LM4830 [NSC]
Two-Way Audio Amplification System with Volume Control; 双向音频放大系统的音量控制
| 型号： | LM4830 |
| 厂家： | 
National Semiconductor |
| 描述： | Two-Way Audio Amplification System with Volume Control |
| 文件： | 总14页 (文件大小：461K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
January 1999
LM4830
Two-Way Audio Amplification System
with Volume Control
General Description
Key Specifications
n THD at 1W cont. avg PO into 8Ω: 1% (max)
The LM4830 is an integrated solution for two-way audio am-
plification. It contains a bridge-connected audio power ampli-
fier capable of delivering 1W of continuous average power to
an 8Ω load with less than 1% THD from a 5V power supply.
n Instantaneous peak output power: 1.4W
n Shutdown current: 0.5 µA (typ)
n Supply voltage range: 2.7V ≤ V
≤ 5.5V
DD
It also has the capability of driving 100 mW into
a
single-ended 32Ω impedance for headset operation. There
is a 30 dB attenuator in front of a bridged power amplifier
with 6 dB of gain. The attenuation is controlled through 4 bits
of parallel digital control; 15 steps of 2 dB each.
Features
n 4-bit digital control for 30 dB of volume attenuation
n Two selectable microphone inputs
n High performance microphone preamp
n Extra buffer for driving long cables
n No bootstrap capacitors or snubber circuits are
necessary
The device also contains a microphone preamp with two se-
lectable inputs. Mic2 is selected when HS is high and A1 is in
single-ended mode. Mic1 is selected when HS is low and A1
is in bridged mode. This configuration is optimum for switch-
ing between an internal system speaker and external head-
set with microphone. The device also incorporates a buffer
used for driving capacitive loads.
n Small Outline (SO) packaging
n Thermal shutdown protection circuitry
The LM4830 also provides a low-current consumption shut-
down mode making it optimally suited for low-power portable
systems. In addition, the device has an internal thermal shut-
down protection mechanism.
Applications
n Hands-free phone systems
n Mobile phone accessories
n Desktop conference phones
n Portable computers
n Teleconference computer applications
Connection Diagram
Dual-In-Line and
Small Outline Packages
DS012677-2
Top View
Order Number LM4830M
See NS Package Number M24B for SO
Order Number LM4830N
See NS Package Number N24A for DIP
© 1999 National Semiconductor Corporation
DS012677
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Typical Application
DS012677-1
FIGURE 1. Typical Application Circuit
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2
Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Infrared (15 sec.)
220˚C
See AN-450 “Surface Mounting and their Effects on
Product Reliability” for other methods of soldering surface
mount devices.
Supply Voltage
6.0V
−65˚C to +150˚C
−0.3V to VDD + 0.3V
Internally Limited
2000V
Operating Ratings
Temperature Range
Storage Temperature
Input Voltage
TMIN ≤ TA ≤ TMAX
Supply Voltage
−40˚C ≤ TA ≤ 85˚C
2.7V ≤ VDD ≤ 5.5V
32˚C/W
Power Dissipation (Note 3)
ESD Susceptibility (Note 4)
ESD Susceptibility (Note 5)
Junction Temperature
Soldering Information
Small Outline Package
Vapor Phase (60 sec.)
θJC (typ) — M24B
θJA (typ) — M24B
θJC (typ) — N24A
θJA (typ) — N24A
250V
79˚C/W
150˚C
21˚C/W
61˚C/W
215˚C
Electrical Characteristics (Notes 1, 2)
=
=
The following specifications apply for VDD 5V, unless otherwise specified. Limits apply for TA 25˚C.
