LM4030AMFX-2.5 [NSC]

Ultra-High Precision Shunt Voltage Reference; 超高精度并联型电压基准
LM4030AMFX-2.5
型号: LM4030AMFX-2.5
厂家: National Semiconductor    National Semiconductor
描述:

Ultra-High Precision Shunt Voltage Reference
超高精度并联型电压基准

文件: 总14页 (文件大小:378K)
中文:  中文翻译
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May 30, 2008  
LM4030  
SOT-23 Ultra-High Precision Shunt Voltage Reference  
General Description  
Features  
The LM4030 is an ultra-high precision shunt voltage refer-  
ence, having exceptionally high initial accuracy (0.05%) and  
temperature stability (10ppm/°C). The LM4030 is available  
with fixed voltage options of 2.5V and 4.096V. Despite the tiny  
SOT23 package, the LM4030 exhibits excellent thermal hys-  
teresis (75ppm) and long-term stability (40ppm) as well as  
immunity to board stress effects.  
High output voltage accuracy 0.05%  
Low temperature coefficient 10 ppm/°C  
Extended temperature operation -40-125°C  
Excellent thermal hysteresis, 75ppm  
Excellent long-term stability, 40ppm  
High immunity to board stress effects  
The LM4030 is designed to operate without an external ca-  
pacitor, but any capacitor up to 10µF may be used. The  
LM4030 can be powered off as little as 120µA (max) but is  
capable of shunting up to 30mA continuously. As with any  
shunt reference, the LM4030 can be powered off of virtually  
any supply and is a simple way to generate a highly accurate  
system reference.  
Capable of handling 50 mA transients  
Voltage options 2.5V, 4.096V  
SOT23-5 Package  
Applications  
Data Acquisition/Signal path  
The LM4030 is available in three grades (A, B, and C). The  
best grade devices (A) have an initial accuracy of 0.05% with  
guaranteed temperature coefficient of 10 ppm/°C or less,  
while the lowest grade parts (C) have an initial accuracy of  
0.15% and a temperature coefficient of 30 ppm/°C.  
Test and Measurement  
Automotive & Industrial  
Communications  
Instrumentation  
Power Management  
Typical Application Circuit  
30046301  
Connection Diagram  
Top View  
30046302  
SOT23-5 Package  
NS Package Number MF05A  
© 2008 National Semiconductor Corporation  
300463  
www.national.com  
Ordering Information  
Input Output Voltage Accuracy at  
25°C And Temperature Coefficient  
LM4030 Supplied as 1000  
units, Tape and Reel  
LM4030 Supplied as 3000 units, Part Marking  
Tape and Reel  
0.05%, 10 ppm/°C max (A grade)  
0.10%, 20 ppm/°C max (B grade)  
0.15%, 30 ppm/°C max (C grade)  
LM4030AMF-2.5  
LM4030AMF-4.096  
LM4030BMF-2.5  
LM4030BMF-4.096  
LM4030CMF-2.5  
LM4030CMF-4.096  
LM4030AMFX-2.5  
LM4030AMFX4.096  
LM4030BMFX-2.5  
LM4030BMFX4.096  
LM4030CMFX-2.5  
LM4030CMFX4.096  
R5JA  
R5KA  
R5JB  
R5KB  
R5JC  
R5KC  
Pin Descriptions  
Pin #  
Name  
N/C  
Function  
No connect pin, leave floating  
Ground or no connect  
No connect pin, leave floating  
Reference voltsge  
1
2
3
4
5
GND, N/C  
N/C  
VREF  
GND  
Ground  
www.national.com  
2
Infrared (15sec)  
ESD Susceptibility (Note 3)  
Human Body Model  
220°C  
2kV  
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Operating Ratings  
Maximum Continuous Shunt Current  
Maximum Shunt Current (<1s)  
Junction Temperature Range (TJ)  
Maximum Voltage on any input  
Power Dissipation (TA = 25°C)  
(Note 2)  
-0.3 to 6V  
30mA  
50mA  
−40°C to  
+125°C  
350mW  
−65°C to 150°C  
260°C  
Storage Temperature Range  
Lead Temperature (soldering, 10sec)  
Vapor Phase (60 sec)  
215°C  
Electrical Characteristics  
