74HC193DB [NXP]

Presettable synchronous 4-bit binary up/down counter; 可预置同步4位二进制加/减计数器
74HC193DB
型号: 74HC193DB
厂家: NXP    NXP
描述:

Presettable synchronous 4-bit binary up/down counter
可预置同步4位二进制加/减计数器

计数器 触发器 逻辑集成电路 光电二极管 输出元件
文件: 总29页 (文件大小:151K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
74HC193; 74HCT193  
Presettable synchronous 4-bit binary up/down counter  
Rev. 03 — 23 May 2007  
Product data sheet  
1. General description  
The 74HC193 and 74HCT193 are high-speed Si-gate CMOS devices and are pin  
compatible with Low power Schottky TTL (LSTTL). They are specified in compliance with  
JEDEC standard no. 7A.  
The 74HC193 and 74HCT193 are 4-bit synchronous binary up/down counters. Separate  
up/down clocks, CPU and CPD respectively, simplify operation. The outputs change state  
synchronously with the LOW-to-HIGH transition of either clock input. If the CPU clock is  
pulsed while CPD is held HIGH, the device will count up. If the CPD clock is pulsed while  
CPU is held HIGH, the device will count down. Only one clock input can be held HIGH at  
any time, or erroneous operation will result. The device can be cleared at any time by the  
asynchronous master reset input (MR); it may also be loaded in parallel by activating the  
asynchronous parallel load input (PL).  
The 74HC193 and 74HCT193 each contain four master-slave JK flip-flops with the  
necessary steering logic to provide the asynchronous reset, load, and synchronous count  
up and count down functions.  
Each flip-flop contains JK feedback from slave to master, such that a LOW-to-HIGH  
transition on the CPD input will decrease the count by one, while a similar transition on the  
CPU input will advance the count by one.  
One clock should be held HIGH while counting with the other, otherwise the circuit will  
either count by twos or not at all, depending on the state of the first flip-flop, which cannot  
toggle as long as either clock input is LOW. Applications requiring reversible operation  
must make the reversing decision while the activating clock is HIGH to avoid erroneous  
counts.  
The terminal count up (TCU) and terminal count down (TCD) outputs are normally HIGH.  
When the circuit has reached the maximum count state of 15, the next HIGH-to-LOW  
transition of CPU will cause TCU to go LOW.  
TCU will stay LOW until CPU goes HIGH again, duplicating the count up clock.  
Likewise, the TCD output will go LOW when the circuit is in the zero state and the  
CPD goes LOW. The terminal count outputs can be used as the clock input signals to the  
next higher order circuit in a multistage counter, since they duplicate the clock waveforms.  
Multistage counters will not be fully synchronous, since there is a slight delay time  
difference added for each stage that is added.  
The counter may be preset by the asynchronous parallel load capability of the circuit.  
Information present on the parallel data inputs (D0 to D3) is loaded into the counter and  
appears on the outputs (Q0 to Q3) regardless of the conditions of the clock inputs when  
the parallel load (PL) input is LOW. A HIGH level on the master reset (MR) input will  
disable the parallel load gates, override both clock inputs and set all outputs (Q0 to  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
Q3) LOW. If one of the clock inputs is LOW during and after a reset or load operation, the  
next LOW-to-HIGH transition of that clock will be interpreted as a legitimate signal and will  
be counted.  
2. Features  
I Synchronous reversible 4-bit binary counting  
I Asynchronous parallel load  
I Asynchronous reset  
I Expandable without external logic  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature  
range  
Name  
Description  
Version  
74HC193D  
40 °C to +125 °C SO16  
plastic small outline package; 16 leads;  
body width 3.9 mm  
SOT109-1  
SOT338-1  
74HC193DB  
40 °C to +125 °C SSOP16  
plastic shrink small outline package; 16 leads;  
body width 5.3 mm  
74HC193N  
40 °C to +125 °C DIP16  
plastic dual in-line package; 16 leads (300 mil)  
SOT38-4  
74HC193PW  
40 °C to +125 °C TSSOP16  
plastic thin shrink small outline package; 16 leads;  
body width 4.4 mm  
SOT403-1  
74HCT193D  
40 °C to +125 °C SO16  
