LM2796TL [NSC]

Dual-Display White LED Driver with 3/2x Switched Capacitor Boost; 双显示白光LED驱动器,带有3 / 2次开关电容升压
LM2796TL
型号: LM2796TL
厂家: National Semiconductor    National Semiconductor
描述:

Dual-Display White LED Driver with 3/2x Switched Capacitor Boost
双显示白光LED驱动器,带有3 / 2次开关电容升压

驱动器 开关
文件: 总8页 (文件大小:171K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
February 2004  
LM2796  
Dual-Display White LED Driver with 3/2x Switched  
Capacitor Boost  
General Description  
Features  
n Drives up to 7 LEDs with up to 20mA each  
The LM2796 is a charge-pump based white-LED driver that  
is ideal for mobile phone display backlighting. It can drive up  
to 7 LEDs in parallel with up to 20mA through each LED.  
Regulated internal current sources deliver excellent current  
and brightness matching in all LEDs. The LED-driver current  
sources are split into two independently controlled groups.  
The primary group (4 LEDs) can be used to backlight the  
main phone display. The second group (3 LEDs) can be  
used to backlight a secondary display or to provide other  
lighting features (keypad LEDs, for example). Brightness of  
the two groups can be adjusted independently with pulse-  
width modulated (PWM) digital signals.  
n LEDs controlled in 2 Distinct Groups, for Backlighting 2  
Displays (main LCD and sub-LCD)  
n Excellent Current and Brightness Matching  
n High-Efficiency 3/2x Charge Pump  
n Extended Li-Ion Input: 2.7V to 5.5V  
n PWM Brightness Control: 100Hz - 1kHz  
n 18-bump Thin Micro SMD Package:  
(2.1mm x 2.4mm x 0.6mm)  
Applications  
n Mobile Phone Display Lighting  
n Mobile Phone Keypad Lighting  
n PDAs  
The LM2796 works off an extended Li-Ion input voltage  
range (2.7V to 5.5V). Voltage boost is achieved with a high-  
efficiency 3/2x-gain charge pump.  
The LM2796 is available in National’s chip-scale 18-bump  
micro SMD package.  
n General LED Lighting  
Typical Application Circuit  
20093801  
© 2004 National Semiconductor Corporation  
DS200938  
www.national.com  
Connection Diagram  
18-Bump Thin Micro SMD Package, Large Bump  
NS Package Number TLA18  
20093802  
Pin Description  
Pin #s  
Pin Names  
Pin Descriptions  
C1  
VIN  
GND  
Input voltage. Input range: 2.7V to 5.5V.  
Ground  
D2  
A3  
POUT  
Charge pump output. Approximately 1.5xVIN  
Flying capacitor connections.  
A1, B2, A5, E1  
C1+, C1-, C2+,  
C2-  
A7  
EN  
Enable pin. Logic input. High = normal operation, Low = shutdown (charge  
pump and all current sources OFF).  
D6, E5, D4, E3  
D1A, D2A, D3A,  
D4A  
LED Outputs - Group A  
C5, B4, C3  
B6  
D1B, D2B, D3B  
EN-A  
LED Outputs - Group B  
Enable for Group-A LEDs (current outputs). Logic input.  
High = Group-A LEDs ON. Low = Group A LEDs OFF.  
Pulsing this pin with a PWM signal (100Hz-1kHz) can be used to dim LEDs.  
Enable for Group-B LEDs (current outputs). Logic input.  
High = Group-B LEDs ON. Low = Group B LEDs OFF.  
Pulsing this pin with a PWM signal (100Hz-1kHz) can be used to dim LEDs.  
Placing a resistor (RSET) between this pin and GND sets the LED current for  
all LEDs. LED Current = 100 x (1.25V ÷ RSET).  
