74HC1G125GW [NXP]

Bus buffer/line driver; 3-state; 总线缓冲器/线路驱动器;三态
74HC1G125GW
型号: 74HC1G125GW
厂家: NXP    NXP
描述:

Bus buffer/line driver; 3-state
总线缓冲器/线路驱动器;三态

总线驱动器 总线收发器 逻辑集成电路 光电二极管
文件: 总13页 (文件大小:84K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INTEGRATED CIRCUITS  
DATA SHEET  
74HC1G125; 74HCT1G125  
Bus buffer/line drivers; 3-state  
Product specification  
2004 Jul 27  
Supersedes data of 2002 May 17  
Philips Semiconductors  
Product specification  
Bus buffer/line drivers; 3-state  
74HC1G125; 74HCT1G125  
FEATURES  
DESCRIPTION  
Wide supply voltage range from 2.0 to 6.0 V  
Symmetrical output impedance  
High noise immunity  
The 74HC1G/HCT1G125 is a high-speed Si-gate CMOS  
device.  
The 74HC1G/HCT1G125 provides one non-inverting  
buffer/line driver with 3-state output. The 3-state output is  
controlled by the output enable input pin (OE). A HIGH at  
pin OE causes the output as assume a high-impedance  
OFF-state.  
Low power dissipation  
Balanced propagation delays  
Very small 5 pins package  
Output capability: bus driver.  
The bus driver output currents are equal compared to the  
74HC/HCT125.  
QUICK REFERENCE DATA  
GND = 0 V; Tamb = 25 °C; tr = tf 6.0 ns.  
TYPICAL  
SYMBOL  
PARAMETER  
CONDITIONS  
UNIT  
ns  
HC1G  
HCT1G  
10  
tPHL/tPLH propagation delay A to Y  
CL = 15 pF; VCC = 5 V  
9
CI  
input capacitance  
1.5  
30  
1.5  
27  
pF  
pF  
CPD  
power dissipation capacitance  
notes 1 and 2  
Notes  
1. CPD is used to determine the dynamic power dissipation (PD in µW).  
PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in Volts;  
(CL × VCC2 × fo) = sum of outputs.  
2. For HC1G the condition is VI = GND to VCC  
.
For HCT1G the condition is VI = GND to VCC 1.5 V.  
FUNCTION TABLE  
See note 1.  
INPUTS  
OUTPUT  
Y
OE  
A
L
L
L
H
X
L
H
Z
H
Note  
1. H = HIGH voltage level;  
L = LOW voltage level;  
X = don’t care;  
Z = high-impedance OFF-state.  
2004 Jul 27  
2
Philips Semiconductors  
Product specification  
Bus buffer/line drivers; 3-state  
74HC1G125; 74HCT1G125  
ORDERING INFORMATION  
PACKAGE  
PACKAGE MATERIAL  
TYPE NUMBER  
TEMPERATURE  
PINS  
CODE  
MARKING  
RANGE  
74HC1G125GW  
74HCT1G125GW  
74HC1G125GV  
74HCT1G125GV  
40 to +125 °C  
40 to +125 °C  
40 to +125 °C  
40 to +125 °C  
5
5
5
5
SC-88A  
SC-88A  
SC-74A  
SC-74A  
plastic  
plastic  
plastic  
plastic  
SOT353  
SOT353  
SOT753  
SOT753  
HM  
TM  
H25  
T25  
PINNING  
PIN  
SYMBOL  
DESCRIPTION  
1
2
3
4
5
OE  
A
output enable input  
data input A  
GND  
Y
ground (0 V)  
data output Y  
supply voltage  
VCC  
handbook, halfpage  
handbook, halfpage  
OE  
1
2
3
5
4
V
Y
A
2
Y
4
CC  
A
125  
1
OE  
GND  
MNA118  
MNA117  
Fig.1 Pin configuration.  
Fig.2 Logic symbol.  
handbook, halfpage  
Y
A
2
handbook, halfpage  
4
1
OE  
OE  
MNA119  
MNA120  
Fig.3 IEC logic symbol.  
Fig.4 Logic diagram.  
