74AHCT32D,112 [NXP]

74AHC(T)32 - Quad 2-input OR gate SOIC 14-Pin;
74AHCT32D,112
型号: 74AHCT32D,112
厂家: NXP    NXP
描述:

74AHC(T)32 - Quad 2-input OR gate SOIC 14-Pin

光电二极管 逻辑集成电路
文件: 总14页 (文件大小:77K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
74AHC32; 74AHCT32  
Quad 2-input OR gate  
Rev. 04 — 22 May 2008  
Product data sheet  
1. General description  
The 74AHC32; 74AHCT32 is a high-speed Si-gate CMOS device and is pin compatible  
with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard  
No. 7-A.  
The 74AHC32; 74AHCT32 provides the 2-input OR function.  
2. Features  
I Balanced propagation delays  
I All inputs have Schmitt-trigger actions  
I Inputs accept voltages higher than VCC  
I Input levels:  
N For 74AHC32: CMOS level  
N For 74AHCT32: TTL level  
I ESD protection:  
N HBM EIA/JESD22-A114E exceeds 2000 V  
N MM EIA/JESD22-A115-A exceeds 200 V  
N CDM EIA/JESD22-C101C exceeds 1000 V  
I Multiple package options  
I Specified from 40 °C to +85 °C and from 40 °C to +125 °C  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74AHC32  
74AHC32D  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
SO14  
plastic small outline package; 14 leads;  
body width 3.9 mm  
SOT108-1  
SOT402-1  
74AHC32PW  
74AHC32BQ  
TSSOP14  
plastic thin shrink small outline package; 14 leads;  
body width 4.4 mm  
DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1  
thin quad flat package; no leads; 14 terminals;  
body 2.5 × 3 × 0.85 mm  
 
 
 
74AHC32; 74AHCT32  
NXP Semiconductors  
Quad 2-input OR gate  
Table 1.  
Ordering information …continued  
Type number  
Package  
Temperature range Name  
Description  
Version  
74AHCT32  
74AHCT32D  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
SO14  
plastic small outline package; 14 leads;  
body width 3.9 mm  
SOT108-1  
SOT402-1  
74AHCT32PW  
74AHCT32BQ  
TSSOP14  
plastic thin shrink small outline package; 14 leads;  
body width 4.4 mm  
DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1  
thin quad flat package; no leads; 14 terminals;  
body 2.5 × 3 × 0.85 mm  
4. Functional diagram  
1
1  
1  
1  
1  
3
6
2
4
5
1
2
1A  
1B  
1Y  
2Y  
3Y  
3
6
8
4
5
2A  
2B  
9
8
10  
9
3A  
3B  
10  
12  
13  
12  
13  
4A  
4B  
4Y 11  
11  
mna242  
mna243  
Fig 1. Logic symbol  
Fig 2. IEC logic symbol  
A
B
Y
mna241  
Fig 3. Logic diagram (one gate)  
74AHC_AHCT32_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 22 May 2008  
2 of 14  
 
74AHC32; 74AHCT32  
NXP Semiconductors  
Quad 2-input OR gate  
5. Pinning information  
5.1 Pinning  
terminal 1  
index area  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
1A  
1B  
V
CC  
4B  
4A  
4Y  
3B  
3A  
3Y  
2
3
4
5
6
13  
12  
11  
10  
9
1B  
1Y  
2A  
2B  
2Y  
4B  
4A  
4Y  
3B  
3A  
1Y  
32  
2A  
32  
(1)  
GND  
2B  
2Y  
001aad102  
8
GND  
Transparent top view  
001aad101  
(1) The die substrate is attached to this pad using  
conductive die attach material. It can not be used as  
a supply pin or input.  
Fig 4. Pin configuration SO14 and TSSOP14  
Fig 5. Pin configuration DHVQFN14  
5.2 Pin description  
Table 2.  
Symbol  
1A  
Pin description  
Pin  
1
Description  
data input  
1B  
2
data input  
1Y  
3
data output  
data input  
2A  
4
2B  
5
data input  
2Y  
6
data output  
ground (0 V)  
data output  
data input  
GND  
3Y  
7
8
3A  
9
3B  
10  
11  
12  
13  
14  
data input  
4Y  
data output  
data input  
4A  
4B  
data input  
VCC  
supply voltage  
74AHC_AHCT32_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 22 May 2008  
3 of 14  
 