Symbol Parameter Conditions LM4830
Units
(Limits)
Typical
Limit
(Note 6)
(Note 7)
POWER AMPLIFIER, A1
=
=
= ∞
IDD
Quiescent Power Supply Current
VO 0V, IO 0A, RL
5.8
mA (min)
mA (max)
mA
11.0
11.4
7.9
20.0
=
Bridged RL 8Ω
=
=
HS 5V, SD 0V, VO1 On Only
mA
=
=
ISD
VOS
eIN
Shutdown Current
Output Offset Voltage
Input Noise
HS 5V, SD 5V, IC Off
0.5
2.0
µA (max)
mV (max)
=
VIN 0V
0.7
50.0
=
IHF-A Weighting Filter, RS 25Ω
=
Bridged Output, VO1–VO2, RL 8Ω
30
16
µV
µV
=
Single-Ended Output, VO1, RL 32Ω
=
=
=
PO
Output Power, Bridged
THD 1% (max); f 1 kHz, RL 8Ω
1.15
1.4
2
1.0
W (min)
W
=
=
=
THD+N 10%; f 1 kHz, RL 8Ω
=
=
=
THD+N 10%; f 1 kHz, RL 4Ω
W
=
@
1 kHz, Attenuation 0 dB
THD
Total Harmonic Distortion
f
=
=
PO 1.5W, RL 4Ω
0.2
0.2
%
%
=
=
PO 1W, RL 8Ω
=
=
VO1 On Only, VO 60 mV, RL 32Ω
0.06
%
±
±
±
Attenuation Step Size Error
Absolute Attenuation
0 dB to −30 dB
0.5
0.5
1.0
dB
dB
dB
kΩ
@
Attenuation 0 dB
@
Attenuation −30 dB
RIN
Power Amp Input Resistance
40
DIGITAL INPUTS
VIH
VIL
High Input Voltage
Low Input Voltage
CMOS Compatible Only
CMOS Compatible Only
4.5
0.5
V
V
PREAMP, A2
RIN
Mic1 and Mic2 Input Resistance
21.5
2.0
kΩ
mV
=
VOS
eIN
Output Offset Voltage
Input Noise
VIN 0V
=
IHF-A Weighting Filter, RS 25Ω
1.3
10.0
µV (max)
%
=
=
=
THD
Total Harmonic Distortion
AVCL 100, VIN 10 mVrms, f 1 kHz
0.06
0.02
=
=
=
=
AVCL −1, PO 50 mW, f 1 kHz, RL
32Ω
(Refer to Figure 2 )
3
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Electrical Characteristics (Notes 1, 2) (Continued)
=
=
The following specifications apply for VDD 5V, unless otherwise specified. Limits apply for TA 25˚C.
Symbol
Parameter
Conditions
LM4830
Units
(Limits)
Typical
Limit
(Note 6)
(Note 7)
PREAMP, A2
=
=
Xtalk
Crosstalk
AVCL 100, Power Amp: PO 1W,
−72
60
dB
dB
=
=
8Ω, f 1 kHz
R
L
= =
VDDAC 0.5 VPP, f 1 kHz
PSRR
Power Supply Rejection Ratio
MICROPHONE BUFFER, A3
RIN
Buffer Input Resistance
Output Offset Voltage
Input Noise
17
2.0
5.8
0.5
−76
kΩ
mV
µV
%
=
VOS
eIN
VIN 0V
=
IHF-A Weighting Filter, RS 25Ω
= = =
PO 50 mW, f 1 kHz, RL 32Ω
THD
Xtalk
Total Harmonic Distortion
Crosstalk
=
=
=
Power Amp: PO 1W, RL 8Ω, f 1 kHz
dB
Note 1: All voltages are measured with respect to the ground pins (Pins 2, 15, and 24), unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-
tional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guar-
antee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is
given, however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
, θ , and the ambient temperature, T . The maximum
JA
A
=
=
allowable power dissipation is P
(T
− T )/θ or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4830M, T
JA JMAX
DMAX
JMAX
A
+150˚C, and the typical junction-to-ambient thermal resistance, when board mounted, is 79˚C/W.
Note 4: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 5: Machine model, 200 pF–240 pF discharged through all pins.
Note 6: Typicals are measured at 25˚C and represent the parametric norm.
Note 7: Limits are guarantees that all parts are tested in production to meet the stated values.
Timing Diagram
DS012677-3
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Computer Application Circuit
DS012677-4
FIGURE 2.
