LMX1600 [NSC]

PLLatinum⑩ Low Cost Dual Frequency Synthesizer; 半导体PLLatinum ™低成本双频合成器
LMX1600
型号: LMX1600
厂家: National Semiconductor    National Semiconductor
描述:

PLLatinum⑩ Low Cost Dual Frequency Synthesizer
半导体PLLatinum ™低成本双频合成器

半导体
文件: 总14页 (文件大小:200K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PRELIMINARY  
March 1998  
LMX1600/LMX1601/LMX1602  
PLLatinum Low Cost Dual Frequency Synthesizer  
LMX1600  
LMX1601  
LMX1602  
2.0 GHz/500 MHz  
1.1 GHz/500 MHz  
1.1 GHz/1.1 GHz  
General Description  
The LMX1600/01/02 is part of a family of monolithic inte-  
grated dual frequency synthesizers designed to be used in a  
local oscillator subsystem for a radio transceiver. It is fabri-  
cated using National’s 0.5u ABiC V silicon BiCMOS process.  
Features  
n VCC = 2.7V to 3.6V operation  
n Low current consumption:  
@
4 mA 3V (typ) for LMX1601  
The LMX1600/01/02 contains two dual modulus prescalers,  
four programmable counters, two phase detectors and two  
selectable gain charge pumps necessary to provide the con-  
trol voltage for two external loop filters and VCO loops. Digi-  
tal filtered lock detects for both PLLs are included. Data is  
@
5 mA 3V (typ) for LMX1600 or LMX1602  
n PLL Powerdown mode: ICC = 1 µA typical  
n Dual modulus prescaler:  
— 2 GHz/500 MHz option:  
— 1.1 GHz/500 MHz option: (Main) 16/17 (Aux) 8/9  
— 1.1 GHz/1.1 GHz option:  
n Digital Filtered Lock Detects  
(Main) 32/33 (Aux) 8/9  
transferred into the LMX1600/01/02 via a MICROWIRE  
serial interface (Data, Clock, LE).  
(Main) 16/17 (Aux) 16/17  
VCC supply voltage can range from 2.7V to 3.6V. The  
LMX1600/01/02 features very low current consumption -  
typically 4.0 mA at 3V for LMX1601, 5.0 mA at 3V for  
LMX1600 or LMX1602. Powerdown for the PLL is hardware  
controlled.  
Applications  
n Cordless / Cellular / PCS phones  
n Other digital mobile phones  
The LMX1600/01/02 is available in a 16 pin TSSOP surface  
mount plastic package.  
Functional Block Diagram  
DS100129-1  
TRI-STATE® is a registered trademark of National Semiconductor Corporation.  
MICROWIRE and PLLatinum are trademarks of National Semiconductor Corporation.  
© 1998 National Semiconductor Corporation  
DS100129  
www.national.com  
Connection Diagram  
DS100129-2  
Order Number LMX1600TM, LMX1601TM, or LMX1602TM  
NS Package Number MTC16  
Pin Description  
Pin  
No.  
1
Pin Name  
I/O  
Description  
FoLD  
O
Multiplexed output of the Main/Aux programmable or reference dividers and Main/Aux lock  
detect. CMOS output. (See Programming Description 2.5)  
2
OSCIN  
I
PLL reference input which drives both the Main and Aux R counter inputs. Has about 1.2V  
input threshold and can be driven from an external CMOS or TTL logic gate. Typically  
connected to a TCXO output. Can be used with an external resonator (See Programming  
Description 2.5.4).  
3
4
5
6
OSCOUT  
GND  
O
I
Oscillator output. Used with an external resonator.  
Aux PLL ground.  
finAUX  
Aux prescaler input. Small signal input from the VCO.  
VCC  
Aux PLL power supply voltage input. Must be equal to VCCMAIN. May range from 2.7V to  
3.6V. Bypass capacitors should be placed as close as possible to this pin and be  
connected directly to the ground plane.  
AUX  
7
8
CPoAUX  
ENAUX  
O
I
Aux PLL Charge Pump output. Connected to a loop filter for driving the control input of an  
external VCO.  
Powers down the Aux PLL when LOW (N and R counters, prescaler, and tristates charge  
pump output). Bringing ENAUX HIGH powers up the Aux PLL.  
9
ENMAIN  
CPoMAIN  
I
Powers down the Main PLL when LOW (N and R counters, prescaler, and tristates charge  
pump output). Bringing ENMAIN HIGH powers up the Main PLL.  
10  
11  
O
Main PLL Charge Pump output. Connected to a loop filter for driving the control input of an  
external VCO.  
VCC  
Main PLL power supply voltage input. Must be equal to VCCAUX. May range from 2.7V to  
3.6V. Bypass capacitors should be placed as close as possible to this pin and be  
connected directly to the ground plane.  