 
 
74AHC32; 74AHCT32  
NXP Semiconductors  
Quad 2-input OR gate  
6. Functional description  
Table 3.  
Function table[1]  
Input  
nA  
L
Output  
nB  
L
nY  
L
X
H
H
H
X
H
[1] H = HIGH voltage level;  
L = LOW voltage level;  
X = don’t care.  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
Min  
0.5  
0.5  
20  
20  
25  
-
Max  
+7.0  
+7.0  
-
Unit  
V
VCC  
VI  
supply voltage  
input voltage  
V
[1]  
[1]  
IIK  
input clamping current  
output clamping current  
output current  
VI < 0.5 V  
mA  
mA  
mA  
mA  
mA  
°C  
IOK  
IO  
VO < 0.5 V or VO > VCC + 0.5 V  
VO = 0.5 V to (VCC + 0.5 V)  
+20  
+25  
+75  
-
ICC  
IGND  
Tstg  
Ptot  
supply current  
ground current  
75  
65  
-
storage temperature  
total power dissipation  
+150  
500  
[2]  
Tamb = 40 °C to +125 °C  
mW  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] For SO14 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K.  
For TSSOP14 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K.  
For DHVQFN14 packages: above 60 °C the value of Ptot derates linearly at 4.5 mW/K.  
8. Recommended operating conditions  
Table 5.  
Operating conditions  
Symbol Parameter  
74AHC32  
Conditions  
Min  
Typ  
Max  
Unit  
VCC  
VI  
supply voltage  
2.0  
5.0  
5.5  
V
input voltage  
0
-
5.5  
V
VO  
output voltage  
0
-
VCC  
+125  
100  
20  
V
Tamb  
t/V  
ambient temperature  
input transition rise and fall rate  
40  
+25  
°C  
ns/V  
ns/V  
VCC = 3.0 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
-
-
-
-
74AHC_AHCT32_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 22 May 2008  
4 of 14  
 
 
 
 
 
