LMX2216M [NSC]

0.1 GHz to 2.0 GHz Low Noise Amplifier/Mixer for RF Personal Communications; 0.1 GHz到2.0 GHz的低噪声放大器/混频器,用于射频个人通信
LMX2216M
型号: LMX2216M
厂家: National Semiconductor    National Semiconductor
描述:

0.1 GHz to 2.0 GHz Low Noise Amplifier/Mixer for RF Personal Communications
0.1 GHz到2.0 GHz的低噪声放大器/混频器,用于射频个人通信

放大器 射频 个人通信
文件: 总12页 (文件大小:260K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
August 1995  
LMX2216  
0.1 GHz to 2.0 GHz Low Noise Amplifier/Mixer  
for RF Personal Communications  
General Description  
The LMX2216 is a monolithic, integrated low noise amplifier  
(LNA) and mixer suitable as a first stage amplifier and down-  
converter for RF receiver applications. The wideband oper-  
ating capabilities of the LMX2216 allow it to function over  
frequencies from 0.1 GHz to 2.0 GHz. It is fabricated using  
National Semiconductor’s ABiC IV BiCMOS process.  
The LMX2216 is available in a narrow-body 16-pin surface  
mount plastic package.  
Features  
Y
Wideband RF operation from 0.1 GHz to 2.0 GHz  
Y
No external biasing components necessary  
All input and output ports of the LMX2216 are single-ended.  
The LNA input and output ports are designed to interface to  
a 50X system. The Mixer input ports are matched to 50X.  
The output port is matched to 200X. The only external com-  
ponents required are DC blocking capacitors. The balanced  
architecture of the LMX2216 maintains consistent operating  
parameters from unit to unit, since it is implemented in a  
monolithic device. This consistency provides manufacturers  
Y
3V operation  
Y
LNA input and output ports matched to 50X  
Y
Mixer input ports matched to 50X, output port matched  
to 200X.  
Y
Doubly balanced Gilbert cell mixer (single ended input  
and output)  
Y
Low power consumption  
Y
Power down feature  
a
significant advantage since tuning proceduresÐoften  
Y
needed with discrete designsÐcan be reduced or eliminat-  
ed.  
Small outline, plastic surface mount package  
Applications  
Y
The low noise amplifier produces very flat gain over the en-  
tire operating range. The doubly-balanced, Gilbert-cell mixer  
provides good LO-RF isolation and cancellation of second-  
order distortion products. A power down feature is imple-  
mented on the LMX2216 that is especially useful for stand-  
by operation common in Time Division Multiple Access  
(TDMA) and Time Division Duplex (TDD) systems.  
Digital European Cordless Telecommunications (DECT)  
Y
Portable wireless communications (PCS/PCN, cordless)  
Y
Wireless local area networks (WLANs)  
Y
Digital cellular telephone systems  
Y
Other wireless communications systems  
Functional Block/Pin Diagram  
TL/W/11814–1  
Order Number LMX2216M  
See NS Package Number M16A  
C
1995 National Semiconductor Corporation  
TL/W/11814  
RRD-B30M115/Printed in U. S. A.  
Pin Description  
Pin  
No.  
Pin  
I/O  
Description  
Name  
1
V
CC  
M
I
Voltage supply for the mixer. The input voltage level to this pin should be a DC Voltage ranging from  
2.85V to 3.15V.  
2
3
4
5
6
GND  
LNA  
Ground  
I
I
RF input signal to the LNA. External DC blocking capacitor is required.  
IN  
GND  
GND  
Ground  
Ground  
RF  
IN  
RF input to the mixer. The RF signal to be down converted is connected to this pin. External DC  
blocking capacitor is required.  
7
8
GND  
Ground  
PWDN  
I
Power down signal pin. Both the LNA and mixer are powered down when a HIGH level is applied to  
this pin (V ).  
IH  
9
10  
11  
12  
13  
14  
IF  
OUT  
O
IF output signal of the mixer. External DC blocking capacitor is required.  
GND  
LO  
Ground  
I
Local oscillator input signal to the mixer. External DC blocking capacitor is required.  
IN  
GND  
GND  
Ground  
Ground  
LNA  
OUT  
O
I
Output of the LNA. This pin outputs the amplified RF signal. External DC blocking capacitor is  
required.  