MAIN  
12  
13  
14  
finMAIN  
GND  
LE  
I
I
Main prescaler input. Small signal input from the VCO.  
Main PLL ground.  
Load enable high impedance CMOS input. Data stored in the shift registers is loaded into  
one of the 4 internal latches when LE goes HIGH (control bit dependent).  
15  
16  
Data  
I
I
High impedance CMOS input. Binary serial data input. Data entered MSB first. The last two  
bits are the control bits.  
Clock  
High impedance CMOS Clock input. Data for the various counters is clocked in on the  
rising edge, into the 18-bit shift register.  
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2
Absolute Maximum Ratings (Notes 1, 2)  
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Value  
Parameter  
Symbol  
Min  
−0.3  
−0.3  
−0.3  
−65  
Typical  
Max  
6.5  
Unit  
V
VCC  
MAIN  
Power Supply Voltage  
VCC  
6.5  
V
AUX  
Voltage on any pin with GND=0V  
Storage Temperature Range  
Lead Temp. (solder 4 sec)  
VI  
TS  
TL  
VCC + 0.3  
+150  
V
˚C  
˚C  
eV  
+260  
ESD-Human Body Model (Note 2)  
2000  
Recommended Operating Conditions  
Value  
Parameter  
Symbol  
Min  
Typical  
Max  
Unit  
V
VCC  
2.7  
3.6  
MAIN  
Power Supply Voltage  
Operating Temperature  
VCC  
VCC  
VCC  
V
AUX  
MAIN  
MAIN  
TA  
−40  
+85  
˚C  
Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for  
which the device is intended to be functional, but do not guarantee specific performance limits. Electrical Characteristics document specific minimum and/or maxi-  
mum performance values at specified test conditions and are guaranteed. Typical values are for informational purposes only - based on design parameters or device  
characterization and are not guaranteed.  
Note 2: This device is a high performance RF integrated circuit and is ESD sensitive. Handling and assembly of this device should only be done on ESD-free work-  
stations.  
Electrical Characteristics  
(VCC  
= VCC  
= 3.0V; TA = 25˚C except as specified)  
MAIN  
AUX  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
GENERAL  
ICC  
Power  
Supply  
Current  
2 GHz + 500 MHz  
1.1 GHz + 500 MHz  
1.1 GHz + 1.1 GHz  
2 GHz Only  
Crystal Mode (Note 3)  
Crystal Mode (Note 3)  
Crystal Mode (Note 3)  
Crystal Mode (Note 3)  
Crystal Mode (Note 3)  
Crystal Mode (Note 3)  
ENMAIN = LOW, ENAUX = LOW  
fin Main 2 GHz Option  
fin Main and Aux 1.1 GHz Option  
fin Aux 500 MHz Option  
Logic Mode (Note 3)  
5.0  
4.0  
5.0  
3.5  
2.5  
1.5  
1
mA  
mA  
mA  
mA  
1.1 GHz Only  
mA  
500 MHz Only  
mA  
ICC-PWDN  
fin  
Power Down Current  
µA  
fin Operating Frequency  
200  
100  
40  
1
2000  
1100  
500  
40  
MHz  
MHz  
MHz  
MHz  
MHz  
VPP  
MHz  
dBm  
OSCIN  
Oscillator Operating Frequency  
Crystal Mode (Note 3)  
1
20  
VOSC  
fφ  
Oscillator Input Sensitivity  
0.5  
VCC  
Maximum Phase Detector Frequency  
Main and Aux RF Input Sensitivity  
10  
Pfin  
−15  
0
CHARGE PUMP  
ICPo-source  
ICPo-sink  
ICPo-source  
ICPo-sink  
ICPo-Tri  
RF Charge Pump Output Current  
(See Programming Description 2.4)  
VCPo = VCC/2, High Gain Mode  
VCPo = VCC/2, High Gain Mode  
VCPo = VCC/2, Low Gain Mode  
VCPo = VCC/2, Low Gain Mode  
0.5 VCPo VCC−0.5  
−1600  
1600  
−160  
160  
µA  
µA  
µA  
µA  
nA  
Charge Pump TRI-STATE® Current  
1
DIGITAL INTERFACE (DATA, CLK, LE, EN, FoLD)  
VIH  
VIL  
High-Level Input Voltage  
Low-Level Input Voltage  
0.8VCC  
V
V
0.2VCC  
3
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Electrical Characteristics (Continued)  
(VCC  
= VCC  
= 3.0V; TA = 25˚C except as specified)  
MAIN  
AUX  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
DIGITAL INTERFACE (DATA, CLK, LE, EN, FoLD)  
IIH  
IIL  
IIH  
IIL  
IO  
High-Level Input Current  
Low-Level Input Current  
OSCIN Input Current  
OSCIN Input Current  
VIH = VCC = 3.6V, (Note 4)  
VIL = 0V; VCC = 3.6V, (Note 4)  
VIH = VCC = 3.6V  
−1.0  
−1.0  
1.0  
1.0  
100  
µA  
µA  
µA  
µA  
µA  
VIL = 0V; VCC = 3.6V  
−100  
OSCOUT Output Current Magnitude  
(sink/source) (Note 5)  
Logic Mode  
VCC = 3.6V  
