LM4910 [NSC]

Output Capacitor-less Stereo 35mW Headphone Amplifier; 输出电容的35MW立体声耳机放大器
LM4910
型号: LM4910
厂家: National Semiconductor    National Semiconductor
描述:

Output Capacitor-less Stereo 35mW Headphone Amplifier
输出电容的35MW立体声耳机放大器

放大器
文件: 总22页 (文件大小:824K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
February 2003  
LM4910  
Output Capacitor-less Stereo 35mW Headphone  
Amplifier  
General Description  
Key Specifications  
n PSRR at f = 217Hz  
65dB (typ)  
The LM4910 is an audio power amplifier primarily designed  
for headphone applications in portable device applications. It  
is capable of delivering 35mW of continuous average power  
to a 32load with less than 1% distortion (THD+N) from a  
3.3VDC power supply.  
n Power Output at VDD = 3.3V, RL = 32, and THD ≤  
1%  
n Shutdown Current  
35mW (typ)  
0.1µA (typ)  
The LM4910 utilizes a new circuit topology that eliminates  
output coupling capacitors and half-supply bypass capaci-  
tors (patent pending). The LM4910 contains advanced pop &  
click circuitry which eliminates noises caused by transients  
that would otherwise occur during turn-on and turn-off.  
Features  
n Eliminates headphone amplifier output coupling  
capacitors (patent pending)  
n Eliminates half-supply bypass capacitor (patent pending)  
n Advanced pop & click circuitry eliminates noises during  
turn-on and turn-off  
n Ultra-low current shutdown mode  
n Unity-gain stable  
n 2.2V - 5.5V operation  
n Available in space-saving MSOP, LLP, and SOIC  
packages  
Boomer audio power amplifiers were designed specifically to  
provide high quality output power with a minimal amount of  
external components. Since the LM4910 does not require  
any output coupling capacitors, half-supply bypass capaci-  
tors, or bootstrap capacitors, it is ideally suited for low-power  
portable applications where minimal space and power con-  
sumption are primary requirements.  
The LM4910 features a low-power consumption shutdown  
mode, activated by driving the shutdown pin with logic low.  
Additionally, the LM4910 features an internal thermal shut-  
down protection mechanism. The LM4910 is also unity-gain  
stable and can be configured by external gain-setting resis-  
tors.  
Applications  
n Mobile Phones  
n PDAs  
n Portable eletronics devices  
n Portable MP3 players  
Typical Application  
20030565  
FIGURE 1. Typical Audio Amplifier Application Circuit  
Boomer® is a registered trademark of National Semiconductor Corporation.  
© 2003 National Semiconductor Corporation  
DS200305  
www.national.com  
Connection Diagrams  
MSOP/SO Package  
20030502  
Top View  
Order Number LM4910MM or LM4910MA  
See NS Package Number MUA08A or M08A  
MSOP Marking  
20030566  
Top View  
G - Boomer Family  
C2 - LM4910MM  
SO Marking  
20030567  
Top View  
TT - Die Traceability  
Bottom 2 lines - Part Number  
LLP Package  
20030595  
Top View  
Order Number LM4910LQ  
See NS package Number LQB08A  
www.national.com  
2
Absolute Maximum Ratings (Note 2)  
θJC (MSOP)  
θJA (MSOP)  
θJC (SOP)  
θJA (SOP)  
θJC (LQ)  
56˚C/W  
190˚C/W  
35˚C/W  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
150˚C/W  
57˚C/W  
Supply Voltage (Note 9)  
Storage Temperature  
6.0V  
−65˚C to +150˚C  
-0.3V to VDD + 0.3V  
Internally Limited  
10kV  
θJA (LQ)  
140˚C/W  
Input Voltage  
Power Dissipation (Note 3)  
ESD Susceptibility Pin 6 (Note 10)  
ESD Susceptibility (Note 4)  
ESD Susceptibility (Note 5)  
Junction Temperature  
Operating Ratings  
Temperature Range  
2000V  
TMIN TA TMAX  
−40˚C T 85˚C  
A
200V  
Supply Voltage (VDD  
)
2.2V VCC 5.5V  
150˚C  
Thermal Resistance  
Electrical Characteristics VDD = 3.3V (Notes 1, 2)  
The following specifications apply for VDD = 3.3V, AV = 1, and 32load unless otherwise specified. Limits apply to TA = 25˚C.  
