LMV1032UP-15 [NSC]
Amplifiers for 3 Wire Analog Electret Microphones; 放大器3线模拟驻极体麦克风
| 型号： | LMV1032UP-15 |
| 厂家： | 
National Semiconductor |
| 描述： | Amplifiers for 3 Wire Analog Electret Microphones |
| 文件： | 总11页 (文件大小：405K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
February 2004
LMV1032-06/LMV1032-15/LMV1032-25
Amplifiers for 3 Wire Analog Electret Microphones
General Description
Features
The LMV1032 is an audio amplifier series for small form
factor electret microphones. It is designed to replace the
JFET preamp currently being used. The LMV1032 series is
ideal for extended battery life applications, such as a blue-
tooth communication link. The addition of a third pin in
electret microphones that incorporate the LMV1032 allows
for a dramatic reduction in supply current as compared to the
JFET equipped electret microphone. Microphone supply cur-
rent is thus reduced to 60 µA, assuring longer battery life.
The LMV1032 series is guaranteed for supply voltages from
1.7V to 5V, and has fixed voltage gains of 6 dB, 15 dB and 25
dB.
(Typical LMV1032-06, 1.7V Supply; Unless Otherwise
Noted)
n Output voltage noise (A-weighted)
n Low supply current
n Supply voltage
−97 dBV
60 µA
1.7V to 5V
84 dB
n PSRR
n Signal to noise ratio
n Input capacitance
n Input impedance
n Output impedance
n Max input signal
n Temperature range
58 dB
2 pF
>
100 MΩ
<
200Ω
300 mVPP
−40˚C to 85˚C
The LMV1032 series offers low output impedance over the
voice bandwidth, excellent power supply rejection (PSRR),
and stability over temperature.
n Offered in 1.13 x 1.13 x 0.4mm Ultra Thin micro SMD
lead free (NOPB) package
The devices are offered in space saving 4-bump ultra thin
micro SMD (TM) lead free package and are thus ideally
suited for the form factor of miniature electret microphone
packages.
Applications
n Mobile communications - Bluetooth
n Automotive accessories
n Cellular phones
n PDAs
n Accessory microphone products
Block Diagram
Electret Microphone
20084202
20084201
© 2004 National Semiconductor Corporation
DS200842
www.national.com
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature Range
Junction Temperature (Note 6)
Mounting Temperature
−65˚C to 150˚C
150˚C max
Infrared or Convection (20 sec.)
235˚C
ESD Tolerance (Note 2)
Human Body Model
Machine Model
Supply Voltage
VDD - GND
2500V
250V
Operating Ratings (Note 1)
Supply Voltage
1.7V to 5V
Temperature Range
−40˚C to +85˚C
5.5V
1.7V and 5V Electrical Characteristics (Note 3)
Unless otherwise specified, all limits guaranteed for TJ = 25˚C and VDD = 1.7V and 5V. Boldface limits apply at the tempera-
ture extremes.
Min
(Note 4)
Typ
(Note 5)
60
Max
(Note 4)
85
Symbol
Parameter
Supply Current
Conditions
Units
IDD
VIN = GND
VDD = 1.7V
µA
100
SNR
Signal to Noise Ratio
LMV1032-06
LMV1032-15
LMV1032-25
LMV1032-06
LMV1036-15
LMV1032-25
LMV1032-06
58
61
61
59
61
62
75
VIN = 18 mVPP
f = 1 kHz
dB
dB
VDD = 5V
VIN = 18 mVPP
f = 1 kHz
<
<
PSRR
Power Supply Rejection Ratio
1.7V VDD 5V
65
60
60
55
55
50
LMV1032-15
LMV1032-25
70
65
VIN
Max Input Signal
f = 1kHz and THD+N LMV1032-06
300
170
60
<
1%
LMV1032-15
LMV1032-25
mVPP
Hz
fLOW
fHIGH
Lower −3 dB Roll Off Frequency RSOURCE = 50Ω
VIN = 18 mVPP
70
Upper −3 dB Roll Off Frequency RSOURCE = 50Ω
VIN = 18 mVPP
LMV1032-06
LMV1032-15
LMV1032-25
LMV1032-06
LMV1032-15
LMV1032-25
LMV1032-06
LMV1032-15
LMV1032-25
120
75
kHz
21
en
Output Noise
A-Weighted
VIN = GND
f = 1 kHz
−97
−89
−80
300
500
600
dBV
VOUT
Output Voltage
100
250
300
500
750
mV
1000
<
RO
IO
Output Impedance
Output Current
200
Ω
VDD = 1.7V, VOUT = 1.7V, Sinking
VDD = 1.7V, VOUT = 0V, Sourcing
VDD = 5V, VOUT = 1.7V, Sinking
VDD = 5V, VOUT = 0V, Sourcing
0.9
0.5
0.3
0.2
0.9
0.5
0.4
0.1
2.3
0.64
2.4
mA
1.46
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2
1.7V and 5V Electrical Characteristics (Note 3) (Continued)
Unless otherwise specified, all limits guaranteed for TJ = 25˚C and VDD = 1.7V and 5V. Boldface limits apply at the tempera-
ture extremes.