5
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Typical Performance Characteristics (Power Amp-Bridged)
Output Power vs
Supply Voltage
Wideband Noise Floor
Frequency Response
vs Attenuation Level
DS012677-6
DS012677-5
DS012677-7
Output Power vs
Supply Voltage
Output Power vs
Supply Voltage
Output Power vs
Supply Voltage
DS012677-8
DS012677-9
DS012677-10
THD + N vs Output Power
THD + N vs Output Power
THD + N vs Output Power
DS012677-11
DS012677-12
DS012677-13
THD + N vs Output Power
THD + N vs Output Power
THD + N vs Output Power
DS012677-14
DS012677-15
DS012677-16
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Typical Performance Characteristics (Power Amp-Bridged) (Continued)
THD + N vs Output Power
THD + N vs Output Power
THD + N vs Output Power
THD + N vs Output Power
THD + N vs Output Power
THD + N vs Output Power
THD + N vs Frequency
THD + N vs Output Power
THD + N vs Output Power
THD + N vs Frequency
DS012677-17
DS012677-20
DS012677-23
DS012677-26
DS012677-18
DS012677-21
DS012677-24
DS012677-27
DS012677-19
DS012677-22
DS012677-25
DS012677-28
THD + N vs Output Power
THD + N vs Output Power
7
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Typical Performance Characteristics (Power Amp-Bridged) (Continued)
THD + N vs Output Power
Power Amp Crosstalk
to Preamp and Buffer
Power Amp Crosstalk
to Preamp
DS012677-29
DS012677-30
DS012677-31
Wideband Noise Floor
Wideband Noise Floor
Buffer
Frequency Response
DS012677-32
DS012677-33
DS012677-34
Output Attenuation
in Shutdown Mode
Power Dissipation vs
Output Power
Power Derating Curve
DS012677-37
DS012677-36
DS012677-35
Supply Current vs
Supply Voltage
Supply Current vs
Temperature
Power Supply
Rejection Ratio
DS012677-38
DS012677-39
DS012677-40
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8
Even with the large internal power dissipation created by the
bridged amplifier, the LM4830 does not require heatsinking
over a large range of ambient temperatures. Using Equation
2, assuming a 5V power supply and a 8Ω load, the maximum
power dissipation point is 633 mW.
Application Information
POWER AMPLIFIER HANDSFREE MODE
As shown in Figure 1, amplifier A1 can be used in one of two
modes, bridged output or single-ended output. This IC was
intended to be used in systems requiring both internal
speaker drive and external mono-headphone drive capabil-
ity. Headphones generally have a much higher impedance
than that of speakers since headphones don’t require as
much output power. This also allows headphones to be
driven single-endedly. Shown in Figure 1, the output can be
automatically switched from bridged speaker drive to
single-ended headphone drive using a control pin in the
headphone jack that is tied to the Headset (HS) pin, pin 3.
When the voltage at the HS pin input changes from 0V to 5V,
VO2 of the bridged amplifier output is put into high imped-
ance. This allows the permanently connected internal
speaker of the system to be disabled when a headphone is
plugged into the headphone jack. Output VO1 then drives the
headphone single-endedly through the output coupling cap,
CC. CC should be chosen to allow the full audio bandwidth to
=
PDMAX (TJMAX − TA)/θJA
(3)
=
For the LM4830 surface mount package, θJA 79˚C/W and
=
TJMAX 150˚C. Depending on the ambient temperature, TA,
of the system surroundings, Equation 3 can be used to find
the maximum internal power dissipation supported by the IC
packaging. If the result of Equation 2 is greater than that of
Equation 3, then either the supply voltage must be de-
creased, the load impedance increased, or the ambient tem-
perature reduced. For the typical application of a 5V power
supply, with a bridged 8Ω load, the maximum ambient tem-
perature possible without violating the maximum junction
temperature is approximately 100˚C provided that device op-
eration is around the maximum power dissipation point. The
average power dissipation caused by typical music material
played at a reasonable level is generally lower than the
maximum power dissipation point. Refer to the Typical Per-
formance Characteristics curves for power dissipation in-
formation for lower output powers.
be amplified. Since CC and R create a high-pass filter, CC
L
must be big enough to allow frequencies down to 20 Hz to be
amplified. The following equation should be used for proper
component selection.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is criti-
cal for low noise performance and high power supply rejec-
tion. The capacitor location on both the half-supply bypass
and power supply pins should be as close to the device as
possible. The effect of a larger half-supply bypass capacitor
is improved low frequency PSRR due to increased
half-supply stability. Typical applications employ a 5V regula-
tor with 10 µF and a 0.1 µF bypass capacitors which aid in
supply stability, but do not eliminate the need for bypassing
the supply nodes of the LM4830. The selection of bypass ca-
pacitors, especially Cb, is thus dependent upon desired low
frequency PSRR, system cost, and size constraints.
=
CC 1/(2π(20 Hz)(R L)) where 16Ω ≤ RL ≤ 600Ω (1)
As usual, the output drive limitations are the maximum sup-
ply voltage swing, current drive capability, and power dissi-
pation. In bridged-output drive mode, the power amplifier will
drive 4Ω or 8Ω with normal music signals over time. How-
ever, trying to put a sinewave through the amplifier at the
worst case power dissipation point could cause the amplifier
to go into thermal shutdown.
In single-ended drive mode, the amplifier is intended to drive
32Ω headphones. It will drive lower impedances with the
limitations of voltage swing and current drive capability. The
result of driving lower impedance loads single-endedly is
lower achievable output power.