Symbol  
Parameter  
Conditions  
LM4910  
Units  
(Limits)  
Typ  
Limit  
(Note 6)  
(Notes 7,  
8)  
6
IDD  
ISD  
VOS  
PO  
Quiescent Power Supply Current VIN = 0V, 32Load  
3.5  
0.1  
mA (max)  
µA (max)  
mV (max)  
mW (min)  
%
Standby Current  
Output Offset Voltage  
Output Power  
VSHUTDOWN = GND  
1.0  
30  
30  
5
THD = 1% (max); f = 1kHz  
35  
THD+N  
Total Harmonic Distortion + Noise PO = 30mWrms; f = 1kHz  
0.3  
65 (f =  
217Hz)  
65 (f =  
1kHz)  
VRIPPLE = 200mVp-p sinewave  
Power Supply Rejection Ratio  
PSRR  
dB  
Input terminated with 10to ground  
VIH  
VIL  
Shutdown Input Voltage High  
Shutdown Input Voltage Low  
1.5  
0.4  
V (min)  
V (max)  
Electrical Characteristics VDD = 3V (Notes 1, 2)  
The following specifications apply for VDD = 3V, AV = 1, and 32load unless otherwise specified. Limits apply to TA = 25˚C.  
Symbol  
Parameter  
Conditions  
LM4910  
Units  
(Limits)  
Typ  
Limit  
(Note 6)  
(Notes 7,  
8)  
6
IDD  
ISD  
VOS  
PO  
Quiescent Power Supply Current VIN = 0V, 32Load  
3.3  
0.1  
mA (max)  
µA (max)  
mV (max)  
mW (min)  
%
Standby Current  
Output Offset Voltage  
Output Power  
VSHUTDOWN = GND  
1.0  
30  
25  
5
THD = 1% (max); f = 1kHz  
30  
THD+N  
Total Harmonic Distortion + Noise PO = 25mWrms; f = 1kHz  
0.3  
65 (f =  
217 Hz)  
65 (f =  
1kHz)  
VRIPPLE = 200mVp-p sinewave  
Power Supply Rejection Ratio  
PSRR  
dB  
Input terminated with 10to ground  
VIH  
VIL  
Shutdown Input Voltage High  
Shutdown Input Voltage Low  
1.5  
0.4  
V (min)  
V (max)  
3
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Electrical Characteristics VDD = 2.6V (Notes 1, 2)  
The following specifications apply for VDD = 2.6V, AV = 1, and 32load unless otherwise specified. Limits apply to TA = 25˚C.  
Symbol  
Parameter  
Conditions  
LM4910  
Units  
(Limits)  
Typ  
(Note 6)  
Limit  
(Notes 7,  
8)  
IDD  
ISD  
VOS  
PO  
Quiescent Power Supply Current VIN = 0V, 32Load  
3.0  
0.1  
mA (max)  
µA (max)  
mV (max)  
mW  
Standby Current  
Output Offset Voltage  
Output Power  
VSHUTDOWN = GND  
5
THD = 1% (max); f = 1kHz  
13  
THD+N  
Total Harmonic Distortion + Noise PO = 10mWrms; f = 1kHz  
0.3  
%
55 (f =  
217Hz)  
55 (f =  
1kHz)  
VRIPPLE = 200mVp-p sinewave  
Power Supply Rejection Ratio  
PSRR  
dB  
Input terminated with 10to ground  
Note 1: All voltages are measured with respect to the GND pin unless otherwise specified.  
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
functional but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which  
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit  
is given, however, the typical value is a good indication of device performance.  
