74AHC1G07GW,118 [NXP]
74AHC(T)1G07 - Buffer with open-drain output TSSOP 5-Pin;型号: | 74AHC1G07GW,118 |
厂家: | NXP |
描述: | 74AHC(T)1G07 - Buffer with open-drain output TSSOP 5-Pin 光电二极管 逻辑集成电路 |
文件: | 总11页 (文件大小:63K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
74AHC1G07; 74AHCT1G07
Buffer with open-drain output
Rev. 06 — 7 June 2007
Product data sheet
1. General description
74AHC1G07 and 74AHCT1G07 are high-speed Si-gate CMOS devices. They provide a
non-inverting buffer.
The output of these devices is open-drain and can be connected to other open-drain
outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions. For
digital operation this device must have a pull-up resistor to establish a logic HIGH-level.
The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V.
The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
2. Features
I High noise immunity
I Low power dissipation
I SOT353-1 and SOT753 package options
I ESD protection:
N HBM JESD22-A114E: exceeds 2000 V
N MM JESD22-A115-A: exceeds 200 V
N CDM JESD22-C101C: exceeds 1000 V
I Specified from −40 °C to +125 °C
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
−40 °C to +125 °C
Name
Description
Version
74AHC1G07GW
74AHCT1G07GW
74AHC1G07GV
74AHCT1G07GV
TSSOP5
plastic thin shrink small outline package;
5 leads; body width 1.25 mm
SOT353-1
−40 °C to +125 °C
SC-74A
plastic surface-mounted package; 5 leads
SOT753
74AHC1G07; 74AHCT1G07
NXP Semiconductors
Buffer with open-drain output
4. Marking
Table 2.
Marking codes
Type number
Marking
AS
74AHC1G07GW
74AHC1G07GV
74AHCT1G07GW
74AHCT1G07GV
A07
CS
C07
5. Functional diagram
Y
A
Y
4
2
2
4
Y
A
A
GND mna591
mna589
mna590
Fig 1. Logic symbol
Fig 2. IEC logic symbol
Fig 3. Logic diagram
6. Pinning information
6.1 Pinning
74AHC1G07
74AHCT1G07
1
2
3
5
4
n.c.
A
V
Y
CC
GND
001aaf094
Fig 4. Pin configuration
6.2 Pin description
Table 3.
Symbol
n.c.
Pin description
Pin
Description
not connected
data input
1
2
3
4
5
A
GND
Y
ground (0 V)
data output
VCC
supply voltage
74AHC_AHCT1G07_6
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 — 7 June 2007
2 of 11
74AHC1G07; 74AHCT1G07
NXP Semiconductors
Buffer with open-drain output
7. Functional description
Table 4.
Function table
H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state
Input
Output
A
L
Y
L
Z
H
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
VI
Parameter
Conditions
Min
−0.5
−0.5
−20
-
Max
+7.0
+7.0
-
Unit
V
supply voltage
input voltage
V
IIK
input clamping current
output clamping current
output current
VI < −0.5 V
mA
mA
mA
V
[1]
IOK
VO < −0.5 V
±20
±25
+7.0
+7.0
75
IO
VO > −0.5 V
-
[1]
[1]
VO
output voltage
active mode
−0.5
−0.5
-
high-impedance mode
V
ICC
supply current
mA
mA
°C
IGND
Tstg
Ptot
ground current
−75
−65
-
-
storage temperature
total power dissipation
+150
250
[2]
Tamb = −40 °C to +125 °C
mW
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For both TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K.
9. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
74AHC1G07
74AHCT1G07
Unit
Min
2.0
0
Typ
Max
5.5
Min
4.5
0
Typ
Max
VCC
VI
supply voltage
input voltage
output voltage
5.0
5.0
5.5
5.5
VCC
6.0
V
V
V
V
-
5.5
-
VO
active mode
0
-
VCC
6.0
0
-
high-impedance mode
0
-
0
-
Tamb
ambient temperature
−40
-
+25
+125
100
20
−40
-
+25
+125 °C
∆t/∆V
input transition rise
and fall rate
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
-
-
-
-
-
ns/V
ns/V
-
-
20
74AHC_AHCT1G07_6
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 — 7 June 2007
3 of 11
74AHC1G07; 74AHCT1G07
NXP Semiconductors
Buffer with open-drain output
10. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
25 °C
−40 °C to +85 °C −40 °C to +125 °C Unit
Min Typ Max
Min
Max
Min
Max
For type 74AHC1G07
VIH
HIGH-level
input voltage
VCC = 2.0 V
1.5
-
-
-
-
-
-
-
-
1.5
-
-
1.5
-
-
V
V
V
V
V
V
VCC = 3.0 V
2.1
2.1
2.1
VCC = 5.5 V
3.85
-
3.85
-
3.85
-
VIL
LOW-level
input voltage
VCC = 2.0 V
-
-
-
0.5
0.9
1.65
-
-
-
0.5
0.9
1.65
-
-
-
0.5
0.9
1.65
VCC = 3.0 V
VCC = 5.5 V
VOL
LOW-level
VI = VIH or VIL
output voltage
IO = 50 µA; VCC = 2.0 V
IO = 50 µA; VCC = 3.0 V
IO = 50 µA; VCC = 4.5 V
IO = 4.0 mA; VCC = 3.0 V
IO = 8.0 mA; VCC = 4.5 V
-
-
-
-
-
-
0
0
0
-
0.1
0.1
-
-
-
-
-
-
0.1
0.1
-
-
-
-
-
-
0.1
0.1
V
V
0.1
0.1
0.1
V
0.36
0.36
0.1
0.44
0.44
1.0
0.55
0.55
2.0
V
-
V
II
input leakage VI = 5.5 V or GND;
-
µA
current
VCC = 0 V to 5.5 V
IOZ
ICC
CI
OFF-state
output current GND; VCC = 5.5 V
VI = VIH or VIL; VO = VCC or
-
-
-
-
-
±0.25
1.0
±2.5
10
±10.0
20
µA
µA
pF
supply current VI = VCC or GND; IO = 0 A;
-
-
-
-
VCC = 5.5 V
input
1.5
10
10
10
capacitance
For type 74AHCT1G07
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
VCC = 4.5 V to 5.5 V
2.0
-
-
-
-
2.0
-
-
2.0
-
-
V
V
VIL
LOW-level
0.8
0.8
0.8
input voltage
VOL
LOW-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 50 µA
-
-
-
0
-
0.1
0.36
0.1
-
-
-
0.1
0.44
1.0
-
-
-
0.1
0.55
2.0
V
IO = 8.0 mA
V
II
input leakage VI = 5.5 V or GND;
-
µA
current
VCC = 0 V to 5.5 V
IOZ
ICC
∆ICC
OFF-state
output current GND; VCC = 5.5 V
VI = VIH or VIL; VO = VCC or
-
-
-
-
-
-
±0.25
1.0
±2.5
10
±10.0
20
µA
µA
mA
supply current VI = VCC or GND; IO = 0 A;
-
-
-
-
VCC = 5.5 V
additional
per input pin; VI = 3.4 V;
1.35
1.5
1.5
supply current other inputs at VCC or GND;
IO = 0 A; VCC = 5.5 V
CI
input
-
1.5
10
-
10
-
10
pF
capacitance
74AHC_AHCT1G07_6
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 — 7 June 2007
4 of 11
74AHC1G07; 74AHCT1G07
NXP Semiconductors
Buffer with open-drain output
11. Dynamic characteristics
Table 8.
Dynamic characteristics
GND = 0 V; tr = tf = ≤ 3.0 ns. For test circuit see Figure 6.
Symbol Parameter
Conditions
25 °C
−40 °C to +85 °C −40 °C to +125 °C Unit
Min Typ Max
Min
Max
Min
Max
For type 74AHC1G07
tPZL
tPLZ
CPD
OFF-state
to LOW
propagation
delay
A to Y; see Figure 5
VCC = 3.0 V to 3.6 V
CL = 15 pF
[1]
[2]
-
-
3.5
5.0
5.6
8.0
1.0
1.0
6.3
9.0
1.0
1.0
7.0
ns
ns
CL = 50 pF
10.0
VCC = 4.5 V to 5.5 V
CL = 15 pF
-
-
2.5
3.6
3.9
5.5
1.0
1.0
4.6
6.5
1.0
1.0
4.9
7.0
ns
ns
CL = 50 pF
LOW to
A to Y; see Figure 5
VCC = 3.0 V to 3.6 V
CL = 15 pF
OFF-state
propagation
delay
[1]
[2]
[3]
-
-
5.8
7.9
1.0
1.0
8.4
1.0
1.0
8.9
ns
ns
CL = 50 pF
8.3 11.5
12.0
12.5
VCC = 4.5 V to 5.5 V
CL = 15 pF
-
-
-
4.2
6.0
5
5.1
7.5
-
1.0
1.0
-
5.6
8.0
-
1.0
1.0
-
6.1
8.5
-
ns
ns
pF
CL = 50 pF
power
per buffer;
dissipation
capacitance
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
For type 74AHCT1G07
tPZL
tPLZ
CPD
OFF-state
to LOW
propagation
delay
A to Y; see Figure 5
VCC = 4.5 V to 5.5 V
CL = 15 pF
[2]
-
-
2.8
4.0
4.6
6.5
1.0
1.0
5.3
7.5
1.0
1.0
5.6
8.0
ns
ns
CL = 50 pF
LOW to
A to Y; see Figure 5
VCC = 4.5 V to 5.5 V
CL = 15 pF
OFF-state
propagation
delay
[2]
[3]
-
-
-
3.9
5.5
6.5
5.6
8.0
-
1.0
1.0
-
6.1
8.5
-
1.0
1.0
-
6.6
9.0
-
ns
ns
pF
CL = 50 pF
power
per buffer;
dissipation
capacitance
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
[1] Typical values are measured at VCC = 3.3 V.
