LM4755T [NSC]
Stereo 11W Audio Power Amplifier with Mute; 立体声11W音频功率放大器静音型号: | LM4755T |
厂家: | National Semiconductor |
描述: | Stereo 11W Audio Power Amplifier with Mute |
文件: | 总18页 (文件大小:717K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
February 1999
LM4755
Stereo 11W Audio Power Amplifier with Mute
@
n PO at 10% THD 1 kHz into 8Ω bridged TO-263 pkg.
General Description
=
at VCC 12V 5W(typ)
The LM4755 is a stereo audio amplifier capable of delivering
11W per channel of continuous average output power to a
4Ω load or 7W per channel into 8Ω using a single 24V supply
at 10% THD+N. The internal mute circuit and pre-set gain re-
sistors provide for a very economical design solution.
Features
n Drives 4Ω and 8Ω loads
n Integrated mute function
n Internal Gain Resistors
n Minimal external components needed
n Single supply operation
n Internal current limiting and thermal protection
n Compact 9-lead TO-220 package
Output power specifications at both 20V and 24V supplies
and low external component count offer high value to con-
sumer electronic manufacturers for stereo TV and compact
stereo applications. The LM4755 is specifically designed for
single supply operation.
Key Specifications
Applications
n Stereos TVs
n Compact stereos
n Mini component stereos
n Output power at 10% THD with 1 kHz into 4Ω at VCC
24V 11W(typ)
=
=
n Output power at 10% THD with 1 kHz into 8Ω at VCC
24V 7W(typ)
n Closed loop gain 34 dB(typ)
@
n PO at 10% THD 1 kHz into 4Ω single-ended TO-263
=
pkg. at VCC 12V 2.5W(typ)
Typical Application
Connection Diagrams
Plastic Package
DS100059-2
Package Description
Top View
Order Number LM4755T
Package Number TA09A
DS100059-36
Top View
DS100059-1
Order Number LM4755TS
Package Number TS9A
FIGURE 1. Typical Audio Amplifier Application Circuit
© 1999 National Semiconductor Corporation
DS100059
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Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
T Package (10 seconds)
Storage Temperature
250˚C
−40˚C to 150˚C
Operating Ratings
Supply Voltage
40V
Temperature Range
TMIN ≤ TA ≤ TMAX
Supply Voltage
θJC
±
Input Voltage
0.7V
−40˚C ≤ TA ≤ +85˚C
9V to 32V
2˚C/W
Output Current
Internally Limited
62.5W
Power Dissipation (Note 3)
ESD Susceptability (Note 4)
Junction Temperature
Soldering Information
2 kV
θJA
76˚C/W
150˚C
Electrical Characteristics
The following specifications apply to each channel with VCC = 24V, TA = 25˚C unless otherwise specified.
LM4755
Units
(Limits)
Symbol
ITOTAL
Parameter
Conditions
Typical
(Note 5)
Limit
Total Quiescent Power
Supply Current
Mute Off
Mute On
10
15
7
mA(max)
mA(min)
mA
7
7
PO
Output Power (Continuous
Average per Channel)
f = 1 kHz, THD+N = 10%, RL = 8Ω
f = 1 kHz, THD+N = 10%, RL = 4Ω
VS = 20V, RL = 8Ω
W
11
4
10
W(min)
W
VS = 20V, RL = 4Ω
7
W
f = 1 kHz, THD+N = 10%, RL = 4Ω
VS = 12V, TO-263 Pkg.