LM4030-2.5 (VOUT = 2.5V) Limits in standard type are for TJ = 25°C only, and limits in boldface type apply over  
the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are guaranteed through test, design, or  
statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference  
purposes only.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
(Note 4) (Note 5) (Note 4)  
VREF  
Reverse Breakdown Voltage  
ISHUNT = 120µA  
2.5  
V
Reverse Breakdown Voltage Tolerance (ISHUNT = 120µA)  
LM4030A-2.5  
(A Grade - 0.05%)  
(B Grade - 0.10%)  
(C Grade - 0.15%)  
-0.05  
-0.10  
-0.15  
0.05  
0.10  
0.15  
120  
%
%
LM4030B-2.5  
LM4030C-2.5  
%
IRMIN  
TC  
Minimum Operating Current  
Temperature Coefficient (Note 6)  
LM4030A-2.5  
µA  
10  
20  
ppm / °C  
ppm / °C  
ppm / °C  
ppm / °C  
ppm / mA  
0°C TJ + 85°C  
-40°C TJ +125°C  
-40°C TJ +125°C  
-40°C TJ +125°C  
160µA ISHUNT 30mA  
LM4030B-2.5  
LM4030C-2.5  
20  
30  
Reverse Breakdown Voltage Change  
with Current  
25  
110  
ΔVREFISHUNT  
Long Term Stability (Note 7)  
Thermal Hysteresis (Note 8)  
Output Noise Voltage (Note 9)  
1000 Hrs, TA = 30°C  
40  
75  
ppm  
ppm  
µVPP  
ΔVREF  
VHYST  
-40°C TJ +125°C  
0.1 Hz to 10 Hz  
VN  
105  
3
www.national.com  
Electrical Characteristics  
LM4030-4.096 (VOUT = 4.096V) Limits in standard type are for TJ = 25°C only, and limits in boldface type apply  
over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are guaranteed through test, design,  
or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference  
purposes only.  
Symbol  
Parameter  
Conditions  
Min  
(Note  
4)  
Typ  
Max  
Unit  
(Note (Note 4)  
5)  
VREF  
Reverse Breakdown Voltage  
ISHUNT = 130µA  
4.096  
V
Reverse Breakdown Voltage Tolerance ( ISHUNT = 130µA)  
LM4030A-4.096  
(A Grade - 0.05%)  
(B Grade - 0.10%)  
(C Grade - 0.15%)  
-0.05  
-0.10  
-0.15  
0.05  
0.10  
0.15  
130  
%
%
LM4030B-4.096  
LM4030C-4.096  
%
IRMIN  
TC  
Minimum Operating Current  
Temperature Coefficient (Note 6)  
LM4030A-4.096  
µA  
10  
20  
20  
30  
ppm / °C  
ppm / °C  
ppm / °C  
ppm / °C  
ppm / mA  
0°C TJ + 85°C  
-40°C TJ +125°C  
-40°C TJ +125°C  
-40°C TJ +125°C  
160µA ISHUNT 30mA  
LM4030B-4.096  
LM4030C-4.096  
Reverse Breakdown Voltage  
Change with Current  
15  
95  
ΔVREFILOAD  
Long Term Stability (Note 7)  
Thermal Hysteresis (Note 8)  
Output Noise Voltage (Note 9)  
1000 Hrs, TA = 30°C  
40  
75  
ppm  
ppm  
µVPP  
ΔVREF  
VHYST  
-40°C TJ +125°C  
0.1 Hz to 10 Hz  
VN  
165  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. Operating Ratings indicate conditions for which the device is  
intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications, see Electrical Characteristics.  
Note 2: Without PCB copper enhancements. The maximum power dissipation must be de-rated at elevated temperatures and is limited by TJMAX (maximum  
junction temperature), θJ-A (junction to ambient thermal resistance) and TA (ambient temperature). The maximum power dissipation at any temperature is:  
PDissMAX = (TJMAX - TA) /θJ-A up to the value listed in the Absolute Maximum Ratings. θJ-A for SOT23-5 package is 220°C/W, TJMAX = 125°C.  
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 kresistor into each pin.  
Note 4: Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality  
Control.  
Note 5: Typical numbers are at 25°C and represent the most likely parametric norm.  
Note 6: Temperature coefficient is measured by the "Box" method; i.e., the maximum ΔVREF is divided by the maximum ΔT.  
