MUB08A [NSC]

1W, Bypass-Capacitor-less Audio Amplifier with Internal Selectable Gain; 1W ,旁路电容无音频放大器,具有内部可选增益
MUB08A
型号: MUB08A
厂家: National Semiconductor    National Semiconductor
描述:

1W, Bypass-Capacitor-less Audio Amplifier with Internal Selectable Gain
1W ,旁路电容无音频放大器,具有内部可选增益

音频放大器
文件: 总15页 (文件大小:466K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
May 2003  
LM4906  
1W, Bypass-Capacitor-less Audio Amplifier with Internal  
Selectable Gain  
General Description  
Key Specifications  
The LM4906 is an audio power amplifier primarily designed  
for demanding applications in mobile phones and other por-  
table communication device applications. It is capable of  
delivering 1W of continuous average power to an 8BTL  
load with less than 1% distortion (THD+N) from a +5V power  
supply.  
j
j
j
j
Improved PSRR at 217Hz for +3V  
71dB  
Power Output at +5V, THD+N = 1%, 8Ω  
1.0W (typ)  
Power Output at +3V, THD+N = 1%, 8390mW (typ)  
Total shutdown power supply current 0.1µA (typ)  
The LM4906 is the first National Semiconductor Boomer  
Power Amplifier that does not require an external PSRR  
bypass capacitor. The LM4906 also has an internal select-  
able gain of either 6dB or 12dB. In addition, no output  
coupling capacitors or bootstrap capacitors are required  
which makes the LM4906 ideally suited for cell phone and  
other low voltage portable applications.  
Features  
n Selectable gain of 6dB (2V/V) or 12dB (4V/V)  
n No output or PSRR bypass capacitors required  
n Improved “Click and Pop” suppression circuitry  
n Very fast turn on time: 5ms (typ)  
n Minimum external components  
n 2.6 - 5.5V operation  
The LM4906 contains advanced pop and click circuitry that  
eliminates noise, which would otherwise occur during  
turn-on and turn-off transitions.  
n BTL output can drive capacitive loads  
n Ultra low current shutdown mode (SD Low)  
Boomer audio power amplifiers were designed specifically to  
provide high quality output power with a minimal amount of  
external components. The LM4906 features a low -power  
consumption shutdown mode (the part is enabled by pulling  
the SD pin high). Additionally, the LM4906 features an inter-  
nal thermal shutdown protection mechanism.  
Applications  
n Portable computers  
n Desktop computers  
n Multimedia monitors  
Typical Application  
200571B9  
FIGURE 1. Typical Audio Amplifier Application Circuit  
Boomer® is a registered trademark of National Semiconductor Corporation.  
© 2003 National Semiconductor Corporation  
DS200571  
www.national.com  
Connection Diagrams  
MSOP Package  
MSOP Marking  
20057102  
200571F1  
Top View  
Order Number LM4906MM  
See NS Package Number MUB08A  
Z - Plant Code  
X - Date Code  
T - Die Traceability  
LLP Package  
LD Marking  
200571F2  
Z - Plant Code  
XY - Date Code  
T - Die Traceability  
200571C3  
Top View  
Order Number LM4906LD  
See NS Package Number LDA10B  
www.national.com  
2
Absolute Maximum Ratings (Note 2)  
Thermal Resistance  
θJC (MSOP)  
θJA (MSOP)  
θJC (LLP)  
56˚C/W  
190˚C/W  
12˚C/W  
63˚C/W  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Supply Voltage (Note 10)  
Storage Temperature  
6.0V  
−65˚C to +150˚C  
−0.3V to VDD +0.3V  
Internally Limited  
2000V  
θJA (LLP)  
Input Voltage  
Operating Ratings  
Temperature Range  
TMIN TA TMAX  
Supply Voltage  
Power Dissipation (Notes 3, 11)  
ESD Susceptibility (Note 4)  
ESD Susceptibility (Note 5)  
Junction Temperature  
−40˚C TA 85˚C  
2.6V VDD 5.5V  
200V  
150˚C  
Electrical Characteristics VDD = 5V (Notes 1, 2)  
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for TA = 25˚C.  