2.5
W
THD
Total Harmonic Distortion
Output Swing
f = 1 kHz, PO = 1 W/ch, RL = 8Ω
PO = 10W, RL = 8Ω
PO = 10W, RL = 4Ω
See Apps. Circuit
0.08
15
%
V
VOSW
14
V
XTALK
PSRR
VODV
Channel Separation
55
dB
f = 1 kHz, VO = 4 Vrms
See Apps. Circuit
Power Supply Rejection Ratio
50
dB
f = 120 Hz, VO = 1 mVrms
VIN = 0V
Differential DC Output Offset
Voltage
0.09
0.4
V(max)
SR
Slew Rate
2
V/µs
kΩ
RIN
Input Impedance
Power Bandwidth
83
65
34
PBW
AVCL
3 dB BW at PO = 2.5W, RL = 8Ω
RL = 8Ω
kHz
Closed Loop Gain
(Internally Set)
33
35
dB(min)
dB(max)
mVrms
eIN
Noise
IHF-A Weighting Filter, RL = 8Ω
0.2
Output Referred
IO
Output Short Circuit Limit
Mute Low Input Voltage
VIN = 0.5V, RL = 2Ω
2
A(min)
V(max)
Mute Pin
VIL
Not in Mute Mode
0.8
VIH
AM
Mute High Input Voltage
Mute Attenuation
In Mute Mode
VMUTE = 5.0V
2.0
80
2.5
V(min)
dB
Note 1: All voltages are measured with respect to the GND pin (5), unless otherwse specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-
tional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guar-
antee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is
given, however, the typical value is a good indication of device performance.
Note 3: For operating at case temperatures above 25˚C, the device must be derated based on a 150˚C maximum junction temperature and a thermal resistance of
θ
= 2˚C/W (junction to case). Refer to the section Determining the Maximum Power Dissipation in the Application Information section for more information.
JC
Note 4: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
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2
Electrical Characteristics (Continued)
Note 5: Typicals are measured at 25˚C and represent the parametric norm.
Note 6: Limits are guaranteed that all parts are tested in production to meet the stated values.
>
Note 7: The TO-263 Package is not recommended for V
16V due to impractical heatsinking limitations.
S
Equivalent Schematic
3
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Test Circuit
DS100059-4
FIGURE 2. Test Circuit
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4
System Application Circuit
DS100059-5
FIGURE 3. Circuit for External Components Description
External Components Description
Components
Function Description
Provides power supply filtering and bypassing.
1, 2
3, 4
5, 6
7
CS
RSN
CSN
Cb
Works with CSN to stabilize the output stage from high frequency oscillations.
Works with RSN to stabilize the output stage from high frequency oscillations.
Provides filtering for the internally generated half-supply bias generator.
8, 9
Ci
Input AC coupling capacitor which blocks DC voltage at the amplifier’s input terminals. Also creates a
high pass filter with fc=1/(2 • π • Rin • Cin).
10, 11
Co
Output AC coupling capacitor which blocks DC voltage at the amplifier’s output terminal. Creates a high
pass filter with fc=1/(2 • π • Rout • Cout).
12, 13
14
Ri
Voltage control - limits the voltage level allowed to the amplifier’s input terminals.
Works with Cm to provide mute function timing.
Rm
Cm
15
Works with Rm to provide mute function timing.
5
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Typical Performance Characteristics(Note 5)
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
DS100059-12
DS100059-6
DS100059-15
DS100059-9
DS100059-13
DS100059-7
DS100059-16
DS100059-10
DS100059-14
DS100059-8
DS100059-17
DS100059-11
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6
Typical Performance Characteristics(Note 5) (Continued)
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
DS100059-38
DS100059-41
DS100059-44
DS100059-47
DS100059-39
DS100059-42
DS100059-45
DS100059-48
DS100059-40
DS100059-43
DS100059-46
DS100059-49
7
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Typical Performance Characteristics(Note 5) (Continued)
Output Power vs Supply Voltage
Output Power vs Supply Voltage
Frequency Response
DS100059-18
DS100059-19
DS100059-20
THD+N vs Frequency
THD+N vs Frequency
Frequency Response
DS100059-21
DS100059-22
DS100059-23
Channel Separation
PSRR vs Frequency
Supply Current vs Supply Voltage
DS100059-26
DS100059-24
DS100059-25
Power Derating Curve
Power Dissipation vs Output Power
Power Dissipation vs Output Power
DS100059-27
DS100059-28
DS100059-29
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Typical Performance Characteristics(Note 5) (Continued)
Power Dissipation vs Output Power
Power Dissipation vs Output Power
DS100059-60
DS100059-61
earlier in the External Components section these capaci-
Application Information
tors create high-pass filters with their corresponding input/
output impedances. The Typical Application Circuit shown
in Figure 1 shows input and output capacitors of 0.1 µF and
1,000 µF respectively. At the input, with an 83 kΩ typical in-
put resistance, the result is a high pass 3 dB point occurring
at 19 Hz. There is another high pass filter at 39.8 Hz created
with the output load resistance of 4Ω. Careful selection of
these components is necessary to ensure that the desired
frequency response is obtained. The Frequency Response
curves in the Typical Performance Characteristics section
show how different output coupling capacitors affect the low
frequency roll-off.
