74HCT138PW,118 [NXP]

74HC(T)138 - 3-to-8 line decoder/demultiplexer; inverting TSSOP 16-Pin;
74HCT138PW,118
型号: 74HCT138PW,118
厂家: NXP    NXP
描述:

74HC(T)138 - 3-to-8 line decoder/demultiplexer; inverting TSSOP 16-Pin

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74HC138; 74HCT138  
3-to-8 line decoder/demultiplexer; inverting  
Rev. 4 — 27 June 2012  
Product data sheet  
1. General description  
The 74HC138; 74HCT138 is a high-speed Si-gate CMOS device and is pin compatible  
with Low-power Schottky TTL (LSTTL).  
The 74HC138; 74HCT138 decoder accepts three binary weighted address inputs (A0, A1  
and A3) and when enabled, provides 8 mutually exclusive active LOW outputs (Y0 to Y7).  
The 74HC138; 74HCT138 features three enable inputs: two active LOW (E1 and E2) and  
one active HIGH (E3). Every output is HIGH unless E1 and E2 are LOW and E3 is HIGH.  
This multiple enable function allows easy parallel expansion of the 74HC138; 74HCT138  
to a 1-of-32 (5 lines to 32 lines) decoder with just four 74HC138; 74HCT138 ICs and one  
inverter.  
The 74HC138; 74HCT138 can be used as an eight output demultiplexer by using one of  
the active LOW enable inputs as the data input and the remaining enable inputs as  
strobes. Permanently tie unused enable inputs to their appropriate active HIGH- or  
LOW-state.  
The 74HC138; 74HCT138 is identical to the 74HC238; 74HCT238 but has inverting  
outputs.  
2. Features and benefits  
Demultiplexing capability  
Multiple input enable for easy expansion  
Complies with JEDEC standard no. 7A  
Ideal for memory chip select decoding  
Active LOW mutually exclusive outputs  
ESD protection:  
HBM EIA/JESD22-A114F exceeds 2000 V  
MM EIA/JESD22-A115-A exceeds 200 V  
Multiple package options  
Specified from 40 °C to +85 °C and from 40 °C to +125 °C  
 
 
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74HC138N  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
DIP16  
plastic dual in-line package; 16 leads (300 mil)  
SOT38-4  
74HCT138N  
74HC138D  
SO16  
plastic small outline package; 16 leads;  
body width 3.9 mm  
SOT109-1  
SOT338-1  
SOT403-1  
74 HCT138D  
74HC138DB  
74HCT138DB  
74HC138PW  
74HCT138PW  
74HC138BQ  
74HCT138BQ  
SSOP16  
TSSOP16  
plastic shrink small outline package; 16 leads;  
body width 5.3 mm  
plastic thin shrink small outline package;  
16 leads; body width 4.4 mm  
DHVQFN16 plastic dual in-line compatible thermal enhanced SOT763-1  
very thin quad flat package; no leads;  
16 terminals; body 2.5 × 3.5 × 0.85 mm  
4. Functional diagram  
Y0  
Y1  
Y2  
15  
14  
13  
A0  
A1  
A2  
1
2
3
Y0  
A0  
A1  
A2  
15  
14  
13  
12  
11  
10  
9
1
2
3
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
Y3 12  
Y4 11  
Y5 10  
3-to-8  
DECODER  
ENABLE  
EXITING  
E1  
E2  
E3  
Y6  
Y7  
9
7
4
5
6
E1  
E2  
E3  
4
5
6
7
mna370  
mna372  
Fig 1. Logic symbol  
Fig 2. Functional diagram  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
2 of 19  
 