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T  
, θ , and the ambient temperature, T . The maximum  
A
JMAX JA  
allowable power dissipation is P  
currents for more information.  
= (T - T )/ θ or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4910, see power derating  
JMAX A JA  
DMAX  
Note 4: Human body model, 100pF discharged through a 1.5kresistor.  
Note 5: Machine Model, 220pF-240pF discharged through all pins.  
Note 6: Typicals are measured at 25˚C and represent the parametric norm.  
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).  
Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.  
Note 9: If the product is in shutdown mode and V exceeds 6V (to a max of 8V V ) then most of the excess current will flow through the ESD protection circuits.  
DD  
DD  
If the source impedance limits the current to a max of 10ma then the part will be protected. If the part is enabled when V is above 6V circuit performance will be  
DD  
curtailed or the part may be permanently damaged.  
Note 10: Human body model, 100pF discharged through a 1.5kresistor, Pin 6 to ground.  
External Components Description (Figure 1)  
Components  
Functional Description  
1.  
2.  
RI  
CI  
Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a  
high-pass filter with Ci at fc = 1/(2πRiCi).  
Input coupling capacitor which blocks the DC voltage at the amplifier’s input terminals. Also creates a  
high-pass filter with Ri at fc = 1/(2πRiCi). Refer to the section Proper Selection of External Components, for  
an explanation of how to determine the value of Ci.  
3.  
4.  
Rf  
Feedback resistance which sets the closed-loop gain in conjunction with Ri.  
CS  
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing  
section for information concerning proper placement and selection of the supply bypass capacitor.  
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4
Typical Performance Characteristics  
THD+N vs Frequency  
THD+N vs Frequency  
THD+N vs Frequency  
THD+N vs Frequency  
20030506  
20030507  
THD+N vs Frequency  
20030508  
20030509  
THD+N vs Frequency  
20030510  
20030511  
5
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Typical Performance Characteristics (Continued)  
THD+N vs Output Power  
THD+N vs Output Power  
THD+N vs Output Power  
THD+N vs Output Power  
20030516  
20030517  
20030518  
20030520  
THD+N vs Output Power  
20030515  
THD+N vs Output Power  
20030519  
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6
Typical Performance Characteristics (Continued)  
Output Power vs  
Load Resistance  
Output Power vs  
Load Resistance  
20030523  
20030578  
Output Power vs  
Supply Voltage  
Output Power vs  
Supply Voltage  
20030580  
20030579  
Output Power vs  
Supply Voltage  
Power Dissipation vs  
Output Power  
20030581  
20030530  
7
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Typical Performance Characteristics (Continued)  
Power Dissipation vs  
Output Power  
Power Dissipation vs  
Output Power  
20030582  
20030529  
Channel Separation  
Power Supply Rejection Ratio  
20030583  
20030535  
Power Supply Rejection Ratio  
Power Supply Rejection Ratio  
20030584  
20030585  
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8
Typical Performance Characteristics (Continued)  
Open Loop Frequency Response  
Noise Floor  
20030586  
20030587  
Frequency Response vs  
Input Capacitor Size  
Supply Current vs  
Supply Voltage  
20030589  
20030588  
9
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capacitance at the amplifier inputs. A more reliable way to  
lower gain or reduce power delivered to the load is to place  
a current limiting resistor in series with the load as explained  
in the Minimizing Output Noise / Reducing Output Power  
section.  
Application Information  
ELIMINATING OUTPUT COUPLING CAPACITORS  
Typical single-supply audio amplifiers that drive single-  
ended (SE) headphones use a coupling capacitor on each  
SE output. This output coupling capacitor blocks the half-  
supply voltage to which the output amplifiers are typically  
biased and couples the audio signal to the headphones. The  
signal return to circuit ground is through the headphone  
jack’s sleeve.  
The LM4910 eliminates these output coupling capacitors.  
Amp3 is internally configured to apply a bandgap referenced  
voltage (VREF = 1.58V) to a stereo headphone jack’s sleeve.  