Min
(Note 4)
Typ
(Note 5)
0.11
0.13
0.35
2
Max
(Note 4)
Symbol
Parameter
Conditions
Units
THD
Total Harmonic Distortion
f = 1 kHz
LMV1032-06
LMV1032-15
LMV1032-25
VIN = 18 mVPP
%
CIN
ZIN
AV
Input Capacitance
Input Impedance
Gain
pF
>
6.2
100
MΩ
f = 1 kHz
LMV1032-06
LMV1032-15
LMV1032-25
5.5
4.5
14.8
14
6.7
7.7
16
VIN = 18 mVPP
15.4
25.5
dB
17
24.8
24
26.2
27
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human Body Model (HBM) is 1.5 kΩ in series with 100 pF.
Note 3: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
>
the device such that T = T . No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where T
J
T .
J
A
A
Note 4: All limits are guaranteed by design or statistical analysis.
Note 5: Typical values represent the most likely parametric norm.
Note 6: The maximum power dissipation is a function of T
, θ and T . The maximum allowable power dissipation at any ambient temperature is P
=
D
J(MAX)
JA
A
(T
- T )/θ . All numbers apply for packages soldered directly into a PC board.
J(MAX)
A JA
3
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Connection Diagram
4-Bump Ultra Thin micro SMD
20084203
Top View
Note: - Pin numbers are referenced to package marking text orientation.
- The actual physical placement of the package marking will vary slightly from part to part. The package will designate the date code and will vary considerably.
Package marking does not correlate to device type in any way.
Ordering Information
Package
Part Number
LMV1032UP-06
LMV1032UPX-06
LMV1032UP-15
LMV1032UPX-15
LMV1032UP-25
LMV1032UPX-25
Package Marking
Transport Media
NSC Drawing
250 Units Tape and Reel
3k Units Tape and Reel
250 Units Tape and Reel
3k Units Tape and Reel
250 Units Tape and Reel
3k Units Tape and Reel
Date Code
4-Bump Ultra Thin
Date Code
Date Code
UPA04QQA
micro SMD lead free
Note: The LMV1032 series is offered only with lead free (NOPB) solder bumps.
The LMV1032 series replaces the LMV1014.
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4
Typical Performance Characteristics Unless otherwise specified, VS = 1.7V, single supply, TA
=
25˚C
Supply Current vs. Supply Voltage (LMV1032-06)
Supply Current vs. Supply Voltage (LMV1032-15)
20084204
20084213
Closed Loop Gain and Phase vs. Frequency
(LMV1032-06)
Supply Current vs. Supply Voltage (LMV1032-25)
20084205
20084214
Closed Loop Gain and Phase vs. Frequency
(LMV1032-15)
Closed Loop Gain and Phase vs. Frequency
(LMV1032-25)
20084216
20084215
5
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Typical Performance Characteristics Unless otherwise specified, VS = 1.7V, single supply, TA
=
25˚C (Continued)
Power Supply Rejection Ratio vs. Frequency
(LMV1036-06)
Power Supply Rejection Ratio vs. Frequency
(LMV1032-15)
20084206
20084217
Power Supply Rejection Ratio vs. Frequency
(LMV1032-25)
Total Harmonic Distortion vs. Frequency (LMV1032-06)
20084207
20084218
Total Harmonic Distortion vs. Frequency (LMV1032-15)
Total Harmonic Distortion vs. Frequency (LMV1032-25)
20084219
20084220
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6
Typical Performance Characteristics Unless otherwise specified, VS = 1.7V, single supply, TA
=
25˚C (Continued)
Total Harmonic Distortion vs. Input Voltage
(LMV1032-06)
Total Harmonic Distortion vs. Input Voltage
(LMV1032-15)
20084208
20084221
Total Harmonic Distortion vs. Input Voltage
(LMV1032-25)
Output Voltage Noise vs. Frequency (LMV1032-06)
20084223
20084222
Output Voltage Noise vs. Frequency (LMV1032-15)
Output Voltage Noise vs. Frequency (LMV1032-25)
20084224
20084225
7
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Application Section
LOW CURRENT
The LMV1032 has low supply current for a longer battery life.
The low supply current makes this amplifier suitable for
microphone applications which need to be always on.
BUILT IN GAIN
The LMV1032 is offered in space saving small micro SMD
package in order to fit in the metal can of a microphone. The
LMV1032 is placed on the PCB inside the microphone.