 
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
Y7  
Y6  
Y5  
Y4  
Y3  
Y2  
Y1  
A2  
A1  
A0  
E1  
E2  
E3  
Y0  
001aae059  
Fig 3. Logic diagram  
5. Pinning information  
5.1 Pinning  
74HC138BQ  
74HCT138BQ  
74HC138  
74HCT138  
terminal 1  
index area  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
A0  
A1  
V
CC  
2
3
4
5
6
7
15  
14  
13  
12  
11  
10  
A1  
A2  
E1  
E2  
E3  
Y7  
Y0  
Y1  
Y2  
Y3  
Y4  
Y5  
Y0  
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
A2  
E1  
(1)  
GND  
E2  
E3  
001aae060  
Y7  
Transparent top view  
GND  
(1) The die substrate is attached to this pad using  
conductive die attach material. It cannot be used as  
supply pin or input.  
001aae061  
Fig 4. Pin configuration DIP16, SO16, SSOP16 and  
TSSOP16  
Fig 5. Pin configuration DHVQFN16  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
3 of 19  
 
 
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
5.2 Pin description  
Table 2.  
Symbol  
A0, A1, A2  
E1, E2  
E3  
Pin description  
Pin  
1, 2, 3  
4, 5  
6
Description  
address input A0, A1, A2  
enable input E1, E2 (active LOW)  
enable input E3 (active HIGH)  
output Y0, Y1, Y2, Y3, Y4, Y5, Y6, Y7 (active LOW)  
ground (0 V)  
Y0, Y1, Y2, Y3, Y4, Y5, Y6, Y7 15, 14, 13, 12, 11, 10, 9, 7  
GND  
VCC  
8
16  
positive supply voltage  
6. Functional description  
Table 3.  
Function table[1]  
Control  
Input  
A2  
Output  
E1  
H
X
E2  
E3  
X
A1  
A0  
Y7  
Y6  
Y5  
Y4  
Y3  
Y2  
Y1  
Y0  
X
H
X
L
X
X
X
H
H
H
H
H
H
H
H
X
X
L
L
H
L
L
L
H
H
H
H
H
H
H
L
H
H
H
H
H
H
L
H
H
H
H
H
L
H
H
H
H
L
H
H
H
L
H
H
L
H
L
L
L
L
H
L
H
H
H
H
H
H
H
L
H
H
L
H
H
H
H
H
H
L
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
L
H
H
H
H
H
H
H
H
H
[1] H = HIGH voltage level;  
L = LOW voltage level;  
X = don’t care.  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
IIK  
Parameter  
Conditions  
Min  
Max  
+7  
Unit  
V
supply voltage  
0.5  
input clamping current  
output clamping current  
output current  
VI < 0.5 V or VI > VCC + 0.5 V  
VO < 0.5 V or VO > VCC + 0.5 V  
VO = 0.5 V to (VCC + 0.5 V)  
-
20  
mA  
mA  
mA  
mA  
mA  
°C  
IOK  
-
20  
IO  
-
25  
ICC  
quiescent supply current  
ground current  
-
50  
IGND  
Tstg  
-
50  
+150  
storage temperature  
65  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
4 of 19  
 
 
 
 
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
Table 4.  
Limiting values …continued  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
Ptot  
total power dissipation  
DIP16 package  
[1]  
[2]  
[3]  
[3]  
[4]  
-
-
-
-
-
750  
500  
500  
500  
500  
mW  
mW  
mW  
mW  
mW  
SO16 package  
SSOP16 package  
TSSOP16 package  
DHVQFN16 package  
[1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 °C.  
[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 °C.  
[3] For SSOP16 and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 °C.  
[4] For DHVQFN16 packages: Ptot derates linearly with 4.5 mW/K above 60 °C.  
8. Recommended operating conditions  
Table 5.  
Recommended operating conditions  
Voltages are referenced to GND (ground = 0 V)  
Symbol Parameter Conditions  
74HC138  
74HCT138  
Unit  
Min  
Typ  
Max  
6.0  
Min  
Typ  
Max  
VCC  
VI  
supply voltage  
2.0  
5.0  
4.5  
5.0  
5.5  
VCC  
VCC  
+125  
-
V
input voltage  
0
-
VCC  
VCC  
+125  
625  
139  
83  
0
-
V
VO  
output voltage  
0
-
0
-
V
Tamb  
Δt/ΔV  
ambient temperature  
input transition rise and fall rate VCC = 2.0 V  
VCC = 4.5 V  
40  
+25  
40  
+25  
°C  
-
-
-
-
-
-
-
-
ns/V  
ns/V  
ns/V  
1.67  
-
1.67  
-
139  
-
VCC = 6.0 V  
9. Static characteristics  
Table 6.  
Static characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
Tamb = 25 °C  
Min Typ Max  
Tamb = 40 °C to Tamb = 40 °C to Unit  
+85 °C +125 °C  
Min  
Max  
Min  
Max  
74HC138  
VIH  
HIGH-level  
input voltage  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
1.5  
1.2  
2.4  
3.2  
0.8  
-
-
1.5  
-
-
1.5  
-
-
V
V
V
V
V
V
3.15  
3.15  
3.15  
4.2  
-
4.2  
-
4.2  
-
VIL  
LOW-level  
input voltage  
-
-
-
0.5  
-
-
-
0.5  
1.35  
1.8  
-
-
-
0.5  
1.35  
1.8  
2.1 1.35  
2.8 1.8  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
5 of 19  
 