E7  
C7  
EN-B  
ISET  
Ordering Information  
Order Information  
LM2796TL  
Package  
Supplied As  
TLA18 Micro SMD  
250 Units, Tape & Reel  
3000 Units, Tape & Reel  
LM2796TLX  
www.national.com  
2
Absolute Maximum Ratings (Notes 1, 2)  
Operating Rating (Notes 1, 2)  
Input Voltage Range  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
2.7V to 5.5V  
-30˚C to +125˚C  
-30˚C to +85˚C  
Junction Temperature (TJ) Range  
Ambient Temperature (TA) Range  
(Note 5)  
VIN pin voltage  
-0.3V to 7.1V  
-0.3V to (VIN+0.3V)  
w/ 5.6V max  
EN, ENA, ENB pin voltages  
Thermal Properties  
Juntion-to-Ambient Thermal  
Continuous Power Dissipation  
(Note 3)  
Internally Limited  
100˚C/W  
Junction Temperature (TJ-MAX  
Storage Temperature Range  
Maximum Lead Temperature  
(Soldering, 10 sec.)  
)
150oC  
-65oC to +150o C  
265oC  
Resistance (θJA), (Note 6)  
ESD Rating (Note 4)Human Body  
Model:  
2.0kV  
200V  
Machine Model  
Electrical Characteristics (Notes 2, 7)  
Limits in standard typeface and typical values apply for TJ = 25oC. Limits in boldface type apply over the full operating junction  
temperature range (-30˚C TJ +85˚C) . Unless otherwise specified: VIN = 3.6V; VDxx = 3.6V; V(EN) = 2.0V; Group A and  
Group B LEDs not ON simultaneously (ENA = VIN and ENB = GND, or ENA = GND and ENB = VIN); RSET = 8.35k; CIN, C1,  
C2, and CPOUT = 1µF. (Note 8)  
Symbol  
Parameter  
Condition  
3.0V VIN 4.2V, and VIN = 5.5V  
2.5V VDxx 3.8V;  
Min  
Typ  
Max  
Units  
13.8  
(-8%)  
16.2  
(+8%)  
mA  
(%)  
15  
RSET = 8.35kΩ  
3.0V VIN 5.5V;  
20  
2.5V VDxx 3.6V;  
RSET = 6.25kΩ  
mA  
mA  
mA  
Output Current Regulation  
3.0V VIN 5.5V;  
2.5V VDxx 3.9V;  
RSET = 12.5kΩ  
10  
15  
IDxx  
2.7V VIN 3.0V;  
2.5V VDxx 3.3V;  
RSET = 8.35kΩ  
ENA and ENB ON (all 7 IDX outputs active),  
VIN = 3.0V, CIN = COUT = 2.2µF  
VIN = 3.0V (Note 10)  
15  
1
mA  
%
IDxx-MATCH Current Matching Between Any  
Two Group A Outputs or Group  
B Outputs  
IQ  
Quiescent Supply Current  
2.7V VIN 4.2V;  
3.5  
6
mA  
No Load Current,  
EN = ON, ENA = ENB = OFF  
2.7V VIN 5.5V, EN = OFF  
2.7V VIN 5.5V  
ISD  
Shutdown Supply Current  
ISET Pin Voltage  
3
4.5  
µA  
V
VSET  
1.25  
100  
I
Dxx/ISET Output Current to Current Set  
Ratio  
ROUT  
Charge Pump Output Resistance VIN = 3.0V  
(Note 11)  
2.7  
VHR  
Current Source Headroom  
IDxx = 95% X IDxx (nom)  
320  
mV  
Voltage Requirement (Note 12)  
RSET = 8.35kΩ  
(IDxx (nom) 15mA)  
IDxx = 95%X IDxx (nom)  
RSET = 12.5kΩ  
220  
(IDxx (nom) 10mA)  
3
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Electrical Characteristics (Notes 2, 7) (Continued)  
Limits in standard typeface and typical values apply for TJ = 25oC. Limits in boldface type apply over the full operating junction  
temperature range (-30˚C TJ +85˚C) . Unless otherwise specified: VIN = 3.6V; VDxx = 3.6V; V(EN) = 2.0V; Group A and  
Group B LEDs not ON simultaneously (ENA = VIN and ENB = GND, or ENA = GND and ENB = VIN); RSET = 8.35k; CIN, C1,  
C2, and CPOUT = 1µF. (Note 8)  
Symbol  
fSW  
Parameter  
Switching Frequency  
Condition  
Min  
325  
Typ  
500  
100  
4.75  
Max  
675  
Units  
kHz  
µs  
3.0V VIN 4.2V  
tSTART  
Start-up Time  
IDx = 90% steady state  
1.5x to 1x Threshold  
1.5x/1x  
Charge pump gain cross-over:  
Gain = 1.5 when VIN is below  
threshold. Gain = 1 when VIN is  
above threshold.  
