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74ABT574ADB,112 [NXP]

74ABT574A - Octal D-type flip-flop; 3-state SSOP2 20-Pin;
74ABT574ADB,112
型号： 74ABT574ADB,112
厂家： NXP    NXP
描述：

74ABT574A - Octal D-type flip-flop; 3-state SSOP2 20-Pin

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74ABT574A  
Octal D-type flip-flop; 3-state  
Rev. 2 — 23 November 2012  
Product data sheet  
1. General description  
The 74ABT574A high-performance BiCMOS device combines low static and dynamic  
power dissipation with high speed and high output drive.  
The 74ABT574A is an 8-bit, edge triggered register coupled to eight 3-State output  
buffers. The clock input (CP) and output enable input (OE) control gates, control the two  
sections of the device independently. The state of each data input (Dn, one set-up time  
before the Low-to-High clock transition) is transferred to the Q output of the corresponding  
flip-flop.  
When OE is Low, the stored data appears at the outputs. When OE is High, the outputs  
are in the High-impedance “off” state, which means they do not drive or load the bus.  
The 3-State output buffers are designed to drive heavily loaded 3-State buses, MOS  
memories, or MOS microprocessors. The active-Low Output Enable (OE) controls all  
eight 3-State buffers independent of the clock operation.  
2. Features and benefits  
74ABT574A is flow-through pinout version of 74ABT374A  
Inputs and outputs on opposite side of package allow easy  
interface to microprocessors  
3-State outputs for bus interfacing  
Power-on 3-state  
Power-on reset  
Common output enable  
Latch-up protection exceeds 500 mA per JESD78B class II level A  
ESD protection:  
HBM JESD22-A114F exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V  
Live insertion/extraction permitted.  
 
 
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74ABT574AN  
74ABT574AD  
40 C to +85 C  
40 C to +85 C  
DIP20  
SO20  
plastic dual in-line package; 20 leads (300 mil)  
SOT146-1  
SOT163-1  
plastic small outline package; 20 leads;  
body width 7.5 mm  
74ABT574ADB 40 C to +85 C  
74ABT574APW 40 C to +85 C  
SSOP20  
plastic shrink small outline package; 20 leads;  
body width 5.3 mm  
SOT339-1  
SOT360-1  
TSSOP20 plastic thin shrink small outline package; 20 leads;  
body width 4.4 mm  
4. Functional diagram  
11  
C1  
1
EN  
11  
2
19  
1D  
CP  
2
19  
18  
17  
16  
15  
14  
13  
12  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
3
4
5
18  
17  
16  
3
4
5
6
7
8
9
6
7
8
9
15  
14  
13  
12  
OE  
1
mna798  
mna446  
Fig 1. Logic symbol  
Fig 2. IEC logic symbol  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
CP  
CP  
CP  
CP  
CP  
CP  
CP  
CP  
FF1  
FF2  
FF3  
FF4  
FF5  
FF6  
FF7  
FF8  
CP  
OE  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
001aah077  
Fig 3. Logic diagram  
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
2 of 16  
 