 
 
 
 
 
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
Table 6.  
Static characteristics …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
Tamb = 25 °C  
Min Typ Max  
Tamb = 40 °C to Tamb = 40 °C to Unit  
+85 °C +125 °C  
Min  
Max  
Min  
Max  
VOH  
HIGH-level  
VI = VIH or VIL  
output voltage  
IO = 20 μA; VCC = 2.0 V  
IO = 20 μA; VCC = 4.5 V  
IO = 20 μA; VCC = 6.0 V  
1.9  
4.4  
5.9  
2.0  
4.5  
6.0  
-
-
-
-
-
1.9  
4.4  
-
-
-
-
-
1.9  
4.4  
5.9  
3.7  
5.2  
-
-
-
-
-
V
V
V
V
V
5.9  
IO = 4.0 mA; VCC = 4.5 V 3.98 4.32  
IO = 5.2 mA; VCC = 6.0 V 5.48 5.81  
VI = VIH or VIL  
3.84  
5.34  
VOL  
LOW-level  
output voltage  
IO = 20 μA; VCC = 2.0 V  
IO = 20 μA; VCC = 4.5 V  
IO = 20 μA; VCC = 6.0 V  
IO = 4.0 mA; VCC = 4.5 V  
IO = 5.2 mA; VCC = 6.0 V  
-
-
-
-
-
-
0
0
0
0.1  
0.1  
0.1  
-
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
-
0.1  
0.1  
0.1  
0.4  
0.4  
1.0  
V
V
0.1  
V
0.15 0.26  
0.16 0.26  
0.33  
0.33  
1.0  
V
V
II  
input leakage  
current  
VI = VCC or GND;  
VCC = 6.0 V  
-
0.1  
μA  
IOZ  
OFF-state  
per input pin; VI = VIH or VIL;  
-
-
0.5  
-
5.0  
-
10  
output current VO = VCC or GND;  
other inputs at VCC or GND;  
VCC = 6.0 V; IO = 0 A  
ICC  
CI  
supply current VI = VCC or GND; IO = 0 A;  
VCC = 6.0 V  
-
-
-
8.0  
-
-
80  
-
160  
μA  
input  
3.5  
pF  
capacitance  
74HCT138  
VIH  
HIGH-level  
input voltage  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
2.0  
-
1.6  
1.2  
-
2.0  
-
-
2.0  
-
-
V
V
VIL  
LOW-level  
0.8  
0.8  
0.8  
input voltage  
VOH  
HIGH-level  
output voltage  
VI = VIH or VIL; VCC = 4.5 V  
IO = 20 μA  
4.4  
4.5  
-
-
4.4  
-
-
4.4  
3.7  
-
-
V
V
IO = 4 mA  
3.98 4.32  
3.84  
VOL  
LOW-level  
output voltage  
VI = VIH or VIL; VCC = 4.5 V  
IO = 20 μA  
-
-
-
0
0.1  
-
-
-
0.1  
0.33  
1.0  
-
-
-
0.1  
0.4  
1.0  
V
IO = 4.0 mA  
0.15 0.26  
V
II  
input leakage  
current  
VI = VCC or GND;  
CC = 5.5 V  
-
0.1  
μA  
V
IOZ  
OFF-state  
per input pin; VI = VIH or VIL;  
-
-
0.5  
-
5.0  
-
10  
output current VO = VCC or GND;  
