74HC04DB [NXP]
Hex inverter; 六反相器
| 型号： | 74HC04DB |
| 厂家： | 
NXP |
| 描述： | Hex inverter |
| 文件： | 总20页 (文件大小：108K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
74HC04; 74HCT04
Hex inverter
Product specification
2003 Jul 23
Supersedes data of 1993 Sep 01
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
FEATURES
DESCRIPTION
• Complies with JEDEC standard no. 8-1A
The 74HC/HCT04 are high-speed Si-gate CMOS devices
and are pin compatible with low power Schottky TTL
(LSTTL). They are specified in compliance with JEDEC
standard no. 7A. The 74HC/HCT04 provide six inverting
buffers.
• ESD protection:
HBM EIA/JESD22-A114-A exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V.
• Specified from −40 to +85 °C and −40 to +125 °C.
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C; tr = tf ≤ 6.0 ns.
TYPICAL
SYMBOL
PARAMETER
CONDITIONS
UNIT
HC04
HCT04
t
PHL/tPLH propagation delay nA to nY
CL = 15 pF; VCC = 5 V
7
8
ns
pF
pF
CI
input capacitance
power dissipation capacitance per gate notes 1 and 2
3.5
21
3.5
24
CPD
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = total load switching outputs;
Σ(CL × VCC2 × fo) = sum of the outputs.
2. For 74HC04: the condition is VI = GND to VCC
.
For 74HCT04: the condition is VI = GND to VCC − 1.5 V.
FUNCTION TABLE
See note 1.
INPUT
nA
OUTPUT
nY
L
H
L
H
Note
1. H = HIGH voltage level;
L = LOW voltage level.
2003 Jul 23
2
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
PACKAGE
TEMPERATURE RANGE
PINS
MATERIAL
CODE
74HC04N
−40 to +125 °C
−40 to +125 °C
−40 to +125 °C
−40 to +125 °C
−40 to +125 °C
−40 to +125 °C
−40 to +125 °C
−40 to +125 °C
−40 to +125 °C
−40 to +125 °C
14
14
14
14
14
14
14
14
14
14
DIP14
DIP14
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
SOT27-1
SOT27-1
74HCT04N
74HC04D
SO14
SOT108-1
SOT108-1
SOT337-1
SOT337-1
SOT402-1
SOT402-1
SOT762-1
SOT762-1
74HCT04D
74HC04DB
74HCT04DB
74HC04PW
74HCT04PW
74HC04BQ
74HCT04BQ
SO14
SSOP14
SSOP14
TSSOP14
TSSOP14
DHVQFN14
DHVQFN14
PINNING
PIN
SYMBOL
1A
DESCRIPTION
1
2
data input
1Y
2A
2Y
3A
3Y
GND
4Y
4A
5Y
5A
6Y
6A
VCC
data output
data input
handbook, halfpage
1A
1Y
1
2
3
4
5
6
7
V
CC
14
13
12
11
10
9
3
6A
6Y
5A
5Y
4A
4Y
4
data output
data input
5
2A
6
data output
ground (0 V)
data output
data input
2Y
04
7
3A
8
3Y
9
8
GND
10
11
12
13
14
data output
data input
MNA340
data output
data input
Fig.1 Pin configuration DIP14, SO14 and
(T)SSOP14.
supply voltage
2003 Jul 23
3
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
V
1A
1
handbook, halfpage
CC
handbook, halfpage
14
1Y
2Y
3Y
4Y
5Y
6Y
1
3
1A
2A
3A
4A
5A
6A
2
4
1Y
2A
2
3
13 6A
12 6Y
6
5
(1)
2Y
3A
3Y
4
5
6
11 5A
10 5Y
GND
8
9
10
12
11
13
9
4A
7
8
GND 4Y
Top view
MBL760
MNA342
(1) The die substrate is attached to this pad using conductive die
attach material. It can not be used as a supply pin or input.
Fig.2 Pin configuration DHVQFN14.
Fig.3 Logic symbol.
handbook, halfpage
1
1
2
1
1
1
1
1
3
4
5
6
handbook, halfpage
Y
A
MNA341
9
8
11
13
10
12
MNA343
Fig.4 IEC logic symbol.
Fig.5 Logic diagram (one inverter).
2003 Jul 23
4
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
RECOMMENDED OPERATING CONDITIONS
74HC04
TYP. MAX. MIN.
74HCT04
UNIT
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
2.0
TYP. MAX.
