LM5025A [NSC]

Active Clamp Voltage Mode PWM Controller; 有源钳位电压模式PWM控制器
LM5025A
型号: LM5025A
厂家: National Semiconductor    National Semiconductor
描述:

Active Clamp Voltage Mode PWM Controller
有源钳位电压模式PWM控制器

控制器
文件: 总16页 (文件大小:696K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
December 2004  
LM5025A  
Active Clamp Voltage Mode PWM Controller  
General Description  
Features  
n Internal Start-up Bias Regulator  
n 3A Compound Main Gate Driver  
The LM5025A is a functional variant of the LM5025 active  
clamp PWM controller. The functional differences of the  
LM5025A are: The CS1 and CS2 current limit thresholds  
have been increased to 0.5V. The internal CS2 filter dis-  
charge device has been disabled and no longer operates  
each clock cycle. The internal VCC and VREF regulators  
continue to operate when the line UVLO pin is below thresh-  
old.  
n Programmable Line Under-Voltage Lockout (UVLO) with  
Adjustable Hysteresis  
n Voltage Mode Control with Feed-Forward  
n Adjustable Dual Mode Over-Current Protection  
n Programmable Overlap or Deadtime between the Main  
and Active Clamp Outputs  
The LM5025A PWM controller contains all of the features  
necessary to implement power converters utilizing the Active  
Clamp / Reset technique. With the active clamp technique,  
higher efficiencies and greater power densities can be real-  
ized compared to conventional catch winding or RDC clamp  
/ reset techniques. Two control outputs are provided, the  
main power switch control (OUT_A) and the active clamp  
switch control (OUT_B). The two internal compound gate  
drivers parallel both MOS and Bipolar devices, providing  
superior gate drive characteristics. This controller is de-  
signed for high-speed operation including an oscillator fre-  
quency range up to 1MHz and total PWM and current sense  
propagation delays less than 100ns. The LM5025A includes  
a high-voltage start-up regulator that operates over a wide  
input range of 13V to 90V. Additional features include: Line  
Under Voltage Lockout (UVLO), softstart, oscillator UP/  
DOWN sync capability, precision reference and thermal  
shutdown.  
n Volt x Second Clamp  
n Programmable Soft-start  
n Leading Edge Blanking  
n Single Resistor Programmable Oscillator  
n Oscillator UP / DOWN Sync Capability  
n Precision 5V Reference  
n Thermal Shutdown  
Packages  
n TSSOP-16  
n LLP-16 (5x5 mm) Thermally Enhanced  
Typical Application Circuit  
20107401  
Simplified Active Clamp Forward Power Converter  
© 2004 National Semiconductor Corporation  
DS201074  
www.national.com  
Connection Diagram  
20107416  
16-Lead TSSOP, LLP  
Ordering Information  
Order Number  
LM5025AMTC  
LM5025AMTCX  
LM5025ASD  
Package Type  
NSC Package Drawing  
Supplied As  
TSSOP-16  
TSSOP-16  
LLP-16  
MTC-16  
MTC-16  
SDA-16A  
SDA-16A  
92 Units per anti-static tube  
2500 Units on Tape and Reel  
Available Soon  
LM5025ASDX  
LLP-16  
Available Soon  
Pin Description  
PIN  
NAME  
DESCRIPTION  
APPLICATION INFORMATION  
1
VIN  
Source Input Voltage  
Input to start-up regulator. Input range 13V to 90V,  
with transient capability to 105V.  
2
3
4
RAMP  
CS1  
Modulator ramp signal  
An external RC circuit from Vin sets the ramp slope.  
This pin is discharged at the conclusion of every  
cycle by an internal FET, initiated by either the  
internal clock or the V*Sec Clamp comparator.  
Current sense input for cycle-by-cycle limiting If CS1 exceeds 0.5V the outputs will go into  
Cycle-by-Cycle current limit. CS1 is held low for  
50ns after OUT_A switches high providing leading  
edge blanking.  
CS2  
Current sense input for soft restart  
If CS2 exceeds 0.5V the outputs will be disabled and  
a softstart commenced. The soft-start capacitor will  
be fully discharged and then released with a pull-up  
current of 1µA. After the first output pulse (when SS  
=1V), the SS charge current will revert back to 20µA.  