(Note 3)  
|200|  
VOUT = VCC/2  
Crystal Mode  
VCC = 2.7V  
(Note 3)  
|300|  
µA  
VOH  
VOL  
High-Level Output Voltage  
Low-Level Output Voltage  
IOH = −500 µA  
IOL = 500 µA  
VCC−0.4  
V
V
0.4  
MICROWIRE TIMING  
tCS  
Data to Clock Set Up Time  
See Data Input Timing  
See Data Input Timing  
See Data Input Timing  
See Data Input Timing  
See Data Input Timing  
See Data Input Timing  
50  
10  
50  
50  
50  
50  
ns  
ns  
ns  
ns  
ns  
ns  
tCH  
Data to Clock Hold Time  
Clock Pulse Width High  
tCWH  
tCWL  
tES  
Clock Pulse Width Low  
Clock to Load Enable Set Up Time  
Load Enable Pulse Width  
tEW  
CLOSED LOOP SYNTHESIZER PERFORMANCE (NSC evaluation board only)  
RFφn Main PLL Phase Noise Floor (Note 6)  
−160  
dBc/Hz  
Note 3: Refer to Programming Description 2.5.3.  
Note 4: Except fin.  
Note 5: The OSCout Output Current Magnitude is lass than or equal to 200µA when the Logic Mode is selected. The OSCout Output Current Magnitude is greater  
than or equal to 300µA when the Crystal Mode is selected.  
>
OSC  
Note 6: Offset frequency = 1 kHz, fin = 900 MHz, fφ = 25 kHz, N = 3600, f  
= 10 MHz, V  
1.2 V . Refer to the Application Note, AN-1052, for description  
PP  
OSC  
of phase noise floor measurement.  
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4
1.0 Functional Description  
The basic phase-lock-loop (PLL) configuration consists of a  
high-stability crystal reference oscillator, a frequency synthe-  
sizer such as the National Semiconductor LMX1600/01/02, a  
voltage controlled oscillator (VCO), and a passive loop filter.  
The frequency synthesizer includes a phase detector, cur-  
rent mode charge pump, as well as programmable reference  
[R], and feedback [N] frequency dividers. The VCO fre-  
quency is established by dividing the crystal reference signal  
down via the R counter to obtain the comparison frequency.  
This reference signal, fr, is then presented to the input of a  
phase/frequency detector and compared with another signal,  
fp, the feedback signal, which was obtained by dividing the  
VCO frequency down using the N counter. The phase/  
frequency detector’s current source outputs pump charge  
into the loop filter, which then converts the charge into the  
VCO’s control voltage. The phase/frequency comparator’s  
function is to adjust the voltage presented to the VCO until  
the feedback signal’s frequency (and phase) match that of  
the reference signal. When this “phase-locked” condition ex-  
ists, the VCO’s frequency will be N times that of the compari-  
son frequency, where N is the divider ratio.  
ured as a 4-bit A Counter and a 12-bit B Counter. These in-  
puts should be AC coupled through external capacitors. (See  
Programming Description 2.3)  
1.3.1 Prescalers  
The RF input to the prescalers consists of the fin pins which  
are one of two complimentary inputs to a differential pair am-  
plifier. The complimentary inputs are internally coupled to  
ground with a 10 pF capacitor and not brought out to a pin.  
The input buffer drives the A counter’s ECL D-type flip flops  
in a dual modulus configuration. A 32/33 for 2.0 GHz option,  
16/17 for 1.1 GHz option, or 8/9 for 500 MHz option prescale  
ratio is provided for the LMX1600/01/02. The prescaler  
clocks the subsequent CMOS flip-flop chain comprising the  
fully programmable A and B counters.  
1.4 PHASE/FREQUENCY DETECTOR  
The Main and Aux phase(/frequency) detectors are driven  
from their respective N and R counter outputs. The maxi-  
mum frequency at the phase detector inputs is 10 MHz (un-  
less limited by the minimum continuous divide ratio of the  
multi modulus prescalers). The phase detector outputs con-  
trol the charge pumps. The polarity of the pump-up or pump-  
down control is programmed using Main_PD_Pol or  
Aux_PD_Pol depending on whether Main or Aux VCO char-  
acteristics are positive or negative. (See Programming De-  
scription 2.4) The phase detector also receives a feedback  
signal from the charge pump in order to eliminate dead zone.  
