74HCT1G14GV-Q100H [NXP]

74HC(T)1G14-Q100 - Inverting Schmitt trigger TSOP 5-Pin;


型号：	74HCT1G14GV-Q100H
厂家：	NXP
描述：	74HC(T)1G14-Q100 - Inverting Schmitt trigger TSOP 5-Pin
文件：	总16页 (文件大小：137K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

74HC1G14-Q100; 74HCT1G14-Q100

Inverting Schmitt trigger

Rev. 2 — 27 December 2012

Product data sheet

1. General description

74HC1G14-Q100 and 74HCT1G14-Q100 are high-speed Si-gate CMOS devices. They

provide an inverting buffer function with Schmitt trigger action. These devices are capable

of transforming slowly changing input signals into sharply defined, jitter-free output

signals.

The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V.

The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.

The standard output currents are half of those of the 74HC14-Q100 and 74HCT14-Q100.

This product has been qualified to the Automotive Electronics Council (AEC) standard

Q100 (Grade 1) and is suitable for use in automotive applications.

2. Features and benefits

 Automotive product qualification in accordance with AEC-Q100 (Grade 1)

 Specified from 40 C to +85 C and from 40 C to +125 C

 Input levels:

 For 74HC1G14-Q100: CMOS level

 For 74HCT1G14-Q100: TTL level

 Symmetrical output impedance

 High noise immunity

 Low power dissipation

 Balanced propagation delays

 ESD protection:

 MIL-STD-883, method 3015 exceeds 2000 V

 HBM JESD22-A114F exceeds 2000 V

 MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )

 SOT353-1 and SOT753 package options

3. Applications

 Wave and pulse shapers

 Astable multivibrators

 Monostable multivibrators

74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

4. Ordering information

Table 1.

Ordering information

Type number

Package

Temperature range Name

Description

Version

74HC1G14GW-Q100

74HCT1G14GW-Q100

74HC1G14GV-Q100

74HCT1G14GV-Q100

40 C to +125 C

TSSOP5

plastic thin shrink small outline package;

5 leads; body width 1.25 mm

SOT353-1

40 C to +125 C

SC-74A

plastic surface-mounted package; 5 leads

SOT753

5. Marking

Table 2.

Marking codes

Type number

Marking code^[1]

74HC1G14GW-Q100

74HCT1G14GW-Q100

74HC1G14GV-Q100

74HCT1G14GV-Q100

H14

T14

[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.

6. Functional diagram

mna023

mna024

mna025

Fig 1. Logic symbol

Fig 2. IEC logic symbol

Fig 3. Logic diagram

7. Pinning information

7.1 Pinning

ꢀꢁꢂꢃꢄꢅꢄꢁꢆꢇꢄꢈꢈ

ꢀꢁꢂꢃꢉꢄꢅꢄꢁꢆꢇꢄꢈꢈ

ꢊ

ꢋ

ꢌ

ꢍ

ꢀꢁꢂꢁ

ꢅ

ꢃ

ꢉ

ꢄꢄ

ꢎ

ꢆꢇꢈ

ꢀꢀꢀꢁꢂꢂꢃꢄꢅꢄ

Fig 4. Pin configuration

74HC_HCT1G14_Q100

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Product data sheet

Rev. 2 — 27 December 2012

2 of 16

74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

7.2 Pin description

Table 3.

Symbol

n.c.

Pin description

Description

not connected

data input

GND

ground (0 V)

data output

V_CC

supply voltage

8. Functional description

Table 4.

Function table

H = HIGH voltage level; L = LOW voltage level

Input

Output

9. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ^[1]

Symbol

V_CC

I_IK

Parameter

Conditions

Min

Max

+7.0

20

12.5

Unit

supply voltage

0.5

input clamping current

output clamping current

output current

V_I< 0.5 V or V_I> V_CC+ 0.5 V

V_O< 0.5 V or V_O> V_CC+ 0.5 V

0.5 V < V_O< V_CC+ 0.5 V

C

I_OK

I_O

I_CC

supply current

I_GND

T_stg

P_tot

ground current

25

65

storage temperature

total power dissipation

+150

200

[2]

T_amb= 40 C to +125 C

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

[2] Above 55 C, the value of P_totderates linearly with 2.5 mW/K.

10. Recommended operating conditions

Table 6.

Recommended operating conditions

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions

74HC1G14-Q100

74HCT1G14-Q100

Unit

Min

2.0

Typ

Max

6.0

Min

4.5

Typ

Max

5.5

V_CC

supply voltage

5.0

74HC_HCT1G14_Q100

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Product data sheet

Rev. 2 — 27 December 2012

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74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

Table 6.