VCC
VI
5.0
−
6.0
4.5
0
5.0
5.5
V
V
V
input voltage
0
VCC
VCC
−
VCC
VCC
VO
output voltage
0
−
0
−
Tamb
ambient temperature
see DC and AC
characteristics per
device
−40
+25
+125 −40
+25
+125 °C
tr, tf
input rise and fall times
VCC = 2.0 V
VCC = 4.5 V
−
−
−
−
1000
500
−
−
−
−
−
ns
ns
ns
6.0
−
6.0
−
500
−
VCC = 6.0 V
400
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
−0.5
MAX.
+7.0
UNIT
VCC
IIK
V
input diode current
output diode current
VI < −0.5 V or VI > VCC + 0.5 V
VO < −0.5 V or VO > VCC + 0.5 V
−0.5 V < VO < VCC + 0.5 V
−
−
−
±20
±20
±25
mA
mA
mA
IOK
IO
output source or sink
current
I
CC, IGND VCC or GND current
−
±50
mA
Tstg
Ptot
storage temperature
power dissipation
DIP14 package
−65
+150
°C
T
amb = −40 to +125 °C; note 1
−
−
750
500
mW
mW
other packages
Tamb = −40 to +125 °C; note 2
Notes
1. For DIP14 packages: above 70 °C derate linearly with 12 mW/K.
2. For SO14 packages: above 70 °C derate linearly with 8 mW/K.
For SSOP14 and TSSOP14 packages: above 60 °C derate linearly with 5.5 mW/K.
For DHVQFN14 packages: above 60 °C derate linearly with 4.5 mW/K.
2003 Jul 23
5
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
DC CHARACTERISTICS
Type 74HC04
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
OTHER
VCC (V)
Tamb = 25 °C
VIH
HIGH-level input voltage
LOW-level input voltage
2.0
1.5
1.2
−
−
−
V
V
V
V
V
V
4.5
6.0
2.0
4.5
6.0
3.15
4.2
−
2.4
3.2
0.8
2.1
2.8
VIL
0.5
−
1.35
1.8
−
VOH
HIGH-level output voltage VI = VIH or VIL
IO = −20 µA
IO = −20 µA
IO = −4.0 mA
IO = −20 µA
IO = −5.2 mA
2.0
4.5
4.5
6.0
6.0
1.9
2.0
−
−
−
−
−
V
V
V
V
V
4.4
4.5
3.98
5.9
4.32
6.0
5.48
5.81
VOL
LOW-level output voltage
VI = VIH or VIL
IO = 20 µA
2.0
4.5
4.5
6.0
6.0
6.0
6.0
−
−
−
−
−
−
−
0
0.1
V
V
V
V
V
IO = 20 µA
0
0.1
IO = 4.0 mA
IO = 20 µA
0.15
0
0.26
0.1
IO = 5.2 mA
VI = VCC or GND
0.16
0.1
−
0.26
±0.1
±.0.5
ILI
input leakage current
µA
µA
IOZ
3-state output OFF current VI = VIH or VIL;
VO = VCC or GND
ICC
quiescent supply current
VI = VCC or GND; IO = 0 6.0
−
−
2
µA
2003 Jul 23
6
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
TEST CONDITIONS
OTHER
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
VCC (V)
Tamb = −40 to +85 °C
VIH
HIGH-level input voltage
2.0
4.5
6.0
2.0
4.5
6.0
1.5
−
−
−
−
−
−
−
−
−
V
3.15
4.2
−
V
V
V
V
V
VIL
LOW-level input voltage
0.5
−
1.35
1.8
−
VOH
HIGH-level output voltage VI = VIH or VIL
IO = −20 µA
IO = −20 µA
IO = −4.0 mA
IO = −20 µA
IO = −5.2 mA
2.0
4.5
4.5
6.0
6.0
1.9
−
−
−
−
−
−
−
−
−
−
V
V
V
V
V
4.4
3.84
5.9
5.34
VOL
LOW-level output voltage
VI = VIH or VIL
IO = 20 µA
2.0
4.5
4.5
6.0
6.0
6.0
6.0
−
−
−
−
−
−
−
−
−
−
−
−
−
−
0.1
V
IO = 20 µA
0.1
V
IO = 4.0 mA
IO = 20 µA
0.33
0.1
V
V
IO = 5.2 mA
VI = VCC or GND
0.33
±1.0
±.5.0
V
ILI
input leakage current
µA
µA
IOZ
3-state output OFF current VI = VIH or VIL;
VO = VCC or GND
ICC
quiescent supply current
VI = VCC or GND; IO = 0 6.0
−
−
20
µA
2003 Jul 23
7
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
TEST CONDITIONS
OTHER
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
VCC (V)
Tamb = −40 to +125 °C
VIH
HIGH-level input voltage
2.0
4.5
6.0
2.0
4.5
6.0
1.5
−
−
−
−
−
−
−
−
−
V
3.15
4.2
−
V
V
V
V
V
VIL
LOW-level input voltage
0.5
−
1.35
1.8
−
VOH
HIGH-level output voltage VI = VIH or VIL
IO = −20 µA
IO = −20 µA
IO = −20 µA
IO = −4.0 mA
IO = −5.2 mA
2.0
4.5
6.0
4.5
6.0
1.9
4.4
5.9
3.7
5.2
−
−
−
−
−
−
−
−
−
−
V
V
V
V
V
VOL
LOW-level output voltage
VI = VIH or VIL
IO = 20 µA
2.0
4.5
6.0
4.5
6.0
6.0
6.0
−
−
−
−
−
−
−
−
−
−
−
−
−
−
0.1
V
IO = 20 µA
0.1
V
IO = 20 µA
0.1
V
IO = 4.0 mA
IO = 5.2 mA
VI = VCC or GND
0.4
V
0.4
V
ILI
input leakage current
±1.0
±10.0
µA
µA
IOZ
3-state output OFF current VI = VIH or VIL;
VO = VCC or GND
ICC
quiescent supply current
VI = VCC or GND; IO = 0 6.0
−
−
40
µA
2003 Jul 23
8
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
Type 74HCT04
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
TYP.