An external resistor (RSET) sets either the overlap  
time or dead time for the active clamp output. An  
RSET resistor connected between TIME and GND  
produces in-phase OUT_A and OUT_B pulses with  
overlap. An RSET resistor connected between TIME  
and REF produces out-of-phase OUT_A and OUT_B  
pulses with deadtime.  
5
TIME  
Output overlap/Deadtime control  
6
7
REF  
VCC  
Precision 5 volt reference output  
Maximum output current: 10mA Locally decouple  
with a 0.1µF capacitor. Reference stays low until the  
VCC UV comparator is satisfied.  
Output from the internal high voltage start-up If an auxiliary winding raises the voltage on this pin  
regulator. The VCC voltage is regulated to  
7.6V.  
above the regulation setpoint, the internal start-up  
regulator will shutdown, reducing the IC power  
dissipation.  
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2
Pin Description (Continued)  
PIN  
NAME  
DESCRIPTION  
Main output driver  
APPLICATION INFORMATION  
Output of the main switch PWM output gate driver.  
Output capability of 3A peak sink current.  
Output of the Active Clamp switch gate driver.  
Capable of 1.25A peak sink current..  
8
OUT_A  
9
OUT_B  
Active Clamp output driver  
10  
11  
PGND  
AGND  
Power ground  
Analog ground  
Connect directly to analog ground.  
Connect directly to power ground. For the LLP  
package option the exposed pad is electrically  
connected to AGND.  
12  
13  
SS  
Soft-start control  
An external capacitor and an internal 20µA current  
source set the softstart ramp. The SS current source  
is reduced to 1uA initially following a CS2  
over-current event or an over temperature event.  
An internal 5Kresistor pull-up is provided on this  
pin. The external opto-coupler sinks current from  
COMP to control the PWM duty cycle.  
COMP  
Input to the Pulse Width Modulator  
14  
15  
RT  
Oscillator timing resistor pin  
An external resistor connected from RT to ground  
sets the internal oscillator frequency.  
SYNC  
Oscillator UP/DOWN synchronization input  
The internal oscillator can be synchronized to an  
external clock with a frequency 20% lower than the  
internal oscillator’s free running frequency. There is  
no constraint on the maximum sync frequency.  
An external voltage divider from the power source  
sets the shutdown comparator levels. The  
comparator threshold is 2.5V. Hysteresis is set by an  
internal current source (20µA) that is switched on or  
off as the UVLO pin potential crosses the 2.5V  
threshold.  
16  
UVLO  
Line Under-Voltage shutdown  
-
EP  
Exposed PAD, underside of the LLP package Internally bonded to the die substrate. Connect to  
option GND potential for low thermal impedance.  
3
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Block Diagram  
Simplified Block Diagram  
20107402  
www.national.com  
4
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Human Body Model  
Storage Temperature Range  
Junction Temperature  
2kV  
-55˚C to 150˚C  
150˚C  
VIN to GND  
-0.3V to 105V  
-0.3V to 16V  
-0.3 to 1.00V  
-0.3 to 7V  
Operating Ratings (Note 1)  
VIN Voltage  
VCC to GND  
13 to 90V  
CS1, CS2 to GND  
All other inputs to GND  
ESD Rating (Note 2)  
External Voltage Applied to VCC  
Operating Junction Temperature  
8 to 15V  
-40˚C to +125˚C  
Electrical Characteristics  
Specifications with standard typeface are for TJ = 25˚C, and those with boldface type apply over full Operating Junction  
Temperature range. VIN = 48V, VCC = 10V, RT = 31.3k, RSET = 27.4k) unless otherwise stated (Note 3)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
Startup Regulator  
VCC Reg  
I-VIN  
VCC Regulation  
VCC Current Limit  
Startup Regulator  
Leakage (external Vcc  
Supply)  
No Load  
(Note 4)  
7.3  
20  
7.6  
25  
7.9  
V
mA  
µA  
VIN = 100V  
165  
500  
VCC Supply  
VCC Under-voltage  
Lockout Voltage  