LM4906  
Units  
(Limits)  
Symbol  
Parameter  
Conditions  
Typical  
Limit  
(Note 6)  
(Notes 7, 8)  
VIN = 0V, Io = 0A, No Load  
VIN = 0V, Io = 0A, 8Load  
VSD = GND  
3.5  
4
7
8
mA (max)  
mA (max)  
µA (max)  
mV (max)  
IDD  
Quiescent Power Supply Current  
ISD  
Shutdown Current  
0.1  
7
2
VOS  
Output Offset Voltage  
35  
THD+N = 1% (max); f = 1 kHz  
Po  
Output Power  
1.0  
0.9  
W (min)  
RL = 8Ω  
TWU  
Wake-up time  
5
ms  
%
THD+N  
Total Harmonic Distortion+Noise  
Po = 0.4 Wrms; f = 1kHz  
Vripple = 200mV sine p-p  
Input terminated with 10Ω  
Gain at 6dB  
0.2  
67 (f =  
PSRR  
Power Supply Rejection Ratio  
217Hz)  
70 (f = 1kHz)  
1.5  
dB  
VSDIH  
VSDIL  
Shutdown Voltage Input High  
Shutdown Voltage Input Low  
SD Pin High = Part On  
SD Pin Low = Part Off  
V (min)  
V (max)  
1.3  
Electrical Characteristics VDD = 3V (Notes 1, 2)  
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for TA = 25˚C.  
LM4906  
Units  
(Limits)  
Symbol  
Parameter  
Conditions  
Typical  
Limit  
(Note 6)  
(Notes 7, 8)  
VIN = 0V, Io = 0A, No Load  
VIN = 0V, Io = 0A, 8Load  
VSD = GND  
2.6  
3
6
7
mA (max)  
mA (max)  
µA (max)  
mV (max)  
IDD  
Quiescent Power Supply Current  
ISD  
Shutdown Current  
0.1  
7
2
VOS  
Output Offset Voltage  
35  
THD+N = 1% (max); f = 1 kHz  
Po  
Output Power  
390  
mW  
RL = 8Ω  
TWU  
Wake-up time  
4
ms  
%
THD+N  
Total Harmonic Distortion+Noise  
Po = 0.15 Wrms; f = 1kHz  
Vripple = 200mV sine p-p  
Input terminated with 10Ω  
Gain at 6dB  
0.1  
71 (f =  
PSRR  
Power Supply Rejection Ratio  
217Hz)  
73 (f = 1kHz)  
1.1  
dB  
VSDIH  
VSDIL  
Shutdown Voltage Input High  
Shutdown Voltage Input Low  
SD Pin High = Part On  
SD Pin Low = Part Off  
V (min)  
V (max)  
0.9  
3
www.national.com  
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.  
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which  
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit  
is given; however, the typical value is a good indication of device performance.  
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T  
, θ , and the ambient temperature T . The maximum  
A
JMAX JA  
allowable power dissipation is P  
= (T  
–T )/θ or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4906, see power derating  
DMAX  
JMAX A JA  
curves for additional information.  
Note 4: Human body model, 100pF discharged through a 1.5kresistor.  
Note 5: Machine Model, 220pF–240pF discharged through all pins.  
Note 6: Typicals are measured at 25˚C and represent the parametric norm.  
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).  
Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.  
Note 9: R  
is measured from the output pin to ground. This value represents the parallel combination of the 10koutput resistors and the two 20kresistors.  
OUT  
Note 10: If the product is in Shutdown mode and V exceeds 6V (to a max of 8V V ), then most of the excess current will flow through the ESD protection circuits.  
DD  
DD  
If the source impedance limits the current to a max of 10mA, then the device will be protected. If the device is enabled when V is greater than 5.5V and less than  
DD  
6.5V, no damage will occur, although operation life will be reduced. Operation above 6.5V with no current limit will result in permanent damage.  
Note 11: Maximum power dissipation in the device (P  
) occurs at an output power level significantly below full output power. P  
can be calculated using  
DMAX  
DMAX  
Equation 1 shown in the Application Information section. It may also be obtained from the power dissipation graphs.  
External Components Description  
Components  
Functional Description  
1.  
C2  
Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a  
highpass filter with Ri at fc = 1 / (2πRiCi). Refer to the section, Proper Selection of External Components,  
for an explanation of how to determine the value of Ci.  
2.  
