74HCT138PW,118 [NXP]
74HC(T)138 - 3-to-8 line decoder/demultiplexer; inverting TSSOP 16-Pin;型号: | 74HCT138PW,118 |
厂家: | NXP |
描述: | 74HC(T)138 - 3-to-8 line decoder/demultiplexer; inverting TSSOP 16-Pin |
文件: | 总19页 (文件大小:148K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
74HC138; 74HCT138
3-to-8 line decoder/demultiplexer; inverting
Rev. 4 — 27 June 2012
Product data sheet
1. General description
The 74HC138; 74HCT138 is a high-speed Si-gate CMOS device and is pin compatible
with Low-power Schottky TTL (LSTTL).
The 74HC138; 74HCT138 decoder accepts three binary weighted address inputs (A0, A1
and A3) and when enabled, provides 8 mutually exclusive active LOW outputs (Y0 to Y7).
The 74HC138; 74HCT138 features three enable inputs: two active LOW (E1 and E2) and
one active HIGH (E3). Every output is HIGH unless E1 and E2 are LOW and E3 is HIGH.
This multiple enable function allows easy parallel expansion of the 74HC138; 74HCT138
to a 1-of-32 (5 lines to 32 lines) decoder with just four 74HC138; 74HCT138 ICs and one
inverter.
The 74HC138; 74HCT138 can be used as an eight output demultiplexer by using one of
the active LOW enable inputs as the data input and the remaining enable inputs as
strobes. Permanently tie unused enable inputs to their appropriate active HIGH- or
LOW-state.
The 74HC138; 74HCT138 is identical to the 74HC238; 74HCT238 but has inverting
outputs.
2. Features and benefits
Demultiplexing capability
Multiple input enable for easy expansion
Complies with JEDEC standard no. 7A
Ideal for memory chip select decoding
Active LOW mutually exclusive outputs
ESD protection:
HBM EIA/JESD22-A114F exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V
Multiple package options
Specified from −40 °C to +85 °C and from −40 °C to +125 °C
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74HC138N
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
74HCT138N
74HC138D
SO16
plastic small outline package; 16 leads;
body width 3.9 mm
SOT109-1
SOT338-1
SOT403-1
74 HCT138D
74HC138DB
74HCT138DB
74HC138PW
74HCT138PW
74HC138BQ
74HCT138BQ
SSOP16
TSSOP16
plastic shrink small outline package; 16 leads;
body width 5.3 mm
plastic thin shrink small outline package;
16 leads; body width 4.4 mm
DHVQFN16 plastic dual in-line compatible thermal enhanced SOT763-1
very thin quad flat package; no leads;
16 terminals; body 2.5 × 3.5 × 0.85 mm
4. Functional diagram
Y0
Y1
Y2
15
14
13
A0
A1
A2
1
2
3
Y0
A0
A1
A2
15
14
13
12
11
10
9
1
2
3
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y3 12
Y4 11
Y5 10
3-to-8
DECODER
ENABLE
EXITING
E1
E2
E3
Y6
Y7
9
7
4
5
6
E1
E2
E3
4
5
6
7
mna370
mna372
Fig 1. Logic symbol
Fig 2. Functional diagram
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
2 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
Y7
Y6
Y5
Y4
Y3
Y2
Y1
A2
A1
A0
E1
E2
E3
Y0
001aae059
Fig 3. Logic diagram
5. Pinning information
5.1 Pinning
74HC138BQ
74HCT138BQ
74HC138
74HCT138
terminal 1
index area
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A0
A1
V
CC
2
3
4
5
6
7
15
14
13
12
11
10
A1
A2
E1
E2
E3
Y7
Y0
Y1
Y2
Y3
Y4
Y5
Y0
Y1
Y2
Y3
Y4
Y5
Y6
A2
E1
(1)
GND
E2
E3
001aae060
Y7
Transparent top view
GND
(1) The die substrate is attached to this pad using
conductive die attach material. It cannot be used as
supply pin or input.
001aae061
Fig 4. Pin configuration DIP16, SO16, SSOP16 and
TSSOP16
Fig 5. Pin configuration DHVQFN16
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
3 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
5.2 Pin description
Table 2.
Symbol
A0, A1, A2
E1, E2
E3
Pin description
Pin
1, 2, 3
4, 5
6
Description
address input A0, A1, A2
enable input E1, E2 (active LOW)
enable input E3 (active HIGH)
output Y0, Y1, Y2, Y3, Y4, Y5, Y6, Y7 (active LOW)
ground (0 V)
Y0, Y1, Y2, Y3, Y4, Y5, Y6, Y7 15, 14, 13, 12, 11, 10, 9, 7
GND
VCC
8
16
positive supply voltage
6. Functional description
Table 3.