The LM4755 contains circuitry to pull down the bias line in-
ternally, effectively shutting down the input stage. An exter-
nal R-C should be used to adjust the timing of the pull-down.
If the bias line is pulled down too quickly, currents induced in
the internal bias resistors will cause a momentary DC volt-
age to appear across the inputs of each amplifier’s internal
differential pair, resulting in an output DC shift towards Vsup-
ply. An R-C timing circuit should be used to limit the pull-
down time such that output “pops” and signal feedthroughs
will be minimized. The pull-down timing is a function of a
number of factors, including the internal mute circuitry, the
voltage used to activate the mute, the bias capacitor, the
half-supply voltage, and internal resistances used in the half-
supply generator. Table 1 shows a list of recommended val-
ues for the external R-C.
OPERATING IN BRIDGE-MODE
Though designed for use as a single-ended amplifier, the
LM4755 can be used to drive a load differentially (bridge-
mode). Due to the low pin count of the package, only the
non-inverting inputs are available. An inverted signal must
be provided to one of the inputs. This can easily be done with
the use of an inexpensive op-amp configured as a standard
inverting amplifier. An LF353 is a good low-cost choice. Care
must be taken, however, for a bridge-mode amplifier must
theoretically dissipate four times the power of a single-ended
type. The load seen by each amplifier is effectively half that
of the actual load being used, thus an amplifier designed to
drive a 4Ω load in single-ended mode should drive an 8Ω
load when operating in bridge-mode.
TABLE 1. Recommended Values for Mute Circuit
VMUTE
5V
VCC
12V
15V
20V
24V
28V
30V
Rm
Cm
18 kΩ
18 kΩ
12 kΩ
12 kΩ
8.2 kΩ
8.2 kΩ
10 µF
10 µF
10 µF
10 µF
10 µF
10 µF
5V
5V
5V
5V
5V
CAPACITOR SELECTION AND FREQUENCY
RESPONSE
With the LM4755, as in all single supply amplifiers, AC cou-
pling capacitors are used to isolate the DC voltage present at
the inputs (pins 3, 7) and outputs (pins 1, 8). As mentioned
9
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Application Information (Continued)
DS100059-30
FIGURE 4. Bridge-Mode Application
DS100059-31
DS100059-37
FIGURE 5. THD+N vs POUT for Bridge-Mode Application
PREVENTING OSCILLATIONS
require an external signal, the inputs should be terminated to
ground with a resistance of 50 kΩ or less on the AC side of
the input coupling capacitors.
With the integration of the feedback and bias resistors on-
chip, the LM4755 fits into a very compact package. However,
due to the close proximity of the non-inverting input pins to
the corresponding output pins, the inputs should be AC ter-
minated at all times. If the inputs are left floating, the ampli-
fier will have a positive feedback path through high imped-
ance coupling, resulting in a high frequency oscillation. In
most applications, this termination is typically provided by
the previous stage’s source impedance. If the application will
UNDERVOLTAGE SHUTDOWN
If the power supply voltage drops below the minimum oper-
ating supply voltage, the internal under-voltage detection cir-
cuitry pulls down the half-supply bias line, shutting down the
preamp section of the LM4755. Due to the wide operating
supply range of the LM4755, the threshold is set to just un-
der 9V. There may be certain applications where a higher
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10
PDMAX = maximum power dissipation of the IC
TJ(˚C) = junction temperature of the IC
Application Information (Continued)
threshold voltage is desired. One example is a design requir-
ing a high operating supply voltage, with large supply and
bias capacitors, and there is little or no other circuitry con-
nected to the main power supply rail. In this circuit, when the
power is disconnected, the supply and bias capacitors will
discharge at a slower rate, possibly resulting in audible out-
put distortion as the decaying voltage begins to clip the out-
put signal. An external circuit may be used to sense for the
desired threshold, and pull the bias line (pin 6) to ground to
disable the input preamp. Figure 6 shows an example of
such a circuit. When the voltage across the zener diode
drops below its threshold, current flow into the base of Q1 is
interrupted. Q2 then turns on, discharging the bias capacitor.