Note 7: Long term stability is VREF @25°C measured during 1000 hrs. This measurement is taken for IR = 500 µA.  
Note 8: Thermal hysteresis is defined as the change in +25°C output voltage before and after cycling the device from (-40°C to 125°C) eight times.  
Note 9: Low frequency peak-to-peak noise measured using first-order 0.1 Hz HPF and second-order 10 Hz LPF.  
www.national.com  
4
Typical Performance Characteristics for 2.5V  
Output Voltage vs Temperature  
0.1 - 10 Hz Peak-to-Peak Noise  
30046303  
30046332  
Start Up - 120 µA  
Start Up - 50 mA  
30046305  
30046304  
Reverse Breakdown Voltage Change with Current  
Reverse Dynamic Impedance vs Frequency  
30046314  
30046340  
5
www.national.com  
Typical Performance Characteristics for 4.096V  
Output Voltage vs Temperature  
0.1 - 10 Hz Peak-to-Peak Noise  
30046306  
30046349  
Start Up - 130 µA  
Start Up - 50 mA  
30046308  
30046307  
Reverse Breakdown Voltage Change with Current  
Reverse Dynamic Impedance vs Frequency  
30046312  
30046341  
www.national.com  
6
Typical Performance Characteristics  
Forward Characteristic  
Load Transient Response  
30046313  
30046311  
Minimum Operating Current  
Noise Spectrum  
30046316  
30046317  
Thermal Hysteresis Distribution  
Output Voltage vs Thermal Cycle (-40°C to 125°C)  
30046351  
30046330  
7
www.national.com  
Long Term Stability (TA = 25°C)  
Long Term Stability (TA =125°C)  
30046347  
30046348  
www.national.com  
8
The LM4030 is designed to operate with or without a bypass  
capacitor (COUT in Figure 1) and is stable with capacitors of  
up to 10 μF. The use of a bypass capacitor can improve tran-  
sient response and reduce broadband noise. Additionally, a  
bypass capacitor will counter the rising reverse dynamic  
impedance at higher frequencies improving noise immunity  
(see Figure 3).  
Application Information  
THEORY OF OPERATION  
The LM4030 is an ultra-high precision shunt voltage refer-  
ence, having exceptionally high initial accuracy (0.05%) and  
temperature stability (10ppm/°C). The LM4030 is available  
with fixed voltage options of 2.5V and 4.096V. Despite the tiny  
SOT23 package, the LM4030 exhibits excellent thermal hys-  
teresis (75ppm) and long-term stability (25ppm). The LM4030  
is designed to operate without an external capacitor, but any  
capacitor up to 10 µF may be used. The LM4030 can be pow-  
ered off as little as 120 µA (max) but is capable of shunting  
up to 30 mA continuously. The typical application circuit for  
the LM4030 is shown in Figure 1.  
30046345  
FIGURE 3. Reverse Dynamic Impedance vs COUT  
30046301  
As with other regulators, an external capacitor reduces the  
amplitude of the VREF transient when a sudden change in  
loading takes place. The capacitor should be placed as close  
to the part as possible to reduce the effects of unwanted board  
parasitics.  
FIGURE 1. Typical Application Circuit  
COMPONENT SELECTION  
A resistor must be chosen to set the maximum operating cur-  
rent for the LM4030 (RZ in Figure 1). The value of the resistor  
can be calculated using the following equation:  
THERMAL HYSTERESIS  
Thermal hysteresis is the defined as the change in output  
voltage at 25°C after some deviation from 25°C. This is to say  
that thermal hysteresis is the difference in output voltage be-  
tween two points in a given temperature profile. An illustrative  
temperature profile is shown in Figure 4.  
RZ = (VIN - VREF)/(IMIN_OPERATING + ILOAD_MAX  
)
RZ is chosen such that the total current flowing through RZ is  
greater than the maximum load current plus the minimum op-  
erating current of the reference itself. This ensures that the  
reference is never starved for current. Running the LM4030  
at higher currents is advantageous for reducing noise. The  
reverse dynamic impedance of the VREF node scales inverse-  
ly with the shunted current (see Figure 2) leading to higher  
rejection of noise emanating from the input supply and from  
EMI (electro-magnetic interferrence).  