 
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
5. Pinning information  
5.1 Pinning  
ꢀꢁꢂꢃꢄꢅꢀꢁꢂ  
ꢀꢁ  
ꢄꢅ  
ꢄꢇ  
ꢄꢈ  
ꢄꢉ  
ꢄꢊ  
ꢄꢋ  
ꢄꢌ  
ꢄꢍ  
ꢇ
ꢈ
ꢉ
ꢊ
ꢋ
ꢌ
ꢍ
ꢑ
ꢒ
ꢈꢅ  
ꢂ
ꢃꢃ  
ꢇꢒ ꢆꢅ  
ꢇꢑ ꢆꢇ  
ꢇꢍ ꢆꢈ  
ꢇꢌ ꢆꢉ  
ꢇꢋ ꢆꢊ  
ꢇꢊ ꢆꢋ  
ꢇꢉ ꢆꢌ  
ꢇꢈ ꢆꢍ  
ꢇꢇ ꢃꢐ  
ꢀꢁꢂꢃꢄꢅꢀꢁꢂ  
ꢇ
ꢈ
ꢈꢅ  
ꢇꢒ  
ꢇꢑ  
ꢇꢍ  
ꢇꢌ  
ꢇꢋ  
ꢇꢊ  
ꢇꢉ  
ꢇꢈ  
ꢇꢇ  
ꢀꢁ  
ꢄꢅ  
ꢂ
ꢃꢃ  
ꢆꢅ  
ꢆꢇ  
ꢆꢈ  
ꢆꢉ  
ꢆꢊ  
ꢆꢋ  
ꢆꢌ  
ꢆꢍ  
ꢃꢐ  
ꢉ
ꢄꢇ  
ꢊ
ꢄꢈ  
ꢋ
ꢄꢉ  
ꢌ
ꢄꢊ  
ꢍ
ꢄꢋ  
ꢑ
ꢄꢌ  
ꢒ
ꢄꢍ  
ꢎꢏꢄ ꢇꢅ  
ꢇꢅ  
ꢎꢏꢄ  
ꢀꢀꢀꢁꢂꢂꢃꢄꢅꢅ  
ꢀꢀꢀꢁꢂꢂꢃꢄꢅꢆ  
Fig 4. Pin configuration DIP20 and SO20  
Fig 5. Pin configuration SSOP20 and TSSOP20  
5.2 Pin description  
Table 2.  
Symbol  
OE  
Pin description  
Pin  
Description  
1
3-state output enable input (active LOW)  
data input  
D0, D1, D2, D3, D4, D5, D6, D7  
2, 3, 4, 5, 6, 7, 8, 9  
GND  
10  
11  
ground (0 V)  
CP  
clock pulse input (active rising edge)  
Q0, Q1, Q2, Q3, Q4, Q5, Q6, Q7  
VCC  
19, 18, 17, 16, 15, 14, 13, 12 3-state flip-flop output  
20  
supply voltage  
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
3 of 16  
 
 
 
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
6. Functional description  
Table 3.  
Function table[1]  
Operating mode  
Input  
OE  
L
Internal  
flip-flop  
Output  
CP  
Dn  
Qn  
L
Load and read register  
Load register and disable output  
l
L
L
h
l
H
L
H
Z
H
H
h
H
Z
[1] H = HIGH voltage level;  
h = HIGH voltage level one setup time before the HIGH-to-LOW CP transition;  
L = LOW voltage level;  
l = LOW voltage level one setup time before the HIGH-to-LOW CP transition;  
Z = high-impedance OFF-state;  
= LOW-to-HIGH clock transition.  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VCC  
VI  
Parameter  
Conditions  
Min  
Max  
+7.0  
+7.0  
+5.5  
-
Unit  
supply voltage  
0.5  
V
[1]  
input voltage  
1.2  
0.5  
18  
50  
-
V
[1]  
VO  
output voltage  
output in OFF-state or HIGH-state  
VI < 0 V  
V
IIK  
input clamping current  
output clamping current  
output current  
mA  
mA  
mA  
C  
C  
IOK  
IO  
VO < 0 V  
-
output in LOW-state  
128  
150  
+150  
[2]  
Tj  
junction temperature  
storage temperature  
-
Tstg  
65  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction  
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 C.  
8. Recommended operating conditions  
Table 5.  
Operating conditions  
Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
VI  
Parameter  
Conditions  
Min  
4.5  
0
Typ  
Max  
5.5  
VCC  
-
Unit  
V
supply voltage  
-
-
-
-
-
input voltage  
V
VIH  
HIGH-level input voltage  
LOW-level input voltage  
HIGH-level output current  
2.0  
-
V
VIL  
0.8  
-
V
IOH  
32  
mA  
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
4 of 16  
 
 
 
 
 