This voltage matches the quiescent voltage present on the  
Amp1 and Amp2 outputs that drive the headphones. The  
headphones operate in a manner similar to a bridge-tied-  
load (BTL). The same DC voltage is applied to both head-  
phone speaker terminals. This results in no net DC current  
flow through the speaker. AC current flows through a head-  
phone speaker as an audio signal’s output amplitude in-  
creases on the speaker’s terminal.  
20030592  
FIGURE 2.  
The headphone jack’s sleeve is not connected to circuit  
ground. Using the headphone output jack as a line-level  
output will place the LM4910’s bandgap referenced voltage  
on a plug’s sleeve connection. This presents no difficulty  
when the external equipment uses capacitively coupled in-  
puts. For the very small minority of equipment that is DC-  
coupled, the LM4910 monitors the current supplied by the  
amplifier that drives the headphone jack’s sleeve. If this  
current exceeds 500mAPK, the amplifier is shutdown, pro-  
tecting the LM4910 and the external equipment.  
AMPLIFIER CONFIGURATION EXPLANATION  
As shown in Figure 1, the LM4910 has three operational  
amplifiers internally. Two of the amplifier’s have externally  
configurable gain while the other amplifier is internally fixed  
at the bias point acting as a unity-gain buffer. The closed-  
loop gain of the two configurable amplifiers is set by select-  
ing the ratio of Rf to Ri. Consequently, the gain for each  
channel of the IC is  
AV = -(Rf/Ri)  
ELIMINATING THE HALF-SUPPLY BYPASS CAPACITOR  
Typical single-supply audio amplifers are normally biased to  
1/2VDD in order to maximize the output swing of the audio  
signal. This is usually achieved with a simple resistor divider  
network from VDD to ground that provides the proper bias  
voltage to the amplifier. However, this scheme requires the  
use of a half-supply bypass capacitor to improve the bias  
voltage’s stability and the amplifier’s PSRR performance.  
By driving the loads through outputs VO1 and VO2 with VO3  
acting as a buffered bias voltage the LM4910 does not  
require output coupling capacitors. The typical single-ended  
amplifier configuration where one side of the load is con-  
nected to ground requires large, expensive output coupling  
capacitors.  
A configuration such as the one used in the LM4910 has a  
major advantage over single supply, single-ended amplifiers.  
Since the outputs VO1, VO2, and VO3 are all biased at VREF  
= 1.58V, no net DC voltage exists across each load. This  
eliminates the need for output coupling capacitors that are  
required in a single-supply, single-ended amplifier configura-  
tion. Without output coupling capacitors in a typical single-  
supply, single-ended amplifier, the bias voltage is placed  
across the load resulting in both increased internal IC power  
dissipation and possible loudspeaker damage.  
The LM4910 utilizes an internally generated, buffered band-  
gap reference voltage as the amplifier’s bias voltage. This  
bandgap reference voltage is not a direct function of VDD  
and therefore is less susceptible to noise or ripple on the  
power supply line. This allows for the LM4910 to have a  
stable bias voltage and excellent PSRR performance even  
without a half-supply bypass capacitor.  
OUTPUT TRANSIENT (’CLICK AND POPS’)  
ELIMINATED  
The LM4910 contains advanced circuitry that virtually elimi-  
nates output transients (’clicks and pops’). This circuitry  
prevents all traces of transients when the supply voltage is  
first applied or when the part resumes operation after coming  
out of shutdown mode. The LM4910 remains in a muted  
condition until there is sufficient input signal magnitude  
POWER DISSIPATION  
Power dissipation is a major concern when designing a  
successful amplifier. A direct consequence of the increased  
power delivered to the load by a bridge amplifier is an  
increase in internal power dissipation. The maximum power  
dissipation for a given application can be derived from the  
power dissipation graphs or from Equation 1.  
