LM27CIM5X-1HJ [NSC]

SOT-23, 3 Degree Celcious Accurate, 120-150 Degree Celcious Factory Preset Thermostat; SOT - 23 ， 3度Celcious准确， 120-150度Celcious出厂预设恒温器


型号：	LM27CIM5X-1HJ
厂家：	National Semiconductor
描述：	SOT-23, 3 Degree Celcious Accurate, 120-150 Degree Celcious Factory Preset Thermostat SOT - 23 ， 3度Celcious准确， 120-150度Celcious出厂预设恒温器
文件：	总9页 (文件大小：202K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

August 2002

LM27

SOT-23, 3˚C Accurate, 120˚C-150˚C Factory Preset

Thermostat

n Portable Battery Powered Systems

n Fan Control

The LM27 is a precision, single digital-output, low-power

n Industrial Process Control

General Description

thermostat comprised of an internal reference, DAC, tem-

perature sensor and comparator. Utilizing factory program-

ming, it can be manufactured with different trip points as well

as different digital output functionality. The trip point (T_OS

n HVAC Systems

n Electronic System Protection

)

can be preset at the factory to any temperature in the range

of +120˚C to +150˚C in 1˚C increments. The LM27 has one

digital output (OS/OS/US/US), one digital input (HYST) and

one analog output (V_TEMP). The digital output stage can be

preset as either open-drain or push-pull. In addition, it can be

factory programmed to be active HIGH or LOW. The digital

output can be factory programmed to indicate an over tem-

perature shutdown event (OS or OS) or an under tempera-

ture shutdown event (US or US). When preset as an over-

temperature shutdown (OS) it will go LOW to indicate that

the die temperature is over the internally preset T_OSand go

HIGH when the temperature goes below (T_OS–T_HYST). Simi-

larly, when preprogrammed as an undertemperature shut-

down (US) it will go HIGH to indicate that the temperature is

below T_USand go LOW when the temperature is above

(T_US+T_HYST). The typical hysteresis, T_HYST, can be set to

2˚C or 10˚C and is controlled by the state of the HYST pin. A

V_TEMPanalog output provides a voltage that is proportional

to temperature and has a −10.7mV/˚C output slope.

Features

n Internal comparator with pin selectable 2˚C or 10˚C

hysteresis

n No external components required

n Open-drain or push-pull digital output; supports CMOS

logic levels

n Internal temperature sensor with V_TEMPoutput pin

n V_TEMPoutput allows after-assembly system testing

n Internal voltage reference and DAC for trip-point setting

n Currently available in 5-pin SOT-23 plastic package

n Excellent power supply noise rejection

Key Specifications

Power Supply Voltage

2.7V to 5.5V

40µA(max)

Power Supply Current

15µA(typ)

Hysteresis Temperature

2˚C or 10˚C(typ)

3˚C (max)

Currently, there are several standard parts available, see

ordering information for details. For other part options, con-

tact a National Semiconductor Distributor or Sales Repre-

sentative for information on minimum order qualification. The

LM27 is currently available in a 5-lead SOT-23 package.

Temperature Trip Point Accuracy

Applications

n Microprocessor Thermal Management

n Appliances

LM27CIM5-2HJ Simplified Block Diagram and Connection Diagram

20030701

The LM27CIM5-2HJ has a fixed trip point of 140˚C.

For other trip point and output function availability,

please see ordering information or contact National Semiconductor.

DS200307

www.national.com

Ordering Information

For more detailed information on the suffix meaning see the part number template at the end of the Electrical Characteris-

tics Section. Contact National Semiconductor for other set points and output options.

Order Number

3000 Units in Tape & Reel

NS Package

Number

MA05B

Bulk Rail

LM27CIM5-1HJ

LM27CIM5-2HJ

Top Mark

T1HJ

Trip Point Setting Output Function

LM27CIM5X-1HJ

LM27CIM5X-2HJ

130˚C

140˚C

Open Drain OS

T2HJ

MA05B

Connection Diagram

20030702

Pin Description

Pin Number

Pin Name

Function

Connection

GND for 10˚C or V⁺for 2˚C

HYST

Hysteresis control, digital

input

GND

Ground, connected to the

back side of the die through

lead frame.

System GND

V_TEMP

V⁺

Analog output voltage

proportional to temperature

Supply input

Leave floating or connect to a high impedance

node.

2.7V to 5.5V with a 0.1µF bypass capacitor.

For PSRR information see Section Titled

NOISE CONSIDERATIONS.