C1  
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing  
section for information concerning proper placement and selection of the supply bypass capacitor.  
www.national.com  
4
Typical Performance Characteristics  
THD+N vs Frequency  
VDD = 5V, RL = 8,  
f = 1kHz, PWR = 500mW  
THD+N vs Frequency  
VDD = 3V, RL = 8,  
f = 1kHz, PWR = 250mW  
200571C4  
200571C5  
THD+N vs Power Out  
THD+N vs Power Out  
VDD = 5V, RL = 8, f = 1kHz  
VDD = 3V, RL = 8, f = 1kHz  
200571C6  
200571C7  
Power Supply Rejection Ratio  
vs Frequency  
Power Supply Rejection Ratio  
vs Frequency  
VDD = 5V, RL = 8Ω  
VDD = 3V, RL = 8Ω  
200571E2  
200571C9  
5
www.national.com  
Typical Performance Characteristics (Continued)  
Noise Floor  
VDD = 5V, RL = 8Ω  
80kHz Bandwith, Input to GND  
Power Derating Curve  
200571E4  
200571D0  
Power Dissipation  
Power Dissipation  
vs Output Power, VDD = 5V  
vs Output Power, VDD = 3V  
200571D2  
200571D1  
Shutdown Hysteresis Voltage  
VDD = 5V, SD Mode = VDD (High)  
Shutdown Hysteresis Voltage  
VDD = 5V, SD Mode = VDD (Low)  
200571D3  
200571D4  
www.national.com  
6
Typical Performance Characteristics (Continued)  
Shutdown Hysteresis Voltage  
VDD = 3V, SD Mode = VDD (High)  
Shutdown Hysteresis Voltage  
VDD = 3V, SD Mode = GND (Low)  
200571E5  
200571D6  
Output Power  
Output Power  
vs Supply Voltage, RL = 8Ω  
vs Supply Voltage, RL = 16Ω  
200571D7  
200571D9  
Output Power  
vs Supply Voltage, RL = 32Ω  
Frequency Response  
vs Input Capacitor Size  
200571D8  
200571F3  
7
www.national.com  
Typical Performance Characteristics (Continued)  
PSRR Distribution  
PSRR Distribution  
VDD = 5V, f = 1kHz, RL = 8Ω  
VDD = 5V, f = 217Hz, RL = 8Ω  
200571F4  
200571F5  
PSRR Distribution  
PSRR Distribution  
VDD = 3V, f = 1kHz, RL = 8Ω  
VDD = 3V, f = 217Hz, RL = 8Ω  
200571F6  
200571F7  
www.national.com  
8
sinking. If TJMAX still exceeds 150˚C, then additional  
changes must be made. These changes can include re-  
duced supply voltage, higher load impedance, or reduced  
ambient temperature. Internal power dissipation is a function  
of output power. Refer to the Typical Performance Charac-  
teristics curves for power dissipation information for differ-  
ent output powers and output loading.  
Application Information  
BRIDGE CONFIGURATION EXPLANATION  
As shown in Figure 2, the LM4906 has two internal opera-  
tional amplifiers. The first amplifier’s gain is either 6dB or  
12dB depending on the gain select input (Low = 6dB, High =  
12dB). The second amplifier’s gain is fixed by the two inter-  
nal 20kresistors. Figure 2 shows that the output of ampli-  
fier one serves as the input to amplifier two which results in  
both amplifiers producing signals identical in magnitude, but  
out of phase by 180˚. Consequently, the differential gain for  
the IC is  
POWER SUPPLY BYPASSING  
As with any amplifier, proper supply bypassing is critical for  
low noise performance and high power supply rejection. The  
capacitor location on the power supply pin should be as  
close to the device as possible. Typical applications employ  
a 5V regulator with 10µF tantalum or electrolytic capacitor  
and a ceramic bypass capacitor which aid in supply stability.  
This does not eliminate the need for bypassing the supply  
nodes of the LM4906.  
AVD = 2 * (20k / 20k) or 2 * (40k / 20k)  
By driving the load differentially through outputs Vo1 and  
Vo2, an amplifier configuration commonly referred to as  
“bridged mode” is established. Bridged mode operation is  
different from the classical single-ended amplifier configura-  
tion where one side of the load is connected to ground.  
TURNING ON THE LM4906  
The power supply must first be applied before the application  
of an input signal to the device and the ramp time to VDD  
must be less than 4ms, otherwise the wake-up time of the  
device will be affected. After applying VDD, the LM4906 will  
turn-on after an initial minimum threshold input signal of  
7mVRMS, resulting in a generated output differential signal.  
An input signal of less than 7mVRMS will result in a negligible  
output voltage. Once the device is turned on, the input signal  
can go below the 7mVRMS without shutting the device off. If,  
however, SHUTDOWN or VDD is cycled, the minimum  
threshold requirement for the input signal must first be met  
again, with VDD ramping first.  