Function table[1]
Control
Input
A2
Output
E1
H
X
E2
E3
X
A1
A0
Y7
Y6
Y5
Y4
Y3
Y2
Y1
Y0
X
H
X
L
X
X
X
H
H
H
H
H
H
H
H
X
X
L
L
H
L
L
L
H
H
H
H
H
H
H
L
H
H
H
H
H
H
L
H
H
H
H
H
L
H
H
H
H
L
H
H
H
L
H
H
L
H
L
L
L
L
H
L
H
H
H
H
H
H
H
L
H
H
L
H
H
H
H
H
H
L
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
L
H
H
H
H
H
H
H
H
H
[1] H = HIGH voltage level;
L = LOW voltage level;
X = don’t care.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC
IIK
Parameter
Conditions
Min
Max
+7
Unit
V
supply voltage
−0.5
input clamping current
output clamping current
output current
VI < −0.5 V or VI > VCC + 0.5 V
VO < −0.5 V or VO > VCC + 0.5 V
VO = −0.5 V to (VCC + 0.5 V)
-
20
mA
mA
mA
mA
mA
°C
IOK
-
20
IO
-
25
ICC
quiescent supply current
ground current
-
50
IGND
Tstg
-
−50
+150
storage temperature
−65
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
4 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
Table 4.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Max
Unit
Ptot
total power dissipation
DIP16 package
[1]
[2]
[3]
[3]
[4]
-
-
-
-
-
750
500
500
500
500
mW
mW
mW
mW
mW
SO16 package
SSOP16 package
TSSOP16 package
DHVQFN16 package
[1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 °C.
[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 °C.
[3] For SSOP16 and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 °C.
[4] For DHVQFN16 packages: Ptot derates linearly with 4.5 mW/K above 60 °C.
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter Conditions
74HC138
74HCT138
Unit
Min
Typ
Max
6.0
Min
Typ
Max
VCC
VI
supply voltage
2.0
5.0
4.5
5.0
5.5
VCC
VCC
+125
-
V
input voltage
0
-
VCC
VCC
+125
625
139
83
0
-
V
VO
output voltage
0
-
0
-
V
Tamb
Δt/ΔV
ambient temperature
input transition rise and fall rate VCC = 2.0 V
VCC = 4.5 V
−40
+25
−40
+25
°C
-
-
-
-
-
-
-
-
ns/V
ns/V
ns/V
1.67
-
1.67
-
139
-
VCC = 6.0 V
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Tamb = 25 °C
Min Typ Max
Tamb = −40 °C to Tamb = −40 °C to Unit
+85 °C +125 °C
Min
Max
Min
Max
74HC138
VIH
HIGH-level
input voltage
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
1.5
1.2
2.4
3.2
0.8
-
-
1.5
-
-
1.5
-
-
V
V
V
V
V
V
3.15
3.15
3.15
4.2
-
4.2
-
4.2
-
VIL
LOW-level
input voltage
-
-
-
0.5
-
-
-
0.5
1.35
1.8
-
-
-
0.5
1.35
1.8
2.1 1.35
2.8 1.8
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
5 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Tamb = 25 °C
Min Typ Max
Tamb = −40 °C to Tamb = −40 °C to Unit
+85 °C +125 °C
Min
Max
Min
Max
VOH
HIGH-level
VI = VIH or VIL
output voltage
IO = −20 μA; VCC = 2.0 V
IO = −20 μA; VCC = 4.5 V
IO = −20 μA; VCC = 6.0 V
1.9
4.4
5.9
2.0
4.5
6.0
-
-
-
-
-
1.9
4.4
-
-
-
-
-
1.9
4.4
5.9
3.7
5.2
-
-
-
-
-
V
V
V
V
V
5.9
IO = −4.0 mA; VCC = 4.5 V 3.98 4.32
IO = −5.2 mA; VCC = 6.0 V 5.48 5.81
VI = VIH or VIL
3.84
5.34
VOL
LOW-level
output voltage
IO = 20 μA; VCC = 2.0 V
IO = 20 μA; VCC = 4.5 V
IO = 20 μA; VCC = 6.0 V
IO = 4.0 mA; VCC = 4.5 V
IO = 5.2 mA; VCC = 6.0 V
-
-
-
-
-
-
0
0
0
0.1
0.1
0.1
-
-
-
-
-
-
0.1
0.1
-
-
-
-
-
-
0.1
0.1
0.1
0.4
0.4
1.0
V
V
0.1
V
0.15 0.26
0.16 0.26
0.33
0.33
1.0
V
V
II
input leakage
current
VI = VCC or GND;
VCC = 6.0 V
-
0.1
μA
IOZ
OFF-state
per input pin; VI = VIH or VIL;
-
-
0.5
-
5.0
-
10
output current VO = VCC or GND;
