74AVC16245DGG [NXP]
16-bit transceiver with direction pin; 3-state 3.6 V tolerant; 16位收发器的方向针;三态3.6 V宽容
| 型号： | 74AVC16245DGG |
| 厂家： | 
NXP |
| 描述： | 16-bit transceiver with direction pin; 3-state 3.6 V tolerant |
| 文件： | 总16页 (文件大小：91K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
74AVC16245
16-bit transceiver with direction pin;
3-state (3.6 V tolerant)
Product specification
1999 Nov 15
Supersedes data of 1998 Dec 11
File under Integrated Circuits, IC24
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
FEATURES
DESCRIPTION
• Wide supply voltage range from 1.2 to 3.6 V
• Complies with JEDEC standard no. 8-1A/5/7
• CMOS low power consumption
The 74AVC16245 is a 16-bit transceiver featuring
non-inverting 3-state bus compatible outputs in both send
and receive directions.
The 74AVC16245 features two output enable inputs (nOE)
for easy cascading and two send/receive inputs (nDIR) for
direction control. Input nOE controls the outputs so that the
buses are effectively isolated. This device can be used as
two 8-bit transceivers or one 16-bit transceiver.
• Input/output tolerant up to 3.6 V
• Dynamic Controlled Output (DCO) circuit dynamically
changes output impedance, resulting in noise reduction
without speed degradation
• Low inductance multiple power and ground pins for
minimum noise and ground bounce
This product is designed to have an extremely fast
propagation delay and a minimum amount of power
consumption.
• Power off disables outputs, permitting live insertion.
To ensure the high-impedance output state during
power-up or power-down, input nOE should be tied to VCC
through a pull-up resistor (live insertion).
A DCO circuitry is implemented to support termination line
drive during transient (see Figs 1 and 2).
MNA506
MNA507
0
300
handbook, halfpage
handbook, halfpage
I
I
OH
OL
(mA)
(mA)
3.3 V
1.8 V
−100
200
2.5 V
2.5 V
−200
100
1.8 V
3.3 V
−300
0
0
1
2
3
4
0
1
2
3
4
V
(V)
V
(V)
OH
OL
Fig.1 Output current as function of output voltage.
Fig.2 Output current as function of output voltage.
1999 Nov 15
2
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C; tr = tf ≤ 2.0 ns; CL = 30 pF.
SYMBOL
tPHL/tPLH
PARAMETER
CONDITIONS
VCC = 1.2 V
TYP.
UNIT
propagation delay nAn to nBn;
nBn to nAn
2.8
1.8
1.8
1.3
1.1
5.0
ns
ns
ns
ns
ns
pF
V
CC = 1.5 V
CC = 1.8 V
V
VCC = 2.5 V
CC = 3.3 V
V
CI
input capacitance
CPD
power dissipation capacitance per buffer notes 1 and 2
outputs enabled
outputs disabled
42
2
pF
pF
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
∑ (CL × VCC2 × fo) = sum of outputs.
2. The condition is VI = GND to VCC
.
FUNCTION TABLE
See note 1.