This discharge rate is governed by several factors, including
the bias capacitor value, the bias voltage, and the resistor at
the emitter of Q2. An equation for approximating the value of
the emitter discharge resistor, R, is given below:
TA(˚C) = ambient temperature
θJC(˚C/W) = junction-to-case thermal resistance of the IC
θCS(˚C/W) = case-to-heatsink thermal resistance (typically
0.2 to 0.5 ˚C/W)
θSA(˚C/W) = thermal resistance of heatsink
When determining the proper heatsink, the above equation
should be re-written as:
θSA ≤ [(TJ–TA) / PDMAX] - θJC–θCS
TO-263 HEATSINKING
Surface mount applications will be limited by the thermal dis-
sipation properties of printed circuit board area. The TO-263
package is not recommended for surface mount applications
>
with VS
16V due to limited printed circuit board area.
There are TO-263 package enhancements, such as clip-on
heatsinks and heatsinks with adhesives, that can be used to
improve performance.
R = (0.7v) / (Cb • (VCC/2) / 0.1s)
Note that this is only a linearized approximation based on a
discharge time of 0.1s. The circuit should be evaluated and
adjusted for each application.
Standard FR-4 single-sided copper clad will have an ap-
proximate Thermal resistance (θSA) ranging from:
As mentioned earlier in the Built-in Mute Circuit section,
when using an external circuit to pull down the bias line, the
rate of discharge will have an effect on the turn-off induced
distortions. Please refer to the Built-in Mute Circuit section
for more information.
1.5 x 1.5 in. sq.
2 x 2 in. sq.
20–27˚C/W (TA=28˚C, Sine wave
testing, 1 oz. Copper)
16–23˚C/W
The above values for θSA vary widely due to dimensional
proportions (i.e. variations in width and length will vary θSA).
For audio applications, where peak power levels are short in
duration, this part will perform satisfactory with less
heatsinking/copper clad area. As with any high power design
proper bench testing should be undertaken to assure the de-
sign can dissipate the required power. Proper bench testing
requires attention to worst case ambient temperature and air
flow. At high power dissipation levels the part will show a ten-
dency to increase saturation voltages, thus limiting the un-
distorted power levels.
DETERMINING MAXIMUM POWER DISSIPATION
For a single-ended class AB power amplifier, the theoretical
maximum power dissipation point is a function of the supply
voltage, VS, and the load resistance, RL and is given by the
following equation:
(single channel)
PDMAX (W) = [VS / (2 • π2 • RL)]
2
DS100059-32
The above equation is for a single channel class-AB power
amplifier. For dual amplifiers such as the LM4755, the equa-
tion for calculating the total maximum power dissipated is:
FIGURE 6. External Undervoltage Pull-Down
(dual channel)
PDMAX (W) = 2 • [VS / (2 • π2 • RL)]
THERMAL CONSIDERATIONS
Heat Sinking
2
or
Proper heatsinking is necessary to ensure that the amplifier
will function correctly under all operating conditions. A heat-
sink that is too small will cause the die to heat excessively
and will result in a degraded output signal as the thermal pro-
tection circuitry begins to operate.