 
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
Table 5.  
Operating conditions …continued  
Voltages are referenced to GND (ground = 0 V).  
Symbol  
IOL  
Parameter  
Conditions  
Min  
-
Typ  
Max  
64  
Unit  
mA  
ns/V  
C  
LOW-level output current  
input transition rise and fall rate  
ambient temperature  
-
-
-
t/V  
Tamb  
0
5
in free air  
40  
+85  
9. Static characteristics  
Table 6.  
Static characteristics  
Symbol Parameter  
Conditions  
25 C  
Min Typ Max  
40 C to +85 C Unit  
Min  
Max  
VIK  
input clamping voltage VCC = 4.5 V; IIK = 18 mA  
1.2 0.9  
-
1.2  
-
V
VOH  
HIGH-level output  
voltage  
VI = VIL or VIH  
VCC = 4.5 V; IOH = 3 mA  
VCC = 5.0 V; IOH = 3 mA  
VCC = 4.5 V; IOH = 32 mA  
2.5  
3.0  
2.0  
-
2.9  
3.4  
2.4  
-
-
-
2.5  
3.0  
2.0  
-
-
V
V
V
V
-
-
VOL  
LOW-level output  
voltage  
VCC = 4.5 V; IOL = 64 mA;  
VI = VIL or VIH  
0.42 0.55  
0.55  
[1]  
[2]  
VOL(pu)  
power-up LOW-level  
output voltage  
VCC = 5.5 V; IO = 1 mA;  
VI = GND or VCC  
-
0.13 0.55  
-
0.55  
V
II  
input leakage current VCC = 5.5 V; VI = VCC or GND  
-
-
0.01 1.0  
5.0 100  
-
-
1.0 A  
100 A  
IOFF  
power-off leakage  
current  
VCC = 0 V; VI or VO 4.5 V  
IO(pu/pd)  
IOZ  
power-up/power-down VCC = 2.0 V; VO = 0.5 V;  
output current  
-
5.0 50  
-
50  
A  
VI = GND or VCC; OE HIGH  
VCC = 5.5 V; VI = VIL or VIH  
VO = 2.7 V  
OFF-state output  
current  
-
5.0  
50  
-
-
50  
-
50  
-
A  
A  
A  
VO = 0.5 V  
50 5.0  
ILO  
output leakage current HIGH-state; VO = 5.5 V;  
VCC = 5.5 V; VI = GND or VCC  
-
5.0  
50  
50  
[3]  
IO  
output current  
supply current  
VCC = 5.5 V; VO = 2.5 V  
VCC = 5.5 V; VI = GND or VCC  
outputs HIGH-state  
180  
40  
180  
40  
mA  
ICC  
-
-
-
-
100  
24  
250  
30  
-
-
-
-
250  
30  
A  
mA  
A  
mA  
outputs LOW-state  
outputs disabled  
100  
0.5  
250  
1.5  
250  
1.5  
[4]  
ICC  
additional supply  
current  
per input pin; VCC = 5.5 V;  
one input at 3.4 V;  
other inputs at VCC or GND  
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
5 of 16  
 