A bridge amplifier design has a few distinct advantages over  
the single-ended configuration, as it provides differential  
drive to the load, thus doubling output swing for a specified  
supply voltage. Four times the output power is possible as  
compared to a single-ended amplifier under the same con-  
ditions. This increase in attainable output power assumes  
that the amplifier is not current limited or clipped. In order to  
choose an amplifier’s closed-loop gain without causing ex-  
cessive clipping, please refer to the Audio Power Amplifier  
Design section.  
A bridge configuration, such as the one used in LM4906,  
also creates a second advantage over single-ended amplifi-  
ers. Since the differential outputs, Vo1 and Vo2, are biased  
at half-supply, no net DC voltage exists across the load. This  
eliminates the need for an output coupling capacitor which is  
required in a single supply, single-ended amplifier configura-  
tion. Without an output coupling capacitor, the half-supply  
bias across the load would result in both increased internal  
IC power dissipation and also possible loudspeaker damage.  
SHUTDOWN FUNCTION  
In order to reduce power consumption while not in use, the  
LM4906 contains shutdown circuitry that is used to turn off  
the amplifier’s bias circuitry. The device is placed into shut-  
down mode by toggling the Shutdown pin Low/ground. The  
trigger point for shutdown low is shown as a typical value in  
the Supply Current vs Shutdown Voltage graphs in the Typi-  
cal Performance Characteristics section. It is best to  
switch between ground and supply for maximum perfor-  
mance. While the device may be disabled with shutdown  
voltages in between ground and supply, the idle current may  
be greater than the typical value of 0.1µA. In either case, the  
shutdown pin should be tied to a definite voltage to avoid  
unwanted state changes.  
POWER DISSIPATION  
Power dissipation is a major concern when designing a  
successful amplifier, whether the amplifier is bridged or  
single-ended. A direct consequence of the increased power  
delivered to the load by a bridge amplifier is an increase in  
internal power dissipation. Since the LM4906 has two opera-  
tional amplifiers in one package, the maximum internal  
power dissipation is 4 times that of a single-ended amplifier.  
The maximum power dissipation for a given application can  
be derived from the power dissipation graphs or from Equa-  
tion 1.  
In many applications, a microcontroller or microprocessor  
output is used to control the shutdown circuitry, which pro-  
vides a quick, smooth transition to shutdown. Another solu-  
tion is to use a single-throw switch in conjunction with an  
external pull-up resistor (or pull-down, depending on shut-  
down high or low application). This scheme guarantees that  
the shutdown pin will not float, thus preventing unwanted  
state changes.  
2
PDMAX = 4 * (VDD  
)
/ (2π2RL)  
(1)  
SELECTION OF INPUT CAPACITOR SIZE  
It is critical that the maximum junction temperature TJMAX of  
150˚C is not exceeded. TJMAX can be determined from the  
power derating curves by using PDMAX and the PC board foil  
area. By adding copper foil, the thermal resistance of the  
Large input capacitors are both expensive and space hungry  
for portable designs. Clearly, a certain sized capacitor is  
needed to couple in low frequencies without severe attenu-  
ation. But in many cases the speakers used in portable  
systems, whether internal or external, have little ability to  
reproduce signals below 100Hz to 150Hz. Thus, using a  
large input capacitor may not increase actual system perfor-  
mance.  
application can be reduced from the free air value of θJA  
,
resulting in higher PDMAX values without thermal shutdown  
protection circuitry being activated. Additional copper foil can  
be added to any of the leads connected to the LM4906. It is  
especially effective when connected to VDD, GND, and the  
output pins. Refer to the application information on the  
LM4906 reference design board for an example of good heat  
In addition to system cost and size, click and pop perfor-  
mance is effected by the size of the input coupling capacitor,  
9
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Extra supply voltage creates headroom that allows the  
LM4906 to reproduce peaks in excess of 1W without pro-  
ducing audible distortion. At this time, the designer must  
make sure that the power supply choice along with the  
output impedance does not violate the conditions explained  
in the Power Dissipation section.  
Application Information (Continued)  
Ci. A larger input coupling capacitor requires more charge to  
reach its quiescent DC voltage (nominally 1/2 VDD). This  
charge comes from the output via the feedback and is apt to  
create pops upon device enable. Thus, by minimizing the  
capacitor size based on necessary low frequency response,  
turn-on pops can be minimized.  
The gain of the LM4906 is internally set at either 6dB or  
12dB.  
The final design step is to address the bandwidth require-  
ments which must be stated as a pair of −3dB frequency  
points. Five times away from a −3dB point is 0.17dB down  
from passband response which is better than the required  
0.25dB specified.  