 
74AHC32; 74AHCT32  
NXP Semiconductors  
Quad 2-input OR gate  
Table 5.  
Operating conditions …continued  
Symbol Parameter  
74AHCT32  
Conditions  
Min  
Typ  
Max  
Unit  
VCC  
VI  
supply voltage  
4.5  
0
5.0  
5.5  
V
input voltage  
-
5.5  
V
VO  
output voltage  
0
-
VCC  
+125  
20  
V
Tamb  
t/V  
ambient temperature  
input transition rise and fall rate  
40  
-
+25  
-
°C  
ns/V  
VCC = 4.5 V to 5.5 V  
9. Static characteristics  
Table 6.  
Static characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
25 °C  
Min Typ  
40 °C to +85 °C 40 °C to +125 °C Unit  
Max  
Min  
Max  
Min  
Max  
74AHC32  
VIH  
HIGH-level  
input voltage  
VCC = 2.0 V  
1.5  
-
-
-
-
-
-
-
-
1.5  
-
-
1.5  
-
-
V
V
V
V
V
V
VCC = 3.0 V  
2.1  
2.1  
2.1  
VCC = 5.5 V  
3.85  
-
3.85  
-
3.85  
-
VIL  
LOW-level  
input voltage  
VCC = 2.0 V  
-
-
-
0.5  
0.9  
1.65  
-
-
-
0.5  
0.9  
1.65  
-
-
-
0.5  
0.9  
1.65  
VCC = 3.0 V  
VCC = 5.5 V  
VOH  
HIGH-level  
VI = VIH or VIL  
output voltage  
IO = 50 µA; VCC = 2.0 V  
IO = 50 µA; VCC = 3.0 V  
IO = 50 µA; VCC = 4.5 V  
1.9  
2.9  
4.4  
2.0  
3.0  
4.5  
-
-
-
-
-
-
1.9  
2.9  
-
-
-
-
-
1.9  
2.9  
-
-
-
-
-
V
V
V
V
V
4.4  
4.4  
IO = 4.0 mA; VCC = 3.0 V 2.58  
IO = 8.0 mA; VCC = 4.5 V 3.94  
VI = VIH or VIL  
2.48  
3.80  
2.40  
3.70  
-
VOL  
LOW-level  
output voltage  
IO = 50 µA; VCC = 2.0 V  
IO = 50 µA; VCC = 3.0 V  
IO = 50 µA; VCC = 4.5 V  
IO = 4.0 mA; VCC = 3.0 V  
IO = 8.0 mA; VCC = 4.5 V  
-
-
-
-
-
-
0
0
0
-
0.1  
0.1  
-
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
-
0.1  
0.1  
V
V
0.1  
0.1  
0.1  
V
0.36  
0.36  
0.1  
0.44  
0.44  
1.0  
0.55  
0.55  
2.0  
V
-
V
II  
input leakage VI = 5.5 V or GND;  
current CC = 0 V to 5.5 V  
-
µA  
V
ICC  
CI  
CO  
supply current VI = VCC or GND; IO = 0 A;  
CC = 5.5 V  
-
-
-
-
2.0  
10  
-
-
-
-
20  
10  
-
-
-
-
40  
10  
-
µA  
pF  
pF  
V
input  
VI = VCC or GND  
3
4
capacitance  
output  
capacitance  
74AHC_AHCT32_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 22 May 2008  
5 of 14  
 
 
74AHC32; 74AHCT32  
NXP Semiconductors  
Quad 2-input OR gate  
Table 6.  
Static characteristics …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
25 °C  
Min Typ  
40 °C to +85 °C 40 °C to +125 °C Unit  
Max  
Min  
Max  
Min  
Max  
74AHCT32  
VIH  
VIL  
HIGH-level  
input voltage  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
2.0  
-
-
-
-
2.0  
-
-
2.0  
-
-
V
V
LOW-level  
0.8  
0.8  
0.8  
input voltage  
VOH  
HIGH-level  
output voltage  
VI = VIH or VIL; VCC = 4.5 V  
IO = 50 µA  
4.4  
4.5  
-
-
-
4.4  
-
-
4.4  
-
-
V
V
IO = 8.0 mA  
3.94  
3.80  
3.70  
VOL  
LOW-level  
output voltage  
VI = VIH or VIL; VCC = 4.5 V  
IO = 50 µA  
-
-
-
0
-
0.1  
0.36  
0.1  
-
-
-
0.1  
0.44  
1.0  
-
-
-
0.1  
0.55  
2.0  
V
IO = 8.0 mA  
V
II  
input leakage VI = 5.5 V or GND;  
current CC = 0 V to 5.5 V  
-
µA  
V
ICC  
ICC  
supply current VI = VCC or GND; IO = 0 A;  
CC = 5.5 V  
-
-
-
-
2.0  
-
-
20  
-
-
40  
µA  
V
additional  
per input pin;  
1.35  
1.5  
1.5  
mA  
supply current VI = VCC 2.1 V; other pins  
at VCC or GND; IO = 0 A;  
VCC = 4.5 V to 5.5 V  
CI  
input  
capacitance  
VI = VCC or GND  
-
-
3
4
10  
-
-
-
10  
-
-
-
10  
-
pF  
pF  
CO  
output  
capacitance  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7.  
Symbol Parameter Conditions  
74AHC32  
25 °C  
Min Typ[1] Max  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min  
Max  
Min  
Max  
[2]  
tpd  
propagation nA, nB to nY; see Figure 6  
delay  
VCC = 3.0 V to 3.6 V  
CL = 15 pF  
-
-
3.9  
7.9  
1.0  
1.0  
9.5  
13  
1.0  
1.0  
10.0  
14.5  
ns  
ns  
CL = 50 pF  
5.6 11.4  
VCC = 4.5 V to 5.5 V  
CL = 15 pF  
-
-
-
2.8  
4.1  
10  
5.5  
7.5  
-
1.0  
1.0  
-
6.5  
8.5  
-
1.0  
1.0  
-
7.0  
9.5  
-
ns  
ns  
pF  
CL = 50 pF  
[3]  
CPD  
power  
fi = 1 MHz; VI = GND to VCC  
dissipation  
capacitance  
74AHC_AHCT32_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 22 May 2008  
6 of 14  
 