other inputs at VCC or GND;  
VCC = 5.5 V; IO = 0 A  
ICC  
supply current VI = VCC or GND; IO = 0 A;  
VCC = 5.5 V  
-
-
8.0  
-
80  
-
160  
μA  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
6 of 19  
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
Table 6.  
Static characteristics …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
Tamb = 25 °C  
Min Typ Max  
Tamb = 40 °C to Tamb = 40 °C to Unit  
+85 °C +125 °C  
Min  
Max  
Min  
Max  
ΔICC  
additional  
VI = VCC 2.1 V;  
supply current other inputs at VCC or GND;  
VCC = 4.5 V to 5.5 V;  
IO = 0 A  
per input pin; An inputs  
per input pin; En inputs  
per input pin; E3 input  
-
-
-
-
150  
125  
100  
3.5  
540  
450  
360  
-
-
-
-
675  
562.5  
450  
-
-
-
735  
μA  
612.5 μA  
490  
μA  
CI  
input  
pF  
capacitance  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 8.  
Symbol Parameter Conditions  
Tamb = 25 °C  
Min  
Tamb = 40 °C  
to +85 °C  
Tamb = 40 °C  
to +125 °C  
Unit  
Typ Max Min  
Max  
Min  
Max  
For type 74HC138  
[1]  
[1]  
[1]  
tpd  
propagation An to Yn; see Figure 6  
delay  
VCC = 2.0 V  
-
-
-
-
41  
15  
12  
12  
150  
30  
-
-
-
-
-
190  
38  
-
-
-
-
-
225  
45  
-
ns  
ns  
ns  
ns  
VCC = 4.5 V  
VCC = 5 V; CL = 15 pF  
VCC = 6.0 V  
26  
33  
38  
E3 to Yn; see Figure 6  
VCC = 2.0 V  
-
-
-
-
47  
17  
14  
14  
150  
20  
-
-
-
-
-
190  
38  
-
-
-
-
-
225  
45  
-
ns  
ns  
ns  
ns  
VCC = 4.5 V  
VCC = 5 V; CL = 15 pF  
VCC = 6.0 V  
26  
33  
38  
En to Yn; see Figure 7  
VCC = 2.0 V  
-
-
-
-
47  
17  
14  
14  
150  
20  
-
-
-
-
-
190  
38  
-
-
-
-
-
225  
45  
-
ns  
ns  
ns  
ns  
VCC = 4.5 V  
VCC = 5 V; CL = 15 pF  
VCC = 6.0 V  
26  
33  
38  
[2]  
tt  
transition  
time  
Yn; see Figure 6 and  
Figure 7  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
-
19  
7
75  
15  
13  
-
-
-
-
-
95  
19  
16  
-
-
-
-
-
110  
22  
19  
-
ns  
ns  
ns  
pF  
6
[3]  
CPD  
power  
CL = 50 pF; f = 1 MHz;  
VI = GND to VCC  
67  
dissipation  
capacitance  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
7 of 19  
 