VS / (π2 • RL)
2
(Bridged Outputs)
PDMAX (W) = 4[VS / (2π2 • RL)]
2
HEATSINK DESIGN EXAMPLE:
The choice of a heatsink for a given application is dictated by
several factors: the maximum power the IC needs to dissi-
pate, the worst-case ambient temperature of the circuit, the
junction-to-case thermal resistance, and the maximum junc-
tion temperature of the IC. The heat flow approximation
equation used in determining the correct heatsink maximum
thermal resistance is given below:
Determine the system parameters:
VS = 24V
RL = 4Ω
Operating Supply Voltage
Minimum Load Impedance
Worst Case Ambient Temperature
TA = 55˚C
Device parameters from the datasheet:
TJ–TA = PDMAX • (θJC + θCS + θSA
)
TJ = 150˚C Maximum Junction Temperature
where:
11
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PDMAX ≈ 3.7W
Application Information (Continued)
Calculating PDMAX
:
2
θJC = 2˚C/W
Junction-to-Case Thermal Resistance
2
2
2
=
=
=
PDMAX VCC /(π RL) (12V) /(π (4Ω)) 3.65W
Calculating Heatsink Thermal Resistance:
Calculations:
<
θSA [(TJ − TA) / PDMAX] − θJC − θCS
2 • PDMAX = 2 • [VS / 2 • π2 • RL)] = (24V)2 / (2 • π2 • 4Ω)
= 14.6W
2
=
<
θSA 100˚C/3.7W − 2.0˚C/W − 0.2˚C/W 24.8˚C/W
Therefore the recommendation is to use 2.0 x 2.0 square
inch of single-sided copper clad.
θ
SA ≤ [(TJ-TA) / PDMAX] - θJC–θCS = [ (150˚C - 55˚C) / 14.6W]
- 2˚C/W–0.2˚C/W = 4.3˚C/W
Example 3: (Bridged Output)
Conclusion: Choose a heatsink with θSA ≤ 4.3˚C/W.
=
TA 50˚C
Given:
=
TJ 150˚C
TO-263 HEATSINK DESIGN EXAMPLES:
=
RL 8Ω
Example 1: (Stereo Single-Ended Output)
=
VS 12V
=
TA 30˚C
Given:
=
θJC 2˚C/W
=
TJ 150˚C
Calculating PDMAX
:
=
RL 4Ω
2
2
2
2
=
=
=
PDMAX 4[VCC /(2π RL)] 4(12V) /(2π (8Ω)) 3.65W
=
VS 12V
Calculating Heatsink Thermal Resistance:
=
θJC 2˚C/W
PDMAX from PD vs PO Graph:
PDMAX ≈ 3.7W
<
θSA [(TJ − TA) / PDMAX] − θJC − θCS
=
<
θSA 100˚C / 3.7W − 2.0˚C/W − 0.2˚C/W 24.8˚C/W
Therefore the recommendation is to use 2.0 x 2.0 square
inch of single-sided copper clad.
Calculating PDMAX
:
2
2
2
2
=
=
=
PDMAX VCC /(π RL) (12V) /π (4Ω)) 3.65W
Calculating Heatsink Thermal Resistance:
LAYOUT AND GROUND RETURNS
<
θSA TJ − TA / PDMAX − θJC − θCS
Proper PC board layout is essential for good circuit perfor-
mance. When laying out a PC board for an audio power am-
plifier, particular attention must be paid to the routing of the
output signal ground returns relative to the input signal and
bias capacitor grounds. To prevent any ground loops, the
ground returns for the output signals should be routed sepa-
rately and brought together at the supply ground. The input
signal grounds and the bias capacitor ground line should
also be routed separately. The 0.1 µF high frequency supply
bypass capacitor should be placed as close as possible to
the IC.
=
<
θSA 120˚C/3.7W − 2.0˚C/W − 0.2˚C/W 30.2˚C/W
Therefore the recommendation is to use 1.5 x 1.5 square
inch of single-sided copper clad.
Example 2: (Stereo Single-Ended Output)
=
TA 50˚C
Given:
=
TJ 150˚C
=
RL 4Ω
=
VS 12V
=
θJC 2˚C/W
PDMAX from PD vs PO Graph:
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Application Information (Continued)
PC BOARD LAYOUT-COMPOSITE
DS100059-33
13
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Application Information (Continued)
PC BOARD LAYOUT-SILK SCREEN
DS100059-34
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Application Information (Continued)
PC BOARD LAYOUT-SOLDER SIDE
DS100059-35
15
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16
Physical Dimensions inches (millimeters) unless otherwise noted
Order Number LM4755T
NS Package Number TA9A
17
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Order Number LM4755TS
NS Package Number TS9A
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with instructions for use provided in the labeling, can
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to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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相关型号:
LM4755TS/NOPB
IC 11 W, 2 CHANNEL, AUDIO AMPLIFIER, PSSO9, LEAD FREE, TO-263, 9 PIN, Audio/Video Amplifier
NSC
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