V
1x to 1.5x Threshold  
4.55  
V
Logic Pin Specifications: EN, ENA, ENB  
VIL  
Input Logic Low  
2.7V VIN 5.5V  
2.7V VIN 5.5V  
VENx = 0V  
0
0.5  
VIN  
V
V
VIH  
Input Logic High  
1.1  
ILEAK  
Input Leakage Current  
0.1  
10  
µA  
VENx = 3V (Note 13)  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of  
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the  
Electrical Characteristics tables.  
Note 2: All voltages are with respect to the potential at the GND pin.  
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T = 160˚C (typ.) and disengages at T  
=
J
J
120˚C (typ.). The thermal shutdown function is guaranteed by design.  
Note 4: The Human body model is a 100pF capacitor discharged through a 1.5k resistor into each pin. The machine model is a 200pF capacitor discharged directly  
into each pin. MIL-STD-883 3015.7  
Note 5: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be  
derated. Maximum ambient temperature (T  
) is dependent on the maximum operating junction temperature (T  
= 125˚C), the maximum power  
A-MAX  
J-MAX-OP  
dissipation of the device in the application (P  
), and the junction-to ambient thermal resistance of the part/package in the application (θ ), as given by the  
D-MAX  
JA  
following equation: T  
= T  
– (θ x P  
).  
A-MAX  
J-MAX-OP  
JA  
D-MAX  
Note 6: Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power dissipation exists,  
special care must be paid to thermal dissipation issues in board design.  
Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.  
Note 8:  
C , C  
IN  
, C , and C : Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics  
OUT 1 2  
Note 9: If both LED groups are to be ON simultaneously, the maximum V  
voltage may need to be derated, depending on minimum input voltage conditions. Refer  
Dxx  
to the "MAXIMUM OUTPUT CURRENT, MAXIMUM LED VOLTAGE, MINIMUM INPUT VOLTAGE" section.  
Note 10: For the two groups of outputs on a part (Group A and Group B), the following are determined: the maximum output current in the group (MAX), the  
minimum output current in the group (MIN), and the average output current of the group (AVG). For each group, two matching numbers are calculated:  
(MAX-AVG)/AVG and (AVG-MIN)/AVG. The largest number of the two (worst case) is considered the matching figure for the group. The matching figure for a given  
part is considered to be the highest matching figure of the two groups. The typical specification provided is the most likely norm of the matching figure for all parts.  
Note 11: Output resistance (R  
) models all voltage losses in the charge pump. R  
OUT  
can be used to estimate the voltage at the charge pump output (P  
):  
OUT  
OUT  
V
= (1.5 x V ) – (R  
x I ). In the equation, I  
OUT  
is the total output current: the sum of all active Dxx output currents and all current drawn from P  
. The  
OUT  
Pout  
IN  
OUT  
OUT  
equation applies when the charge pump is operating with a gain of 3/2 (V 4.75V typ.).  
IN  
Note 12: Headroom voltage: V  
= V  
– V  
. If headroom voltage requirement is not met, LED current regulation will be compromised.  
Dxx  
HR  
Pout  
Note 13: There is a 300k(typ.) pull-down resistor connected internally between each enable pin (EN, ENA, ENB) and GND.  