plastic small outline package; 16 leads;  
body width 3.9 mm  
SOT109-1  
SOT338-1  
74HCT193DB  
40 °C to +125 °C SSOP16  
plastic shrink small outline package; 16 leads;  
body width 5.3 mm  
74HCT193N  
40 °C to +125 °C DIP16  
plastic dual in-line package; 16 leads (300 mil)  
SOT38-4  
74HCT193PW  
40 °C to +125 °C TSSOP16  
plastic thin shrink small outline package; 16 leads;  
body width 4.4 mm  
SOT403-1  
4. Functional diagram  
15  
D0  
1
10  
D2  
9
D1  
D3  
PL  
TCU  
TCD  
11  
5
PL  
11  
D0  
15  
D1  
1
D2  
10  
D3  
9
12  
13  
CPU  
CPD  
COUNTER  
4
CPU  
CPD  
5
4
12  
13  
TCU  
TCD  
MR  
14  
FLIP-FLOPS  
Q0 Q1 Q2  
14  
3
2
6
7
Q3  
MR Q0  
Q1  
Q2  
Q3 001aag409  
3
2
6
7
001aag405  
Fig 1. Functional diagram  
Fig 2. Logic symbol  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
2 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
CTR4  
11  
5
C3  
2+  
G1  
1  
4
G2  
R
14  
15  
1
3
2
6
7
3D  
10  
9
13  
2CT = 0  
12  
1CT = 15  
001aag410  
Fig 3. IEC logic symbol  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
3 of 29  
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xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx  
D0  
D1  
D2  
D3  
PL  
CPU  
TCU  
SD  
SD  
SD  
SD  
Q
Q
Q
Q
T
FF1  
T
FF2  
T
FF3  
T
FF4  
Q
Q
Q
Q
RD  
RD  
RD  
RD  
TCD  
CPD  
MR  
Q0  
Q1  
Q2  
Q3  
001aag412  
Fig 4. Logic diagram  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
5. Pinning information  
5.1 Pinning  
74HC193  
74HCT193  
74HC193  
74HCT193  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
D1  
Q1  
V
CC  
D1  
Q1  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
V
CC  
74HC193  
74HCT193  
D0  
D0  
Q0  
MR  
TCD  
TCU  
PL  
Q0  
MR  
TCD  
TCU  
PL  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
D1  
Q1  
V
CC  
CPD  
CPU  
Q2  
D0  
CPD  
CPU  
Q2  
Q0  
MR  
TCD  
CPD  
CPU  
Q2  
12 TCU  
11  
10  
9
PL  
D2  
D3  
Q3  
D2  
Q3  
D2  
Q3  
GND  
D3  
GND  
D3  
GND  
001aaf408  
001aag406  
001aag407  
Fig 5. Pin configuration SO16  
Fig 6. Pin configuration TSSOP16  
and SSOP16  
Fig 7. Pin configuration DIP16  
5.2 Pin description  
Table 2.  
Symbol  
D0  
Pin description  
Pin  
Description  
15  
1
data input 0  
D1  
data input 1  
D2  
10  
9
data input 2  
D3  
data input 3  
Q0  
3
flip-flop output 0  
flip-flop output 1  
flip-flop output 2  
flip-flop output 3  
count down clock input[1]  
count up clock input[1]  
ground (0 V)  
Q1  
2
Q2  
6
Q3  
7
CPD  
CPU  
GND  
PL  
4
5
8
11  
12  
13  
14  
16  
asynchronous parallel load input (active LOW)  
terminal count up (carry) output (active LOW)  
terminal count down (borrow) output (active LOW)  
asynchronous master reset input (active HIGH)  
supply voltage  
TCU  
TCD  
MR  
VCC  
[1] LOW-to-HIGH, edge triggered.  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
5 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
6. Functional description  
Table 3.  
Function table[1]  
Operating mode  
Reset (clear)  
Parallel load  
Inputs  
Outputs  
MR PL  
CPU CPD D0  
D1  
X
X
L
D2  
X
X
L
D3  
X
X
L
Q0  
L
Q1  
L
Q2  
L
Q3  
L
TCU TCD  
H
H
L
L
L
L
L
L
X
X
L
X
X
X
X
L
L
X
X
L
H
L
H
L
L
L
L
L
H
H
L
L
L
L
L
H
L
H
X
X
H
L
L
L
L
L
L
L
L
H
H
H
H
H
H[3]  
L
H
H
X
X
H
H
X
X
H
H
X
X
H
H
X
X
H
H
H
H
H
H
H
H
L
L
H
H
H[2]  
Count up  
H
H
count up  
Count down  
H
count down  
H
[1] H = HIGH voltage level  
L = LOW voltage level  
X = don’t care  
= LOW-to-HIGH clock transition.  
[2] TCU = CPU at terminal count up (HHHH)  
[3] TCD = CPD at terminal count down (LLLL).  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
6 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
(1)  
MR  
PL  
D0  
D1  
D2  
D3  
(2)  
CPU  
(2)  
CPD  
Q0  
Q1  
Q2  
Q3  
TCU  
TCD  
0
13  
14  
15  
0
1
2
1
0
15  
14  
13  
COUNT UP  
COUNT DOWN  
CLEAR PRESET  
001aag411  
(1) Clear overrides load, data and count inputs.  
(2) When counting up, the count down clock input (CPD) must be HIGH, when counting down the count up clock input  
(CPU) must be HIGH.  
Sequence  
Clear (reset outputs to zero);  
load (preset) to binary thirteen;  
count up to fourteen, fifteen, terminal count up, zero, one and two;  
count down to one, zero, terminal count down, fifteen, fourteen and thirteen.  