other inputs at VCC or GND;
VCC = 6.0 V; IO = 0 A
ICC
CI
supply current VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
-
8.0
-
-
80
-
160
μA
input
3.5
pF
capacitance
74HCT138
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
VCC = 4.5 V to 5.5 V
2.0
-
1.6
1.2
-
2.0
-
-
2.0
-
-
V
V
VIL
LOW-level
0.8
0.8
0.8
input voltage
VOH
HIGH-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = −20 μA
4.4
4.5
-
-
4.4
-
-
4.4
3.7
-
-
V
V
IO = −4 mA
3.98 4.32
3.84
VOL
LOW-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 20 μA
-
-
-
0
0.1
-
-
-
0.1
0.33
1.0
-
-
-
0.1
0.4
1.0
V
IO = 4.0 mA
0.15 0.26
V
II
input leakage
current
VI = VCC or GND;
CC = 5.5 V
-
0.1
μA
V
IOZ
OFF-state
per input pin; VI = VIH or VIL;
-
-
0.5
-
5.0
-
10
output current VO = VCC or GND;
other inputs at VCC or GND;
VCC = 5.5 V; IO = 0 A
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
8.0
-
80
-
160
μA
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
6 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Tamb = 25 °C
Min Typ Max
Tamb = −40 °C to Tamb = −40 °C to Unit
+85 °C +125 °C
Min
Max
Min
Max
ΔICC
additional
VI = VCC − 2.1 V;
supply current other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V;
IO = 0 A
per input pin; An inputs
per input pin; En inputs
per input pin; E3 input
-
-
-
-
150
125
100
3.5
540
450
360
-
-
-
-
675
562.5
450
-
-
-
735
μA
612.5 μA
490
μA
CI
input
pF
capacitance
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 8.
Symbol Parameter Conditions
Tamb = 25 °C
Min
Tamb = −40 °C
to +85 °C
Tamb = −40 °C
to +125 °C
Unit
Typ Max Min
Max
Min
Max
For type 74HC138
[1]
[1]
[1]
tpd
propagation An to Yn; see Figure 6
delay
VCC = 2.0 V
-
-
-
-
41
15
12
12
150
30
-
-
-
-
-
190
38
-
-
-
-
-
225
45
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
26
33
38
E3 to Yn; see Figure 6
VCC = 2.0 V
-
-
-
-
47
17
14
14
150
20
-
-
-
-
-
190
38
-
-
-
-
-
225
45
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
26
33
38
En to Yn; see Figure 7
VCC = 2.0 V
-
-
-
-
47
17
14
14
150
20
-
-
-
-
-
190
38
-
-
-
-
-
225
45
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
26
33
38
[2]
tt
transition
time
Yn; see Figure 6 and
Figure 7
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
-
-
-
-
19
7
75
15
13
-
-
-
-
-
95
19
16
-
-
-
-
-
110
22
19
-
ns
ns
ns
pF
6
[3]
CPD
power
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
67
dissipation
capacitance
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
7 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 8.
Symbol Parameter Conditions
Tamb = 25 °C
Min
Tamb = −40 °C
to +85 °C
Tamb = −40 °C
to +125 °C
Unit
Typ Max Min
Max
Min
Max
For type 74HCT138
[1]
[1]
[1]
tpd
propagation An to Yn; see Figure 6
delay
VCC = 4.5 V
-
-
20
17
35
-
-
-
44
-
-
-
53
-
ns
ns
VCC = 5 V; CL = 15 pF
E3 to Yn; see Figure 6
VCC = 4.5 V
-
-
18
19
40
-
-
-
50
-
-
-
60
-
ns
ns
VCC = 5 V; CL = 15 pF
En to Yn; see Figure 7
VCC = 4.5 V
-
-
19
19
40
-
-
-
50
-
-
-
60
-
ns
ns
VCC = 5 V; CL = 15 pF
[2]
[3]
tt
transition
time
Yn; see Figure 6 and
Figure 7
VCC = 4.5 V
-
-
7
15
-
-
-
19
-
-
-
22
-
ns
CPD
power
dissipation
capacitance
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
67
pF
[1] tpd is the same as tPLH and tPHL
.