15  
16  
GND  
Ground  
V
CC  
A
LNA supply Voltage. DC Voltage ranging from 2.85V to 3.15V.  
Absolute Maximum Ratings  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales  
Office/Distributors for availability and specifications.  
Recommended Operating  
Conditions  
Supply Voltage (V  
)
CC  
2.85V3.15V  
b
a
10 C to 70 C  
§
Operating Temperature (T )  
A
§
0.1 GHz to 2.0 GHz  
Supply Voltage (V  
)
CC  
6.5V  
RF  
IN  
IN  
b
a
65 C to 150 C  
Storage Temperature (T )  
S
§
§
§
LO  
0.1 GHz to 2.0 GHz  
b a  
40 C to 85 C  
Operating Temperature (T  
)
O
§
2
Electrical Characteristics: LNA  
@
b
30 dBm unless otherwise specified.)  
e a  
e
e
e
50X and f  
IN  
g
3.0V 5%, T  
(V  
25 C, Z  
§
2.0 GHz  
CC  
A
o
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
8.0  
10  
Units  
mA  
mA  
I
I
Supply Current  
Supply Current  
Gain  
In Operation  
6.5  
CC  
In Power Down Mode  
CC-PWDN  
G
9
10  
dB  
b
b
P
Output 1 dB Compression Point  
Output 3rd Order Intercept Point  
Single Side Band Noise Figure  
Input Return Loss  
5.0  
5.0  
3.0  
7.0  
dBm  
dBm  
dB  
1dB  
OIP3  
NF  
4.8  
15  
11  
6.0  
RL  
RL  
10  
10  
dB  
IN  
Output Return Loss  
dB  
OUT  
@
e
a
e
e
e
2.0 GHz  
RF  
g
Electrical Characteristics: Mixer (V  
3.0V 5%, T  
25 C, Z  
§
50X, f  
CC  
e
110 MHz unless otherwise specified.)  
A
o
@
1.89 GHz 0 dBm; f  
b
e
30 dBm, f  
LO  
IF  
Symbol  
Parameter  
Conditions  
In Operation  
Min  
Typ  
Max  
12.0  
10  
Units  
mA  
mA  
dB  
I
I
Supply Current  
Supply Current  
9.0  
CC  
In Power Down Mode  
CC-PWDN  
G
Conversion Gain (Single Side Band)  
Output 1 dB Compression Point  
Output Third Order Intercept Point  
Single Side Band Noise Figure  
Double Side Band Noise Figure  
LO to RF Isolation  
4.0  
6.0  
C
b
b
9.0  
0.0  
P
13.0  
dBm  
dBm  
dB  
1dB  
b
OIP3  
3.0  
SSB NF  
DSB NF  
LO-RF  
LO-IF  
17  
14  
30  
30  
15  
15  
15  
200  
18  
15  
dB  
20  
dB  
LO to IF Isolation  
20  
10  
10  
dB  
RF RL  
LO RL  
IF RL  
RF Return Loss  
dB  
LO Return Loss  
dB  
IF Return Loss  
dB  
Z
IF Port Impedance  
X
IF  
Electrical Characteristics: Power Down  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
b
V
V
High Level Input Voltage  
Low Level Input Voltage  
High Level Input Current  
Low Level Input Current  
V
0.8  
V
V
IH  
CC  
0.8  
IL  
e
e
b
b
I
I
V
V
V
10.0  
10.0  
10.0  
10.0  
mA  
mA  
IH  
IL  
IH  
CC  
GND  
IL  
3
Typical Application Block Diagram  
TL/W/11814–2  
FIGURE 2  
Typical Characteristics  
LNA  
LNA Current Composition  
vs Supply Voltage with  
Temperature as a Parameter  
LNA P vs P with Supply  
OUT IN  
Voltage as a Parameter  
TL/W/11814–3  
TL/W/11814–4  
LNA P vs P with  
OUT IN  
Temperature as a Parameter  
LNA P vs P with  
OUT IN  
Temperature as a Parameter  
TL/W/11814–6  
TL/W/11814–7  
4
Typical Characteristics (Continued)  
LNA (Continued)  
LNA Gain vs Frequency with Supply  
Voltage as a Parameter  
LNA Noise Figure vs Frequency with  
Supply Voltage as a Parameter  
TL/W/11814–8  
TL/W/11814–9  
LNA Gain vs Frequency with  
Temperature as a Parameter  
LNA Noise Figure vs Frequency with  
Temperature as a Parameter  
TL/W/1181410  
TL/W/1181411  
LNA Input Return Loss vs Frequency  
with Voltage as a Parameter  
LNA Output Return Loss vs Frequency  
with Voltage as a Parameter  
TL/W/1181412  
TL/W/1181419  
5
Typical Characteristics (Continued)  
MIXER  
Mixer Gain (Double Sideband)  
vs Frequency with Supply  
Voltage as a Parameter  
Mixer Gain (Double Sideband)  
vs Frequency with Temperature  
as a Parameter  
TL/W/1181420  
TL/W/1181421  
Mixer Noise Figure (Double Sideband)  
vs Frequency with Supply  
Voltage as a Parameter  
Mixer Noise Figure (Double Sideband)  