Recommended operating conditions …continued

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions

74HC1G14-Q100

74HCT1G14-Q100

Unit

Min

Typ

Max

Min

Typ

Max

V_I

input voltage

V_CC

V_O

output voltage

T_amb

ambient temperature

40

+25

+125

40

+25

+125 C

11. Static characteristics

Table 7.

Static characteristics

Voltages are referenced to GND (ground = 0 V). All typical values are measured at T_amb= 25 C.

Symbol

Parameter

Conditions

40 C to +85 C

40 C to +125 C Unit

Min

Typ

Max

Min

Max

For type 74HC1G14-Q100

V_OH

HIGH-level output

voltage

V_I= V_T+or V_T

I_O= 20 A; V_CC= 2.0 V

I_O= 20 A; V_CC= 4.5 V

I_O= 20 A; V_CC= 6.0 V

I_O= 2.0 mA; V_CC= 4.5 V

I_O= 2.6 mA; V_CC= 6.0 V

V_I= V_T+or V_T

1.9

4.4

2.0

4.5

1.9

4.4

5.9

3.7

5.2

5.9

6.0

4.13

5.63

4.32

5.81

V_OL

LOW-level output

voltage

I_O= 20 A; V_CC= 2.0 V

I_O= 20 A; V_CC= 4.5 V

I_O= 20 A; V_CC= 6.0 V

I_O= 2.0 mA; V_CC= 4.5 V

I_O= 2.6 mA; V_CC= 6.0 V

0.1

0.4

1.0

0.15

0.16

0.1

0.33

1.0

I_I

input leakage current V_I= V_CCor GND; V_CC= 6.0 V

A

I_CC

supply current

V_I= V_CCor GND; I_O= 0 A;

V_CC= 6.0 V

C_I

input capacitance

1.5

V_T+

positive-going

threshold voltage

see Figure 7 and 8

V_CC= 2.0 V

0.7

1.7

2.1

1.09

2.36

3.12

1.5

3.15

4.2

0.7

1.7

2.1

1.5

3.15

4.2

V_CC= 4.5 V

V_CC= 6.0 V

V_T

negative-going

threshold voltage

see Figure 7 and 8

V_CC= 2.0 V

0.3

0.9

1.2

0.60

1.53

2.08

0.9

2.0

2.6

0.3

0.9

1.2

0.9

2.0

2.6

V_CC= 4.5 V

V_CC= 6.0 V

V_H

hysteresis voltage

see Figure 7 and 8

V_CC= 2.0 V

0.2

0.4

0.6

0.48

0.83

1.04

1.0

1.4

1.6

0.2

0.4

0.6

1.0

1.4

1.6

V_CC= 4.5 V

V_CC= 6.0 V

74HC_HCT1G14_Q100

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Product data sheet

Rev. 2 — 27 December 2012

4 of 16

74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

Table 7.

Static characteristics …continued

Voltages are referenced to GND (ground = 0 V). All typical values are measured at T_amb= 25 C.

Symbol

Parameter

Conditions

40 C to +85 C

40 C to +125 C Unit

Min

Typ

Max

Min

Max

For type 74HCT1G14-Q100

V_OH

HIGH-level output

voltage

V_I= V_T+or V_T

I_O= 20 A; V_CC= 4.5 V

I_O= 2.0 mA; V_CC= 4.5 V

V_I= V_T+or V_T

4.4

4.5

4.4

3.7

4.13

4.32

V_OL

LOW-level output

voltage

I_O= 20 A; V_CC= 4.5 V

I_O= 2.0 mA; V_CC= 4.5 V

0.1

0.33

1.0

0.1

0.4

1.0

0.15

I_I

input leakage current V_I= V_CCor GND; V_CC= 5.5 V

A

I_CC

supply current

V_I= V_CCor GND; I_O= 0 A;

V_CC= 5.5 V

I_CC

additional supply

current

per input; V_CC= 4.5 V to 5.5 V;

V_I= V_CC 2.1 V; I_O= 0 A

500

850

A

C_I

input capacitance

1.5

V_T+

positive-going

threshold voltage

see Figure 7 and 8

V_CC= 4.5 V

1.2

1.4

1.55

1.80

1.9

2.1

1.2

1.4

1.9

2.1

V_CC= 5.5 V

V_T

negative-going

threshold voltage

see Figure 7 and 8

V_CC= 4.5 V

0.5

0.6

0.76

0.90

1.2

1.4

0.5

0.6

1.2

1.4

V_CC= 5.5 V

V_H

hysteresis voltage

see Figure 7 and 8

V_CC= 4.5 V

0.4

0.80

0.90

0.4

V_CC= 5.5 V

12. Dynamic characteristics

Table 8.