74AHC32; 74AHCT32  
NXP Semiconductors  
Quad 2-input OR gate  
Table 7.  
Dynamic characteristics …continued  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7.  
Symbol Parameter Conditions  
25 °C  
Min Typ[1] Max  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min  
Max  
Min  
Max  
74AHCT32; VCC = 4.5 V to 5.5 V  
[2]  
[3]  
tpd  
propagation nA, nB to nY; see Figure 6  
delay  
CL = 15 pF  
-
-
-
3.1  
4.3  
12  
6.9  
7.9  
-
1.0  
1.0  
-
8.0  
9.0  
-
1.0  
1.0  
-
9.0  
10.0  
-
ns  
ns  
pF  
CL = 50 pF  
CPD  
power  
fi = 1 MHz; VI = GND to VCC  
dissipation  
capacitance  
[1] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V).  
[2] tpd is the same as tPLH and tPHL  
.
[3] CPD is used to determine the dynamic power dissipation (PD in µW).  
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in V;  
N = number of inputs switching;  
Σ(CL × VCC2 × fo) = sum of the outputs.  
11. Waveforms  
V
I
V
nA, nB input  
GND  
M
t
t
PLH  
PHL  
V
OH  
nY output  
V
M
V
OL  
mna224  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 6. Input to output propagation delays  
Table 8.  
Type  
Measurement points  
Input  
VM  
Output  
VM  
74AHC32  
0.5 × VCC  
1.5 V  
0.5 × VCC  
0.5 × VCC  
74AHCT32  
74AHC_AHCT32_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 22 May 2008  
7 of 14  
 
 
 
 
 
74AHC32; 74AHCT32  
NXP Semiconductors  
Quad 2-input OR gate  
t
W
V
I
90 %  
negative  
pulse  
V
V
V
V
M
M
10 %  
GND  
t
t
r
f
t
t
f
r
V
I
90 %  
positive  
pulse  
M
M
10 %  
GND  
t
W
V
CC  
V
V
O
I
G
DUT  
R
T
C
L
001aah768  
Test data is given in Table 9.  
Definitions test circuit:  
RT = termination resistance should be equal to output impedance Zo of the pulse generator.  
CL = load capacitance including jig and probe capacitance.  
Fig 7. Load circuitry for measuring switching times  
Table 9.  
Type  
Test data  
Input  
VI  
Load  
Test  
tr, tf  
CL  
74AHC32  
VCC  
3.0 V  
3.0 ns  
3.0 ns  
15 pF, 50 pF  
15 pF, 50 pF  
tPLH, tPHL  
tPLH, tPHL  
74AHCT32  
74AHC_AHCT32_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 22 May 2008  
8 of 14  
 