VCC Reg -  
220mV  
VCC Reg -  
120mV  
V
(positive going Vcc  
)
VCC Under-voltage  
Hysteresis  
1.0  
1.5  
2.0  
4.2  
V
VCC Supply Current  
Cgate = 0  
mA  
(ICC  
Reference Supply  
VREF Ref Voltage  
)
IREF = 0 mA  
4.85  
10  
5
5.15  
50  
V
Ref Voltage  
IREF = 0 to 10mA  
25  
mV  
Regulation  
Ref Current Limit  
20  
40  
mA  
ns  
Current Limit  
CS1 Prop CS1 Delay to Output  
CS1 Step from 0 to 0.6V  
Time to onset of OUT  
Transition (90%)  
Cgate = 0  
CS2 Prop CS2 Delay to Output  
CS2 Step from 0 to 0.6V  
Time to onset of OUT  
Transition (90%)  
Cgate = 0  
50  
ns  
V
Cycle by Cycle  
0.45  
0.45  
0.5  
0.55  
0.55  
Threshold Voltage  
(CS1)  
Cycle Skip Threshold  
Voltage (CS2)  
Resets SS capacitor; auto  
restart  
0.5  
50  
30  
15  
V
ns  
Leading Edge  
Blanking Time (CS1)  
CS1 Sink Impedance  
(clocked)  
CS1 = 0.4V  
CS1 = 0.6V  
50  
30  
CS1 Sink Impedance  
(Post Fault Discharge)  
5
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Electrical Characteristics (Continued)  
Specifications with standard typeface are for TJ = 25˚C, and those with boldface type apply over full Operating Junction  
Temperature range. VIN = 48V, VCC = 10V, RT = 31.3k, RSET = 27.4k) unless otherwise stated (Note 3)  
Symbol  
Parameter  
CS2 Sink Impedance  
(Post Fault Discharge)  
CS1 and CS2  
Conditions  
CS2 = 0.6V  
Min  
Typ  
Max  
85  
Units  
55  
CS = CS Threshold -  
100mV  
1
µA  
Leakage Current  
Soft-Start  
Soft-start Current  
Source Normal  
Soft-start Current  
Source following a  
CS2 event  
17  
22  
1
27  
µA  
µA  
0.5  
1.5  
Oscillator  
Frequency1  
TA = 25˚C  
180  
175  
510  
200  
220  
225  
650  
kHz  
TJ = Tlow to Thigh  
RT = 10.4KΩ  
Frequency2  
580  
2
kHz  
V
Sync threshold  
Min Sync Pulse Width  
Sync Frequency  
Range  
100  
ns  
160  
kHz  
PWM Comparator  
Delay to Output  
COMP step 5V to 0V  
Time to onset of OUT_A  
transition low  
40  
ns  
Duty Cycle Range  
COMP to PWM Offset  
COMP Open Circuit  
Voltage  
0
80  
1.3  
5.9  
%
V
0.7  
4.3  
1
1
V
COMP Short Circuit  
Current  
COMP = 0V  
0.6  
2.4  
1.4  
2.6  
mA  
V
Volt x Second Clamp  
Ramp Clamp Level  
Delta RAMP measured  
from onset of OUT_A to  
Ramp peak.  
2.5  
COMP = 5V  
UVLO Shutdown  
Undervoltage  
2.44  
16  
2.5  
20  
2.56  
24  
V
Shutdown Threshold  
Undervoltage  
µA  
Shutdown Hysteresis  
Output Section  
@
OUT_A High  
Saturation  
MOS Device Iout =  
5
3
6
10  
9
A
-10mA,  
@
Bipolar Device Vcc/2  
OUTPUT_A Peak  
Current Sink  
OUT_A Low  
Saturation  
@
MOS Device Iout =  
10mA,  
OUTPUT_A Rise Time Cgate = 2.2nF  
20  
15  
10  
ns  
ns  
OUTPUT_A Fall Time  
OUT_B High  
Cgate = 2.2nF  
@
MOS Device Iout =  
20  
Saturation  
-10mA,  
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6
Electrical Characteristics (Continued)  
Specifications with standard typeface are for TJ = 25˚C, and those with boldface type apply over full Operating Junction  
Temperature range. VIN = 48V, VCC = 10V, RT = 31.3k, RSET = 27.4k) unless otherwise stated (Note 3)  
Symbol  
Parameter  
OUTPUT_B Peak  
Current Sink  
Conditions  
Min  
Typ  
Max  
Units  
@
Bipolar Device Vcc/2  
1
A
@
OUT_B Low  
MOS Device Iout =  
12  
18  
Saturation  
10mA,  
OUTPUT_B Rise Time Cgate = 1nF  
20  
15  
ns  
ns  
OUTPUT_B Fall Time  
Cgate = 1nF  
Output Timing Control  
Overlap Time  
RSET = 38 kconnected to  
GND, 50% to 50%  
transitions  
75  
75  
105  
105  
135  
135  
ns  
ns  
Deadtime  
RSET = 29.5 kconnected  
to REF, 50% to 50%  
transitions  
Thermal Shutdown  
TSD  
Thermal Shutdown  
165  
25  
˚C  
˚C  
Threshold  
Thermal Shutdown  
Hysteresis  
Thermal Resistance  
θJA Junction to Ambient  
MTC Package  
SDA Package  
125  
32  
˚C/W  
˚C/W  
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device  
is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.  