1.1 REFERENCE OSCILLATOR INPUTS  
The reference oscillator frequency for the Main and Aux  
PLL’s is provided by either an external reference through the  
OSCIN pin with the OSCOUT pin not connected or connected  
to a 30 pF capacitor to ground in Logic Mode, or an external  
crystal resonator across the OSCIN and OSCOUT pins in  
Crystal Mode (See Programming Description 2.5.3). The  
OSCIN input can operate to 40 MHz in Logic Mode or to 20  
MHz in Crystal Mode with an input sensitivity of 0.5 VPP. The  
OSCIN pin drives the Main and Aux R counters. The inputs  
1.5 CHARGE PUMP  
The phase detector’s current source outputs pump charge  
into an external loop filter, which then converts the charge  
into the VCO’s control voltage. The charge pumps steer the  
charge pump output, CPo, to VCC (pump-up) or ground  
z
have a 1.2V input threshold and can be driven from an ex-  
ternal CMOS or TTL logic gate. The OSCIN pin is typically  
connected to the output of a Temperature Compensated  
Crystal Oscillator (TCXO).  
(pump-down). When locked, CPo is primarily in  
a
TRI-STATE mode with small corrections. The charge pump  
output current magnitude can be selected as 160 µA or 1600  
µA using bits AUX_CP_GAIN and MAIN_CP_GAIN as  
shown in Programming Description 2.4.  
1.2 REFERENCE DIVIDERS (R COUNTERS)  
The Main and Aux R Counters are clocked through the oscil-  
lator block in common. The maximum frequency is 40 MHz  
in Logic Mode or 20 MHz in crystal Mode. Both R Counters  
are 12-bit CMOS counters with a divide range from 2 to  
4,095. (See Programming Description 2.2)  
1.7 MICROWIRE SERIAL INTERFACE  
The programmable functions are accessed through the MI-  
CROWIRE serial interface. The interface is made of 3 func-  
tions: clock, data, and latch enable (LE). Serial data for the  
various counters is clocked in from data on the rising edge of  
clock, into the 18-bit shift register. Data is entered MSB first.  
The last two bits decode the internal register address. On the  
rising edge of LE, data stored in the shift register is loaded  
into one of the 4 appropriate latches (selected by address  
bits). Data is loaded from the latch to the counter when  
counter reaches to zero. A complete programming descrip-  
tion is included in the following sections.  
1.3 FEEDBACK DIVIDERS (N COUNTERS)  
The Main and Aux N Counters are clocked by the small sig-  
nal fin Main and fin Aux input pins respectively. These inputs  
should be AC coupled through external capacitors. The Main  
N counter has an 16-bit equivalent integer divisor configured  
as a 5-bit A Counter and an 11-bit B Counter offering a con-  
tinuous divide range from 992 to 65,535 (2 GHz option) or a  
4-bit A Counter and a 12-bit B Counter offering a continuous  
divide range from 240 to 65,535 (1.1 GHz option). The Main  
N divider incorporates a 32/33 dual modulus prescaler ca-  
pable of operation from 200 MHz to 2.0 GHz or a 16/17 dual  
modulus prescaler capable of operation from 100 MHz to  
1.1 GHz.  
1.8 FoLD MULTIFUNCTION OUTPUT  
The LMX1600/01/02 programmable output pin (FoLD) can  
deliver the internal counter outputs, digital lock detects, or  
CMOS high/low levels.  
The Aux N divider operates from 100 MHz to 1.1 GHz with a  
16/17 prescaler or from 40 MHz to 500 MHz with a 8/9 pres-  
caler. The Aux N counter is a 16-bit integer divider fully pro-  
grammable from 240 to 65,535 over the frequency range of  
100 MHz to 1.1 GHz or from 56 to 32,767 over the frequency  
range of 40 MHz to 550 MHz. The Aux N counter is config-  
1.8.1 Lock Detect  
A digital filtered lock detect function is included with each  
phase detector through an internal digital filter to produce a  
logic level output available on the Fo/LD output pin, if se-  
lected. The lock detect output is high when the error between  
5
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1.9 POWER CONTROL  
1.0 Functional Description (Continued)  
Each PLL is individually power controlled by the device EN  
pin. The ENMAIN controls the Main PLL, and the ENAUX con-  
trols the Aux PLL. Activation of EN = LOW (power down)  
condition results in the disabling of the respective N and R  
counters and de-biasing of their respective fin inputs (to a  
high impedance state). The reference oscillator input block  
powers down and the OSCIN pin reverts to a high impedance  
state only when both EN pins are LOW. Power down forces  
the respective charge pump and phase comparator logic to a  
TRI-STATE condition as well as disabling the bandgap refer-  
ence block. Power up occurs immediately when the EN pin is  
brought high. Power up sequence: Bandgap and Oscillator  
blocks come up first, with the remaining PLL functions be-  
coming active approx. 1 µs later. All programming informa-  
tion is retained internally in the chip when in power down  
mode. The MICROWIRE control register remains active and  
capable of loading and latching in data during power down  
mode.  