2004 Jul 27  
3
Philips Semiconductors  
Product specification  
Bus buffer/line drivers; 3-state  
74HC1G125; 74HCT1G125  
RECOMMENDED OPERATING CONDITIONS  
74HC1G125  
MIN. TYP. MAX. MIN.  
2.0  
74HCT1G125  
SYMBOL  
PARAMETER  
supply voltage  
CONDITIONS  
UNIT  
TYP. MAX.  
VCC  
VI  
5.0  
6.0  
4.5  
0
5.0  
5.5  
V
input voltage  
0
VCC  
VCC  
VCC  
VCC  
V
V
VO  
output voltage  
0
0
Tamb  
operating ambient  
temperature  
see DC and AC  
characteristics per  
device  
40  
+25  
+125 40  
+25  
+125 °C  
tr, tf  
input rise and fall times  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
1000  
500  
ns  
ns  
ns  
500  
400  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).  
SYMBOL  
VCC  
IIK  
PARAMETER  
supply voltage  
CONDITIONS  
MIN. MAX. UNIT  
0.5  
+7.0  
±20  
±20  
V
input diode current  
VI < 0.5 V or VI > VCC + 0.5 V; note 1  
VO < 0.5 V or VO > VCC + 0.5 V; note 1  
0.5 V < VO < VCC + 0.5 V; note 1  
note 1  
mA  
mA  
IOK  
output diode current  
IO  
output source or sink current  
VCC or GND current  
±12.5 mA  
±25 mA  
+150 °C  
200 mW  
ICC  
Tstg  
PD  
storage temperature  
65  
power dissipation per package  
for temperature range from 40 to +125 °C;  
note 2  
Notes  
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. Above 55 °C the value of PD derates linearly with 2.5 mW/K.  
2004 Jul 27  
4
Philips Semiconductors  
Product specification  
Bus buffer/line drivers; 3-state  
74HC1G125; 74HCT1G125  
DC CHARACTERISTICS  
Family 74HC1G  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
TEST CONDITIONS Tamb (°C)  
SYMBOL  
PARAMETER  
40 to +85  
40 to +125  
MIN. MAX.  
1.5  
UNIT  
OTHER  
VCC (V)  
MIN. TYP.(1) MAX.  
VIH  
HIGH-level input voltage  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
2.0  
1.5  
3.15  
4.2  
1.2  
2.4  
3.2  
0.8  
2.1  
2.8  
2.0  
V
V
V
V
V
V
V
3.15  
4.2  
VIL  
LOW-level input voltage  
0.5  
1.35  
1.8  
0.5  
1.35  
1.8  
VOH  
HIGH-level output  
voltage  
VI = VIH or VIL;  
IO = 20 µA  
1.9  
1.9  
VI = VIH or VIL;  
IO = 20 µA  
4.5  
6.0  
4.5  
6.0  
2.0  
4.5  
6.0  
4.5  
6.0  
4.4  
5.9  
4.13  
5.63  
4.5  
6.0  
4.32  
5.81  
0
4.4  
5.9  
3.7  
5.2  
V
V
V
V
V
V
V
V
V
VI = VIH or VIL;  
IO = 20 µA  
VI = VIH or VIL;  
IO = 2.0 mA  
VI = VIH or VIL;  
IO = 2.6 mA  
VOL  
LOW-level output  
voltage  
VI = VIH or VIL;  
IO = 20 µA  
0.1  
0.1  
0.1  
0.33  
0.33  
0.1  
0.1  
0.1  
0.4  
0.4  
VI = VIH or VIL;  
IO = 20 µA  
0
VI = VIH or VIL;  
IO = 20 µA  
0
VI = VIH or VIL;  
IO = 2.0 mA  
0.15  
0.16  
VI = VIH or VIL;  
IO = 2.6 mA  
ILI  
input leakage current  
VI = VCC or GND 6.0  
1.0  
5
1.0  
10  
µA  
µA  
IOZ  
3-state output current  
OFF-state  
VI = VIH or VIL;  
6.0  
VO = VCC or GND  
ICC  
quiescent supply  
current  
VI = VCC or GND; 6.0  
IO = 0  
10  
20  
µA  
Note  
1. All typical values are measured at Tamb = 25 °C.  
2004 Jul 27  
5
Philips Semiconductors  
Product specification  
Bus buffer/line drivers; 3-state  
74HC1G125; 74HCT1G125  
Family 74HCT1G  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
TEST CONDITIONS Tamb (°C)  
SYMBOL  
PARAMETER  
40 to +85  
40 to +125  
MIN. MAX.  