Note 2: For detailed information on soldering plastic TSSOP and LLP packages, refer to the Packaging Data Book available from National Semiconductor  
Corporation.  
Note 3: All limits are guaranteed. All electrical characteristics having room temperature limits are tested during production with T = T = 25˚C. All hot and cold limits  
A
J
are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.  
Note 4: Device thermal limitations may limit usable range.  
7
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Typical Performance Characteristics  
VCC Regulator Start-up Characteristics, VCC vs Vin  
VCC vs ICC  
20107403  
20107404  
VREF vs IREF  
Oscillator Frequency vs RT  
20107405  
20107406  
Overlap Time vs Temperature  
RSET = 38K  
Overlap Time vs RSET  
20107407  
20107408  
www.national.com  
8
Typical Performance Characteristics (Continued)  
Dead Time vs Temperature  
RSET = 29.5K  
Dead Time vs RSET  
20107409  
20107410  
SS Pin Current vs Temperature  
20107411  
9
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When the converter auxiliary winding is inactive, external  
current draw on the VCC line should be limited so the power  
dissipated in the start-up regulator does not exceed the  
maximum power dissipation of the controller.  
Detailed Operating Description  
The LM5025A is a functional variant of the LM5025 active  
clamp PWM controller. The functional differences of the  
LM5025A are:  
An external start-up regulator or other bias rail can be used  
instead of the internal start-up regulator by connecting the  
VCC and the VIN pins together and feeding the external bias  
voltage into the two pins.  
The CS1 and CS2 current limit thresholds have been in-  
creased to 0.5V.  
The internal CS2 filter discharge device has been disabled  
and no longer operates each clock cycle.  
The internal VCC and VREF regulators continue to operate  
when the line UVLO pin is below threshold.  
Line Under-Voltage Detector  
The LM5025A contains a line Under Voltage Lock Out  
(UVLO) circuit. An external set-point voltage divider from Vin  
to GND, sets the operational range of the converter. The  
divider must be designed such that the voltage at the UVLO  
pin will be greater than 2.5V when Vin is in the desired  
operating range. If the undervoltage threshold is not met,  
both outputs are disabled,all other functions of the controller  
remain active. UVLO hysteresis is accomplished with an  
internal 20uA current source that is switched on or off into  
the impedance of the set-point divider. When the UVLO  
threshold is exceeded, the current source is activated to  
instantly raise the voltage at the UVLO pin. When the UVLO  
pin voltage falls below the 2.5V threshold, the current source  
is turned off causing the voltage at the UVLO pin to fall. The  
UVLO pin can also be used to implement a remote enable /  
disable function. Pulling the UVLO pin below the 2.5V  
threshold disables the PWM outputs.  
The LM5025A PWM controller contains all of the features  
necessary to implement power converters utilizing the Active  
Clamp Reset technique. The device can be configured to  
control either a P-Channel clamp switch or an N-Channel  
clamp switch. With the active clamp technique higher effi-  
ciencies and greater power densities can be realized com-  
pared to conventional catch winding or RDC clamp / reset  
techniques. Two control outputs are provided, the main  
power switch control (OUT_A) and the active clamp switch  
control (OUT_B). The active clamp output can be configured  
for either a guaranteed overlap time (for P-Channel switch  
applications) or a guaranteed dead time (for N_Channel  
applications). The two internal compound gate drivers paral-  
lel both MOS and Bipolar devices, providing superior gate  
drive characteristics. This controller is designed for high-  
speed operation including an oscillator frequency range up  
to 1MHz and total PWM and current sense propagation  
delays less than 100ns. The LM5025A includes a high-  
voltage start-up regulator that operates over a wide input  
range of 13V to 90V. Additional features include: Line Under  
Voltage Lockout (UVLO), softstart, oscillator UP/DOWN sync  
capability, precision reference and thermal shutdown.  