Fig 8. Typical clear, load and count sequence  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
7 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
IIK  
Parameter  
Conditions  
Min  
Max  
+7.0  
±20  
±20  
±25  
50  
Unit  
V
supply voltage  
0.5  
[1]  
[1]  
input clamping current  
output clamping current  
output current  
VI < 0.5 V or VI > VCC + 0.5 V  
VO < 0.5 V or VO > VCC + 0.5 V  
VO = 0.5 V to VCC + 0.5 V  
-
mA  
mA  
mA  
mA  
mA  
°C  
IOK  
-
IO  
-
ICC  
supply current  
-
IGND  
Tstg  
Ptot  
ground current  
-
50  
+150  
750  
500  
500  
500  
storage temperature  
total power dissipation  
65  
[2]  
[2]  
[2]  
[2]  
DIP16 package  
SO16 package  
-
-
-
-
mW  
mW  
mW  
mW  
SSOP16 package  
TSSOP16 package  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] For DIP16 packages: above 70 °C the value of Ptot derates linearly at 12 mW/K.  
For SO16 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K.  
For SSOP16 and TSSOP16 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K.  
8. Recommended operating conditions  
Table 5.  
Recommended operating conditions  
Symbol Parameter  
74HC193  
Conditions  
Min Typ Max Unit  
VCC  
VI  
supply voltage  
input voltage  
2.0  
0
5.0  
6.0  
V
V
V
-
-
VCC  
VCC  
VO  
Tamb  
tr  
output voltage  
ambient temperature  
rise time  
0
40  
+25 +125 °C  
inputs  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
inputs  
-
-
-
-
1000 ns  
6.0  
-
500  
400  
ns  
ns  
tf  
fall time  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
-
1000 ns  
6.0  
-
500  
400  
ns  
ns  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
8 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
Table 5.  
Recommended operating conditions …continued  
Symbol Parameter  
74HCT193  
Conditions  
Min Typ Max Unit  
VCC  
VI  
supply voltage  
input voltage  
output voltage  
ambient temperature  
rise time  
4.5  
5.0  
5.5  
V
V
V
0
-
-
VCC  
VCC  
VO  
Tamb  
tr  
0
40  
+25 +125 °C  
inputs; VCC = 4.5 V  
inputs; VCC = 4.5 V  
-
-
6.0  
6.0  
500  
500  
ns  
ns  
tf  
fall time  
9. Static characteristics  
Table 6.  
Static characteristics type 74HC193  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Tamb = 25 °C  
VIH  
HIGH-level input voltage  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
1.5  
3.15  
4.2  
-
1.2  
2.4  
3.2  
0.8  
2.1  
2.8  
-
-
V
V
V
V
V
V
-
-
VIL  
LOW-level input voltage  
0.5  
-
1.35  
-
1.8  
VOH  
HIGH-level output voltage VI = VIH or VIL  
IO = 20 µA; VCC = 2.0 V  
-
-
-
-
-
-
-
1.9  
4.4  
5.9  
3.98  
5.48  
2.0  
4.5  
6.0  
4.32  
5.81  
V
V
V
V
V
IO = 20 µA; VCC = 4.5 V  
IO = 20 µA; VCC = 6.0 V  
IO = 4.0 mA; VCC = 4.5 V  
IO = 5.2 mA; VCC = 6.0 V  
VI = VIH or VIL  
VOL  
LOW-level output voltage  
IO = 20 µA; VCC = 2.0 V  
IO = 20 µA; VCC = 4.5 V  
IO = 20 µA; VCC = 6.0 V  
IO = 4.0 mA; VCC = 4.5 V  
IO = 5.2 mA; VCC = 6.0 V  
VI = VCC or GND; VCC = 6.0 V  
VI = VCC or GND; IO = 0 A;  
-
-
-
-
-
-
-
0
0.1  
V
0
0.1  
V
0
0.1  
V
0.15  
0.26  
0.26  
±0.1  
8.0  
V
0.16  
V
II  
input leakage current  
supply current  
-
-
µA  
µA  
ICC  
VCC = 6.0 V  
Ci  
input capacitance  
-
3.5  
-
pF  
Tamb = 40 °C to +85 °C  
VIH  
HIGH-level input voltage  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
1.5  
-
-
-
-
-
-
V
V
V
3.15  
4.2  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
9 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
Table 6.  