74AHC32; 74AHCT32  
NXP Semiconductors  
Quad 2-input OR gate  
12. Package outline  
SO14: plastic small outline package; 14 leads; body width 3.9 mm  
SOT108-1  
D
E
A
X
v
c
y
H
M
A
E
Z
8
14  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
7
e
detail X  
w
M
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
8.75  
8.55  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.75  
1.27  
0.05  
1.05  
0.25  
0.01  
0.25  
0.1  
0.25  
0.01  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.35  
0.014 0.0075 0.34  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches  
0.041  
0.01 0.004  
0.069  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT108-1  
076E06  
MS-012  
Fig 8. Package outline SOT108-1 (SO14)  
74AHC_AHCT32_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 22 May 2008  
9 of 14  
 
74AHC32; 74AHCT32  
NXP Semiconductors  
Quad 2-input OR gate  
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm  
SOT402-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
(A )  
3
A
2
A
A
1
pin 1 index  
θ
L
p
L
1
7
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
5.1  
4.9  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.72  
0.38  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT402-1  
MO-153  
Fig 9. Package outline SOT402-1 (TSSOP14)  
74AHC_AHCT32_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 22 May 2008  
10 of 14  
74AHC32; 74AHCT32  
NXP Semiconductors  
Quad 2-input OR gate  
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;  
14 terminals; body 2.5 x 3 x 0.85 mm  
SOT762-1  
B
A
D
A
A
1
E
c
detail X  
terminal 1  
index area  
C
terminal 1  
index area  
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
6
L
1
7
8
E
h
e
14  
13  
9
D
h
X
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
(1)  
(1)  
UNIT  
A
1
b
c
E
e
e
1
y
D
D
E
L
v
w
y
h
h
1
max.  
0.05 0.30  
0.00 0.18  
3.1  
2.9  
1.65  
1.35  
2.6  
2.4  
1.15  
0.85  
0.5  
0.3  
mm  
0.05  
0.1  
1
0.2  
0.5  
2
0.1  
0.05  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-10-17  
03-01-27  
SOT762-1  
- - -  
MO-241  
- - -  
Fig 10. Package outline SOT762-1 (DHVQFN14)  
74AHC_AHCT32_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 22 May 2008  
11 of 14  
74AHC32; 74AHCT32  
NXP Semiconductors  
Quad 2-input OR gate  
13. Abbreviations  
Table 10. Abbreviations  
Acronym  
CDM  
Description  
Charged Device Model  
CMOS  
DUT  
Complementary Metal-Oxide Semiconductor  
Device Under Test  
ESD  
ElectroStatic Discharge  
HBM  
Human Body Model  
LSTTL  
MM  
Low-power Schottky Transistor-Transistor Logic  
Machine Model  
14. Revision history  
Table 11. Revision history  
Document ID  
Release date  
20080522  
Data sheet status  
Change notice  
Supersedes  
74AHC_AHCT32_4  
Modifications:  
Product data sheet  
-
74AHC_AHCT32_3  
The format of this data sheet has been redesigned to comply with the new identity guidelines  
of NXP Semiconductors.  
Legal texts have been adapted to the new company name where appropriate.  
Table 6: the conditions for input leakage current have been changed.  
74AHC_AHCT32_3  
74AHC_AHCT32_2  
74AHC_AHCT32_1  
20040519  
19990927  
19981209  
Product specification  
Product specification  
Preliminary specification  
-
-
-
74AHC_AHCT32_2  
74AHC_AHCT32_1  
-
74AHC_AHCT32_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 22 May 2008  
12 of 14  
 
 
74AHC32; 74AHCT32  
NXP Semiconductors  
Quad 2-input OR gate  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
15.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
15.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74AHC_AHCT32_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 22 May 2008  
13 of 14  
 
 
 
 
 
 
74AHC32; 74AHCT32  
NXP Semiconductors  
Quad 2-input OR gate  
17. Contents  
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
6
Functional description . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 4  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12  
7
8
9
10  
11  
12  
13  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 13  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2008.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 22 May 2008  
Document identifier: 74AHC_AHCT32_4  
 

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