vs Frequency with Temperature  
as a Parameter  
TL/W/1181422  
TL/W/1181423  
6
Typical Characteristics (Continued)  
MIXER (Continued)  
Mixer P vs P with Supply  
OUT IN  
Voltage as a Parameter  
Mixer P vs P with Supply  
OUT IN  
Voltage as a Parameter  
TL/W/1181424  
TL/W/1181425  
Mixer P vs P with  
OUT IN  
Temperature as a Parameter  
Mixer P vs P with  
OUT IN  
Temperature as a Parameter  
TL/W/1181426  
TL/W/1181427  
Mixer RF Return Loss  
IN  
Mixer RF Return Loss  
IN  
vs Frequency with Supply  
Voltage as a Parameter  
vs Frequency with Supply  
Voltage as a Parameter  
TL/W/1181428  
TL/W/1181429  
7
Typical Characteristics (Continued)  
MIXER (Continued)  
Mixer RF Return Loss  
IN  
Mixer IF Return Loss  
OUT  
vs Frequency with Supply  
Voltage as a Parameter  
vs Frequency with Supply  
Voltage as a Parameter  
TL/W/1181430  
TL/W/1181431  
Functional Description  
TL/W/1181413  
FIGURE 3. Block Diagram of the LMX2216  
8
Functional Description (Continued)  
Typical Gilbert Cell  
THE LNA  
The LNA is a common emitter stage with active feedback.  
This feedback network allows for wide bandwidth operation  
while providing the necessary optimal input impedance for  
low noise performance. The power down feature is imple-  
mented using a CMOS buffer and a power-down switch. The  
power down switch is implemented with CMOS devices.  
During power down, the switch is open and only leakage  
currents are drawn from the supply.  
THE MIXER  
The mixer is a Gilbert cell architecture, with the RF input  
signal modulating the LO signal and single ended output  
taken from the collector of one of the upper four transistors.  
The power down circuitry of the mixer is similar to that of the  
LNA. The power down switch is used to provide or cut off  
bias to the Gilbert cell.  
Typical Low Noise Amplifier  
TL/W/1181415  
FIGURE 5. Typical Gilbert Cell Circuit Diagram  
The Gilbert cell shown above is a circuit which multiplies  
two input signals, RF and LO. The input RF voltage differen-  
tially modulates the currents on the collectors of the transis-  
tors Q1 and Q2, which in turn modulate the LO voltage by  
varying the bias currents of the transistors Q3, Q4, Q5, and  
Q6. Assuming that the two signals are small, the result is a  
product of the two signals, producing at the output a sum  
and difference of the frequencies of the two input signals. If  
either of these two signals are much larger than the thresh-  
TL/W/1181414  
FIGURE 4. Typical LNA Structure  
A typical low noise amplifier consists of an active amplifying  
element and input and output matching networks. The input  
matching network is usually optimized for noise perform-  
ance, and the output matching network for gain. The active  
element is chosen such that it has the lowest optimal noise  
old voltage V , the output will contain other mixing products  
T
and higher order terms which are undesirable and may need  
to be attenuated or filtered out.  
Analysis of the Gilbert cell shows that the output, which is  
the difference of the collector currents of Q3 and Q6, is  
related to the two inputs by the equation:  
figure, F  
, an intrinsic property of the device. The noise  
MIN  
figure of a linear two-port is a function of the source admit-  
tance and can be expressed by  
V
V
R
n
RF  
LO  
e
b
e
I
C6 EE  
2
2
b
]
B )  
G
e
a
b
a
DI  
I
I
tanh  
tanh  
[
F
F
(G  
ON  
G
)
G
(B  
ON  
C3  
MIN  
2V  
2V  
Ð # J( Р# J(  
G
T
T
G
and the hyperbolic tangent function can be expressed as a  
Taylor series  
a
e
e
e
where G  
jB  
G
generator admittance presented to  
the input of the two port,  
G
3
5
x
x
a
G
jB  
generator admittance at which op-  
timum noise figure occurs,  
e
b
a
b
. . .  