Static characteristics type 74HC193 …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
Min  
Typ  
Max  
0.5  
Unit  
V
VIL  
LOW-level input voltage  
-
-
-
-
-
-
1.35  
1.8  
V
V
VOH  
HIGH-level output voltage VI = VIH or VIL  
IO = 20 µA; VCC = 2.0 V  
1.9  
-
-
-
-
-
-
-
-
-
-
V
V
V
V
V
IO = 20 µA; VCC = 4.5 V  
IO = 20 µA; VCC = 6.0 V  
IO = 4.0 mA; VCC = 4.5 V  
IO = 5.2 mA; VCC = 6.0 V  
VI = VIH or VIL  
4.4  
5.9  
3.84  
5.34  
VOL  
LOW-level output voltage  
IO = 20 µA; VCC = 2.0 V  
IO = 20 µA; VCC = 4.5 V  
IO = 20 µA; VCC = 6.0 V  
IO = 4.0 mA; VCC = 4.5 V  
IO = 5.2 mA; VCC = 6.0 V  
VI = VCC or GND; VCC = 6.0 V  
VI = VCC or GND; IO = 0 A;  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.1  
V
0.1  
V
0.1  
V
0.33  
0.33  
±1.0  
80  
V
V
II  
input leakage current  
supply current  
µA  
µA  
ICC  
VCC = 6.0 V  
Tamb = 40 °C to +125 °C  
VIH HIGH-level input voltage  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
1.5  
-
-
-
-
-
-
-
V
V
V
V
V
V
3.15  
-
4.2  
-
VIL  
LOW-level input voltage  
-
-
-
0.5  
1.35  
1.8  
VOH  
HIGH-level output voltage VI = VIH or VIL  
IO = 20 µA; VCC = 2.0 V  
1.9  
4.4  
5.9  
3.7  
5.2  
-
-
-
-
-
-
-
-
-
-
V
V
V
V
V
IO = 20 µA; VCC = 4.5 V  
IO = 20 µA; VCC = 6.0 V  
IO = 4.0 mA; VCC = 4.5 V  
IO = 5.2 mA; VCC = 6.0 V  
VI = VIH or VIL  
VOL  
LOW-level output voltage  
IO = 20 µA; VCC = 2.0 V  
IO = 20 µA; VCC = 4.5 V  
IO = 20 µA; VCC = 6.0 V  
IO = 4.0 mA; VCC = 4.5 V  
IO = 5.2 mA; VCC = 6.0 V  
VI = VCC or GND; VCC = 6.0 V  
VI = VCC or GND; IO = 0 A;  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
0.4  
0.4  
±1.0  
160  
V
V
V
V
V
II  
input leakage current  
supply current  
µA  
µA  
ICC  
VCC = 6.0 V  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
10 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
Table 7.  
Static characteristics type 74HCT193  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Tamb = 25 °C  
VIH  
VIL  
HIGH-level input voltage  
LOW-level input voltage  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
2.0  
-
1.6  
1.2  
-
V
V
0.8  
VOH  
HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V  
IO = 20 µA  
4.4  
4.5  
-
-
V
V
IO = 4.0 mA  
3.98  
4.32  
VOL  
LOW-level output voltage  
VI = VIH or VIL; VCC = 4.5 V  
IO = 20 µA  
-
-
-
-
0
0.1  
V
IO = 4.0 mA  
0.15  
0.26  
±0.1  
8.0  
V
II  
input leakage current  
supply current  
VI = VCC or GND; VCC = 5.5 V  
-
-
µA  
µA  
ICC  
VI = VCC or GND; IO = 0 A;  
VCC = 5.5 V  
ICC  
additional supply current  
per input pin; VI = VCC 2.1 V and  
other inputs at VCC or GND;  
IO = 0 A; VCC = 4.5 V to 5.5 V  
pin Dn  
-
-
-
-
-
35  
126  
504  
234  
378  
-
µA  
µA  
µA  
µA  
pF  
pins CPU, CPD  
pin PL  
140  
65  
pin MR  
105  
3.5  
Ci  
input capacitance  
Tamb = 40 °C to +85 °C  
VIH  
VIL  
HIGH-level input voltage  
LOW-level input voltage  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
2.0  
-
-
-
-
V
V
0.8  
VOH  
HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V  
IO = 20 µA  
4.4  
-
-
-
-
V
V
IO = 4.0 mA  
3.84  
VOL  
LOW-level output voltage  
VI = VIH or VIL; VCC = 4.5 V  
IO = 20 µA  
-
-
-
-
-
-
-
-
0.1  
V
IO = 4.0 mA  
0.33  
±1.0  
80  
V
II  
input leakage current  
supply current  
VI = VCC or GND; VCC = 5.5 V  
µA  
µA  
ICC  
VI = VCC or GND; IO = 0 A;  
VCC = 5.5 V  
ICC  
additional supply current  
per input pin; VI = VCC 2.1 V and  
other inputs at VCC or GND;  
IO = 0 A; VCC = 4.5 V to 5.5 V  
pin Dn  
-
-
-
-
-
-
-
-
157.5  
630  
µA  
µA  
µA  
µA  
pins CPU, CPD  
pin PL  
292.5  
472.5  
pin MR  
Tamb = 40 °C to +125 °C  
VIH  
HIGH-level input voltage  
LOW-level input voltage  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
2.0  
-
-
-
-
V
V
VIL  
0.8  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
11 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
Table 7.  