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
Table 6.  
Static characteristics …continued  
Symbol Parameter  
Conditions  
25 C  
Min Typ Max  
40 C to +85 C Unit  
Min  
Max  
CI  
input capacitance  
output capacitance  
VI = 0 V or VCC  
-
-
3
6
-
-
-
-
-
-
pF  
pF  
CO  
outputs disabled; VO = 0 V or VCC  
[1] For valid test results, do not load data into the flip-flops (or latches) after applying the power.  
[2] This parameter is valid for any VCC between 0 V and 2.1 V, with a transition time of up to 10 ms. A transition time of up to 100 s is  
permitted between VCC = 2.1 V and VCC = 5 V 10 %.  
[3] Do not test more than one output at a time, and the duration of the test must not exceed one second.  
[4] This characteristic is the increase in supply current for each input at 3.4 V.  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
GND = 0 V; for test circuit, see Figure 9.  
Symbol Parameter Conditions  
25 C; VCC = 5.0 V  
40 C to +85 C;  
VCC = 5.0 V 0.5 V  
Unit  
Min  
Typ  
Max  
Min  
Max  
fmax  
tPLH  
tPHL  
tPZH  
tPZL  
tPHZ  
tPLZ  
maximum  
frequency  
see Figure 6  
150  
400  
-
125  
-
MHz  
ns  
LOW to HIGH  
propagation delay  
CP to Qn, see Figure 6  
CP to Qn, see Figure 6  
1.5  
2.0  
1.0  
2.5  
1.8  
1.4  
3.0  
3.4  
2.9  
3.8  
3.1  
2.6  
4.4  
4.7  
4.1  
5.2  
4.3  
3.8  
1.5  
2.0  
1.0  
2.5  
1.8  
1.4  
5.0  
5.1  
5.0  
5.7  
5.0  
4.0  
HIGH to LOW  
propagation delay  
ns  
OFF-state to HIGH OE to Qn; see Figure 8  
propagation delay  
ns  
OFF-state to LOW OE to Qn; see Figure 8  
propagation delay  
ns  
HIGH to OFF-state OE to Qn; see Figure 8  
propagation delay  
ns  
LOW to OFF-state OE to Qn; see Figure 8  
propagation delay  
ns  
tsu(H)  
tsu(L)  
th(H)  
th(L)  
tWH  
set-up time HIGH  
set-up time LOW  
hold time HIGH  
hold time LOW  
Dn to CP; see Figure 7  
Dn to CP; see Figure 7  
CP to Dn; see Figure 7  
CP to Dn; see Figure 7  
CP; see Figure 6  
1.0  
1.0  
0.6  
0.2  
-
-
-
-
-
-
1.0  
1.0  
1.0  
1.0  
2.0  
2.0  
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
+1.0 0.7  
+1.0 0.4  
pulse width HIGH  
pulse width LOW  
2.0  
2.0  
0.7  
0.8  
tWL  
CP; see Figure 6  
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
6 of 16  
 
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
11. Waveforms  
1 / f  
max  
V
I
CP input  
V
M
GND  
t
t
WL  
WH  
t
t
PLH  
PHL  
V
OH  
V
M
Qn output  
V
OL  
001aac445  
VM = 1.5 V  
OL and VOH are typical voltage output levels that occur with the output load.  
V
Fig 6. Propagation delay clock input (CP) to output (Qn), clock pulse (CP) width and maximum clock (CP)  
frequency  
V
l
V
V
V
V
M
Dn input  
CP input  
M
M
M
GND  
t
t
t
t
h(L)  
su(H)  
h(H)  
su(L)  
V
l
V
V
M
M
GND  
001aac738  
VM = 1.5 V  
The shaded areas indicate when the input is permitted to change for predictable output performance.  
Fig 7. Set-up and hold times data output (Dn) to clock (CP)  
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
7 of 16  
 
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
V
I
OE input  
V
M
t
GND  
3.5 V  
t
PZL  
PLZ  
V
V
Qn output  
Qn output  
M
V
+ 0.3 V  
OL  
V
V
OL  
t
t
PHZ  
PZH  
V
OH  
− 0.3 V  
OH  
M
GND  
001aac448  
VM = 1.5 V  
VOL and VOH are typical voltage output levels that occur with the output load  
Fig 8. 3-state output (Qn) enable and disable times  
t
W
V
I
90 %  
90 %  
V
EXT  
negative  
pulse  
V
V
M
M
V
CC  
10 %  
10 %  
R
L
0 V  
V
V
O
I
t
t
r
f
G
DUT  
t
t
f
r
R
T
C
L
R
L
V
I
90 %  
90 %  
positive  
pulse  
V
M
V
M
mna616  
10 %  
10 %  
0 V  
t
W
001aai298  
a. Input pulse definition  
b. Test circuit  
Test data is given in Table 8.  
RL = Load resistance.  
CL = Load capacitance including jig and probe capacitance.  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.  
VEXT = External voltage for measuring switching times.  
Fig 9. Test circuit for measuring switching times  
Table 8.  
Input  
VI  
Test data  
Load  
CL  
VEXT  
fi  
tW  
tr, tf  
RL  
tPHL, tPLH  
open  
tPZH, tPHZ  
tPZL, tPLZ  
7.0 V  
3.0 V  
1 MHz  
500 ns  
2.5 ns  
50 pF  
500   
open  
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
8 of 16  
 