PWM Outputs  
The relative phase of the main (OUT_A) and active clamp  
outputs (OUT_B) can be configured for the specific applica-  
tion. For active clamp configurations utilizing a ground refer-  
enced P-Channel clamp switch, the two outputs should be in  
phase with the active clamp output overlapping the main  
output. For active clamp configurations utilizing a high side  
N-Channel switch, the active clamp output should be out of  
phase with main output and there should be a dead time  
between the two gate drive pulses. A distinguishing feature  
of the LM5025A is the ability to accurately configure either  
dead time (both off) or overlap time (both on) of the gate  
driver outputs. The overlap / deadtime magnitude is con-  
trolled by the resistor value connected to the TIME pin of the  
controller. The opposite end of the resistor can be connected  
to either REF for deadtime control or GND for overlap con-  
trol. The internal configuration detector senses the connec-  
tion and configures the phase relationship of the main and  
active clamp outputs. The magnitude of the overlap/dead  
time can be calculated as follows:  
High Voltage Start-Up Regulator  
The LM5025A contains an internal high voltage start-up  
regulator that allows the input pin (VIN) to be connected  
directly to the line voltage. The regulator output is internally  
current limited to 20mA. When power is applied, the regula-  
tor is enabled and sources current into an external capacitor  
connected to the VCC pin. The recommended capacitance  
range for the VCC regulator is 0.1µF to 100µF. When the  
voltage on the VCC pin reaches the regulation point of 7.6V  
and the internal voltage reference (REF) reaches its regula-  
tion point of 5V, the controller outputs are enabled. The  
outputs will remain enabled until VCC falls below 6.2V or the  
line Under Voltage Lock Out detector indicates that VIN is out  
of range. In typical applications, an auxiliary transformer  
winding is connected through a diode to the VCC pin. This  
winding must raise the VCC voltage above 8V to shut off the  
internal start-up regulator. Powering VCC from an auxiliary  
winding improves efficiency while reducing the controller  
power dissipation.  
Overlap Time (ns) = 2.8 x RSET - 1.2  
Dead Time (ns) = 2.9 x RSET +20  
RSET in k, Time in ns  
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10  
PWM Outputs (Continued)  
20107412  
FIGURE 1.  
the internal 5V reference and COMP, can be used as the  
pull-up for an optocoupler. The comparator polarity is such  
that 0V on the COMP pin will produce a zero duty cycle on  
both gate driver outputs.  
Compound Gate Drivers  
The LM5025A contains two unique compound gate drivers,  
which parallel both MOS and Bipolar devices to provide high  
drive current throughout the entire switching event. The Bi-  
polar device provides most of the drive current capability and  
provides a relatively constant sink current which is ideal for  
driving large power MOSFETs. As the switching event nears  
conclusion and the Bipolar device saturates, the internal  
MOS device continues to provide a low impedance to com-  
pete the switching event.  
Volt Second Clamp  
The Volt x Second Clamp comparator compares the ramp  
signal (RAMP) to a fixed 2.5V reference. By proper selection  
of RFF and CFF, the maximum ON time of the main switch  
can be set to the desired duration. The ON time set by Volt  
x Second Clamp varies inversely with the line voltage be-  
cause the RAMP capacitor is charged by a resistor con-  
nected to Vin while the threshold of the clamp is a fixed  
voltage (2.5V). An example will illustrate the use of the Volt x  
Second Clamp comparator to achieve a 50% duty cycle limit,  
at 200KHz, at a 48V line input: A 50% duty cycle at a 200KHz  
requires a 2.5µs of ON time. At 48V input the Volt x Second  
product is 120V x µs (48V x 2.5µs). To achieve this clamp  
level:  
During turn-off at the Miller plateau region, typically around  
2V - 3V, is where gate driver current capability is needed  
most. The resistive characteristics of all MOS gate drivers  
are adequate for turn-on since the supply to output voltage  
differential is fairly large at the Miller region. During turn-off  
however, the voltage differential is small and the current  
source characteristic of the Bipolar gate driver is beneficial to  
provide fast drive capability.  