Static characteristics type 74HCT193 …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
VOH  
HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V  
IO = 20 µA  
4.4  
3.7  
-
-
-
-
V
V
IO = 4.0 mA  
VOL  
LOW-level output voltage  
VI = VIH or VIL; VCC = 4.5 V  
IO = 20 µA  
-
-
-
-
-
-
-
-
0.1  
V
IO = 4.0 mA  
0.4  
V
II  
input leakage current  
supply current  
VI = VCC or GND; VCC = 5.5 V  
±1.0  
160  
µA  
µA  
ICC  
VI = VCC or GND; IO = 0 A;  
VCC = 5.5 V  
ICC  
additional supply current  
per input pin; VI = VCC 2.1 V and  
other inputs at VCC or GND;  
IO = 0 A; VCC = 4.5 V to 5.5 V  
pin Dn  
-
-
-
-
-
-
-
-
171.5  
686  
µA  
µA  
µA  
µA  
pins CPU, CPD  
pin PL  
318.5  
514.5  
pin MR  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
12 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
10. Dynamic characteristics  
Table 8.  
Dynamic characteristics type 74HC193  
Symbol Parameter  
Conditions  
25 °C  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
[1]  
tpd  
propagation  
delay  
CPU, CPD to Qn;  
see Figure 9  
-
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
63  
23  
18  
215  
43  
-
-
-
270  
54  
-
-
-
325  
65  
ns  
ns  
ns  
37  
46  
55  
CPU to TCU; see  
Figure 10  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
39  
14  
11  
125  
25  
-
-
-
155  
31  
-
-
-
190  
38  
ns  
ns  
ns  
21  
26  
32  
CPD to TCD; see  
Figure 10  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
39  
14  
11  
125  
25  
-
-
-
155  
31  
-
-
-
190  
38  
ns  
ns  
ns  
21  
26  
32  
PL to Qn; see  
Figure 11  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
69  
25  
20  
220  
44  
-
-
-
275  
55  
-
-
-
330  
66  
ns  
ns  
ns  
37  
47  
56  
MR to Qn; see  
Figure 12  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
58  
21  
17  
200  
40  
-
-
250  
50  
-
-
-
300  
60  
ns  
ns  
ns  
34  
43  
51  
Dn to Qn; see  
Figure 11  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
69  
25  
20  
210  
42  
-
-
-
265  
53  
-
-
-
315  
63  
ns  
ns  
ns  
36  
45  
54  
PL to TCU, PL to  
TCD; see Figure 14  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
80  
29  
23  
290  
58  
-
-
-
365  
73  
-
-
-
435  
87  
ns  
ns  
ns  
49  
62  
74  
MR to TCU, MR to  
TCD; see Figure 14  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
74  
27  
22  
285  
57  
-
-
-
355  
71  
-
-
-
430  
86  
ns  
ns  
ns  
48  
60  
73  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
13 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
Table 8.  
Dynamic characteristics type 74HC193 …continued  
Symbol Parameter  
Conditions  
25 °C  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
tpd  
propagation  
delay  
Dn to TCU, Dn to  
TCD; see Figure 14  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
see Figure 12  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
see Figure 12  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
80  
29  
23  
290  
58  
-
-
-
365  
73  
-
-
-
435  
87  
ns  
ns  
ns  
49  
62  
74  
tTHL  
tTLH  
tW  
HIGH to LOW  
output transition  
time  
-
-
-
19  
7
75  
15  
13  
-
-
-
95  
19  
16  
-
-
-
110  
22  
ns  
ns  
ns  
6
19  
LOW to HIGH  
output transition  
time  
-
-
-
19  
7
75  
15  
13  
-
-
-
95  
19  
16  
-
-
-
110  
22  
ns  
ns  
ns  
6
19  
pulse width  
CPU, CPD (HIGH  
or LOW); see  
Figure 9  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
100  
20  
22  
8
-
-
-
125  
25  
-
-
-
150  
30  
-
-
-
ns  
ns  
ns  
17  
6
21  
26  
MR (HIGH); see  
Figure 12  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
100  
20  
25  
9
-
-
-
125  
25  
-
-
-
150  
30  
-
-
-
ns  
ns  
ns  
17  
7
21  
26  
PL (LOW); see  
Figure 11  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
100  
20  
19  
7
-
-
-
125  
25  
-
-
-
150  
30  
-
-
-
ns  
ns  
ns  
17  
6
21  
26  
trec  
recovery time  
PL to CPU, CPD;  
see Figure 11  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
50  
10  
9
8
3
2
-
-
-
65  
13  
11  
-
-
-
75  
15  
13  
-
-
-
ns  
ns  
ns  
MR to CPU, CPD;  
see Figure 12  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
50  
10  
9
0
0
0
-
-
-
65  
13  
11  
-
-
-
75  
15  
13  
-
-
-
ns  
ns  
ns  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
14 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
Table 8.  