2.0  
UNIT  
OTHER  
VCC (V)  
MIN. TYP.(1) MAX.  
VIH  
VIL  
HIGH-level input  
voltage  
4.5 to 5.5 2.0  
1.6  
1.2  
4.5  
4.32  
0
V
V
V
V
V
V
LOW-level input  
voltage  
4.5 to 5.5  
4.5  
0.8  
0.8  
VOH  
HIGH-level output  
voltage  
VI = VIH or VIL;  
IO = 20 µA  
4.4  
4.13  
4.4  
3.7  
VI = VIH or VIL;  
IO = 2.0 mA  
4.5  
VOL  
LOW-level output  
voltage  
VI = VIH or VIL;  
IO = 20 µA  
4.5  
0.1  
0.33  
0.1  
0.4  
VI = VIH or VIL;  
IO = 2.0 mA  
4.5  
0.15  
ILI  
input leakage current VI = VCC or GND 5.5  
1.0  
5
1.0  
10  
µA  
µA  
IOZ  
3-state output  
VI = VIH or VIL;  
5.5  
current OFF-state  
VO = VCC or GND  
ICC  
quiescent supply  
current  
VI = VCC or GND; 5.5  
IO = 0  
10  
20  
µA  
µA  
ICC  
additional supply  
current per input  
VI = VCC 2.1 V; 4.5 to 5.5  
IO = 0  
500  
850  
Note  
1. All typical values are measured at Tamb = 25 °C.  
2004 Jul 27  
6
Philips Semiconductors  
Product specification  
Bus buffer/line drivers; 3-state  
74HC1G125; 74HCT1G125  
AC CHARACTERISTICS  
Type 74HC1G125  
GND = 0 V; tr = tf 6.0 ns; CL = 50 pF.  
TEST CONDITIONS  
WAVEFORMS VCC (V)  
Tamb (°C)  
SYMBOL  
PARAMETER  
40 to +85  
40 to +125  
UNIT  
MIN. TYP.(1) MAX.  
MIN.  
MAX.  
150  
30  
t
PHL/tPLH  
propagation delay see Figs 5 and 7  
A to Y  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
24  
10  
8
125  
25  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
21  
26  
tPZH/tPZL  
3-state output  
enable time  
OE to Y  
see Figs 6 and 7  
see Figs 6 and 7  
19  
9
155  
31  
190  
38  
7
26  
32  
tPHZ/tPLZ  
3-state output  
disable time  
OE to Y  
18  
12  
11  
155  
31  
190  
38  
26  
32  
Note  
1. All typical values are measured at Tamb = 25 °C.  
Type 74HCT1G125  
GND = 0 V; tr = tf 6.0 ns; CL = 50 pF.  
TEST CONDITIONS  
WAVEFORMS VCC (V)  
Tamb (°C)  
SYMBOL  
PARAMETER  
40 to +85  
MIN. TYP.(1) MAX.  
40 to +125  
UNIT  
MIN.  
MAX.  
36  
tPHL/tPLH  
tPZH/tPZL  
propagation delay see Figs 5 and 7  
A to Y  
4.5  
4.5  
11  
30  
ns  
ns  
3-state output  
enable time  
OE to Y  
see Figs 6 and 7  
10  
35  
42  
38  
tPHZ/tPLZ  
3-state output  
disable time  
OE to Y  
see Figs 6 and 7  
4.5  
11  
31  
ns  
Note  
1. All typical values are measured at Tamb = 25 °C.  
2004 Jul 27  
7
Philips Semiconductors  
Product specification  
Bus buffer/line drivers; 3-state  
74HC1G125; 74HCT1G125  
AC WAVEFORMS  
V
handbook, halfpage  
A input  
I
V
M
GND  
t
t
PHL  
PLH  
V
Y output  
M
MNA121  
For HC1G: VM = 50%; VI = GND to VCC  
.