RFF x CFF = VIN x TON / 2.5V  
48 x 2.5µ / 2.5 = 48µ  
Select CFF = 470pF  
RFF = 102kΩ  
The recommended capacitor value range for CFF is 100pF  
to 1000pF.  
The CFF ramp capacitor is discharged at the conclusion of  
every cycle by an internal discharge switch controlled by  
either the internal clock or by the V x S Clamp comparator,  
whichever event occurs first.  
Current Limit  
The LM5025A contains two modes of over-current protec-  
tion. If the sense voltage at the CS1 input exceeds 0.5V the  
present power cycle is terminated (cycle-by-cycle current  
limit). If the sense voltage at the CS2 input exceeds 0.5V, the  
controller will terminate the present cycle, discharge the  
softstart capacitor and reduce the softstart current source to  
1µA. The softstart (SS) capacitor is released after being fully  
discharged and slowly charges with a 1µA current source.  
When the voltage at the SS pin reaches approximately 1V,  
20107413  
PWM Comparator  
The PWM comparator compares the ramp signal (RAMP) to  
the loop error signal (COMP). This comparator is optimized  
for speed in order to achieve minimum controllable duty  
cycles. The internal 5kpull-up resistor, connected between  
11  
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b) An external over-current timer can be configured which  
trips after a pre-determined over-current time, driving the  
CS2 input high, initiating a hiccup event.  
Current Limit (Continued)  
the PWM comparator will produce the first output pulse at  
OUT_A. After the first pulse occurs, the softstart current  
source will revert to the normal 20µA level. Fully discharging  
and then slowly charging the SS capacitor protects a con-  
tinuously over-loaded converter with a low duty cycle hiccup  
mode.  
c) In a closed loop voltage regulaton system, the COMP  
input will rise to saturation when the cycle-by-cycle current  
limit is active. An external filter/delay timer and voltage di-  
vider can be configured between the COMP pin and the CS2  
pin to scale and delay the COMP voltage. If the CS2 pin  
voltage reaches 0.5V a hiccup event will initiate.  
These two modes of over-current protection allow the user  
great flexibility to configure the system behavior in over-load  
conditions. If it is desired for the system to act as a current  
source during an over-load, then the CS1 cycle-by-cycle  
current limiting should be used. In this case the current  
sense signal should be applied to the CS1 input and the CS2  
input should be grounded. If during an overload condition it is  
desired for the system to briefly shutdown, followed by soft-  
start retry, then the CS2 hiccup current limiting mode should  
be used. In this case the current sense signal should be  
applied to the CS2 input and the CS1 input should be  
grounded. This shutdown / soft-start retry will repeat indefi-  
nitely while the over-load condition remains. The hiccup  
mode will greatly reduce the thermal stresses to the system  
during heavy overloads. The cycle-by-cycle mode will have  
higher system thermal dissipations during heavy overloads,  
but provides the advantage of continuous operation for short  
duration overload conditions.  
A small RC filter, located near the controller, is recom-  
mended for each of the CS pins. The CS1 input has an  
internal FET which discharges the current sense filter ca-  
pacitor at the conclusion of every cycle, to improve dynamic  
performance. This same FET remains on an additional 50ns  
at the start of each main switch cycle to attenuate the leading  
edge spike in the current sense signal. The CS2 discharge  
FET only operates following a CS2 event, UVLO and thermal  
shutdown.  
The LM5025A CS comparators are very fast and may re-  
spond to short duration noise pulses. Layout considerations  
are critical for the current sense filter and sense resistor. The  
capacitor associated with the CS filter must be placed very  
close to the device and connected directly to the pins of the  
IC (CS and GND). If a current sense transformer is used,  
both leads of the transformer secondary should be routed to  
the filter network , which should be located close to the IC. If  
a sense resistor in the source of the main switch MOSFET is  
used for current sensing, a low inductance type of resistor is  
required. When designing with a current sense resistor, all of  
the noise sensitive low power ground connections should be  
connected together near the IC GND and a single connec-  
tion should be made to the power ground (sense resistor  
ground point).  