INPUTS
nOE
INPUTS/OUTPUTS
nDIR
nAn
nBn
L
L
L
H
X
A = B
inputs
Z
inputs
B = A
Z
H
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
1999 Nov 15
3
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
TEMPERATURE RANGE
PINS
PACKAGE
MATERIAL
CODE
74AVC16245DGG
−40 to +85 °C
48
TSSOP
plastic
SOT362-1
PINNING
PIN
SYMBOL
DESCRIPTION
1
1DIR
direction control
2, 3, 5, 6, 8, 9, 11 and 12
1B0 to 1B7
GND
data inputs/outputs
ground (0 V)
4, 10, 15, 21, 28, 34, 39 and 45
7, 18, 31 and 42
VCC
DC supply voltage
13, 14, 16, 17, 19, 20, 22 and 23
2B0 to 2B7
2DIR
data inputs/outputs
direction control
24
25
2OE
output enable input (active LOW)
data inputs/outputs
data inputs/outputs
output enable input (active LOW)
26, 27, 29, 30, 32, 33, 35 and 36
37, 38, 40, 41, 43, 44, 46 and 47
48
2A7 to 2A0
1A7 to 1A0
1OE
1999 Nov 15
4
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
handbook, halfpage
1DIR
1B
1
2
3
4
5
6
7
8
9
48 1OE
47 1A
0
0
1B
46 1A
1
48
1
1
1OE
1DIR
G3
3EN1[BA]
3EN2[AB]
G6
GND
45 GND
25
24
1B
2
44 1A
2
2OE
2DIR
6EN1[BA]
6EN2[AB]
1B
3
43 1A
3
V
42
V
CC
CC
47
2
1B
4
41 1A
40 1A
1A
0
1B
0
1
4
5
1B
5
2
3
46
44
GND 10
39 GND
1B
1
1A
1
1A
2
1A
3
1A
4
5
1B
2
1B 11
6
38 1A
6
6
43
41
40
38
37
1B
3
8
1B 12
7
37 1A
7
1B
4
1B
5
16245
9
1A
5
2B 13
0
36 2A
0
11
1B
1A
6
6
2B 14
1
35 2A
1
12
1A
7
1B
7
13
36
GND 15
34 GND
2B
0
2A
0
4
2B 16
2
33 2A
2
5
2B 17
3
32 2A
3
14
35
33
32
30
29
27
26
2A
1
2B
1
16
V
18
31
V
CC
2A
2
2B
CC
2
17
2B
3
2A
3
2B 19
4
30 2A
29 2A
4
5
19
2A
4
2B
4
20
2B 20
5
2B
5
2A
5
22
2B
2A
6
2A
7
6
GND 21
28 GND
23
2B
7
2B 22
6
27 2A
6
MNA003
2B
23
26 2A
7
7
25
2DIR 24
2OE
MNA508
Fig.3 Pin configuration.
Fig.4 IEEE/IEC logic symbol.
1999 Nov 15
5
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
1DIR
2DIR
1
24
1OE
2OE
48
2
25
13
14
16
17
19
20
22
23
1A
0
2A
0
47
46
44
43
41
40
38
37
36
35
33
32
30
29
27
26
1B
0
2B
0
1A
1
2A
1
1B
1
2B
1
3
1A
2
2A
2
1B
2
2B
2
5
1A
3
2A
3
1B
3
2B
3
6
1A
4
2A
4
1B
4
2B
4
8
1A
5
2A
5
1B
5
2B
5
9
1A
6
2A
6
1B
6
2B
6
11
12
1A
7
2A
7
1B
7
2B
7
MNA509
Fig.5 Logic symbol.
1999 Nov 15
6
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
DC supply voltage
CONDITIONS
MIN.
1.65
MAX.
1.95
UNIT
VCC
according JEDEC low-voltage
standards
V
2.3
3.0
1.2
0
2.7
3.6
3.6
3.6
3.6
VCC
+85
30
V
V
low-voltage applications
V
VI
DC input voltage
DC output voltage
V
VO
3-state
0
V
HIGH or LOW state
in free air
0
V
Tamb
tr, tf
operating ambient temperature
input rise and fall times
−40
0
°C
ns/V
ns/V
ns/V
VCC = 1.65 to 2.3 V
VCC = 2.3 to 3.0 V
0
20
V
CC = 3.0 to 3.6 V
0
10
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
DC supply voltage
CONDITIONS
MIN.
−0.5
MAX.