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
12. Package outline  
DIP20: plastic dual in-line package; 20 leads (300 mil)  
SOT146-1  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
M
H
20  
11  
pin 1 index  
E
1
10  
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
(1)  
(1)  
Z
1
2
UNIT  
mm  
b
b
c
D
E
e
e
1
L
M
M
H
w
1
E
max.  
min.  
max.  
max.  
1.73  
1.30  
0.53  
0.38  
0.36  
0.23  
26.92  
26.54  
6.40  
6.22  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.1  
7.62  
0.3  
0.254  
0.01  
2
0.068  
0.051  
0.021  
0.015  
0.014  
0.009  
1.060  
1.045  
0.25  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.02  
0.13  
0.078  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-13  
SOT146-1  
MS-001  
SC-603  
Fig 10. Package outline SOT146-1 (DIP20)  
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
9 of 16  
 
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
SO20: plastic small outline package; 20 leads; body width 7.5 mm  
SOT163-1  
D
E
A
X
c
y
H
E
v
M
A
Z
20  
11  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
10  
w
detail X  
e
M
b
p
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
max.  
(1)  
(1)  
(1)  
UNIT  
mm  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.3  
0.1  
2.45  
2.25  
0.49  
0.36  
0.32  
0.23  
13.0  
12.6  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.1  
1.0  
0.9  
0.4  
2.65  
0.1  
0.25  
0.01  
1.27  
0.05  
1.4  
0.25 0.25  
0.01  
0.1  
8o  
0o  
0.012 0.096  
0.004 0.089  
0.019 0.013 0.51  
0.014 0.009 0.49  
0.30  
0.29  
0.419  
0.394  
0.043 0.043  
0.016 0.039  
0.035  
0.016  
inches  
0.055  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT163-1  
075E04  
MS-013  
Fig 11. Package outline SOT163-1 (SO20)  
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
10 of 16  
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm  
SOT339-1  
D
E
A
X
c
H
v
M
A
y
E
Z
20  
11  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
10  
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.21  
0.05  
1.80  
1.65  
0.38  
0.25  
0.20  
0.09  
7.4  
7.0  
5.4  
5.2  
7.9  
7.6  
1.03  
0.63  
0.9  
0.7  
0.9  
0.5  
mm  
2
0.65  
0.25  
1.25  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT339-1  
MO-150  
Fig 12. Package outline SOT339-1 (SSOP20)  
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
11 of 16  
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm  
SOT360-1  
D
E
A
X
c
H
v
M
A
y
E
Z
11  
20  
Q
A
2
(A )  
3
A
A
1
pin 1 index  
θ
L
p
L
1
10  
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
6.6  
6.4  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.5  
0.2  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT360-1  
MO-153  
Fig 13. Package outline SOT360-1 (TSSOP20)  
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
12 of 16  
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
13. Abbreviations  
Table 9.  
Acronym  
BiCMOS  
DUT  
Abbreviations  
Description  
Bipolar Complementary Metal-Oxide Semiconductor  
Device Under Test  
ESD  
ElectroStatic Discharge  
HBM  
Human Body Model  
MM  
Machine Model  
14. Revision history  
Table 10. Revision history  
Document ID  
74ABT574A v.2  
Modifications:  
Release date  
20121123  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
74ABT574A v.1  
• The format of this data sheet has been redesigned to comply with the new identity  
guidelines of NXP Semiconductors.  
• Legal texts have been adapted to the new company name where appropriate.  
74ABT574A v.1  
19950522  
Product specification  
-
-
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
13 of 16  
 
 
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
15.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
15.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
14 of 16  
 
 
 
 
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74ABT574A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 2 — 23 November 2012  
15 of 16  
 
 
74ABT574A  
NXP Semiconductors  
Octal D-type flip-flop; 3-state  
17. Contents  
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
6
Functional description . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 4  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13  
7
8
9
10  
11  
12  
13  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 15  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2012.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 23 November 2012  
Document identifier: 74ABT574A  
 

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