74ALVC541PW-Q100 [NXP]

ALVC/VCX/A SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20;
74ALVC541PW-Q100
型号: 74ALVC541PW-Q100
厂家: NXP    NXP
描述:

ALVC/VCX/A SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20

驱动 光电二极管 输出元件 逻辑集成电路
文件: 总16页 (文件大小:161K)
中文:  中文翻译
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74ALVC541-Q100  
Octal buffer/line driver; 3-state  
Rev. 1 — 19 May 2014  
Product data sheet  
1. General description  
The 74ALVC541-Q100 is an octal non-inverting buffer/line driver with 3-state bus  
compatible outputs. The output enable inputs OE0 and OE1, control the 3-state outputs.  
A HIGH on OEn causes the outputs to assume a high-impedance OFF-state.  
This product has been qualified to the Automotive Electronics Council (AEC) standard  
Q100 (Grade 3) and is suitable for use in automotive applications.  
2. Features and benefits  
Automotive product qualification in accordance with AEC-Q100 (Grade 3)  
Specified from 40 C to +85 C  
Wide supply voltage range from 1.65 V to 3.6 V  
3.6 V tolerant inputs/outputs  
CMOS LOW power consumption  
Direct interface with TTL levels (2.7 V to 3.6 V)  
Power-down mode  
Latch-up performance exceeds 250 mA  
Complies with JEDEC standard:  
JESD8-7 (1.65 V to 1.95 V)  
JESD8-5 (2.3 V to 2.5 V)  
JESD8B/JESD36 (2.7 V to 3.6 V)  
ESD protection:  
MIL-STD-883, method 3015 exceeds 2000 V  
HBM JESD22-A114F exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74ALVC541D-Q100  
40 C to +85 C  
SO20  
plastic small outline package; 20 leads;  
body width 7.5 mm  
SOT163-1  
74ALVC541PW-Q100 40 C to +85 C  
74ALVC541BQ-Q100 40 C to +85 C  
TSSOP20  
plastic thin shrink small outline package; 20 leads; SOT360-1  
body width 4.4 mm  
DHVQFN20 plastic dual-in-line compatible thermal enhanced SOT764-1  
very thin quad flat package no leads; 20 terminals;  
body 2.5 4.5 0.85 mm  
4. Functional diagram  
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Fig 1. Logic symbol  
Fig 2. IEC logic symbol  
74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
2 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
5. Pinning information  
5.1 Pinning  
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(1) This is not a supply pin. The substrate is attached to this  
pad using conductive die attach material. There is no  
electrical or mechanical requirement to solder this pad.  
However, if it is soldered, the solder land should remain  
floating or be connected to GND.  
Fig 3. Pin configuration SO20, TSSOP20  
Fig 4. Pin configuration DHVQFN20  
5.2 Pin description  
Table 2.  
Symbol  
OE0  
Pin description  
Pin  
Description  
1
output enable input (active LOW)  
data input  
A[0:7]  
GND  
2, 3, 4, 5, 6, 7, 8, 9  
10  
ground (0 V)  
Y[0:7]  
OE1  
18, 17, 16, 15, 14, 13, 12, 11 data output  
19  
20  
output enable input (active LOW)  
VCC  
supply voltage  
74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
3 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
6. Functional description  
Table 3.  
Functional table[1]  
Control  
Input  
An  
L
Output  
OE0  
L
OE1  
Yn  
L
L
L
L
H
H
Z
X
H
X
X
H
X
Z
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
VI  
Parameter  
Conditions  
Min  
0.5  
0.5  
50  
-
Max  
+4.6  
+4.6  
-
Unit  
V
supply voltage  
input voltage  
V
[1]  
IIK  
input clamping current  
output clamping current  
output voltage  
VI < V  
mA  
mA  
IOK  
VO > VCC or VO < 0 V  
output HIGH or LOW state  
output 3-state  
50  
[2]  
[2]  
[3]  
VO  
0.5  
0.5  
0.5  
-
VCC + 0.5 V  
+4.6  
+4.6  
50  
100  
-
V
power-down mode, VCC = 0 V  
VO = 0 V to VCC  
V
IO  
output current  
mA  
mA  
mA  
C  
ICC  
IGND  
Tstg  
Ptot  
supply current  
-
ground current  
100  
65  
storage temperature  
total power dissipation  
SO20 package  
+150  
Tamb = 40 C to +85 C  
[4]  
[5]  
[6]  
-
-
-
500  
500  
500  
mW  
mW  
mW  
TSSOP20 package  
DHVQFN20 package  
[1] The minimum input voltage ratings may be exceeded if the input current ratings are observed.  