Dynamic characteristics type 74HC193 …continued  
Symbol Parameter  
Conditions  
25 °C  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
tsu  
set-up time  
Dn to PL; see  
Figure 13; note:  
CPU = CPD =  
HIGH  
V
CC = 2.0 V  
80  
16  
14  
22  
8
-
-
-
100  
20  
-
-
-
120  
24  
-
-
-
ns  
ns  
ns  
VCC = 4.5 V  
VCC = 6.0 V  
6
17  
20  
th  
hold time  
Dn to PL; see  
Figure 13  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
0
0
0
14  
5  
-
-
-
0
0
0
-
-
0
0
0
-
-
-
ns  
ns  
ns  
4  
CPU to CPD,  
CPD to CPU; see  
Figure 15  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
80  
16  
8
22  
8
-
-
-
100  
20  
-
-
-
120  
24  
-
-
-
ns  
ns  
ns  
6
17  
20  
fmax  
maximum  
frequency  
CPU, CPD; see  
Figure 9  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
4.0  
20  
24  
-
13.5  
41  
-
-
-
-
3.2  
16  
19  
-
-
-
-
-
2.6  
13  
15  
-
-
-
-
-
MHz  
MHz  
MHz  
pF  
49  
[2]  
CPD  
power  
VI = GND to VCC  
CC = 5 V;  
fi = 1 MHz  
;
24  
dissipation  
capacitance  
V
[1] tpd is the same as tPHL and tPLH  
.
[2] CPD is used to determine the dynamic power dissipation (PD in µW):  
PD = CPD × VCC2 × fi × N + (CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in V;  
N = number of inputs switching;  
(CL × VCC2 × fo) = sum of outputs.  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
15 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
Table 9.  
Dynamic characteristics type 74HCT193  
Symbol Parameter  
Conditions  
25 °C  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min  
Typ  
Max  
43  
27  
27  
46  
40  
46  
55  
55  
Min  
Max  
54  
34  
34  
58  
50  
58  
69  
69  
Min  
Max  
65  
41  
41  
69  
60  
69  
83  
83  
[1]  
tpd  
propagation  
delay  
CPU, CPD to Qn;  
see Figure 9  
VCC = 4.5 V  
-
-
-
-
-
-
-
-
23  
15  
15  
26  
22  
27  
31  
29  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CPU to TCU; see  
Figure 10  
VCC = 4.5 V  
CPD to TCD; see  
Figure 10  
VCC = 4.5 V  
PL to Qn; see  
Figure 11  
VCC = 4.5 V  
MR to Qn; see  
Figure 12  
VCC = 4.5 V  
Dn to Qn; see  
Figure 11  
VCC = 4.5 V  
PL to TCU, PL to  
TCD; see Figure 14  
VCC = 4.5 V  
MR to TCU, MR to  
TCD; see Figure 14  
VCC = 4.5 V  
Dn to TCU, Dn to  
TCD; see Figure 14  
VCC = 4.5 V  
see Figure 12  
VCC = 4.5 V  
-
-
32  
7
58  
15  
-
-
73  
19  
-
-
87  
22  
ns  
ns  
tTHL  
tTLH  
tW  
HIGH to LOW  
output transition  
time  
LOW to HIGH  
output transition  
time  
see Figure 12  
VCC = 4.5 V  
-
7
15  
-
19  
-
22  
ns  
pulse width  
CPU, CPD (HIGH  
or LOW); see  
Figure 9  
VCC = 4.5 V  
25  
20  
20  
11  
7
-
-
-
31  
25  
25  
-
-
-
38  
30  
30  
-
-
-
ns  
ns  
ns  
MR (HIGH); see  
Figure 12  
VCC = 4.5 V  
PL (LOW); see  
Figure 11  
VCC = 4.5 V  
8
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
16 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
Table 9.  
Dynamic characteristics type 74HCT193 …continued  
Symbol Parameter  
Conditions  
25 °C  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min  
10  
Typ  
Max  
Min  
Max  
Min  
Max  
trec  
recovery time  
PL to CPU, CPD;  
see Figure 11  
VCC = 4.5 V  
2
0
-
-
13  
-
-
15  
-
-
ns  
ns  
MR to CPU, CPD;  
see Figure 12  
VCC = 4.5 V  
10  
13  
15  
tsu  
set-up time  
hold time  
Dn to PL; see  
Figure 13; note:  
CPU = CPD =  
HIGH  
VCC = 4.5 V  
16  
0
8
-
-
20  
0
-
-
24  
0
-
-
ns  
ns  
th  
Dn to PL; see  
Figure 13  
VCC = 4.5 V  
6  
CPU to CPD,  
CPD to CPU; see  
Figure 15  
VCC = 4.5 V  
16  
7
-
20  
-
24  
-
ns  
fmax  
maximum  
frequency  
CPU, CPD; see  
Figure 9  
VCC = 4.5 V  
20  
-
43  
26  
-
-
16  
-
-
-
13  
-
-
-
MHz  
pF  
[2]  
CPD  
power  
VI = GND to VCC  
1.5 V; VCC = 5 V;  
fi = 1 MHz  
dissipation  
capacitance  
[1] tpd is the same as tPHL and tPLH  
.