+4.6
UNIT
VCC
IIK
V
DC input diode current
DC input voltage
VI < 0 V
−
−50
mA
V
VI
for inputs; note 1
−0.5
−
+4.6
±50
IOK
VO
DC output diode current
DC output voltage
VO > VCC or VO < 0 V
HIGH or LOW state; note 1
3-state; note 1
mA
V
−0.5
−0.5
−
VCC + 0.5
+4.6
±50
V
IO
DC output source or sink current
DC VCC or GND current
VO = 0 V to VCC
mA
mA
°C
mW
ICC,IGND
−
±100
+150
500
Tstg
Ptot
storage temperature
−65
−
power dissipation per package
temperature range from
−40 to +85 °C; note 2
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. Above 60 °C the value of PD derates linearly with 5.5 mW/K.
1999 Nov 15
7
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
DC CHARACTERISTICS
Over recommended operating conditions; voltages are referenced to GND (ground = 0 V).
TEST CONDITIONS
Tamb = −40 to +85 °C
MIN. MAX.
TYP.(1)
VCC
1.65 to 1.95 0.65VCC
SYMBOL
PARAMETER
UNIT
OTHER
VCC (V)
1.2
VIH
HIGH-level input
voltage
−
−
−
−
−
V
V
V
V
V
V
V
V
0.9
1.2
1.5
−
2.3 to 2.7
3.0 to 3.6
1.2
1.7
2.0
−
VIL
LOW-level input
voltage
GND
0.35VCC
0.7
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
−
0.9
1.2
1.5
−
−
0.8
VOH
HIGH-level output
voltage
VI = VIH or VIL
IO = −100 µA
IO = −4 mA
1.65 to 3.6
1.65
V
V
V
V
CC − 0.20 VCC
−
−
−
−
V
V
V
V
CC − 0.45
CC − 0.55
CC − 0.70
VCC − 0.10
VCC − 0.28
VCC − 0.32
IO = −8 mA
2.3
IO = −12 mA
VI = VIH or VIL
IO = 100 µA
IO = 4 mA
3.0
VOL
LOW-level output
voltage
1.65 to 3.6
1.65
−
−
−
−
−
GND
0.10
0.26
0.36
0.1
0.20
0.45
0.55
0.70
2.5
V
V
IO = 8 mA
2.3
V
IO = 12 mA
3.0
V
II
input leakage
current per pin
VI = VCC or GND
1.65 to 3.6
µA
Ioff
power off leakage
current
VI or VO = 3.6
0
−
−
0.1
0.1
±10
µA
µA
IIHZ/IILZ
input current for
common I/O pins
VI = VCC or GND
1.65 to 3.6
12.5
IOZ
3-state output
OFF-state current
VI = VIH or VIL;
VO = VCC or GND
1.65 to 2.7
3.0 to 3.6
1.65 to 2.7
3.0 to 3.6
−
−
−
−
0.1
0.1
0.1
0.2
5
µA
µA
µA
µA
10
20
40
ICC
quiescent supply
current
VI = VCC or GND;
IO = 0
Note
1. All typical values are measured at Tamb = 25 °C.
1999 Nov 15
8
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
AC CHARACTERISTICS
GND = 0 V; tr = tf ≤ 2.0 ns; CL = 30 pF.
TEST CONDITIONS
WAVEFORMS VCC (V)
Tamb = −40 to +85 °C
MIN. TYP.(1) MAX.
