DBV | 5 | -40 to 125
TI

LM27313_07

1.6 MHz Boost Converter With 30V Internal FET Switch in SOT-23
NSC