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4
Typical Performance Characteristics Unless otherwise specified: VIN = 3.6V; VDXX = 3.6V; V(EN) =  
2.0V; V(ENA) = 2.0V; V(ENB) = 0V; RSET = 8.3 k; CIN, C1, C2, and CPOUT = 1 µF.  
LED Current vs. Input Voltage  
LED Current vs. RSET Resistance  
20093803  
20093804  
LED Current vs. PWM Duty Cycle,  
PWM Applied to ENA and/or ENB  
Charge Pump Output Resistance  
vs. Ambient Temperature  
20093806  
20093805  
5
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ENA and ENB are used to turn the output currents ON and  
OFF. ENA activates/deactivates the four group-A outputs  
(D1A-D4A). ENB activates/deactivates the three group-B  
outputs (D1B-D3B).  
Circuit Description  
OVERVIEW  
The LM2796 is primarily intended for Lithium-Ion battery  
driven white-LED drive applications, and is well suited to  
drive white LEDs that are used for backlighting small-format  
displays. The part has seven matched constant-current out-  
puts, each capable of driving up to 20mA (or more) through  
white LEDs. The well-matched current sources ensure the  
current through all the LEDs is virtually identical. This keeps  
brightness of all LEDs matched to near perfection so that  
they can provide a consistent backlight over the entire dis-  
play.  
SETTING LED CURRENTS  
The output currents of the LM2796 can be set to a desired  
value simply by connecting an appropriately sized resistor  
(RSET) between the ISET pin of the LM2796 and GND. The  
output currents (LED currents) are proportional to the current  
that flows out of the ISET pin. The output currents are a factor  
of 100 greater than the ISET current. The feedback loop of an  
internal amplifier sets the voltage of the ISET pin to 1.25V  
(typ.). Placing a resistor between ISET and GND programs  
the ISET current, and thus the LED currents. The statements  
above are simplified in the equations below:  
The core of the LM2796 is a 1.5x/1x dual-mode charge  
pump. The input of the charge pump is connected to the VIN  
pin. The recommended input voltage range of the LM2796 is  
2.7V to 5.5V. The output of the charge pump is the POUT pin  
( “Pump OUTput”). The output voltage of the charge pump is  
unregulated and varies with input voltage and load current.  
IDxx = 100 x(VSET / RSET  
)
RSET = 100 x (1.25V / IDxx  
)
Maximum Output Current, Maximum LED Voltage,  
Minimum Input Voltage  
The charge pump operates in the 1.5x mode when the input  
voltage is below 4.75V (typ.). In this mode, the input-to-  
output voltage gain of the charge pump is 1.5, and the  
voltage at the output of the charge pump will be approxi-  
mately 1.5x the input voltage (V(POUT) 1.5 * VIN ). When in  
the 1.5x mode, the charge pump provides the voltage boost  
that is required to drive white LEDs from a Li-Ion battery.  
(White LEDs typically have a forward voltage in the range of  
3.3V to 4.0V. A Li-Ion battery typically is not considered to be  
fully discharged until the battery voltage falls to 3.0V (ap-  
prox.) )  
The LM2796 can drive 7 LEDs at 15mA each from an input  
voltage as low as 3.0V, so long as the LEDs have a forward  
voltage of 3.6V or less (room temperature).  
The statement above is a simple example of the LED drive  
capabilities of the LM2796. The statement contains the key  
application parameters that are required to validate an LED-  
drive design using the LM2796: LED current (ILED), number  
of active LEDs (N), LED forward voltage (VLED), and mini-  
mum input voltage (VIN-MIN).  
The equation below can be used to estimate the total output  
current capability of the LM2796:  
The charge pump operates in the 1x mode when the input  
voltage is above 4.75V (typ.). In these conditions, voltage  
boost is not required to drive the LEDs, so the charge pump  
merely passes the input voltage to POUT (V(POUT) VIN).  
This reduces the input current and the power dissipation of  
the LM2796 when the input voltage is high.  