the phase detector inputs is less than 15 ns for 4 consecutive  
comparison cycles. The lock detect output is low when the  
error between the phase detector outputs is more than 30 ns  
for one comparison cycle. The lock detect output is always  
low when the PLL is in power down mode. For further de-  
scription see Programming Description 2.5.  
2.0 Programming Description  
2.1 MICROWIRE INTERFACE  
The descriptions below detail the 18-bit data register loaded through the MICROWIRE Interface. The 18-bit shift register is used  
to program the 12-bit Main and Aux R counter registers and the 16-bit Main and Aux N counter registers. The shift register con-  
sists of a 16-bit DATA field and a 2-bit control (CTL [1:0]) field as shown below. The control bits decode the internal register ad-  
dress. On the rising edge of LE, data stored in the shift register is loaded into one of the 4 appropriate latches (selected by ad-  
dress bits). Data is shifted in MSB first.  
MSB  
LSB  
CTL [1:0]  
DATA [15:0]  
18  
2
1
0
2.1.1 Register Location Truth Table  
When LE transitions high, data is transferred from the 18-bit shift register into one of the 4 appropriate internal latches depending  
upon the state of the control (CTL) bits. The control bits decode the internal register address  
CTL [1:0]  
DATA Location  
AUX_R Register  
0
0
1
1
0
1
0
1
AUX_N Register  
MAIN_R Register  
MAIN_N Register  
2.1.2 Register Content Truth Table  
First Bit  
SHIFT REGISTER BIT LOCATION  
Last Bit  
17 16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
0
0
1
1
0
0
1
0
1
AUX_R  
AUX_N  
MAIN_R  
MAIN_N  
FoLD  
AUX_R_CNTR  
AUX_B_CNTR  
CP_WORD  
AUX_A_CNTR  
MAIN_R_CNTR  
MAIN_B_CNTR and MAIN_A_CNTR  
2.2 PROGRAMMABLE REFERENCE DIVIDERS  
2.2.1 AUX_R Register  
If the Control Bits (CTL [1:0]) are 0 0 when LE transitions high, data is transferred from the 18-bit shift register into a latch which  
sets the Aux PLL 12-bit R counter divide ratio. The divide ratio is programmed using the bits AUX_R_CNTR as shown in table  
2.2.3. The divider ratio must be 2. The FoLD word bits controls the multifunction FoLD output as described in section in 2.5.  
First Bit  
SHIFT REGISTER BIT LOCATION  
Last Bit  
17 16 15 14 13 12 11 10  
FoLD[3:0]  
9
8
7
6
5
4
3
2
1
0
0
0
AUX_R  
AUX_R_CNTR[11:0]  
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6
2.0 Programming Description (Continued)  
2.2.2 MAIN_R REGISTER  
If the Control Bits (CTL [1:0]) are 1 0 when LE transitions high, data is transferred from the 18-bit shift register into a latch which  
sets the Main PLL 12-bit R counter divide ratio and various control functions. The divide ratio is programmed using the bits  
MAIN_R_CNTR as shown in table 2.2.3. The divider ratio must be 2. The charge pump control word (CP_WORD[3:0] ) sets the  
charge pump gain and the phase detector polarity as detailed in 2.4.  
First Bit  
SHIFT REGISTER BIT LOCATION  
Last Bit  
17 16 15 14 13 12 11 10  
CP_WORD[3:0]  
9
8
7
6
5
4
3
2
1
1
0
0
MAIN_R  
MAIN_R_CNTR[11:0]  
2.2.3 12-Bit Programmable Main and Auxiliary Reference Divider Ratio  
(MAIN/AUX R Counter)  
MAIN_R_CNTR/AUX_R_CNTR  
Divide Ratio 11 10  
9
0
0
8
0
0
7
0
0
6
0
0
5
0
0
4
0
0
3
0
0
2
0
0
1
1
1
0
0
1
2
0
0
0
0
3
4,095  
1
1
1
1
1
1
1
1
1
1
1
1
Note 7: Legal divide ratio: 2 to 4,095.  