MAX. UNIT
OTHER
VCC (V)
Tamb = 25 °C
VIH
VIL
HIGH-level input voltage
LOW-level input voltage
HIGH-level output voltage
4.5 to 5.5 2.0
1.6
−
V
V
4.5 to 5.5
−
1.2
0.8
VOH
VI = VIH or VIL
IO = −20 µA
4.5
4.5
4.4
4.5
−
−
V
V
IO = −4.0 mA
VI = VIH or VIL
IO = 20 µA
3.84
4.32
VOL
LOW-level output voltage
4.5
4.5
5.5
5.5
−
−
−
−
0
0.1
V
IO = 4.0 mA
0.15
−
0.26
±0.1
±0.5
V
ILI
input leakage current
VI = VCC or GND
µA
µA
IOZ
3-state output OFF current
VI = VIH or VIL;
VO = VCC or GND;
IO = 0
−
ICC
quiescent supply current
VI = VCC or GND; 5.5
IO = 0
−
−
−
2
µA
µA
∆ICC
additional supply current per input VI = VCC − 2.1 V;
4.5 to 5.5
120
432
IO = 0
Tamb = −40 to +85 °C
VIH
VIL
HIGH-level input voltage
4.5 to 5.5 2.0
−
−
−
−
−
−
−
−
−
−
−
V
V
LOW-level input voltage
HIGH-level output voltage
4.5 to 5.5
−
0.8
VOH
VI = VIH or VIL
IO = −20 µA
4.5
4.5
4.4
−
−
V
V
IO = −4.0 mA
VI = VIH or VIL
IO = 20 µA
3.84
VOL
LOW-level output voltage
4.5
4.5
5.5
5.5
−
−
−
−
0.1
V
IO = 4.0 mA
0.33
±1.0
±5.0
V
ILI
input leakage current
VI = VCC or GND
µA
µA
IOZ
3-state output OFF current
VI = VIH or VIL;
VO = VCC or GND;
IO = 0
ICC
quiescent supply current
VI = VCC or GND; 5.5
IO = 0
−
−
−
−
20
µA
µA
∆ICC
additional supply current per input VI = VCC − 2.1 V;
4.5 to 5.5
540
IO = 0
2003 Jul 23
9
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
TYP.
MAX. UNIT
OTHER
VCC (V)
Tamb = −40 to +125 °C
VIH
VIL
HIGH-level input voltage
LOW-level input voltage
HIGH-level output voltage
4.5 to 5.5 2.0
−
−
−
V
V
4.5 to 5.5
−
0.8
VOH
VI = VIH or VIL
IO = −20 µA
4.5
4.5
4.4
3.7
−
−
−
−
V
V
IO = −4.0 mA
VI = VIH or VIL
IO = 20 µA
VOL
LOW-level output voltage
4.5
4.5
5.5
5.5
−
−
−
−
−
−
−
−
0.1
V
IO = 4.0 mA
0.4
V
ILI
input leakage current
VI = VCC or GND
±1.0
±10
µA
µA
IOZ
3-state output OFF current
VI = VIH or VIL;
VO = VCC or GND;
IO = 0
ICC
quiescent supply current
VI = VCC or GND; 5.5
IO = 0
−
−
−
−
40
µA
µA
∆ICC
additional supply current per input VI = VCC − 2.1 V;
4.5 to 5.5
590
IO = 0
2003 Jul 23
10
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
AC CHARACTERISTICS
Family 74HC04
GND = 0 V; tr = tf ≤ 6.0 ns; CL = 50 pF.