ILED_MAX = ((1.5 x VIN) - VLED) / ((N x ROUT) + kHR) (eq. 1)  
ILED_MAX = ((1.5 x VIN ) - VLED) / ((N x 2.7) + 22mV/mA)  
ROUT – Output resistance. This parameter models the inter-  
nal losses of the charge pump that result in voltage droop at  
the pump output POUT. Since the magnitude of the voltage  
droop is proportional to the total output current of the charge  
pump, the loss parameter is modeled as a resistance. The  
output resistance of the LM2796 is typically 2.7(VIN = 3.0V,  
TA = 25˚C). In equation form:  
The matched current outputs are generated with a precision  
current mirror that is biased off the charge pump output.  
Matched currents are ensured with the use of tightly  
matched internal devices and internal mismatch cancellation  
circuitry. Top-side current drive allows LEDs to be connected  
between each current output and GND, simplifying PWB  
routing and connectivity.  
VPOUT = 1.5xVIN – NxILEDxROUT  
(eq. 2)  
kHR – Headroom constant. This parameter models the mini-  
mum voltage required to be present across the current  
sources for them to regulate properly. This minimum voltage  
is proportional to the programmed LED current, so the con-  
stant has units of mV/mA. The typical kHR of the LM2796 is  
22mV/mA. In equation form:  
There are seven regulated current outputs. These seven  
outputs are split into two groups, a group of 4 outputs and a  
group of 3 outputs. There is an ON/OFF control pin for each  
group.  
The DC current through the LEDs is programmed with an  
external resistor. Changing currents on-the-fly can be  
achieved with the use of digital pulse (PWM) signals.  
>
(VPOUT – VLED  
)
kHRxILED  
(eq. 3)  
The "ILED-MAX" equation (eq. 1) is obtained from combining  
the ROUT equation (eq. 2) with the kHR equation (eq. 3) and  
solving for ILED. Maximum LED current is highly dependent  
on minimum input voltage and LED forward voltage. Output  
current capability can be increased by raising the minimum  
input voltage of the application, or by selecting an LED with  
a lower forward voltage. Excessive power dissipation may  
also limit output current capability of an application.  
ENABLE PINS: EN, ENA, ENB  
The LM2796 has 3 enable pins. All three are active-high  
logic (HIGH = ON). There are internal pull-down resistors  
(300ktyp.) that are connected internally between each of  
the enable pins and GND.  
The EN pin is the master enable pin for the part. When  
<
voltage on this pin is low ( 0.5V), the part is in shutdown  
mode. All internal circuitry is OFF and the part consumes  
very little supply current when the LM2796 is shutdown.  
Soft Start  
The LM2796 contains internal soft-start circuitry to limit input  
inrush currents when the part is enabled. Soft start is imple-  
mented internally with a controlled turn-on of the internal  
voltage reference. During soft start, the current through the  
>
When the voltage on the EN pin is high ( 1.1V), the part is  
active. The charge pump is ON, and it is possible to turn on  
the output currents to drive the LEDs.  
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6
In cases where a PWM signal must be connected to the EN  
pin, measures can be taken to reduce the magnitude of the  
charge-pump turn-on voltage spikes. More input capaci-  
tance, series resistors and/or ferrite beads may provide ben-  
efits.  
Circuit Description (Continued)  
LED outputs rise at the rate of the reference voltage ramp.  
Due to the soft-start circuitry, turn-on time of the LM2796 is  
approximately 100µs (typ.).  
If the current and voltage spikes can be tolerated, connect-  
ing the PWM signal to the EN pin does provide a benefit:  
lower supply current when the PWM signal is active. When  
the PWM signal is low, the LM2796 will be shutdown and  
input current will only be a few micro-amps. This results in a  
lower time-averaged input current than the prior suggestion,  
where EN is kept on continuously.  