Overtemperature Shutdown

open-drain active low

Controller interrupt, system or power supply

shutdown; pull-up resistor ≥ 10kΩ

thermostat digital output

Overtemperature Shutdown

totem-pull active high

Controller interrupt, system or power supply

shutdown

thermostat digital output

Undertemperature Shutdown

open-drain active low

System or power supply shutdown; pull-up

resistor ≥ 10kΩ

thermostat digital output

Undertemperature Shutdown

totem-pull active high

System or power supply shutdown

thermostat digital output

Note: pin 5 functionality and trip point setting are programmed during LM27 manufacture.

www.national.com

Absolute Maximum Ratings (Note 1)

Storage Temperature

ESD Susceptibility (Note 4)

Human Body Model

Machine Model

−65˚C to + 150˚C

Input Voltage

6.0V

2500V

250V

Input Current at any pin (Note 2)

Package Input Current(Note 2)

Package Dissipation at T_A= 25˚C

(Note 3)

5mA

20mA

Operating Ratings(Note 1)

500mW

Soldering Information

SOT23 Package

Specified Temperature Range

T_MIN≤ T_A≤ T_MAX

−40˚C ≤ T_A≤ +150˚C

+2.7V to +5.5V

+5.5V

LM27CIM

Vapor Phase (60 seconds)

Infrared (15 seconds)

215˚C

220˚C

Positive Supply Voltage (V⁺)

Maximum V_OUT

LM27 Electrical Characteristics

The following specifications apply for V⁺= 2.7V_DCto 5.5V_DC, and V_TEMPload current = 0µA unless otherwise specified. Bold-

face limits apply for T_A= T_J= T_MINto T_MAX; all other limits T_A= T_J= 25˚C unless otherwise specified.

Typical

LM27CIM

Limits

Units

Symbol

Parameter

Conditions

(Note 6)

(Limits)

(Note 7)

Temperature Sensor

Trip Point Accuracy (Includes

_REF, DAC, Comparator Offset,

+120˚C T_A+150˚C

˚C (max)

and Temperature Sensitivity

errors)

Trip Point Hysteresis

HYST = GND

HYST = V⁺

˚C

V_TEMPOutput Temperature

Sensitivity

−10.82

mV/˚C

V_TEMPTemperature Sensitivity

Error to Equation:

V_O= (−3.552x10⁻⁶x(T−30)²+

(−10.695x10⁻³x(T−30))+

1.8386V

−30˚C ≤ T_A≤ 150˚C,

2.7V ≤ V⁺≤ 5.5V

−55˚C ≤ T_A≤ 150˚C,

4.5V ≤ V⁺≤ 5.5V

T_A= 25˚C

˚C (max)

2.5

0.7

˚C (max)

V_TEMPLoad Regulation

V_TEMPLine Regulation

Supply Current

−1µA ≤ I_L≤ 0

0.070

−0.2

0 ≤ I_L≤ +40µA

+2.7V ≤ V⁺≤ +5.5V,

−30˚C ≤ T_A≤ +120˚C

mV (max)

mV/V

I_S

µA (max)

Digital Output and Input

I_OUT(“1”)

Logical “1” Output Leakage

V⁺= +5.0V

0.001

µA (max)

V (max)

Current (Note 9)

V_OUT(“0”)

Logical “0” Output Voltage

I_OUT= +1.2mA and

V⁺≥2.7V;

0.4

I_OUT= +3.2mA and

V⁺≥4.5V; (Note 8)

I_SOURCE= 500µA, V⁺

≥ 2.7V

V_OUT(“1”)

Logical “1” Push-Pull Output

Voltage

0.8 x V⁺

V⁺− 1.5

0.8 x V⁺

0.2 x V⁺

V (min)

V (max)

I_SOURCE= 800µA,

V⁺≥4.5V

V_IH

V_IL

HYST Input Logical ”1“ Threshold

Voltage

HYST Input Logical ”0“ Threshold

Voltage

www.national.com

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed

specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test

conditions.

V ), the current at that pin should be limited to 5mA. The 20mA

Note 2: When the input voltage (V ) at any pin exceeds the power supply (V

GND or V

maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5mA to four. Under normal

operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each.

Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T

(maximum junction temperature), θ (junction to

Jmax

ambient thermal resistance) and T (ambient temperature). The maximum allowable power dissipation at any temperature is P = (T

–T )/θ or the number

Jmax

A JA

given in the Absolute Maximum Ratings, whichever is lower. For this device, T

= 150˚C. For this device the typical thermal resistance (θ ) of the different

Jmax

package types when board mounted follow:

Package Type

θ_JA

SOT23-5, MA05B

250˚C/W

Note 4: The human body model is a 100pF capacitor discharge through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor discharged directly

into each pin.

Note 5: See the URL ”http://www.national.com/packaging/“ for other recommendations and methods of soldering surface mount devices.

Note 6: Typicals are at T = T = 25˚C and represent most likely parametric norm.

Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).