For HCT1G: VM = 1.3 V; VI = GND to 3.0 V.  
Fig.5 The input (A) to output (Y) propagation delays.  
V
I
V
OE input  
M
GND  
t
t
PZL  
PLZ  
V
CC  
output  
LOW-to-OFF  
OFF-to-LOW  
V
M
V
+0.3 V  
OL  
V
t
t
PHZ  
PZH  
0.3 V  
OH  
output  
V
HIGH-to-OFF  
OFF-to-HIGH  
M
GND  
output  
enabled  
output  
enabled  
output  
disabled  
MNA122  
For HC1G: VM = 50%; VI = GND to VCC  
.
For HCT1G: VM = 1.3 V; VI = GND to 3.0 V.  
Fig.6 The 3-state enable and disable times.  
8
2004 Jul 27  
Philips Semiconductors  
Product specification  
Bus buffer/line drivers; 3-state  
74HC1G125; 74HCT1G125  
V
handbook, halfpage  
CC  
S
V
V
O
1
V
R
= 1 k  
I
CC  
open  
L
PULSE  
GENERATOR  
D.U.T.  
C
L
R
T
50 pF  
MNA123  
TEST  
tPLH/tPHL  
tPLZ/tPZL  
tPHZ/tPZH  
S1  
open  
VCC  
Definitions for test circuit:  
CL = load capacitance including jig and probe capacitance (see “AC characteristics”).  
GND  
RT = termination resistance should be equal to the output impedance Zo of the pulse generator.  
Fig.7 Load circuitry for switching times.  
2004 Jul 27  
9
Philips Semiconductors  
Product specification  
Bus buffer/line drivers; 3-state  
74HC1G125; 74HCT1G125  
PACKAGE OUTLINES  
Plastic surface mounted package; 5 leads  
SOT353  
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
1
2
3
c
e
1
b
p
L
p
w
M B  
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
(2)  
UNIT  
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max  
0.30  
0.20  
1.1  
0.8  
0.25  
0.10  
2.2  
1.8  
1.35  
1.15  
2.2  
2.0  
0.45  
0.15  
0.25  
0.15  
mm  
0.1  
1.3  
0.65  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
SC-88A  
97-02-28  
SOT353  
2004 Jul 27  
10  
Philips Semiconductors  
Product specification  
Bus buffer/line drivers; 3-state  
74HC1G125; 74HCT1G125  
Plastic surface mounted package; 5 leads  
SOT753  
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
c
L
p
1
2
3
detail X  
e
b
p
w
M B  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
A
1
b
c
D
E
e
H
L
Q
v
w
y
p
p
E
0.100  
0.013  
0.40  
0.25  
1.1  
0.9  
0.26  
0.10  
3.1  
2.7  
1.7  
1.3  
3.0  
2.5  
0.6  
0.2  
0.33  
0.23  
mm  
0.95  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
SOT753  
SC-74A  
02-04-16  
2004 Jul 27  
11  
Philips Semiconductors  
Product specification  
Bus buffer/line drivers; 3-state  
74HC1G125; 74HCT1G125  
DATA SHEET STATUS  
DATA SHEET  
STATUS(1)  
PRODUCT  
STATUS(2)(3)  
LEVEL  
DEFINITION  
I
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
II  
Preliminary data Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Relevant changes will  
be communicated via a Customer Product/Process Change Notification  
(CPCN).  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes in the products -  
including circuits, standard cells, and/or software -  
described or contained herein in order to improve design  
and/or performance. When the product is in full production  
(status ‘Production’), relevant changes will be  
Application information  
Applications that are  
communicated via a Customer Product/Process Change  
Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these  
products, conveys no licence or title under any patent,  
copyright, or mask work right to these products, and  
makes no representations or warranties that these  
products are free from patent, copyright, or mask work  
right infringement, unless otherwise specified.  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2004 Jul 27  
12  
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2004  
SCA76  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
R44/04/pp13  
Date of release: 2004 Jul 27  
Document order number: 9397 750 13725  

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