2.3 PROGRAMMABLE FEEDBACK (N) DIVIDERS  
2.3.1 AUX_N Register  
If the Control Bits ( CTL[1:0]) are 0 1 when LE transitions high, data is transferred from the 18-bit shift register into the AUX_N  
register latch which sets the Aux PLL 16-bit programmable N counter value. The AUX_N counter is a 16-bit counter which is fully  
programmable from 240 to 65,535 for 1.1 GHz option or from 56 to 32,767 for 500 MHz option. The AUX_N register consists of  
the 4-bit swallow counter (AUX_A_CNTR), the 12-bit programmable counter (AUX_B_CNTR). Serial data format is shown below.  
The divide ratio (AUX_N_CNTR [13:0]) must be 240 (1.1 GHz option) or 56 (500 MHz option) for a continuous divide range.  
The Aux PLL N divide ratio is programmed using the bits AUX_A_CNTR, AUX_B_CNTR as shown in tables 2.3.2.  
First Bit  
SHIFT REGISTER BIT LOCATION  
Last Bit  
17 16 15 14 13 12 11 10  
AUX_B_CNTR[11:0]  
9
8
7
6
5
4
3
2
1
0
0
1
AUX_N  
AUX_A_CNTR[3:0]  
2.3.2 4-BIT Swallow Counter Divide Ratio (Aux A COUNTER)  
1.1 GHz option  
500 MHz option  
Swallow  
Swallow  
AUX_A_CNTR  
Count  
AUX_A_CNTR  
Count  
(A)  
0
3
0
0
2
0
0
1
0
0
0
0
1
(A)  
0
3
X
X
2
0
0
1
0
0
0
0
1
1
1
15  
1
1
1
1
7
X
1
1
1
Note 8: Swallow Counter Value: 0 to 15  
Note 9: Swallow Counter Value: 0 to 7  
X = Don’t Care condition  
2.3.3 12-BIT Programmable Counter Divide Ratio (Aux B COUNTER)  
AUX_B_CNTR  
Divide Ratio 11 10  
9
0
0
8
0
0
7
0
0
6
0
0
5
0
0
4
0
0
3
0
0
2
0
1
1
1
0
0
1
0
3
0
0
0
0
4
4,095  
1
1
1
1
1
1
1
1
1
1
1
1
Note 10: Divide ratio: 3 to 4,095 (Divide ratios less than 3 are prohibited)  
AUX_B_CNTR AUX_A_CNTR.  
See section 2.3.7 for calculation of VCO output frequency.  
7
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2.0 Programming Description (Continued)  
2.3.4 MAIN_N Register  
If the Control Bits (CTL[1:0]) are 1 1 when LE transitions high, data is transferred from the 18-bit shift register into the MAIN_N  
register latch which sets 16-bit programmable N divider value. The Main N divider is a 16-bit counter which is fully programmable  
from 992 to 65,535 for 2 GHz option and from 240 to 65,535 for 1.1 GHz option. The MAIN_N register consists of the 5-bit (2 GHz  
option) or 4-bit (1.1 GHz option) swallow counter (MAIN_A_CNTR) and the 11-bit (2 GHz option) or 12-bit (1.1 GHz option) pro-  
grammable counter (MAIN_B_CNTR). Serial data format for the MAIN_N register latch shown below. The divide ratio must be ≥  
992 (2 GHz option) or 240 (1.1 GHz option) for a continuous divide range. The divide ratio is programmed using the bits  
MAIN _A_CNTR and MAIN_B_CNTR as shown in tables 2.3.5 and 2.3.6 The pulse swallow function which determines the divide  
ratio is described in Section 2.3.7.  
2 GHz option  
First Bit  
SHIFT REGISTER BIT LOCATION  
Last Bit  
17 16 15 14 13 12 11 10  
AUX_B_CNTR[10:0]  
9
8
7
6
5
4
3
2
1
1
0
1
MAIN_N  
AUX_A_CNTR[4:0]  
1.1 GHz option  
First Bit  
SHIFT REGISTER BIT LOCATION  
Last Bit  
17 16 15 14 13 12 11 10  
AUX_B_CNTR[11:0]  
9
8
7
6
5
4
3
2
1
1
0
1
MAIN_N  
AUX_A_CNTR[3:0]  
2.3.5 Swallow Counter Divide Ratio (Main A COUNTER)  
2 GHz option (5 bit)  
1.1 GHz option (4 bit)  
Swallow  
Swallow  
MAIN_A_CNTR  
Count  
MAIN_A_CNTR  
Count  
(A)  
0
4
0
0
3
0
0
2
0
0
1
0
0
0
0
1
(A)  
0
3
0
0
2
0
0
1
0
0
0
0
1
1
1
31  
1
1
1
1
1
15  
1
1
1
1
Note 11: Swallow Counter Value: 0 to 31  
Note 12: Swallow Counter Value: 0 to 15  
2.3.6 Programmable Counter Divide Ratio (Main B COUNTER)  
2 GHz option (11 bit)  
MAIN_B_CNTR  
Divide Ratio 10  
9
0
0
8
0
0
7
0
0
6
0
0
5
0
0
4
0
0
3
0
0
2
0
1
1
1
0
0
1
0
3
0
0
4
2,047  
1
1
1
1
1
1
1
1
1
1
1
Note 13: Divide ratio: 3 to 2,047 (Divide ratios less than 3 are prohibited)  
MAIN_B_CNTR MAIN_A_CNTR.  