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
WAVEFORMS
VCC (V)
Tamb = 25 °C
tPHL/tPLH
propagation delay
nA to nY
see Figs 6 and 7
2.0
4.5
6.0
2.0
4.5
6.0
−
−
−
−
−
−
25
85
ns
9
17
14
75
15
13
ns
ns
ns
ns
ns
7
tTHL/tTLH
output transition time
see Figs 6 and 7
19
7
6
Tamb = −40 to +85 °C
tPHL/tPLH
propagation delay
nA to nY
see Figs 6 and 7
see Figs 6 and 7
2.0
4.5
6.0
2.0
4.5
6.0
−
−
−
−
−
−
−
−
−
−
−
−
105
21
18
95
19
16
ns
ns
ns
ns
ns
ns
tTHL/tTLH
output transition time
Tamb = −40 to +125 °C
tPHL/tPLH
propagation delay
nA to nY
see Figs 6 and 7
see Figs 6 and 7
2.0
4.5
6.0
2.0
4.5
6.0
−
−
−
−
−
−
−
−
−
−
−
−
130
26
ns
ns
ns
ns
ns
ns
22
tTHL/tTLH
output transition time
110
22
19
2003 Jul 23
11
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
Family 74HCT04
GND = 0 V; tr = tf ≤ 6.0 ns; CL = 50 pF.
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
WAVEFORMS
VCC (V)
Tamb = 25 °C
tPHL/tPLH
propagation delay
nA to nY
see Figs 6 and 7
see Figs 6 and 7
4.5
4.5
−
−
10
19
ns
tTHL/tTLH
output transition time
7
15
ns
Tamb = −40 to +85 °C
tPHL/tPLH propagation delay
see Figs 6 and 7
see Figs 6 and 7
4.5
4.5
−
−
−
−
24
19
ns
ns
nA to nY
tTHL/tTLH
output transition time
Tamb = −40 to +125 °C
tPHL/tPLH propagation delay
see Figs 6 and 7
see Figs 6 and 7
4.5
4.5
−
−
−
−
29
22
ns
ns
nA to nY
tTHL/tTLH
output transition time
AC WAVEFORMS
V
handbook, halfpage
I
V
V
M
nA input
M
GND
t
t
PHL
PLH
V
OH
90%
V
V
nY output
M
M
10%
V
OL
t
t
TLH
MNA722
THL
For 74HC04: VM = 50%; VI = GND to VCC
.
For 74HCT04: VM = 1.3 V; VI = GND to 3.0 V.
Fig.6 Waveforms showing the data input (nA) to data output (nY) propagation delays and the output transition
times.
2003 Jul 23
12
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
V
handbook, halfpage
CC
V
V
I
O
PULSE
GENERATOR
D.U.T
R
C
50 pF
T
L
MGK565
Definitions for test circuit:
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.7 Load circuitry for switching times.
2003 Jul 23
13
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
PACKAGE OUTLINES
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
M
H
14
8
pin 1 index
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
w
1
1
E
max.
min.
max.
max.
1.73
1.13
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
2.2
0.068
0.044
0.021
0.015
0.014
0.009
0.77
0.73
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-13
SOT27-1
050G04
MO-001
SC-501-14
2003 Jul 23
14
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.05
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT108-1
076E06
MS-012
2003 Jul 23
15
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
7
1
detail X
w M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.4
0.9
mm
2
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT337-1
MO-150
2003 Jul 23
16
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
7
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.72
0.38
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT402-1
MO-153
2003 Jul 23
17
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
SOT762-1
B
A
D
A
A
1
E
c
detail X
terminal 1
index area
C
terminal 1
index area
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
6
L
1
7
8
E
h
e
14
13
9
D
h
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
1
y
D
D
E
L
v
w
y
1
h
h
1
max.
0.05 0.30
0.00 0.18
3.1
2.9
1.65
1.35
2.6
2.4
1.15
0.85
0.5
0.3
mm
0.05
0.1
1
0.2
0.5
2
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-10-17
03-01-27
SOT762-1
- - -
MO-241
- - -
2003 Jul 23
18
Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
DATA SHEET STATUS
DATA SHEET
LEVEL
PRODUCT
STATUS(2)(3)
DEFINITION
STATUS(1)
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Jul 23
19
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613508/03/pp20
Date of release: 2003 Jul 23
Document order number: 9397 750 11256
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