It is possible to utilize both over-current modes concurrently,  
whereby slight overload conditions activate the CS1 cycle-  
by-cycle mode while more severe overloading activates the  
CS2 hiccup mode. Generally the CS1 input will always be  
configured to monitor the main switch FET current each  
cycle. The CS2 input can be configured in several different  
ways depending upon the system requirements.  
a) The CS2 input can also be set to monitor the main switch  
FET current except scaled to a higher threshold than CS1  
20107414  
chronization feature is not required, the SYNC pin should be  
connected to GND to prevent any abnormal interference .  
The internal oscillator can be completely disabled by con-  
necting the RT pin to REF. Once disabled, the sync signal  
will act directly as the master clock for the controller. Both the  
frequency and the maximum duty cycle of the PWM control-  
ler can be controlled by the SYNC signal (within the limita-  
tions of the Volt x Second Clamp). The maximum duty cycle  
(D) will be (1-D) of the SYNC signal.  
Oscillator and Sync Capability  
The LM5025A oscillator is set by a single external resistor  
connected between the RT pin and GND. To set a desired  
oscillator frequency (F), the necessary RT resistor can be  
calculated from:  
RT = (5725/F)1.026  
where F is in kHz and RT in k.  
The RT resistor should be located very close to the device  
and connected directly to the pins of the IC (RT and GND).  
Feed-Forward Ramp  
A unique feature of LM5025A is the ability to synchronize the  
oscillator to an external clock with a frequency that is either  
higher or lower than the frequency of the internal oscillator.  
The lower frequency sync frequency range is 80% of the free  
running internal oscillator frequency. There is no constraint  
on the maximum SYNC frequency. A minimum pulse width of  
100ns is required for the synchronization clock . If the syn-  
An external resistor (RFF) and capacitor (CFF) connected to  
VIN and GND are required to create the PWM ramp signal.  
The slope of the signal at the RAMP pin will vary in propor-  
tion to the input line voltage. This varying slope provides line  
feedforward information necessary to improve line transient  
response with voltage mode control. The RAMP signal is  
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12  
discharged. When the fault condition is no longer present a  
softstart sequence will be initiated. Following a second level  
current limit detection (CS2), the softstart current source is  
reduced to 1µA until the first output pulse is generated by the  
PWM comparator. The current source returns to the nominal  
Feed-Forward Ramp (Continued)  
compared to the error signal at the COMP pin by the pulse  
width modulator comparator to control the duty cycle of the  
main switch output. The Volt Second Clamp comparator also  
monitors the RAMP pin and if the ramp amplitude exceeds  
2.5V the present cycle is terminated. The ramp signal is  
reset to GND at the end of each cycle by either the internal  
clock or the Volt Second comparator, which ever occurs first.  
~
20µA level after the first output pulse ( 1V at the SS pin).  
Thermal Protection  
Internal Thermal Shutdown circuitry is provided to protect the  
integrated circuit in the event the maximum junction tem-  
perature is exceeded. When activated, typically at 165˚C,  
the controller is forced into a low power standby state with  
the output drivers and the bias regulator disabled. The de-  
vice will restart after the thermal hysteresis (typically 25˚C).  
During a restart after thermal shutdown, the softstart capaci-  
tor will be fully discharged and then charged in the low  
current mode (1µA) similar to a second level current limit  
event. The thermal protection feature is provided to prevent  
catastrophic failures from accidental device overheating.  
Soft-start  
The softstart feature allows the power converter to gradually  
reach the initial steady state operating point, thus reducing  
start-up stresses and surges. At power on, a 20µA current is  
sourced out of the softstart pin (SS) into an external capaci-  
tor. The capacitor voltage will ramp up slowly and will limit  
the COMP pin voltage and therefore the PWM duty cycle. In  
the event of a fault as determined by VCC undervoltage, line  
undervoltage (UVLO) or second level current limit, the output  
gate drivers are disabled and the softstart capacitor is fully  
13  
www.national.com  
www.national.com  
14  
Physical Dimensions inches (millimeters)  
unless otherwise noted  
Molded TSSOP-16  
NS Package Number MTC16  
Note: It is recommended that the exposed pad be connected to Pin 11 (AGND)  
16-Lead LLP Surface Mount Package  
NS Package Number SDA16A  
15  
www.national.com  
Notes  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
BANNED SUBSTANCE COMPLIANCE  
National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship  
Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned  
Substances’’ as defined in CSP-9-111S2.  
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Fax: +49 (0) 180-530 85 86  
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