The bottom side of the PCB has the pins that connect the
supply voltage to the amplifier and make the output avail-
able. The input of the amplifier is connected inside the metal
can via the PCB to the microphone.
20084209
FIGURE 2. A-Weighted Filter
MEASURING NOISE AND SNR
The overall noise of the LMV1032 is measured within the
frequency band from 10 Hz to 22 kHz using an A-weighted
filter. The input of the LMV1032 is connected to ground with
a 5 pF capacitor.
20084202
FIGURE 1. Built-in Gain
A-WEIGHTED FILTER
The human ear has a frequency range from 20 Hz to about
20 kHz. Within this range the sensitivity of the human ear is
not equal for each frequency. To approach the hearing re-
sponse weighting filters are introduced. One of those filters
is the A-weighted filter.
20084210
The A-weighted filter is usually used in signal to noise ratio
measurements, where sound is compared to device noise. It
improves the correlation of the measured data to the signal
to noise ratio perceived by the human ear.
FIGURE 3. Noise Measurement Setup
Signal to noise ratio (SNR) is measured with a 1 kHz input
signal of 18 mVPP using an A-weighted filter. This represents
a sound pressure level of 94 dB SPL. No input capacitor is
connected.
SOUND PRESSURE LEVEL
The volume of sound applied to a microphone is usually
stated as a pressure level referred to the threshold of hear-
ing of the human ear. The sound pressure level (SPL) in
decibels is defined by:
Sound pressure level (dB) = 20 log Pm/PO
Where,
Pm is the measured sound pressure
PO is the threshold of hearing (20µPa)
In order to be able to calculate the resulting output voltage of
the microphone for a given SPL, the sound pressure in dB
SPL needs to be converted to the absolute sound pressure
in dBPa. This is the sound pressure level in decibels referred
to 1 Pascal (Pa).
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8
Application Section (Continued)
The conversion is given by:
dBPa = dB SPL + 20*log 20 µPa
dBPa = dB SPL - 94 dB
Translation from absolute sound pressure level to a voltage
is specified by the sensitivity of the microphone. A conven-
tional microphone has a sensitivity of −44 dBV/Pa.
20084212
FIGURE 5. Gain vs. Frequency Over Temperature
The LMV1032 is optimized to be used in audio band appli-
cations. By using the LMV1032, the gain response is flat
within the audio band and has the linearity and temperature
stability.
ADVANTAGE OF THREE PINS
20084211
The LMV1032 has three pins instead of two pins as in the
case of a JFET solution. The third pin brings the advantage
of a low supply current, high PSRR and eliminates the need
for additional components.
FIGURE 4. dB SPL to dBV Conversion
Example: Busy traffic is 70 dB SPL
VOUT = 70 −94 −44 = −68 dBV
This is equivalent to 1.13 mVPP
Noise pick-up by a microphone in a cell phone is a well-
known problem. A conventional JFET circuit is sensitive for
noise pick-up because of its high output impedance. The
output impedance is usually around 2.2 kΩ. By separating
the output pin and the positive supply pin a much lower
output impedance is achieved. The output of the LMV1032 is
therefore less sensitive to noise pick-up.
Since the LMV1032-06 has a gain of 2 (6 dB) over the JFET,
the output voltage of the microphone is 2.26 mVPP. By
implementing the LMV1032-06, the sensitivity of the micro-
phone is −38 dBV/Pa (−44 + 6).
RF noise is amongst other caused by non-linear behavior.
The non-linear behavior of the amplifier at high frequencies,
well above the usable bandwidth of the device, causes AM-
demodulation of high frequency signals. The AM modulation
contained in such signals folds back into the audio band,
thereby disturbing the intended microphone signal. The
GSM signal of a cell phone is such an AM-modulated signal.
The modulation frequency of 216 Hz and its harmonics can
be observed in the audio band. This kind of noise is called
bumblebee noise.
LOW FREQUENCY CUT OFF FILTER
To reduce noise on the output of the microphone a low cut
filter has been implemented. This filter reduces the effect of
wind and handling noise.
It’s also helpful to reduce the proximity effect in directional
microphones. This effect occurs when the sound source is
very close to the microphone. The lower frequencies are
amplified which gives a bass sound. This amplification can
cause an overload, which results in a distortion of the signal.
9
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Physical Dimensions inches (millimeters)
unless otherwise noted
NOTE: UNLESS OTHERWISE SPECIFIED.
1. TITANIUM COATING.
2. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB
PAGE (www.national.com).
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211. VARIATION BC.
4-Bump Ultra Thin micro SMD
NS Package Number UPA04QQA
X1 = 1.133mm X2 = 1.133mm X3 = 0.4mm
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10
Notes
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