Note 8: Care should be taken to include the effects of self heating when setting the maximum output load current. The power dissipation of the LM27 would increase

by 1.28mW when I

=3.2mA and V

=0.4V. With a thermal resistance of 250˚C/W, this power dissipation would cause an increase in the die temperature of

OUT

about 0.32˚C due to self heating. Self heating is not included in the trip point accuracy specification.

Note 9: The 1µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the current for every 15˚C

increase in temperature. For example, the 1nA typical current at 25˚C would increase to 16nA at 85˚C.

Part Number Template

The series of digits labeled xyz in the part number LM27CIM-xyz, describe the set point value and the function of the output as

follows:

The place holders xy describe the set point temperature as shown in the following table.

x (10x)

y (1x)

Temperature (˚C)

x (10x)

y (1x)

Temperature (˚C)

The value of z describes the assignment/function of the output as shown in the following table:

Open-Drain/

Active-Low/High

Push-Pull

OS/US

Value of z

Digital Output Function

Active-Low, Open-Drain, OS output

Active-Low, Open-Drain, US output

Active-High, Push-Pull, OS output

Active-High, Push-Pull, US output

For example:

•

the part number LM27CIM5-2SJ has T_OS= 147˚C, and programmed as an active-low open-drain overtemperature shutdown

output.

•

the part number LM27CIM5-ZLN has T_US= 123˚C, and programmed as an active-high, push-pull undertemperature shutdown

output.

Active-high open-drain and active-low push-pull options are available, please contact National Semiconductor for more informa-

tion.

www.national.com

Functional Description

LM27 OPTIONS

20030712

20030713

LM27-_ _J

LM27-_ _K

20030714

20030715

LM27-_ _L

LM27-_ _N

FIGURE 1. Output Pin Options Block Diagrams

The LM27 can be factory programmed to have a trip point

anywhere in-between 120˚C to 150˚C.

board temperature not the ambient temperature (see

Section Titled Mounting Considerations)

Applications Hints

A. Observe that OS is high.

B. Drive V_TEMPto ground.

AFTER-ASSEMBLY PCB TESTING

C. Observe that OS is now low.

D. Release the V_TEMPpin.

E. Observe that OS is now high.

The LM27’s V_TEMPoutput allows after-assembly PCB testing

by following a simple test procedure. Simply measuring the

V_TEMPoutput voltage will verify that the LM27 has been

assembled properly and that its temperature sensing cir-

cuitry is functional. The V_TEMPoutput has very weak drive

capability that can be overdriven by 1.5mA. Therefore, one

can simply force the V_TEMPvoltage to cause the digital

output to change state, thereby verifying that the comparator

and output circuitry function after assembly. Here is a

sample test procedure that can be used to test the

LM27CIM5X-2HJ which has a 140˚C trip point.

A. Observe that OS is high.

B. Drive V_TEMPvoltage down gradually.

C. When OS goes low, note the V_TEMPvoltage.

D. V_TEMPTrig = V_TEMPat OS trigger (HIGH- LOW)

E. Calculate Ttrig using Equation (2).

1. Turn on V⁺and measure V_TEMP. Then calculate the

temperature reading of the LM27 using the equation:

A. Gradually raise V_TEMPuntil OS goes HIGH. Note

V_TEMP

V_O= (−3.552x10⁻⁶x(T−30)²) +

B. Calculate T_HYSTusing Equation (2).

(−10.69576x10⁻³x(T−30)) + 1.8386V

(1)

V_TEMPLOADING

The V_TEMPoutput has very weak drive capability (40µA

source, 1µA sink). So care should be taken when attaching

circuitry to this pin. Capacitive loading may cause the V_TEMP

output to oscillate. Simply adding a resistor in series as

shown in Figure 2 will prevent oscillations from occurring. To

determine the value of the resistor follow the guidelines

given in Table 1. The same value resistor will work for either

placement of the resistor. If an additional capacitive load is

placed directly on the LM27 output, rather than across

C_LOAD, it should be at least a factor of 10 smaller than

(2)

2. Verify that the temperature measured in step one is

within ( 3˚C + error of reference temperature sensor) of

the ambient/board temperature. The ambient/board tem-

perature (reference temperature) should be measured

using an extremely accurate calibrated temperature sen-

sor, which is in close proximity to and mounted on the

same PCB as the LM27 perhaps even touching the GND

lead of the LM27 if possible. The LM27 will sence the

C_LOAD

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MOUNTING CONSIDERATIONS

Applications Hints (Continued)

The LM27 can be applied easily in the same way as other

integrated-circuit temperature sensors. It can be glued or

cemented to a surface. The temperature that the LM27 is

sensing will be within about +0.06˚C of the surface tempera-

ture to which the LM27’s leads are attached to.