See section 2.3.7 for calculation of VCO output frequency.  
www.national.com  
8
2.0 Programming Description (Continued)  
1.1 GHz option (12 bit)  
MAIN_B_CNTR  
Divide Ratio 11 10  
9
0
0
8
0
0
7
0
0
6
0
0
5
0
0
4
0
0
3
0
0
2
0
1
1
1
0
0
1
0
3
0
0
0
0
4
4,095  
1
1
1
1
1
1
1
1
1
1
1
1
Note 14: Divide ratio: 3 to 4,095 (Divide ratios less than 3 are prohibited)  
MAIN_B_CNTR MAIN_A_CNTR.  
See section 2.3.7 for calculation of VCO output frequency.  
2.3.7 Pulse Swallow Function  
The N divider counts such that it divides the VCO RF frequency by (P+1) for A times, and then divides by P for (B – A ) times.  
The B value (B_CNTR) must be 3. The continuous divider range for the Main PLL N divider is from 992 to 65,535 for 2 GHz  
option, from 240 to 65,535 for 1.1 GHz option, and from 56 to 32,767 for 500 MHz option. Divider ratios less than the minimum  
value are achievable as long as the binary counter value is greater than or equal to the swallow counter value (B_CNTR ≥  
A_CNTR).  
fVCO = N x ( fOSC / R )  
N = (P x B) + A  
fVCO  
fOSC  
R:  
:
Output frequency of external voltage controlled oscillator (VCO)  
Output frequency of the external reference frequency oscillator (input to OSCIN).  
Preset divide ratio of binary programmable reference counter (R_CNTR)  
Preset divide ratio of main programmable integer N counter (N_CNTR)  
Preset divide ratio of binary programmable B counter (B_CNTR)  
Preset value of binary 4-bit swallow A counter (A _CNTR)  
:
N:  
B:  
A:  
P:  
Preset modulus of dual modulus prescaler (P = 32 for 2 GHz option, P=16 for 1.1 GHz option, and P=8 for 500 MHz  
option)  
2.4 CHARGE PUMP CONTROL WORD (CP_WORD)  
MSB  
LSB  
MAIN_PD_POL  
AUX_CP_GAIN  
MAIN_CP_GAIN  
AUX_PD_POL  
BIT  
LOCATION  
MAIN_R[17]  
MAIN_R[16]  
MAIN_R[15]  
MAIN_R[14]  
FUNCTION  
0
1
AUX_CP_GAIN  
MAIN_CP_GAIN  
AUX_PD_POL  
MAIN_PD_POL  
Aux Charge Pump Current Gain  
Main Charge Pump Current Gain  
Aux Phase Detector Polarity  
Main Phase Detector Polarity  
LOW  
HIGH  
LOW  
HIGH  
Negative  
Negative  
Positive  
Positive  
AUX_CP_GAIN (MAIN_R[17]) and MAIN_CP_GAIN (MAIN_R[16]) are used to select charge pump current magnitude either low  
gain mode (160 µA typ) or high gain mode (1600 µA typ)  
AUX_ PD_POL (MAIN_R[15]) and MAIN_ PD_POL (MAIN_R[14]) are respectively set to one when Aux or Main VCO character-  
istics are positive as in (1) below. When VCO frequency decreases with increasing control voltage (2) PD_POL should set to zero.  
9
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2.0 Programming Description (Continued)  
2.4.1 VCO Characteristics  
DS100129-14  
2.4.2 Phase Comparator and Internal Charge Pump Characteristics  
(AUX_PD_POL/MAIN_PD_POL = 1)  
DS100129-15  
Note 15: fr is phase detector input from reference counter. fp is phase detector input from programmable N counter.  
Phase difference detection range: - 2π to + 2pπ.  
The minimum width pump up and pump down current pulses occur at the CPo pin when the loop is locked.  