>
(
5mVRMS, typ) to mask any remaining transient that may  
occur. Figure 2 shows the LM4910’s lack of transients in the  
differential signal (Trace B) across a 320 load. The LM4910’s  
active-low SHUTDOWN pin is driven by the logic signal  
shown in Trace A. Trace C is the VO1 output signal and Trace  
D is the VO3 output signal.  
2
PDMAX = 4(VDD  
)
/ (π2RL)  
(1)  
It is critical that the maximum junction temperature TJMAX of  
150˚C is not exceeded. Since the typical application is for  
To ensure optimal click and pop performance under low gain  
configurations (less than 0dB), it is critical to minimize the  
RC combination of the feedback resistor RF and stray input  
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10  
shown in Figure 1. The input coupling capacitor, Ci, forms a  
first order high pass filter which limits low frequency re-  
sponse. This value should be chosen based on needed  
frequency response and turn-on time.  
Application Information (Continued)  
headphone operation (32impedance) using a 3.3V supply  
the maximum power dissipation is only 138mW. Therefore,  
power dissipation is not a major concern.  
SELECTION OF INPUT CAPACITOR SIZE  
Amplifiying the lowest audio frequencies requires a high  
value input coupling capacitor, Ci. A high value capacitor can  
be expensive and may compromise space efficiency in por-  
table designs. In many cases, however, the headphones  
used in portable systems have little ability to reproduce  
signals below 60Hz. Applications using headphones with this  
limited frequency response reap little improvement by using  
a high value input capacitor.  
POWER SUPPLY BYPASSING  
As with any amplifier, proper supply bypassing is important  
for low noise performance and high power supply rejection.  
The capacitor location on the power supply pins should be  
as close to the device as possible.  
Typical applications employ a 3.3V regulator with 10µF tan-  
talum or electrolytic capacitor and a ceramic bypass capaci-  
tor which aid in supply stability. This does not eliminate the  
need for bypassing the supply nodes of the LM4910. A  
bypass capacitor value in the range of 0.1µF to 1µF is  
recommended for CS.  
In addition to system cost and size, turn-on time is affected  
by the size of the input coupling capacitor Ci. A larger input  
coupling capacitor requires more charge to reach its quies-  
cent DC voltage. This charge comes from the output via the  
feedback Thus, by minimizing the capacitor size based on  
necessary low frequency response, turn-on time can be  
minimized. A small value of Ci (in the range of 0.1µF to  
0.39µF), is recommended.  
MICRO POWER SHUTDOWN  
The voltage applied to the SHUTDOWN pin controls the  
LM4910’s shutdown function. Activate micro-power shut-  
down by applying a logic-low voltage to the SHUTDOWN  
pin. When active, the LM4910’s micro-power shutdown fea-  
ture turns off the amplifier’s bias circuitry, reducing the sup-  
ply current. The trigger point is 0.4V(max) for a logic-low  
level, and 1.5V(min) for a logic-high level. The low 0.1µA(typ)  
shutdown current is achieved by applying a voltage that is as  
near as ground as possible to the SHUTDOWN pin. A volt-  
age that is higher than ground may increase the shutdown  
current.  
USING EXTERNAL POWERED SPEAKERS  
The LM4910 is designed specifically for headphone opera-  
tion. Often the headphone output of a device will be used to  
drive external powered speakers. The LM4910 has a differ-  
ential output to eliminate the output coupling capacitors. The  
result is a headphone jack sleeve that is connected to VO3  
instead of GND. For powered speakers that are designed to  
have single-ended signals at the input, the click and pop  
circuitry will not be able to eliminate the turn-on/turn-off click  
and pop. Unless the inputs to the powered speakers are fully  
differential the turn-on/turn-off click and pop will be very  
large.  
There are a few ways to control the micro-power shutdown.  