ON  
ON  
tanh(x)  
x
3
5
Assuming that the RF and LO signals are sinusoids.  
R
empirical constant relating the  
sensitivity of the noise figure to  
generator admittance.  
n
e
e
a
a
V
V
Acos (0  
Bcos (0  
t
t
w
w
)
RF  
RF  
LO  
RF  
LO  
)
LO  
then  
3
A
3
e
a
b
a
a
) . . .  
RF  
DI  
I
Acos (0RF  
t
w
)
cos (0RF  
t
w
EE  
RF  
3
Ð
(
3
B
3
a
b
a
a
) . . .  
LO  
Bcos (0LO  
t
w
)
cos (0LO  
t
w
#
LO  
3
Ð
(
The lowest order term is a product of two sinusoids, yielding  
a sum of two sinusoids,  
a
a
) t  
a
AB  
2
cos ((0  
a
0
) t  
LO  
w
a
w
)
LO  
RF  
RF  
w
I
EE  
b
b
w
RF  
cos ((0  
0
)
LO  
Ð
RF  
LO  
(
one of which is the desired intermediate frequency signal.  
9
Figures of Merit  
GAIN (G)  
Many different types of gain are specified in RF engineering.  
The type referred to here is called transducer gain and is  
defined as the ratio of the power delivered to the load to the  
available power from the source,  
P
V2OUT/R  
V2IN/R  
R
V2OUT  
OUT  
L
S
e
e
e
4
G
P
R
V2IN  
L
IN  
S
where V  
OUT  
is the voltage across the load R and V is the  
IN  
L
generator voltage with internal resistance R . In terms of  
S
scattering parameters, transducer gain is defined as  
e
G
20 log ( S )  
21  
l
l
where S is the forward transmission parameter, which can  
21  
be measured using a network analyzer.  
1 dB COMPRESSION POINT (P  
)
1dB  
TL/W/1181416  
A measure of amplitude Iinearity, 1 dB compression point is  
the point at which the actual gain is 1dB below the ideal  
linear gain. For a memoryless two-port with weak nonlineari-  
ty, the output can be represented by a power series of the  
input as  
FIGURE 6. Typical P  
OUT  
–P Characteristics  
IN  
NOISE FIGURE (NF)  
Noise figure is defined as the input signal to noise ratio di-  
vided by the output signal to noise ratio. For an amplifier, it  
can also be interpreted as the amount of noise introduced  
by the amplifier itself seen at the output. Mathematically,  
e
a
a
k
3
a
v
k
v
k
v2i  
v3i  
. . .  
o
1
i
2
For a sinusoidal input,  
a
G N  
a i  
S /N  
i
S /N  
i
N
a
e
v
Acos 0 t  
i
i
i
1
e
e
e
F
a
S /N  
o
G
S /(N  
i
G
N )  
i
G N  
a i  
the output is  
o
a
a
a
e
1
2
2
3
NF  
10 log (F)  
3
e
a
a
A
v
k
A
k
k
A
cos 0 t  
1
o
2
1
3
4
#
J
where S and N represent the signal and noise power levels  
i i  
available at the input to the amplifier, S and N the signal  
1
2
1
4
o
o
2
3
a
a
k
A
cos 20  
t
k
A
cos 30 t  
1
2
1
3
and noise power levels available at the output, G the avail-  
a
able gain, and Na the noise added by the amplifier. Noise  
figure is an important figure of merit used to characterize the  
performance of not only a single component but also the  
entire system. It is one of the factors which determine the  
system sensitivity.  
assuming that all of the fourth and higher order terms are  
negligible. For an amplifier, the fundamental component is  
the desired output, and it can be rewritten as  
3
2
.