[2] CPD is used to determine the dynamic power dissipation (PD in µW):  
PD = CPD × VCC2 × fi × N + (CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in V;  
N = number of inputs switching;  
(CL × VCC2 × fo) = sum of outputs.  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
17 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
11. Waveforms  
1/f  
max  
V
I
CPU, CPD  
input  
V
t
M
GND  
t
W
t
PHL  
PLH  
V
OH  
V
Qn output  
M
001aag413  
V
OL  
Measurement points are given in Table 10.  
tPLH and tPHL are the same as tpd  
.
Logic levels VOL and VOH are typical output voltage drops that occur with the output load.  
Fig 9. The clock (CPU, CPD) to output (Qn) propagation delays, the clock pulse width, and the maximum clock  
pulse frequency  
V
I
CPU, CPD  
input  
V
M
GND  
t
t
PHL  
PLH  
V
OH  
TCU, TCD  
output  
V
M
V
001aag414  
OL  
Measurement points are given in Table 10.  
tPLH and tPHL are the same as tpd  
.
Logic levels VOL and VOH are typical output voltage drops that occur with the output load.  
Fig 10. The clock (CPU, CPD) to terminal count output (TCU, TCD) propagation delays  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
18 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
V
I
Dn input  
V
V
M
M
GND  
V
I
PL input  
GND  
t
rec  
t
W
V
I
CPU, CPD  
input  
V
M
GND  
t
t
PHL  
PLH  
V
OH  
Qn output  
V
M
V
OL  
001aag415  
Measurement points are given in Table 10.  
tPLH and tPHL are the same as tpd  
.
Logic levels VOL and VOH are typical output voltage drops that occur with the output load.  
Fig 11. The parallel load input (PL) and data (Dn) to Qn output propagation delays and PL removal time to clock  
input (CPU, CPD)  
V
I
MR input  
V
M
GND  
t
t
rec  
W
V
I
CPU, CPD  
input  
V
M
GND  
t
PHL  
V
OH  
90 %  
V
M
Qn output  
10 %  
V
OL  
t
t
THL  
TLH  
001aag416  
Measurement points are given in Table 10.  
tPLH and tPHL are the same as tpd  
.
Logic levels VOL and VOH are typical output voltage drops that occur with the output load.  
Fig 12. The master reset input (MR) pulse width, MR to Qn propagation delays, MR to CPU, CPD removal time and  
output transition times  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
19 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
V
I
V
Dn input  
PL input  
M
GND  
t
t
su  
su  
t
t
h
h
V
I
V
M
GND  
V
OH  
Qn output  
V
OL  
001aag417  
The shaded areas indicate when the input is permitted to change for predictable output performance.  
Measurement points are given in Table 10.  
Logic levels VOL and VOH are typical output voltage drops that occur with the output load.  
Fig 13. The data input (Dn) to parallel load input (PL) set-up and hold times  
V
I
PL, MR, Dn  
input  
V
M
GND  
t
t
PLH  
PHL  
V
OH  
TCU, TCD  
output  
V
M
V
OL  
001aag418  
Measurement points are given in Table 10.  
tPLH and tPHL are the same as tpd  
.
Logic levels VOL and VOH are typical output voltage drops that occur with the output load.  
Fig 14. The data input (Dn), parallel load input (PL) and the master reset input (MR) to the terminal count outputs  
(TCU, TCD) propagation delays  
V
I
CPU or CPD  
input  
V
M
GND  
t
h
V
I
CPD or CPU  
input  
V
M
GND  
001aag419  
Measurement points are given in Table 10.  
Fig 15. The CPU to CPD or CPD to CPU hold times  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
20 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
Table 10. Measurement points  
Type  
Input  
VM  
Output  
VM  
VI  
GND to VCC  
GND to 3 V  
74HC193  
0.5 × VCC  
1.3 V  
0.5 × VCC  
74HCT193  
1.3 V  
t
W
V
I
90 %  
negative  
pulse  
V
V
V
M
M
10 %  
0 V  
t
t
r
f
t
t
f
r
V
I
90 %  
positive  
pulse  
V
M
M
10 %  
0 V  
t
W
V
V
CC  
CC  
V
V
O
I
R
L
S1  
PULSE  
GENERATOR  
open  
DUT  
R
T
C
L
001aad983  
Test data is given in Table 11.  