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
Table 7.  
Dynamic characteristics …continued  
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 8.  
Symbol Parameter Conditions  
Tamb = 25 °C  
Min  
Tamb = 40 °C  
to +85 °C  
Tamb = 40 °C  
to +125 °C  
Unit  
Typ Max Min  
Max  
Min  
Max  
For type 74HCT138  
[1]  
[1]  
[1]  
tpd  
propagation An to Yn; see Figure 6  
delay  
VCC = 4.5 V  
-
-
20  
17  
35  
-
-
-
44  
-
-
-
53  
-
ns  
ns  
VCC = 5 V; CL = 15 pF  
E3 to Yn; see Figure 6  
VCC = 4.5 V  
-
-
18  
19  
40  
-
-
-
50  
-
-
-
60  
-
ns  
ns  
VCC = 5 V; CL = 15 pF  
En to Yn; see Figure 7  
VCC = 4.5 V  
-
-
19  
19  
40  
-
-
-
50  
-
-
-
60  
-
ns  
ns  
VCC = 5 V; CL = 15 pF  
[2]  
[3]  
tt  
transition  
time  
Yn; see Figure 6 and  
Figure 7  
VCC = 4.5 V  
-
-
7
15  
-
-
-
19  
-
-
-
22  
-
ns  
CPD  
power  
dissipation  
capacitance  
CL = 50 pF; f = 1 MHz;  
VI = GND to VCC  
67  
pF  
[1] tpd is the same as tPLH and tPHL  
.
[2] tt is the same as tTHL and tTLH  
.
[3] CPD is used to determine the dynamic power dissipation (PD in μW).  
PD = CPD × VCC2 × fi × N + (CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in V;  
N = number of inputs switching;  
(CL × VCC2 × fo) = sum of outputs.  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
8 of 19  
 
 
 
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
11. Waveforms  
V
CC  
An, E3  
input  
V
M
GND  
t
t
PLH  
PHL  
V
OH  
Yn  
output  
V
M
V
OL  
t
t
THL  
TLH  
mna373  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 6. Propagation delay input (An) and enable input (E3) to output (Yn) and transition time output (Yn)  
V
CC  
E1, E2  
input  
V
M
GND  
t
t
PLH  
PHL  
V
OH  
Yn  
output  
V
M
V
OL  
t
t
THL  
TLH  
mna374  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 7. Propagation delay enable input (En) to output (Yn) and transition time output (Yn)  
Table 8.  
Type  
Measurement points  
Input  
VM  
Output  
VM  
74HC138  
0.5VCC  
1.3 V  
0.5VCC  
1.3 V  
74HCT138  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
9 of 19  
 
 
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
t
W
V
I
90 %  
negative  
pulse  
V
V
V
M
M
10 %  
0 V  
t
t
r
f
t
t
f
r
V
I
90 %  
positive  
pulse  
V
M
M
10 %  
0 V  
t
W
V
CC  
V
CC  
V
V
O
I
R
L
S1  
G
open  
DUT  
R
T
C
L
001aad983  
Test data is given in Table 9.  
Definitions test circuit:  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.  
CL = Load capacitance including jig and probe capacitance.  
RL = Load resistance.  
S1 = Test selection switch.  
Fig 8. Load circuitry for measuring switching times  
Table 9.  
Type  
Test data  
Input  
Load  
S1 position  
tPHL, tPLH  
open  
VI  
tr, tf  
6 ns  
6 ns  
CL  
RL  
tPZH, tPHZ  
GND  
tPZL, tPLZ  
VCC  
74HC138  
VCC  
3 V  
15 pF, 50 pF  
15 pF, 50 pF  
1 kΩ  
1 kΩ  
74HCT138  
open  
GND  
VCC  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
10 of 19  
 
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
12. Package outline  
DIP16: plastic dual in-line package; 16 leads (300 mil)  
SOT38-4  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
b
2
16  
9
M
H
pin 1 index  
E
1
8
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
2
(1)  
(1)  
Z
1
w
UNIT  
mm  
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.  
min.  
max.  
max.  
1.73  
1.30  
0.53  
0.38  
1.25  
0.85  
0.36  
0.23  
19.50  
18.55  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.1  
7.62  
0.3  
0.254  
0.01  
0.76  
0.068 0.021 0.049 0.014  
0.051 0.015 0.033 0.009  
0.77  
0.73  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.02  
0.13  
0.03  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
95-01-14  
03-02-13  
SOT38-4  
Fig 9. Package outline SOT38-4 (DIP16)  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
11 of 19  
 