Thermal Protection  
Internal thermal protection circuitry disables the LM2796  
when the junction temperature exceeds 160˚C (typ.). This  
feature protects the device from being damaged by high die  
temperatures that might otherwise result from excessive  
power dissipation. The device will recover and operate nor-  
mally when the junction temperature falls below 120˚C (typ.).  
It is important that the board layout provides good thermal  
conduction. This will help to keep the junction temperature  
within specified operating ratings.  
CAPACITOR SELECTION  
The LM2796 requires 4 external capacitors for proper opera-  
tion. Surface-mount multi-layer ceramic capacitors are rec-  
ommended. These capacitors are small, inexpensive and  
<
have very low equivalent series resistance (ESR 20mW  
Applications Information  
typ.). Tantalum capacitors, OS-CON capacitors, and alumi-  
num electrolytic capacitors are not recommended for use  
with the LM2796 due to their high ESR, as compared to  
ceramic capacitors.  
ADJUSTING LED BRIGHTNESS (PWM control)  
Perceived LED brightness can be adjusted using a PWM  
control signal to turn the LM2796 current sources ON and  
OFF at a rate faster than perceptible by the eye. When this  
is done, the total brightness perceived is proportional to the  
duty cycle (D) of the PWM signal (D = the percentage of time  
that the LED is on in every PWM cycle). A simple example: if  
the LEDs are driven at 15mA each with a PWM signal that  
has a 50% duty cycle, perceived LED brightness will be  
about half as bright as compared to when the LEDs are  
driven continuously with 15mA. A PWM signal thus provides  
brightness (dimming) control for the solution.  
For most applications, ceramic capacitors with X7R or X5R  
temperature characteristic are preferred for use with the  
LM2796. These capacitors have tight capacitance tolerance  
(as good as 10%) and hold their value over temperature  
(X7R: 15% over -55˚C to 125˚C; X5R: 15% over -55˚C to  
85˚C).  
Capacitors with Y5V or Z5U temperature characteristic are  
generally not recommended for use with the LM2796. Ca-  
pacitors with these temperature characteristics typically  
have wide capacitance tolerance (+80%, -20%) and vary  
significantly over temperature (Y5V: +22%, -82% over -30˚C  
to +85˚C range; Z5U: +22%, -56% over +10˚C to +85˚C  
range). Under some conditions, a nominal 1µF Y5V or Z5U  
capacitor could have a capacitance of only 0.1µF. Such  
detrimental deviation is likely to cause Y5V and Z5U capaci-  
tors to fail to meet the minimum capacitance requirements of  
the LM2796.  
The minimum recommended PWM frequency is 100Hz. Fre-  
quencies below this may be visibly noticeable as flicker or  
blinking. The maximum recommended PWM frequency is  
1kHz. Frequencies above this may cause interference with  
internal current driver circuitry.  
The preferred method for applying a PWM signal to adjust  
brightness is to keep the master EN voltage ON continuously  
and to apply the PWM signal(s) to the current source enable  
pin(s): ENA and/or ENB. The benefit of this type of connec-  
tion can be best understood with a contrary example. When  
a PWM signal is connected to the master enable (EN) pin,  
the charge pump repeatedly turns on and off. Every time the  
charge pump turns on, there is an inrush of current as  
capacitances, both internal and external, are recharged. This  
inrush current results in a current and voltage spike at the  
input of the part. By only applying the PWM signal to ENA/  
ENB, the charge pump stays on continuously and much  
lower input noise results.  
The minimum recommended voltage rating for these capaci-  
tors is 10V.  
MICRO SMD MOUNTING  
The LM2796 is an 18-bump micro SMD with a bump size of  
approximately 300 micron diameter. The micro SMD pack-  
age requires specific mounting techniques detailed in Na-  
tional Semiconductor Application Note 1112 (AN-1112).  
7
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Physical Dimensions inches (millimeters) unless otherwise noted  
TLA18EHA: 18-Bump Thin Micro SMD, Large Bump  
X1 = 2.098 0.030mm  
X2 = 2.403mm 0.030  
X3 = 0.600mm 0.075mm  
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