30046318  
FIGURE 4. Illustrative Temperature Profile  
This may be expressed analytically as the following:  
Where  
VHYS = Thermal hysteresis expressed in ppm  
VREF = Nominal preset output voltage  
VREF1 = VREF before temperature fluctuation  
30046346  
FIGURE 2. Reverse Dynamic Impedance vs IOUT  
9
www.national.com  
VREF2 = VREF after temperature fluctuation.  
shifts in VREF arise due to offsets between matched devices  
within the regulation loop. Both passive and active devices  
naturally experience drift over time and stress and tempera-  
ture gradients across the silicon die also generate offset. The  
LM4030 incorporates a dynamic offset cancellation scheme  
which compensates for offsets developing within the regula-  
tion loop. This gives the LM4030 excellent long-term stability  
(40 ppm typical) and thermal hysteresis performance (75ppm  
typical), as well as substantial immunity to PCB stress effects,  
despite being packaged in a tiny SOT23.  
The LM4030 features a low thermal hysteresis of 75 ppm  
(typical) from -40°C to 125°C after 8 temperature cycles.  
TEMPERATURE COEFFICIENT  
Temperature drift is defined as the maximum deviation in out-  
put voltage over the temperature range. This deviation over  
temperature may be illustrated as shown in Figure 5.  
EXPRESSION OF ELECTRICAL CHARACTERISTICS  
Electrical characteristics are typically expressed in mV, ppm,  
or a percentage of the nominal value. Depending on the ap-  
plication, one expression may be more useful than the other.  
To convert one quantity to the other one may apply the fol-  
lowing:  
ppm to mV error in output voltage:  
30046320  
FIGURE 5. Illustrative VREF vs Temperature Profile  
Where:  
VREF is in volts (V) and VERROR is in milli-volts (mV).  
Bit error (1 bit) to voltage error (mV):  
Temperature coefficient may be expressed analytically as the  
following:  
VREF is in volts (V), VERROR is in milli-volts (mV), and n is the  
number of bits.  
TD = Temperature drift  
VREF = Nominal preset output voltage  
mV to ppm error in output voltage:  
VREF_MIN  
temperature range  
VREF_MAX Maximum output voltage over operating  
=
Minimum output voltage over operating  
=
temperature range  
ΔT = Operating temperature range.  
The LM4030 features a low temperature drift of 10ppm (max)  
Where:  
VREF is in volts (V) and VERROR is in milli-volts (mV).  
Voltage error (mV) to percentage error (percent):  
to 30ppm (max), depending on the grade.  
DYNAMIC OFFSET CANCELLATION AND LONG TERM  
STABILITY  
Aside from initial accuracy and drift performance, other spec-  
ifications such as thermal hysteresis and long-term stability  
can affect the accuracy of a voltage reference, especially over  
the lifetime of the application. The reference voltage can also  
shift due to board stress once the part is mounted onto the  
PCB and during subsequent thermal cycles. Generally, these  
Where:  
VREF is in volts (V) and VERROR is in milli-volts (mV).  
www.national.com  
10  
PRINTED CIRCUIT BOARD and LAYOUT  
CONSIDERATIONS  
voltage drop proportional to load current and should be min-  
imized. The LM4030 should be placed as close to the load it  
is driving as the layout will allow. The location of RZ is not  
important, but COUT should be as close to the LM4030 as  
possible so added ESR does not degrade the transient per-  
formance.  
The LM4030 has a very small change in reverse voltage with  
current (25ppm/mA typical) so large variations in load current  
(up to 50mA) should not appreciably shift VREF. Parasitic re-  
sistance between the LM4030 and the load introduces a  
11  
www.national.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
SOT23-5 Package  
NS Package Number MF05A  
www.national.com  
12  
Notes  
13  
www.national.com  
Notes  
For more National Semiconductor product information and proven design tools, visit the following Web sites at:  
Products  
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Design Support  
Amplifiers  
WEBENCH  
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Audio  
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Analog University  
App Notes  
Clock Conditioners  
Data Converters  
Displays  
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www.national.com/quality/green  
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Distributors  
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www.national.com/interface  
www.national.com/lvds  
Green Compliance  
Packaging  
Ethernet  
Interface  
Quality and Reliability www.national.com/quality  
LVDS  
Reference Designs  
Feedback  
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Power Management  
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LDOs  
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Temperature Sensors  
Wireless (PLL/VCO)  
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