[2] The output voltage ratings may be exceeded if the output current ratings are observed.  
[3] When VCC = 0 V (Power-down mode), the output voltage can be 3.6 V in normal operation.  
[4] Ptot derates linearly with 8 mW/K above 70 C.  
[5] Ptot derates linearly with 5.5 mW/K above 60 C.  
[6]  
Ptot derates linearly with 4.5 mW/K above 60 C.  
74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
4 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
8. Recommended operating conditions  
Table 5.  
Symbol  
VCC  
Recommended operating conditions  
Parameter  
Conditions  
Min  
Max  
3.6  
3.6  
VCC  
3.6  
3.6  
+85  
20  
Unit  
V
supply voltage  
input voltage  
output voltage  
1.65  
VI  
0
V
VO  
output HIGH or LOW state  
output 3-state  
0
V
0
V
power-down mode, VCC = 0 V  
0
V
Tamb  
ambient temperature  
40  
-
C  
ns/V  
ns/V  
t/V  
input transition rise and fall rate VCC = 1.65 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
-
10  
9. Static characteristics  
Table 6.  
Static characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter Conditions  
Tamb = 40 C to +85 C  
Unit  
Min  
Typ[1]  
Max  
VIH  
HIGH-level input voltage VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
0.65 VCC  
-
-
-
-
-
-
-
V
V
V
V
V
V
1.7  
-
VCC = 2.7 V to 3.6 V  
2.0  
-
0.35 VCC  
0.7  
VIL  
LOW-level input voltage  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
-
-
-
0.8  
VOH  
HIGH-level output voltage VI = VIH or VIL  
IO = 100 A; VCC = 1.65 V to 3.6 V  
0.2  
1.25  
1.8  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
IO = 6 mA; VCC = 1.65 V  
IO = 12 mA; VCC = 2.3 V  
IO = 18 mA; VCC = 2.3 V  
IO = 12 mA; VCC = 2.7 V  
IO = 18 mA; VCC = 3.0 V  
IO = 24 mA; VCC = 3.0 V  
1.7  
2.2  
2.4  
2.2  
VOL  
LOW-level output voltage VI = VIH or VIL  
IO = 100 A; VCC = 1.65 V to 3.6 V  
IO = 6 mA; VCC = 1.65 V  
IO = 12 mA; VCC = 2.3 V  
IO = 18 mA; VCC = 2.3 V  
IO = 12 mA; VCC = 2.7 V  
IO = 18 mA; VCC = 3.0 V  
IO = 24 mA; VCC = 3.0 V  
-
-
-
-
-
-
-
-
-
0.2  
0.3  
V
-
V
-
0.4  
V
-
0.6  
V
-
0.4  
V
-
-
0.4  
V
0.55  
10.0  
V
IOZ  
OFF-state output current VI = VIH or VIL; VO = VCC or GND;  
VCC = 3.6 V  
0.1  
A  
74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
5 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
Table 6.  
Static characteristics …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
Tamb = 40 C to +85 C  
Unit  
Min  
Typ[1]  
0.1  
0.1  
0.2  
Max  
5.0  
10.0  
10  
II  
input leakage current  
VI = VCC or GND; VCC = 3.6 V  
-
-
-
-
A  
A  
A  
A  
IOFF  
ICC  
ICC  
power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V  
supply current  
VI = VCC or GND; IO = 0 A; VCC = 3.6 V  
additional supply current per input pin; VCC = 3.0 V to 3.6 V;  
5
750  
VI = VCC 0.6 V; IO = 0 A;  
CI  
input capacitance  
-
3.5  
-
pF  
[1] All typical values are measured at VCC = 3.3 V and Tamb = 25 C.  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 7.  
Symbol  
Parameter  
Conditions  
Tamb = 40 C to +85 C  
Unit  
Min  
Typ[1]  
Max  
[2]  
[2]  
[2]  
tpd  
propagation  
delay  
An to Yn; see Figure 5  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 27 V  
1.0  
1.0  
1.0  
1.0  
3.0  
2.2  
2.5  
2.3  
4.6  
3.3  
3.3  
3.0  
ns  
ns  
ns  
ns  
VCC = 3.0 V to 3.6 V  
OEn to Yn; see Figure 6  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 27 V  
ten  
enable time  
disable time  
1.0  
1.0  
1.0  
1.0  
4.2  
3.3  
3.7  
3.3  
7.5  
5.4  
5.8  
4.9  
ns  
ns  
ns  
ns  
VCC = 3.0 V to 3.6 V  
OEn to Yn; see Figure 6  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 27 V  
tdis  
1.0  
1.0  
1.0  
1.0  
4.8  
3.1  
3.1  
2.9  
7.5  
4.5  
4.8  
4.6  
ns  
ns  
ns  
ns  
VCC = 3.0 V to 3.6 V  
74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
6 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
Table 7.  