a
k
A
1
(k /k ) A  
1
1
3
4
Ð
(
IMAGE FREQUENCY, DSB/SSB NF  
This fundamental component is larger than k A (the ideally  
linear gain) if k  
1
0. For most practi-  
Image frequency refers to that frequency which is also  
down-converted by the mixer, along with the desired RF  
component, to the intermediate frequency. This image fre-  
quency is located at the same distance away from the LO,  
but on the opposite side of the RF. For most mixers, it must  
be filtered out before the signal is down-converted; other-  
wise, an image-reject mixer must be used. Figure 7 illus-  
trates the concept.  
l
k
0 and smaller if k  
0, and the gain compresses as the ampli-  
3
3
k
cal devices, k  
3
tude A of the input signal gets larger. The 1 dB compression  
point can be expressed in terms of either the input power or  
the output power. Measurement of P  
increasing the input power while observing the output power  
until the gain is compressed by 1 dB.  
can be made by  
1dB  
THIRD ORDER INTERCEPT (OIP )  
3
Third order intercept is another figure of merit used to char-  
acterize the linearity of a two-port. It is defined as the point  
at which the third order intermodulation product equals the  
ideal linear, uncompressed, output. Unlike the P  
, OIP  
1dB  
3
involves two input signals. However, it can be shown mathe-  
matically (similar derivation as above) that the two are  
&
a
figures of merit are illustrated in Figure 6.  
closely related and OIP  
P
10 dB. Theses two  
3
1dB  
TL/W/1181417  
FIGURE 7. Input and Output Spectrum of Mixers  
10  
Figures of Merit (Continued)  
Due to the presence of image frequencies and the method  
in which noise figure is defined, noise figures can be mea-  
sured and specified in two ways: double side band (DSB) or  
single side band (SSB). In DSB measurements, the image  
frequency component of the input noise source is not fil-  
tered and contributes to the total output noise at the inter-  
mediate frequency. In SSB measurements. the image fre-  
quency is filtered and the output noise is not caused by this  
frequency component. In most mixer applications where  
only one side band is wanted, SSB noise figure is 3 dB  
higher than DSB noise figure.  
ates the image frequency. The mixer is shown to use an LO  
signal generated by a PLL synthesizer, but, depending on  
the type of application, the LO signal could be generated by  
a device as simple as a free-running oscillator. The IF output  
is then typically filtered by a channel-select filter following  
the mixer, and this signal can then be demodulated or go  
through another down conversion, depending upon the in-  
termediate frequency and system requirements. This exter-  
nal filter rejects adjacent channels and also attenuates any  
LO feed through. Figure 9 shows a cascade analysis of a  
typical RF front-end subsystem in which the LMX2216 is  
used. It includes the bandpass filter and the switch through  
which the input RF signal goes in a radio system before  
reaching the LNA. Typical values are used for the insertion  
loss of the various filters in this example.  
In this application, the LMX2216 is used in a radio receiver  
front end, where it amplifies the signal from the antenna and  
then down converts it to an intermediate frequency. The  
image filter placed between the LNA and the mixer attenu-  
TL/W/1181418  
FIGURE 8. Typical Applications Circuit of the LMX2216  
Data per Stage  
Gain  
Cumulative Data  
Ý
1
2
3
4
5
6
Ý
1
2
3
4
5
6
Comp  
Filter  
N Fig  
2.0  
OIP3  
100.0  
100.0  
6.0  
Gain  
N Fig  
2.0  
IIP3  
97.9  
96.6  
OIP3  
95.9  
94.0  
6.0  
b
b
b
b
2.0  
0.6  
2.0  
2.6  
9.7  
6.7  
Switch  
LNA  
0.6  
2.6  
b
b
12.3  
3.7  
6.3  
3.7  
3.7  
b
Filter  
Mixer  
Filter  
3.0  
5.8  
3.0  
3.0  
100.0  
3.0  
6.4  
3.0  
b
b
13.7  
3.0  
12.5  
9.5  
9.6  
10.5  
10.5  
2.0  
b
1.0  
b
100.0  
9.7  
System Cumulative Values  
Gain  
N Fig  
IIP  
9.5 dB  
9.7 dB  
b
10.5 dBm  
3
b
OIP  
1.0 dBm  
3
FIGURE 9. Cascade Analysis Example  
11  
Physical Dimensions inches (millimeters)  
JEDEC 16-Lead (0.150 Wide) Small Outline Molded Package (M)  
×
Order Number LMX2216M  
For Tape and Reel Order Number LMX2216MX  
NS Package Number M16A  
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to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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