2.5 FOUT/LOCK DETECT PROGRAMMING TRUTH TABLE (FoLD)  
FoLD  
Fo/LD OUTPUT STATE  
3
2
1
0
AUX_R[17]  
AUX_R[16] AUX_R[15]  
AUX_R[14]  
0
0
0
0
0
1
1
1
1
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
“0”  
“1”  
X
x
Main Lock Detect  
Aux Lock Detect  
X
X
X
X
X
Main “and” Aux Lock Detect  
Main Reference Counter Output  
Aux Reference Counter Output  
Main Programmable Counter Output  
Aux Programmable Counter Output  
Note 16: See section 2.5.3 for AUX_R[14] description.  
www.national.com  
10  
2.0 Programming Description (Continued)  
2.5.1 Lock Detect Digital Filter  
The Lock Detect Digital Filter compares the difference between the phase of the inputs of the phase detector to a RC generated  
delay of approximately 15 ns. To enter the locked state (Lock = HIGH) the phase error must be less than the 15 ns RC delay for  
4 consecutive reference cycles. Once in lock (Lock = HIGH), the RC delay is changed to approximately 30 ns. To exit the locked  
state (Lock = LOW), the phase error must become greater than the 30 ns RC delay. When the PLL is in the powerdown mode,  
Lock is forced LOW. A flow chart of the digital filter is shown below.  
DS100129-16  
2.5.2 Typical Lock Detect Timing (AUX_PD_POL/MAIN_PD_POL = 1)  
DS100129-17  
11  
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2.0 Programming Description (Continued)  
2.5.3 OSC Mode Programming  
The OSCout pin can be optimized for operating with an external crystal resonator or an external reference frequency source (i.e.  
TCXO). If the application uses an external reference frequency source, the current dissipation of the LMX1600/01/02 can be re-  
duced with the Logic Mode (0.5 mA typ.). Crystal Mode should be used when an external crystal resonator is used. Logic Mode  
is used when an external reference frequency source is used. In Logic Mode, OSCOUT should be connected to a 30 pF capacitor  
to ground for optimum performance.  
When the FoLD output state is selected to CMOS high/low levels, the OSC Mode is forced to Crystal Mode.  
FoLD  
OSCOUT  
3
2
1
0
AUX_R[17]  
AUX_R[16]  
AUX_R[15]  
AUX_R[14]  
0
0
0
0
0
0
1
0
1
Crystal Mode  
Crystal Mode  
Logic Mode  
0
All Other States  
Crystal Mode  
2.5.4 Typical Crystal Oscillator Circuit  
A typical implementation of a 10 MHz crystal oscillator with the OSCOUT pin in Crystal Mode is shown below.  
DS100129-18  
2.6 SERIAL DATA INPUT TIMING  
DS100129-19  
Note 17: Data shifted into register on clock rising edge.  
Data is shifted in MSB first.  
TEST CONDITIONS: The Serial Data Input Timing is tested using a symmetrical waveform around VCC/2. The test waveform has  
@
an edge rate of 0.6 V/ns with amplitudes of 2.2V VCC = 2.7V.  
www.national.com  
12  
2.0 Programming Description (Continued)  
2.7 TYPICAL APPLICATION EXAMPLE  
DS100129-20  
OPERATIONAL NOTES:  
*
VCO is assumed AC coupled.  
**  
RIN increases impedance so that VCO output power is provided to the load rather than the PLL. Typical values are 10to  
200depending on the VCO power level. The fin RF impedance ranges from 40to 100. The fin IF impedances are  
higher.  
*** 50termination is often used on test boards to allow use of external reference oscillator. For most typical products, a CMOS  
clock is used and no terminating resistor is required. OSCIN may be AC or DC coupled. AC coupling is recommended be-  
cause the input circuit provides its own bias. (See Figure below)  
DS100129-21  
**** Adding RC filter to the VCC line is recommended to reduce loop-to-loop noise coupling.  
Proper use of grounds and bypass capacitors is essential to achieve a high level of performance. Crosstalk between pins  
can be reduced by careful board layout.  
This is a static sensitive device. It should be handled only at static free work stations.  
13  
www.national.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
Dimensions are in millimeters.  
LMX1600/01/02 Frequency Synthesizer IC (16-Pin TSSOP Package)  
NS Package Number MTC16  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE-  
VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMI-  
CONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or sys-  
tems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, and whose fail-  
ure to perform when properly used in accordance  
with instructions for use provided in the labeling, can  
be reasonably expected to result in a significant injury  
to the user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
National Semiconductor  
Corporation  
Americas  
Tel: 1-800-272-9959  
Fax: 1-800-737-7018  
Email: support@nsc.com  
National Semiconductor  
Europe  
National Semiconductor  
Asia Pacific Customer  
Response Group  
Tel: 65-2544466  
Fax: 65-2504466  
National Semiconductor  
Japan Ltd.  
Tel: 81-3-5620-6175  
Fax: 81-3-5620-6179  
Fax: +49 (0) 1 80-530 85 86  
Email: europe.support@nsc.com  
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Email: sea.support@nsc.com  
www.national.com  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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