[2] Typical values are measured at VCC = 5.0 V.
[3] CPD is used to determine the dynamic power dissipation PD (µW).
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts
74AHC_AHCT1G07_6
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 — 7 June 2007
5 of 11
74AHC1G07; 74AHCT1G07
NXP Semiconductors
Buffer with open-drain output
12. Waveforms
V
I
(1)
V
A input
M
GND
t
t
PZL
PLZ
V
CC
Y output
(2)
V
M
V
+ 0.3 V
V
OL
OL
mna592
Measurement points are given in Table 9.
Fig 5. Input (A) to output (Y) propagation delays
Table 9.
Type
Measurement point
Input
Output
(1)
(2)
VI
VM
VM
74AHC1G07
GND to VCC
GND to 3.0 V
0.5 × VCC
1.5 V
0.5 × VCC
0.5 × VCC
74AHCT1G07
S
1
V
CC
open
GND
V
CC
R
L
=
1000 Ω
V
V
O
I
PULSE
GENERATOR
D.U.T.
C
L
R
T
mna232
Test data is given in Table 8. Definitions for test circuit:
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
For tPLZ, tPZL, S1 = VCC
Fig 6. Load circuitry for switching times
74AHC_AHCT1G07_6
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 — 7 June 2007
6 of 11
74AHC1G07; 74AHCT1G07
NXP Semiconductors
Buffer with open-drain output
13. Package outline
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
SOT353-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
4
A
2
A
(A )
3
A
1
θ
L
L
p
1
3
e
w M
b
p
detail X
e
1
0
1.5
3 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
A
A
A
b
c
D
E
e
e
1
H
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
E
max.
0.1
0
1.0
0.8
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
2.25
2.0
0.46
0.21
0.60
0.15
7°
0°
mm
1.1
0.65
1.3
0.15
0.425
0.3
0.1
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-09-01
03-02-19
SOT353-1
MO-203
SC-88A
Fig 7. Package outline SOT353-1 (TSSOP5)
74AHC_AHCT1G07_6
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 — 7 June 2007
7 of 11
74AHC1G07; 74AHCT1G07
NXP Semiconductors
Buffer with open-drain output
Plastic surface-mounted package; 5 leads
SOT753
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
c
L
p
1
2
3
detail X
e
b
p
w
M B
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A
b
c
D
E
e
H
L
Q
v
w
y
p
1
p
E
0.100
0.013
0.40
0.25
1.1
0.9
0.26
0.10
3.1
2.7
1.7
1.3
3.0
2.5
0.6
0.2
0.33
0.23
mm
0.95
0.2
0.2
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
02-04-16
06-03-16
SOT753
SC-74A
Fig 8. Package outline SOT753 (SC-74A)
74AHC_AHCT1G07_6
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 — 7 June 2007
8 of 11
74AHC1G07; 74AHCT1G07
NXP Semiconductors
Buffer with open-drain output
14. Abbreviations
Table 10. Abbreviations
Acronym
CDM
DUT
Description
Charged Device Model
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
Machine Model
HBM
MM
TTL
Transistor-Transistor Logic
15. Revision history
Table 11. Revision history
Document ID
Release date
20070607
Data sheet status
Change notice
Supersedes
74AHC_AHCT1G07_6
Modifications:
Product data sheet
-
74AHC_AHCT1G07_5
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Package SOT353 changed to SOT353-1 in Section 3 and Section 13.
• Quick reference data and Soldering sections removed.
74AHC_AHCT1G07_5
74AHC_AHCT1G07_4
74AHC_AHCT1G07_3
74AHC_AHCT1G07_2
74AHC_AHCT1G07_1
20021002
20020606
20020221
20010209
20000502
Product specification
Product specification
Product specification
Product specification
Product specification
-
-
-
-
-
74AHC_AHCT1G07_4
74AHC_AHCT1G07_3
74AHC_AHCT1G07_2
74AHC_AHCT1G07_1
-
74AHC_AHCT1G07_6
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 — 7 June 2007
9 of 11
74AHC1G07; 74AHCT1G07
NXP Semiconductors
Buffer with open-drain output
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of a NXP Semiconductors product can reasonably be expected to
16.2 Definitions
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
17. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
74AHC_AHCT1G07_6
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 — 7 June 2007
10 of 11
74AHC1G07; 74AHCT1G07
NXP Semiconductors
Buffer with open-drain output
18. Contents
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
7
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 3
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
8
9
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 7 June 2007
Document identifier: 74AHC_AHCT1G07_6
相关型号:
©2020 ICPDF网 联系我们和版权申明