[2] tt is the same as tTHL and tTLH
.
[3] CPD is used to determine the dynamic power dissipation (PD in μW).
PD = CPD × VCC2 × fi × N + (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL × VCC2 × fo) = sum of outputs.
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
8 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
11. Waveforms
V
CC
An, E3
input
V
M
GND
t
t
PLH
PHL
V
OH
Yn
output
V
M
V
OL
t
t
THL
TLH
mna373
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6. Propagation delay input (An) and enable input (E3) to output (Yn) and transition time output (Yn)
V
CC
E1, E2
input
V
M
GND
t
t
PLH
PHL
V
OH
Yn
output
V
M
V
OL
t
t
THL
TLH
mna374
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7. Propagation delay enable input (En) to output (Yn) and transition time output (Yn)
Table 8.
Type
Measurement points
Input
VM
Output
VM
74HC138
0.5VCC
1.3 V
0.5VCC
1.3 V
74HCT138
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
9 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
0 V
t
W
V
CC
V
CC
V
V
O
I
R
L
S1
G
open
DUT
R
T
C
L
001aad983
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch.
Fig 8. Load circuitry for measuring switching times
Table 9.
Type
Test data
Input
Load
S1 position
tPHL, tPLH
open
VI
tr, tf
6 ns
6 ns
CL
RL
tPZH, tPHZ
GND
tPZL, tPLZ
VCC
74HC138
VCC
3 V
15 pF, 50 pF
15 pF, 50 pF
1 kΩ
1 kΩ
74HCT138
open
GND
VCC
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
10 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
12. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
0.76
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
95-01-14
03-02-13
SOT38-4
Fig 9. Package outline SOT38-4 (DIP16)
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
11 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
v
c
y
H
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT109-1
076E07
MS-012
Fig 10. Package outline SOT109-1 (SO16)
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
12 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
8
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.40
0.06
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT403-1
MO-153
Fig 11. Package outline SOT403-1 (TSSOP16)
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
13 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
8
1
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.00
0.55
mm
2
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT338-1
MO-150
Fig 12. Package outline SOT338-1 (SSOP16)
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
14 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
16 terminals; body 2.5 x 3.5 x 0.85 mm
SOT763-1
B
A
D
A
A
1
E
c
detail X
terminal 1
index area
C
terminal 1
index area
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
7
L
1
8
9
E
h
e
16
15
10
D
h
X
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
y
D
D
E
L
v
w
y
1
1
h
1
h
max.
0.05 0.30
0.00 0.18
3.6
3.4
2.15
1.85
2.6
2.4
1.15
0.85
0.5
0.3
mm
0.05
0.1
1
0.2
0.5
2.5
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-10-17
03-01-27
SOT763-1
- - -
MO-241
- - -
Fig 13. Package outline SOT763-1 (DHVQFN16)
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
15 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
13. Abbreviations
Table 10. Abbreviations
Acronym
CMOS
DUT
Description
Complementary Metal Oxide Semiconductor
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
LSTTL
MM
Low-power Schottky Transistor-Transistor Logic
Machine Model
14. Revision history
Table 11. Revision history
Document ID
Release date Data sheet status Change notice Doc. number Supersedes
74HC_HCT138 v.4
Modifications:
20120627
Product data sheet
-
-
74HC_HCT138 v.3
• The format of this data sheet has been redesigned to comply with
the new identity guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where
appropriate.
• SOT38-1 changed to SOT38-4.
74HC_HCT138 v.3
Modifications:
20051223
Product data sheet
-
-
74HC_HCT138_CNV v.2
• The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
• Section 3 “Ordering information”, Section 5 “Pinning information” and Section 12 “Package
outline”: Added DHVQFN package information
• Section 9 “Static characteristics”: Added from the family specification
74HC_HCT138_CNV v.2 19970827
Product
-
-
-
specification
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
16 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
15.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
17 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74HC_HCT138
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 June 2012
18 of 19
74HC138; 74HCT138
NXP Semiconductors
3-to-8 line decoder/demultiplexer; inverting
17. Contents
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
6
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
7
8
9
10
11
12
13
14
15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
15.1
15.2
15.3
15.4
16
17
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 June 2012
Document identifier: 74HC_HCT138
相关型号:
74HCT138PW-T
IC HCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO16, 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16, Decoder/Driver
NXP
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