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
SO16: plastic small outline package; 16 leads; body width 3.9 mm  
SOT109-1  
D
E
A
X
v
c
y
H
M
A
E
Z
16  
9
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
8
e
w
M
detail X  
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
10.0  
9.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.05  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.39  
0.014 0.0075 0.38  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.020  
0.028  
0.012  
inches  
0.069  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT109-1  
076E07  
MS-012  
Fig 10. Package outline SOT109-1 (SO16)  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
12 of 19  
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm  
SOT403-1  
D
E
A
X
c
y
H
v
M
A
E
Z
9
16  
Q
(A )  
3
A
2
A
A
1
pin 1 index  
θ
L
p
L
1
8
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
5.1  
4.9  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.40  
0.06  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT403-1  
MO-153  
Fig 11. Package outline SOT403-1 (TSSOP16)  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
13 of 19  
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm  
SOT338-1  
D
E
A
X
c
y
H
v
M
A
E
Z
9
16  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
8
1
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.  
8o  
0o  
0.21  
0.05  
1.80  
1.65  
0.38  
0.25  
0.20  
0.09  
6.4  
6.0  
5.4  
5.2  
7.9  
7.6  
1.03  
0.63  
0.9  
0.7  
1.00  
0.55  
mm  
2
0.25  
0.65  
1.25  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT338-1  
MO-150  
Fig 12. Package outline SOT338-1 (SSOP16)  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
14 of 19  
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;  
16 terminals; body 2.5 x 3.5 x 0.85 mm  
SOT763-1  
B
A
D
A
A
1
E
c
detail X  
terminal 1  
index area  
C
terminal 1  
index area  
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
7
L
1
8
9
E
h
e
16  
15  
10  
D
h
X
0
2.5  
scale  
5 mm  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
(1)  
(1)  
UNIT  
A
b
c
E
e
e
y
D
D
E
L
v
w
y
1
1
h
1
h
max.  
0.05 0.30  
0.00 0.18  
3.6  
3.4  
2.15  
1.85  
2.6  
2.4  
1.15  
0.85  
0.5  
0.3  
mm  
0.05  
0.1  
1
0.2  
0.5  
2.5  
0.1  
0.05  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-10-17  
03-01-27  
SOT763-1  
- - -  
MO-241  
- - -  
Fig 13. Package outline SOT763-1 (DHVQFN16)  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
15 of 19  
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
13. Abbreviations  
Table 10. Abbreviations  
Acronym  
CMOS  
DUT  
Description  
Complementary Metal Oxide Semiconductor  
Device Under Test  
ESD  
ElectroStatic Discharge  
HBM  
Human Body Model  
LSTTL  
MM  
Low-power Schottky Transistor-Transistor Logic  
Machine Model  
14. Revision history  
Table 11. Revision history  
Document ID  
Release date Data sheet status Change notice Doc. number Supersedes  
74HC_HCT138 v.4  
Modifications:  
20120627  
Product data sheet  
-
-
74HC_HCT138 v.3  
The format of this data sheet has been redesigned to comply with  
the new identity guidelines of NXP Semiconductors.  
Legal texts have been adapted to the new company name where  
appropriate.  
SOT38-1 changed to SOT38-4.  
74HC_HCT138 v.3  
Modifications:  
20051223  
Product data sheet  
-
-
74HC_HCT138_CNV v.2  
The format of this data sheet has been redesigned to comply with the new presentation and  
information standard of Philips Semiconductors.  
Section 3 “Ordering information”, Section 5 “Pinning information” and Section 12 “Package  
outline”: Added DHVQFN package information  
Section 9 “Static characteristics”: Added from the family specification  
74HC_HCT138_CNV v.2 19970827  
Product  
-
-
-
specification  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
16 of 19  
 
 
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
15.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
15.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
17 of 19  
 
 
 
 
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74HC_HCT138  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 27 June 2012  
18 of 19  
 
 
74HC138; 74HCT138  
NXP Semiconductors  
3-to-8 line decoder/demultiplexer; inverting  
17. Contents  
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
6
Functional description . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 5  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16  
7
8
9
10  
11  
12  
13  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 18  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2012.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 27 June 2012  
Document identifier: 74HC_HCT138  
 

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