Definitions test circuit:  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator  
CL = Load capacitance including jig and probe capacitance  
RL = Load resistor  
S1 = Test selection switch  
Fig 16. Load circuitry for measuring switching times  
Table 11. Test data  
Type  
Input  
VI  
Load  
S1 position  
tPHL, tPLH  
open  
tr, tf  
6 ns  
6 ns  
CL  
RL  
74HC193  
VCC  
3 V  
15 pF, 50 pF  
15 pF, 50 pF  
1 kΩ  
1 kΩ  
74HCT193  
open  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
21 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
12. Application information  
data input  
D0 D1 D2 D3  
CPU TCU  
CPD IC1 TCD  
PL MR  
Q0 Q1 Q2 Q3  
D0 D1 D2 D3  
CPU TCU  
CPD IC2 TCD  
PL MR  
Q0 Q1 Q2 Q3  
up clock  
carry  
down clock  
borrow  
asynchronous  
parallel load  
reset  
data output  
001aag420  
Fig 17. Application for cascaded up/down counter with parallel load  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
22 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
13. Package outline  
SO16: plastic small outline package; 16 leads; body width 3.9 mm  
SOT109-1  
D
E
A
X
v
c
y
H
M
A
E
Z
16  
9
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
8
e
w
M
detail X  
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
10.0  
9.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.05  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.39  
0.014 0.0075 0.38  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.020  
0.028  
0.012  
inches  
0.069  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT109-1  
076E07  
MS-012  
Fig 18. Package outline SOT109-1 (SO16)  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
23 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm  
SOT338-1  
D
E
A
X
c
y
H
v
M
A
E
Z
9
16  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
8
1
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.  
8o  
0o  
0.21  
0.05  
1.80  
1.65  
0.38  
0.25  
0.20  
0.09  
6.4  
6.0  
5.4  
5.2  
7.9  
7.6  
1.03  
0.63  
0.9  
0.7  
1.00  
0.55  
mm  
2
0.25  
0.65  
1.25  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT338-1  
MO-150  
Fig 19. Package outline SOT338-1 (SSOP16)  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
24 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
DIP16: plastic dual in-line package; 16 leads (300 mil)  
SOT38-4  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
b
2
16  
9
M
H
pin 1 index  
E
1
8
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
2
(1)  
(1)  
Z
1
w
UNIT  
mm  
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.  
min.  
max.  
max.  
1.73  
1.30  
0.53  
0.38  
1.25  
0.85  
0.36  
0.23  
19.50  
18.55  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.1  
7.62  
0.3  
0.254  
0.01  
0.76  
0.068 0.021 0.049 0.014  
0.051 0.015 0.033 0.009  
0.77  
0.73  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.02  
0.13  
0.03  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
95-01-14  
03-02-13  
SOT38-4  
Fig 20. Package outline SOT38-4 (DIP16)  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
25 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm  
SOT403-1  
D
E
A
X
c
y
H
v
M
A
E
Z
9
16  
Q
(A )  
3
A
2
A
A
1
pin 1 index  
θ
L
p
L
1
8
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
5.1  
4.9  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.40  
0.06  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT403-1  
MO-153  
Fig 21. Package outline SOT403-1 (TSSOP16)  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
26 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
14. Revision history  
Table 12. Revision history  
Document ID  
74HC_HCT193_3  
Modifications:  
Release date  
20070523  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
74HC_HCT193_CNV_2  
The format of this data sheet has been redesigned to comply with the new identity  
guidelines of NXP Semiconductors.  
Legal texts have been adapted to the new company name where appropriate.  
Family specification included  
74HC_HCT193_CNV_2  
19970828  
Product specification  
-
-
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
27 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
15. Legal information  
16. Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of a NXP Semiconductors product can reasonably be expected to  
16.1 Definitions  
result in personal injury, death or severe property or environmental damage.  
NXP Semiconductors accepts no liability for inclusion and/or use of NXP  
Semiconductors products in such equipment or applications and therefore  
such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
16.2 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
16.3 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
17. Contact information  
For additional information, please visit: http://www.nxp.com  
For sales office addresses, send an email to: salesaddresses@nxp.com  
74HC_HCT193_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 23 May 2007  
28 of 29  
74HC193; 74HCT193  
NXP Semiconductors  
Presettable synchronous 4-bit binary up/down counter  
18. Contents  
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5  
6
Functional description . . . . . . . . . . . . . . . . . . . 6  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Recommended operating conditions. . . . . . . . 8  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 9  
Dynamic characteristics . . . . . . . . . . . . . . . . . 13  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Application information. . . . . . . . . . . . . . . . . . 22  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 27  
7
8
9
10  
11  
12  
13  
14  
15  
16  
16.1  
16.2  
16.3  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 28  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 28  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
17  
18  
Contact information. . . . . . . . . . . . . . . . . . . . . 28  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2007.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 23 May 2007  
Document identifier: 74HC_HCT193_3  

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