AUDIO POWER AMPLIFIER DESIGN  
A 1W/8Audio Amplifier  
Given:  
Power Output  
Load Impedance  
Input Level  
1 Wrms  
fL = 100Hz / 5 = 20Hz  
8Ω  
1 Vrms  
fH = 20kHz * 5 = 100kHz  
Input Impedance  
Bandwidth  
20 kΩ  
100 Hz–20 kHz 0.25 dB  
As stated in the External Components section, Rin (20k) in  
conjunction with C2 create a highpass filter.  
A designer must first determine the minimum supply rail to  
obtain the specified output power. By extrapolating from the  
Output Power vs Supply Voltage graphs in the Typical Per-  
formance Characteristics section, the supply rail can be  
easily found.  
C2 1 / (2π*20k*20Hz) = 0.397µF; use 0.39µF  
200571C0  
FIGURE 2. REFERENCE DESIGN BOARD SCHEMATIC  
www.national.com  
10  
Application Information (Continued)  
LM4906 MSOP DEMO BOARD ARTWORK  
Top Layer  
200571E6  
Bottom Layer  
200571E7  
11  
www.national.com  
Application Information (Continued)  
LM4906 LD DEMO BOARD ARTWORK  
Top Layer  
200571E8  
Bottom Layer  
200571E9  
www.national.com  
12  
Application Information (Continued)  
Mono LM4906 Reference Design Boards  
Bill of Material  
Part Description  
LM4906 Audio Amplifier  
Quantity  
Reference Designator  
1
1
1
5
U1  
Tantalum Capcitor, 1µF  
C1  
Ceramic Capacitor, 0.39µF  
C2  
Jumper Header Vertical Mount 2X1 0.100“ spacing  
J1, J2, Input, Output, VDD  
PCB LAYOUT GUIDELINES  
Single-Point Power / Ground Connections  
This section provides practical guidelines for mixed signal  
PCB layout that involves various digital/analog power and  
ground traces. Designers should note that these are only  
"rule-of-thumb" recommendations and the actual results will  
depend heavily on the final layout.  
The analog power traces should be connected to the digital  
traces through a single point (link). A "Pi-filter" can be helpful  
in minimizing High Frequency noise coupling between the  
analog and digital sections. It is further recommended to put  
digital and analog power traces over the corresponding digi-  
tal and analog ground traces to minimize noise coupling.  
GENERAL MIXED SIGNAL LAYOUT  
RECOMMENDATION  
Placement of Digital and Analog Components  
All digital components and high-speed digital signal traces  
should be located as far away as possible from analog  
components and circuit traces.  
Power and Ground Circuits  
For 2 layer mixed signal design, it is important to isolate the  
digital power and ground trace paths from the analog power  
and ground trace paths. Star trace routing techniques (bring-  
ing individual traces back to a central point rather than daisy  
chaining traces together in a serial manner) can have a  
major impact on low level signal performance. Star trace  
routing refers to using individual traces to feed power and  
ground to each circuit or even device. This technique will  
require a greater amount of design time but will not increase  
the final price of the board. The only extra parts required will  
be some jumpers.  
Avoiding Typical Design / Layout Problems  
Avoid ground loops or running digital and analog traces  
parallel to each other (side-by-side) on the same PCB layer.  
When traces must cross over each other do it at 90 degrees.  
Running digital and analog traces at 90 degrees to each  
other from the top to the bottom side as much as possible will  
minimize capacitive noise coupling and cross talk.  
13  
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Physical Dimensions inches (millimeters) unless otherwise noted  
MSOP  
Order Number LM4906MM  
NS Package Number MUA08A  
www.national.com  
14  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
LLP  
Order Number LM4906LD  
NS Package Number LDA10B  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL  
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and  
whose failure to perform when properly used in  
accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a  
significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
National Semiconductor  
Americas Customer  
Support Center  
National Semiconductor  
Europe Customer Support Center  
Fax: +49 (0) 180-530 85 86  
National Semiconductor  
Asia Pacific Customer  
Support Center  
National Semiconductor  
Japan Customer Support Center  
Fax: 81-3-5639-7507  
Email: new.feedback@nsc.com  
Tel: 1-800-272-9959  
Email: europe.support@nsc.com  
Deutsch Tel: +49 (0) 69 9508 6208  
English Tel: +44 (0) 870 24 0 2171  
Français Tel: +33 (0) 1 41 91 8790  
Email: ap.support@nsc.com  
Email: jpn.feedback@nsc.com  
Tel: 81-3-5639-7560  
www.national.com  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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SI9137

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137DB

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137LG

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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