GROUNDING
In order to achieve the best possible performance, there are
certain grounding techniques that should be followed. All in-
put reference grounds should be tied with their respective
source grounds and brought back to the power supply
ground separately from the output load ground returns.
Those input grounds should also be tied in with the
half-supply bypass ground, pin 16. As an example, the AC in-
put ground reference for the power amplifier, A1, is VIN+, pin
7. This ground should be tied as close as possible to the By-
pass ground (pin 16), as shown in Figure 1. In order to tie in
the signal source ground, the audio jack ground on VIN−
should also be tied to the Bypass ground.
Headset and Shutdown Pin Table
HS Pin
Low
SD Pin
Low
IC Operation
All Outputs On
1/2 A1 On
Microphone
MIC1 On
High
Low
MIC2 On
(VO1 On Only)
Whole IC Off
X
High
NA
X — “Don’t Care” NA — Not Applicable
POWER DISSIPATION
As stated above, the ground returns for the output loads
should be brought back to the supply ground individually.
This will keep large signal currents on those ground lines
from interfering with the stable AC input ground references.
Power dissipation is a major concern when using any power
amplifier and must be thoroughly understood to ensure a
successful design. Equation 2 states the maximum power
dissipation point for a bridged amplifier operating at a given
supply voltage and driving a specified output load.
In addition, the signal ground reference for the preamp, A2,
(the ground end of capacitor CI) should be tied together with
the mic inputs’ signal ground reference from the microphone.
=
PDMAX 4(VDD
)
2/(2π2 RL)
(2)
Although the LM4830 has three amplifiers in the package,
the bridged amplifier produces the majority of the power dis-
sipation because it supplies the largest amount of output
power. If each of the amplifiers in the LM4830 were of the
same power level, each of their power dissipations would
need to be taken into account. However, this is not the case
and the bridged power amplifier is the only major power dis-
sipation contributor.
LAYOUT ISSUES
As stated in the Grounding section, placement of ground re-
turn lines is imperative in maintaining the highest level of
system performance. It is not only important to route the cor-
rect ground return lines together, but also equally important
to be aware of where those ground return lines are routed in
conjunction with each other. As an example, the output load
9
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SELECTION OF EXTERNAL CAPACITORS
Application Information (Continued)
The IC’s low frequency power supply rejection can be im-
proved by using a larger bypass capacitor, Cb. By increasing
this capacitor value, the THD performance at low frequen-
cies will also be improved. For cost sensitive designs, 0.1 µF
is recommended, however, for best performance at least 1
µF should be used.
ground return lines should not be tied together with AC input
reference ground return lines. In addition, the layout of these
ground lines should be physically located as far as reason-
ably possible from each other so that large signal coupling
cannot occur. To further exemplify this point, the outputs and
output load returns for the power amplifier, which have volts
of signal on them, should be physically isolated from the sen-
sitive inputs and AC input ground returns associated with the
preamp. It is easy for large signals to couple into the sensi-
tive low voltage microphone preamp inputs.
The selection of the microphone input coupling capacitors
should be based on desired low frequency coupling. Since
the input resistance for those inputs is around 20 kΩ, the
coupling cap should be 0.47 µF for 17 Hz coupling or 0.047
µF for 170 Hz coupling.
Similarly, the selection of the power amplifier input coupling
capacitors should be based on an input resistance of 40 kΩ,
so for flatband 20 Hz reproduction, 0.47 µF caps or larger
should be used.
TABLE 1. 4-Bit Attenuation Control
LD
Input Bits
msb: lsb
D3–D0
0000
Attenuation
Level (dB)
Bridge
Pin
Amplifier
Gain (dB)
VOICE-BAND DESIGN
The preamp on this IC is intended to be used for microphone
amplification. Depending upon the frequency response of
the microphone, the preamplifier’s response can be config-
ured to fit the microphone. Simple capacitors can be used to
bandwidth limit the frequency response of the preamplifier
and improve the system’s performance. Once the gain of the
preamp is chosen, the values for the resistors and capacitors
can be selected based upon desired cutoff frequencies using
the equations below.
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0 dB
6 dB
0001
−2 dB
−4 dB
4 dB
2 dB
0010
0011
−6 dB
0 dB
0100
−8 dB
−2 dB
−4 dB
−6 dB
−8 dB
−10 dB
−12 dB
−14 dB
−16 dB
−18 dB
−20 dB
−22 dB
−24 dB
0101
−10 dB
−12 dB
−14 dB
−16 dB
−18 dB
−20 dB
−22 dB
−24 dB
−26 dB
−28 dB
−30 dB
0110
0111
=
AVCL 1 + Rf/R
(4)
(5)
(6)
i
=
1000
flp 1/(2π RfCf )
=
fhp 1/(2π RiCi )
1001
As an example, lets assume that the desired closed-loop
gain is 40 dB and the desired voice-band is 300 Hz to 3 kHz.