Dynamic characteristics …continued  
Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 7.  
Symbol  
Parameter  
Conditions  
Tamb = 40 C to +85 C  
Unit  
Min  
Typ[1]  
Max  
[3]  
CPD  
power  
dissipation  
capacitance  
per buffer; VI = GND to VCC; VCC = 3.3 V  
outputs enabled  
-
-
25  
0
-
-
pF  
pF  
outputs disabled  
[1] All typical values are measured at Tamb = 25 C and VCC = 1.8 V, 2.5 V, 2.7 V and 3.3 V.  
[2] tpd is the same as tPLH and tPHL  
ten is the same as tPZL and tPZH  
tdis is the same as tPLZ and tPHZ  
PD is used to determine the dynamic power dissipation (PD in W).  
.
.
.
[3]  
C
PD = CPD VCC2 fi N + (CL VCC2 fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in V;  
N = number of inputs switching;  
(CL VCC2 fo) = sum of the outputs.  
11. Waveforms  
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Measurement points are given in Table 8.  
OL and VOH are typical voltage output levels that occur with the output load.  
V
Fig 5. Propagation delay input (An) to output (Yn)  
74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
7 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
9
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Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 6. Enable and disable times  
Table 8. Measurement points  
Supply voltage  
VCC  
Input  
VI  
Output  
VM  
VM  
VX  
VY  
1.65 V to 1.65 V  
2.3 V to 2.7 V  
2.7 V  
VCC  
VCC  
2.7 V  
2.7 V  
0.5 VCC  
0.5 VCC  
1.5 V  
0.5 VCC  
0.5 VCC  
1.5 V  
VOL + 0.15 V  
VOL + 0.15 V  
VOL + 0.3 V  
VOL + 0.3 V  
VOH 0.15 V  
VOH 0.15 V  
VOH 0.3 V  
VOH 0.3 V  
3.0 V to 3.6 V  
1.5 V  
1.5 V  
74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
8 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
W
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Test data is given in Table 9.  
Definitions test circuit:  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator  
CL = Load capacitance including jig and probe capacitance  
RL = Load resistor  
Fig 7. Test circuit for measuring switching times  
Table 9.  
Test data  
Supply voltage  
VCC  
Input  
VI  
Load  
CL  
VEXT  
tr, tf  
RL  
tPLH, tPHL  
open  
tPLZ, tPZL  
2 VCC  
2 VCC  
6
tPHZ, tPZH  
GND  
1.65 V to 1.95 V  
2.3 V to 2.7 V  
2.7 V  
VCC  
VCC  
2.7 V  
2.7 V  
2.0 ns  
2.0 ns  
2.5 ns  
2.5 ns  
30 pF  
30 pF  
50 pF  
50 pF  
1 k  
500   
500   
500   
open  
GND  
open  
GND  
3.0 V to 3.6 V  
open  
6
GND  
74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
9 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
12. Package outline  
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74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
10 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
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74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
11 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
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Fig 10. Package outline SOT764-1 (DHVQFN20)  
74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
12 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
13. Abbreviations  
Table 10. Abbreviations  
Acronym  
CDM  
DUT  
ESD  
HBM  
MIL  
Description  
Charged Device Model  
Device Under Test  
ElectroStatic Discharge  
Human Body Model  
Military  
MM  
Machine Model  
TTL  
Transistor-Transistor Logic  
14. Revision history  
Table 11. Revision history  
Document ID  
Release date  
Data sheet status  
Change notice  
Supersedes  
74ALVC541_Q100 v.1 20140519  
Product data sheet  
-
-
74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
13 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use in automotive applications — This NXP  
15.2 Definitions  
Semiconductors product has been qualified for use in automotive  
applications. Unless otherwise agreed in writing, the product is not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer's own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
15.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
14 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74ALVC541-Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 19 May 2014  
15 of 16  
74ALVC541-Q100  
NXP Semiconductors  
Octal buffer/line driver; 3-state  
17. Contents  
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
6
Functional description . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 5  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13  
7
8
9
10  
11  
12  
13  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 15  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP Semiconductors N.V. 2014.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 19 May 2014  
Document identifier: 74ALVC541-Q100  

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