TABLE 1. Resistive compensation for capacitive

loading of V_TEMP

C_LOAD

≤100pF

1nF

R (Ω)

This presumes that the ambient air temperature is almost the

same as the surface temperature; if the air temperature were

much higher or lower than the surface temperature, the

actual temperature measured would be at an intermediate

temperature between the surface temperature and the air

temperature.

8200

3000

1000

430

10nF

100nF

≥1µF

To ensure good thermal conductivity, the backside of the

LM27 die is directly attached to the GND pin (pin 2). The

temperatures of the lands and traces to the other leads of the

LM27 will also affect the temperature that is being sensed.

Alternatively, the LM27 can be mounted inside a sealed-end

metal tube, and can then be dipped into a bath or screwed

into a threaded hole in a tank. As with any IC, the LM27 and

accompanying wiring and circuits must be kept insulated and

dry, to avoid leakage and corrosion. This is especially true if

the circuit may operate at cold temperatures where conden-

sation can occur. Printed-circuit coatings and varnishes such

as Humiseal and epoxy paints or dips are often used to

ensure that moisture cannot corrode the LM27 or its connec-

tions.

20030717

a) R in series with capacitor

The junction to ambient thermal resistance (θ_JA) is the pa-

rameter used to calculate the rise of a part’s junction tem-

perature due to its power dissipation. For the LM27 the

equation used to calculate the rise in the die junction tem-

perature is as follows:

(3)

where T_Ais the ambient temperature, V⁺is the power supply

voltage, I_Qis the quiescent current, I_{L_TEMP}is the load

current on the V_TEMPoutput, V_DOis the voltage on the digital

output, and I_DOis the load current on the digital output. Since

the LM27’s junction temperature is the actual temperature

being measured, care should be taken to minimize the load

current that the LM27 is required to drive.

20030718

b) R in series with signal path

FIGURE 2. Resistor placement for capacitive loading

compensation of V_TEMP

The tables shown in Figure 3 summarize the thermal resis-

tance for different conditions and the rise in die temperature

of the LM27 without any loading on V_TEMPand a 10k pull-up

resistor on an open-drain digital output with a 5.5V power

supply.

NOISE CONSIDERATIONS

The LM27 has excellent power supply noise rejection. Listed

below is a variety of signals used to test the LM27 power

supply rejection. False triggering of the output was not ob-

served when these signals where coupled into the V+ pin of

the LM27.

SOT23-5

no heat sink

small heat sink

θ_JA

(˚C/W)

250

T_J−T_A

θ_JA

(˚C/W)

TBD

T_J−T_A

(˚C)

•

square wave 400kHz, 1Vp-p

(˚C)

0.11

TBD

square wave 2kHz, 200mVp-p

sine wave 100Hz to 1MHz, 200mVp-p

Still Air

TBD

Moving Air

TBD

Testing was done while maintaining the temperature of the

LM27 one degree centigrade way from the trip point with the

output not activated.

FIGURE 3. Thermal resistance (θ_JA) and temperature

rise due to self heating (T_J−T_A)

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Typical Applications

20030703

Note: The fan’s control pin has internal pull-up. The 10k pull-down sets a slow fan speed. When the output of the LM27 goes low, the fan will speed up.

FIGURE 4. Two Speed Fan Speed Control

20030720

FIGURE 5. Fan High Side Drive

20030721

FIGURE 6. Fan Low Side Drive

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Typical Applications (Continued)

20030722

FIGURE 7. Audio Power Amplifier Thermal Protection

20030723

FIGURE 8. Simple Thermostat

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Physical Dimensions inches (millimeters)

unless otherwise noted

5-Lead Molded SOT-23 Plastic Package, JEDEC

Order Number LM27CIM5 or LM27CIM5X

NS Package Number MA05B

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL

COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or

systems which, (a) are intended for surgical implant

into the body, or (b) support or sustain life, and

whose failure to perform when properly used in

accordance with instructions for use provided in the

labeling, can be reasonably expected to result in a

significant injury to the user.

2. A critical component is any component of a life

support device or system whose failure to perform

can be reasonably expected to cause the failure of

the life support device or system, or to affect its

safety or effectiveness.

National Semiconductor

Corporation

Americas

National Semiconductor

Europe

National Semiconductor

Asia Pacific Customer

Response Group

Tel: 65-2544466

Fax: 65-2504466

National Semiconductor

Japan Ltd.

Tel: 81-3-5639-7560

Fax: 81-3-5639-7507

Fax: +49 (0) 180-530 85 86

Email: support@nsc.com

Email: europe.support@nsc.com

Deutsch Tel: +49 (0) 69 9508 6208

English Tel: +44 (0) 870 24 0 2171

Français Tel: +33 (0) 1 41 91 8790

Email: ap.support@nsc.com

www.national.com

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.

LM27CIM5X-1HJ [NSC]

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