1010
1011
=
=
Using Equation 4, we choose Rf 100 kΩ and Ri 1 kΩ.
1100
The desired value in dB is equal to 20 log (AVCL). Then, solv-
=
=
=
1101
ing for Cf and Ci using flp 3 kHz, fhp 300 Hz, Rf 100
=
=
kΩ, and Ri 1 kΩ we get the following: Cf 530 pF and C
1110
=
i
0.53 µF.
1111
XXXX
NC
NC
COMPUTER APPLICATION CIRCUIT
0 — Logic Low (0V)
1 — Logic High (5V)
X — Don’t Care
The LM4830 can also be used to drive both an internal sys-
tem speaker and stereo headphones simultaneously, as
shown in Figure 2. The internally configured unity-gain buffer
requires the preamp to also be set up in an inverting
unity-gain fashion to maintain proper signal phase between
channels for the stereo headphone amplifier. The unity-gain
configured circuit also requires that the AC input signal dy-
namic range be properly conditioned for the 2.5 VPK signal
swing.
NC — No Change
DIGITAL ATTENUATION CONTROL
The Load (LD) pin, pin 9, has two modes of operation. When
this input pin is a logic high, 5V, the power amp’s attenuation
control is in “transparent mode” where the voltages on bits
D0–D3 will cause the appropriate attenuation level to be
latched and decoded within the IC. For normal attenuation,
pin 9 should be at 5V. When the LD input pin is a logic low,
0V, the power amp’s attenuation control is “locked-out” so
that any change in the input bits will not cause a subsequent
change in the amp’s attenuation level.
Please refer to the Typical Performance Characteristics
curves for THD+N vs P and frequency of the MIC preamp
O
and buffer.
SHUTDOWN FUNCTION
In order to reduce current consumption while not in use, the
LM4830 contains a shutdown pin to externally turn off the
IC’s bias circuitry. This shutdown feature turns the IC off
when a logic high is placed on the shutdown pin. The trigger
The attenuation level is preset to −16 dB when the IC is first
powered up, assuming that LD is a logic low until the IC is
fully biased up.
To provide the best click and pop performance when chang-
ing attenuation levels, each step should be utilized. If a
mute-type function is desired, it is recommended that each
of the attenuation steps be “ramped through” quicker than
the normal attenuation ramp.
point between
a logic low and logic high is typically
half-supply. Quiescent current consumption will depend
upon the value of this voltage. It is best for this voltage to be
forced to VDDto obtain the guaranteed shutdown current.
The shutdown feature reduces quiescent supply current con-
sumption from a typical 11 mA to under 2 µA for the whole IC.
To ensure that attenuation steps are flawless when data is
transitioning with load, refer to the timing diagram for proper
setup and hold times.
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10
external pull-up resistor. When the switch is closed, the shut-
down pin is connected to ground and enables the amplifier. If
the switch is open, the external pull-up resistor disables the
LM4830 by bringing the shutdown pin up to VDD. This
scheme guarantees that the shutdown pin will not float, pre-
venting unwanted state changes.
Application Information (Continued)
This feature is especially useful when the IC is used in por-
table battery operated systems where energy conservation
is imperative.
In many applications, a microcontroller or microprocessor
output interfaces to the LM4830 shutdown pin, providing a
quick, smooth transition into shutdown. Another solution is to
use a single-pole, single-throw switch in conjunction with an
Additionally, when the IC comes out of shutdown the IC’s
volume attenuation setting will remain unchanged.
11
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12
Physical Dimensions inches (millimeters) unless otherwise noted
24-Lead (0.300" Wide) Molded Small Outline Package, JEDEC
Order Number LM4830M
NS Package Number M24B
24-Lead (0.600" Wide) Molded Dual-In-Line Package
Order Number LM4830N
NS Package Number N24A
13
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE-
VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMI-
CONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or sys-
tems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose fail-
ure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
National Semiconductor
Corporation
Americas
Tel: 1-800-272-9959
Fax: 1-800-737-7018
Email: support@nsc.com
National Semiconductor
Europe
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
National Semiconductor
Japan Ltd.
Tel: 81-3-5639-7560
Fax: 81-3-5639-7507
Fax: +49 (0) 1 80-530 85 86
Email: europe.support@nsc.com
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Email: sea.support@nsc.com
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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SI9137DB
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