These include using a single-pole, single-throw switch, a  
microprocessor, or a microcontroller. When using a switch,  
connect an external 100kpull-up resistor between the  
SHUTDOWN pin and VDD. Connect the switch between the  
SHUTDOWN pin and ground. Select normal amplifier opera-  
tion by opening the switch. Closing the switch connects the  
SHUTDOWN pin to ground, activating micro-power shut-  
down. The switch and resistor guarantee that the SHUT-  
DOWN pin will not float. This prevents unwanted state  
changes. In a system with a microprocessor or microcontrol-  
ler, use a digital output to apply the control voltage to the  
SHUTDOWN pin. Driving the SHUTDOWN pin with active  
circuitry eliminates the pull-up resistor.  
AUDIO POWER AMPLIFIER DESIGN  
A 30mW/32Audio Amplifier  
Given:  
Power Output  
Load Impedance  
Input Level  
30mWrms  
32Ω  
1Vrms  
Input Impedance  
20kΩ  
A designer must first determine the minimum supply rail to  
obtain the specified output power. By extrapolating from the  
Output Power vs Supply Voltage graphs in the Typical Per-  
formance Characteristics section, the supply rail can be  
easily found.  
SELECTING EXTERNAL COMPONENTS  
Selecting proper external components in applications using  
integrated power amplifiers is critical to optimize device and  
system performance. While the LM4910 is tolerant of exter-  
nal component combinations, consideration to component  
values must be used to maximize overall system quality.  
Since 3.3V is a standard supply voltage in most applications,  
it is chosen for the supply rail in this example. Extra supply  
voltage creates headroom that allows the LM4910 to repro-  
duce peaks in excess of 30mW without producing audible  
distortion. At this time, the designer must make sure that the  
power supply choice along with the output impedance does  
no violate the conditions explained in the Power Dissipa-  
tion section.  
The LM4910 is unity-gain stable which gives the designer  
maximum system flexibility. The LM4910 should be used in  
low gain configurations to minimize THD+N values, and  
maximize the signal to noise ratio. Low gain configurations  
require large input signals to obtain a given output power.  
Input signals equal to or greater than 1Vrms are available  
from sources such as audio codecs. Very large values  
should not be used for the gain-setting resistors. Values for  
Ri and Rf should be less than 1M. Please refer to the  
section, Audio Power Amplifier Design, for a more com-  
plete explanation of proper gain selection  
Once the power dissipation equations have been addressed,  
the required differential gain can be determined from Equa-  
tion 2.  
Besides gain, one of the major considerations is the closed-  
loop bandwidth of the amplifier. To a large extent, the band-  
width is dictated by the choice of external components  
(2)  
11  
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Application Information (Continued)  
As mentioned in the Selecting Proper External Compo-  
nents section, Ri and Ci create a highpass filter that sets the  
amplifier’s lower bandpass frequency limit. Find the coupling  
capacitor’s value using Equation (3).  
From Equation 2, the minimum AV is 0.98; use AV = 1. Since  
the desired input impedance is 20k, and with AV equal to 1,  
a ratio of 1:1 results from Equation 1 for Rf to Ri. The values  
are chosen with Ri = 20kand Rf = 20k.  
Ci1/(2πR ifL)  
(5)  
The last step in this design example is setting the amplifier’s  
−3dB frequency bandwidth. To achieve the desired 0.25dB  
pass band magnitude variation limit, the low frequency re-  
sponse must extend to at least one-fifth the lower bandwidth  
limit and the high frequency response must extend to at least  
five times the upper bandwidth limit. The gain variation for  
both response limits is 0.17dB, well within the 0.25dB  
desired limit. The results are an  
The result is  
*
*
1/(2π 20k20Hz) = 0.397µF  
Use a 0.39µF capacitor, the closest standard value.  
The high frequency pole is determined by the product of the  
desired frequency pole, fH, and the differential gain, AV. With  
an AV = 1 and fH = 100kHz, the resulting GBWP = 100kHz  
which is much smaller than the LM4910 GBWP of 11MHz.  
This figure displays that if a designer has a need to design  
an amplifier with higher differential gain, the LM4910 can still  
be used without running into bandwidth limitations.  
fL = 100Hz/5 = 20Hz  
(3)  
and an  
fH = 20kHz x 5 = 100kHz  
(4)  
MINIMIZING OUTPUT NOISE / REDUCING OUTPUT POWER  
20030568  
FIGURE 3.  