SYMBOL
PARAMETER
propagation delay
UNIT
tPHL/tPLH
see Figs 6 and 8
see Figs 7 and 8
see Figs 7 and 8
1.2
−
−
2.8
1.8
1.8
1.3
1.1
5.9
3.9
3.3
2.4
2.0
6.9
4.8
3.7
2.0
2.2
−
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
nAn to nBn; nBn to nAn
1.40 to 1.60
−
1.65 to 1.95 0.7
3.0
1.9
1.7
−
2.3 to 2.7
3.0 to 3.6
1.2
0.6
0.5
−
t
PZH/tPZL
3-state output enable time
nOE to nAn; nOE to nBn
1.40 to 1.60
−
−
1.65 to 1.95 1.4
6.5
4.5
3.7
−
2.3 to 2.7
3.0 to 3.6
1.2
1.0
0.7
−
t
PHZ/tPLZ
3-state output disable time
nOE to nAn; nOE to nBn
1.40 to 1.60
−
−
1.65 to 1.95 2.2
6.0
4.2
3.7
2.3 to 2.7
3.0 to 3.6
1.1
1.2
Note
1. All typical values are measured at Tamb = 25 °C and at VCC = 1.2 V, 1.5 V, 1.8 V, 2.5 V or 3.3 V.
AC WAVEFORMS
V
handbook, halfpage
nA , nB
I
n
n
V
M
input
GND
t
t
PLH
PHL
V
OH
nB , nA
n
output
n
V
M
MNA511
V
OL
VCC
VM
VI
≤2.3 to 2.7 V
0.5VCC VCC
0.5VCC VCC
3.0 to 3.6 V
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.6 The input (nAn, nBn) to output (nBn, nAn) propagation delay.
1999 Nov 15
9
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
V
I
nOE input
V
M
GND
t
t
PZL
PLZ
V
CC
output
LOW-to-OFF
OFF-to-LOW
V
M
V
X
V
OL
t
t
PZH
PHZ
V
OH
V
Y
output
HIGH-to-OFF
OFF-to-HIGH
V
M
GND
outputs
enabled
outputs
enabled
outputs
disabled
MNA478
VCC
VM
VX
VY
VI
≤2.3 to 2.7 V
3.0 to 3.6 V
0.5VCC VOL + 0.15 V
0.5VCC VOL + 0.3 V
V
OH − 0.15 V VCC
VOH − 0.3 V VCC
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.7 The 3-state enable and disable times.
S1
2 × V
CC
open
GND
V
CC
R
load
V
V
O
I
PULSE
D.U.T.
GENERATOR
C
R
load
R
L
T
MNA505
TEST
S1
VCC
VI
VCC
Rload
Definitions for test circuit.
t
PLH/tPHL open
<2.3 V
1000 Ω
500 Ω
500 Ω
CL = load capacitance including jig and probe capacitance
(See Chapter “AC characteristics”).
tPLZ/tPZL
2 x VCC
2.3 to 2.7 V VCC
3.0 to 3.6 V VCC
RT = termination resistance should be equal to the output
impedance Zo of the pulse generator.
tPHZ/tPZH GND
FFiigg..88 LToeasdt cciirrccuuiittrryyffoorrsswwiittcchhiinnggttiimmeess..
10
1999 Nov 15
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
PACKAGE OUTLINE
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
SOT362-1
E
D
A
X
c
H
v
M
A
y
E
Z
48
25
Q
A
2
(A )
3
A
A
1
pin 1 index
θ
L
p
L
detail X
1
24
w
M
b
e
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
A
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.15
0.05
1.05
0.85
0.28
0.17
0.2
0.1
12.6
12.4
6.2
6.0
8.3
7.9
0.8
0.4
0.50
0.35
0.8
0.4
mm
1.2
0.25
0.5
1
0.25
0.08
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
93-02-03
95-02-10
SOT362-1
MO-153ED
1999 Nov 15
11
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
Manual soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Nov 15
12
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
BGA, LFBGA, SQFP, TFBGA
WAVE
not suitable
REFLOW(1)
suitable
suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC(3), SO, SOJ
not suitable(2)
suitable
LQFP, QFP, TQFP
not recommended(3)(4) suitable
not recommended(5)
suitable
SSOP, TSSOP, VSO
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Nov 15
13
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
NOTES
1999 Nov 15
14
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state
(3.6 V tolerant)
74AVC16245
NOTES
1999 Nov 15
15
Philips Semiconductors – a worldwide company
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For all other countries apply to: Philips Semiconductors,
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5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
68
SCA
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245004/02/pp16
Date of release: 1999 Nov 15
Document order number: 9397 750 06481
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