Output noise delivered to the load can be minimized with the  
use of an external resistor, RSERIES, placed in series with  
each load as shown in Figure 3. RSERIES forms a voltage  
divider with the impedance of the headphone driver RL. As a  
Figure 4 shows an optional resistor connected between the  
amplifier output that drives the headphone jack sleeve and  
ground. This resistor provides a ground path that supressed  
power supply hum. This hum may occur in applications such  
as notebook computers in a shutdown condition and con-  
nected to an external powered speaker. The resistor’s 100Ω  
value is a suggested starting point. Its final value must be  
determined based on the tradeoff between the amount of  
noise suppression that may be needed and minimizing the  
additional current drawn by the resistor (25mA for a 100Ω  
resistor and a 5V supply).  
result, output noise is attenuated by the factor RL / (RL  
+
RSERIES). Figure 4 illustrates the relationship between output  
noise and RSERIES for different loads. RSERIES also de-  
creases output power delivered to the load by the factor RL  
/ (RL + RSERIES)2. However, this may not pose a problem  
since most headphone applications require less than 10mW  
@
of output power. Figure 5 illustrates output power ( 1%  
THD+N) vs RSERIES for different loads.  
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12  
Application Information (Continued)  
ESD PROTECTION  
As stated in the Absolute Maximum Ratings, pin 6 (Vo3) on  
the LM4910 has a maximum ESD susceptibility rating of  
10kV. For higher ESD voltages, the addition of a PCDN042  
dual transil (from California Micro Devices), as shown in  
Figure 4, will provide additional protection.  
20030594  
FIGURE 4. The PCDN042 provides additional ESD protection beyond the 10kV shown in the Absolute Maximum  
Ratings for the Vo3 output  
Output Noise vs RSERIES  
20030590  
FIGURE 5.  
13  
www.national.com  
Application Information (Continued)  
Output Power vs RSERIES  
20030591  
FIGURE 6.  
HIGHER GAIN AUDIO AMPLIFIER  
20030593  
FIGURE 7.  
www.national.com  
14  
feedback capacitor creates a low pass filter that eliminates  
possible high frequency oscillations. Care should be taken  
when calculating the -3dB frequency in that an incorrect  
combination of Rf and Cf will cause frequency response roll  
off before 20kHz. A typical combination of feedback resistor  
and capacitor that will not produce audio band high fre-  
quency roll off is Rf = 20kand Cf = 25pF. These compo-  
nents result in a -3dB point of approximately 320kHz.  
Application Information (Continued)  
The LM4910 is unity-gain stable and requires no external  
components besides gain-setting resistors, input coupling  
capacitors, and proper supply bypassing in the typical appli-  
cation. However, if a very large closed-loop differential gain  
is required, a feedback capacitor (Cf) may be needed as  
shown in Figure 6 to bandwidth limit the amplifier. This  
REFERENCE DESIGN BOARD and LAYOUT GUIDELINES  
MSOP & SO BOARDS  
20030569  
FIGURE 8.  
(Note: RPU2 is not required. It is used for test measurement purposes only.)  
15  
www.national.com  
Application Information (Continued)  
LM4910 SO DEMO BOARD ARTWORK  
Composite View  
Silk Screen  
20030571  
20030570  
Top Layer  
Bottom Layer  
20030573  
20030572  
www.national.com  
16  
Application Information (Continued)  
LM4910 MSOP DEMO BOARD ARTWORK  
Composite View  
Silk Screen  
20030575  
20030574  
Top Layer  
Bottom Layer  
20030577  
20030576  
17  
www.national.com  
Application Information (Continued)  
LM4910 LLP DEMO BOARD ARTWORK  
Composite View  
Silk Screen  
20030598  
20030597  
Top Layer  
Bottom Layer  
20030599  
20030596  
www.national.com  
18  
Application Information (Continued)  
LM4910 Reference Design Boards  
Bill of Materials  
Part Description  
LM4910 Mono Reference Design Board  
LM4910 Audio AMP  
Qty  
1
Ref Designator  
1
U1  
Cs  
Tantalum Cap 1µF 16V 10  
1
Ceramic Cap 0.39µF 50V Z50 20  
Resistor 20k1/10W 5  
2
Ci  
4
Ri, Rf  
Rpu  
J1  
Resistor 100k1/10W 5  
1
Jumper Header Vertical Mount 2X1, 0.100  
1
PCB LAYOUT GUIDELINES  
greatly enhance low level signal performance. Star trace  
routing refers to using individual traces to feed power and  
ground to each circuit or even device. This technique will  
require a greater amount of design time but will not increase  
the final price of the board. The only extra parts required may  
be some jumpers.  
This section provides practical guidelines for mixed signal  
PCB layout that involves various digital/analog power and  
ground traces. Designers should note that these are only  
"rule-of-thumb" recommendations and the actual results will  
depend heavily on the final layout.  
Single-Point Power / Ground Connections  
Minimization of THD  
The analog power traces should be connected to the digital  
traces through a single point (link). A "PI-filter" can be helpful  
in minimizing high frequency noise coupling between the  
analog and digital sections. Further, place digital and analog  
power traces over the corresponding digital and analog  
ground traces to minimize noise coupling.  
PCB trace impedance on the power, ground, and all output  
traces should be minimized to achieve optimal THD perfor-  
mance. Therefore, use PCB traces that are as wide as  
possible for these connections. As the gain of the amplifier is  
increased, the trace impedance will have an ever increasing  
adverse affect on THD performance. At unity-gain (0dB) the  
parasitic trace impedance effect on THD performance is  
reduced but still a negative factor in the THD performance of  
the LM4910 in a given application.  
Placement of Digital and Analog Components  
All digital components and high-speed digital signal traces  
should be located as far away as possible from analog  
components and circuit traces.  
GENERAL MIXED SIGNAL LAYOUT  
RECOMMENDATION  
Avoiding Typical Design / Layout Problems  
Power and Ground Circuits  
Avoid ground loops or running digital and analog traces  
parallel to each other (side-by-side) on the same PCB layer.  
When traces must cross over each other do it at 90 degrees.  
Running digital and analog traces at 90 degrees to each  
other from the top to the bottom side as much as possible will  
minimize capacitive noise coupling and cross talk.  
For two layer mixed signal design, it is important to isolate  
the digital power and ground trace paths from the analog  
power and ground trace paths. Star trace routing techniques  
(bringing individual traces back to a central point rather than  
daisy chaining traces together in a serial manner) can  
19  
www.national.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
MSOP  
Order Number LM4910MM  
NS Package Number MUA08A  
www.national.com  
20  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
SO  
Order Number LM4910MA  
NS Package Number M08A  
LQ  
Order Number LM4910LQ  
NS Package Number LQB08A  
21  
www.national.com  
Notes  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL  
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and  
whose failure to perform when properly used in  
accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a  
significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
National Semiconductor  
Americas Customer  
Support Center  
National Semiconductor  
Europe Customer Support Center  
Fax: +49 (0) 180-530 85 86  
National Semiconductor  
Asia Pacific Customer  
Support Center  
National Semiconductor  
Japan Customer Support Center  
Fax: 81-3-5639-7507  
Email: new.feedback@nsc.com  
Tel: 1-800-272-9959  
Email: europe.support@nsc.com  
Deutsch Tel: +49 (0) 69 9508 6208  
English Tel: +44 (0) 870 24 0 2171  
Français Tel: +33 (0) 1 41 91 8790  
Fax: 65-6250 4466  
Email: ap.support@nsc.com  
Tel: 65-6254 4466  
Email: nsj.crc@jksmtp.nsc.com  
Tel: 81-3-5639-7560  
www.national.com  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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