Dynamic characteristics

GND = 0 V; t_r= t_f 6.0 ns; All typical values are measured at T_amb= 25 C. For test circuit see Figure 6

Symbol Parameter

Conditions

40 C to +85 C

40 C to +125 C Unit

Min

Typ

Max

Min

Max

For type 74HC1G14-Q100

[1]

t_pd

propagation delay A to Y; see Figure 5

V_CC= 2.0 V; C_L= 50 pF

155

190

V_CC= 4.5 V; C_L= 50 pF

V_CC= 5.0 V; C_L= 15 pF

V_CC= 6.0 V; C_L= 50 pF

[2]

C_PD

power dissipation V_I= GND to V_CC

capacitance

74HC_HCT1G14_Q100

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Product data sheet

Rev. 2 — 27 December 2012

5 of 16

74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

Table 8.

Dynamic characteristics …continued

GND = 0 V; t_r= t_f 6.0 ns; All typical values are measured at T_amb= 25 C. For test circuit see Figure 6

Symbol Parameter

Conditions

40 C to +85 C

40 C to +125 C Unit

Min

Typ

Max

Min

Max

For type 74HCT1G14-Q100

[1]

[2]

t_pd

propagation delay A to Y; see Figure 5

V_CC= 4.5 V; C_L= 50 pF

V_CC= 5.0 V; C_L= 15 pF

C_PD

power dissipation V_I= GND to V_CC 1.5 V

capacitance

[1] t_pdis the same as t_PLHand t_PHL

[2] _PDis used to determine the dynamic power dissipation P_D(W).

P_D= C_PD V_CC² f_i+  (C_L V_CC² f_o) where:

f_i= input frequency in MHz; f_o= output frequency in MHz

C_L= output load capacitance in pF; V_CC= supply voltage in Volts

 (C_L V_CC² f_o) = sum of outputs

13. Waveforms

A input

PHL

PLH

Y output

mna033

Measurement points are given in Table 9.

Fig 5. The input (A) to output (Y) propagation delays

Table 9. Measurement points

Type number

Input

Output

V_I

V_M

74HC1G14-Q100

74HCT1G14-Q100

GND to V_CC

GND to 3.0 V

0.5  V_CC

1.5 V

74HC_HCT1G14_Q100

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Product data sheet

Rev. 2 — 27 December 2012

6 of 16

74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

PULSE

GENERATOR

DUT

50 pF

mna034

Test data is given in Table 8. Definitions for test circuit:

C_L= Load capacitance including jig and probe capacitance.

R_T= Termination resistance should be equal to output impedance Z_oof the pulse generator.

Fig 6. Load circuitry for switching times

14. Transfer characteristics waveforms

T+

T−

mna027

T+

T−

mna026

Fig 7. Transfer characteristic

Fig 8. The definitions of V_T+, V_Tand V_H; where V_T+

and V_Tare between limits of 20 % and 70 %

mna029

mna028

1.0

100

(mA)

(μA)

0.8

0.6

0.4

0.2

2.5

5.0

1.0

2.0

V (V)

Fig 9. Typical 74HC1G14-Q100 transfer

characteristics; V_CC= 2.0 V

Fig 10. Typical 74HC1G14-Q100 transfer

characteristics; V_CC= 4.5 V

74HC_HCT1G14_Q100

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Product data sheet

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7 of 16

74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

mna030

1.6

(mA)

0.8

3.0

6.0

V (V)

Fig 11. Typical 74HC1G14-Q100 transfer characteristics; V_CC= 6.0 V

mna031

mna032

2.0

3.0

(mA)

2.0

1.0

2.5

5.0

3.0

6.0

V (V)

Fig 12. Typical 74HCT1G14-Q100 transfer

characteristics; V_CC= 4.5 V

Fig 13. Typical 74HCT1G14-Q100 transfer

characteristics; V_CC= 5.5 V

15. Application information

The slow input rise and fall times cause additional power dissipation. The additional power

dissipation can be calculated using the following formula:

P_add= f_i (t_r I_CC(AV)+ t_f I_CC(AV))  V_CC

Where:

P_add= additional power dissipation (W)

f_i= input frequency (MHz)

t_r= rise time (ns); 10 % to 90 %

74HC_HCT1G14_Q100

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Product data sheet

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8 of 16

74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

t_f= fall time (ns); 90 % to 10 %

I_CC(AV)= average additional supply current (A)

I_CC(AV)differs with positive or negative input transitions, as shown in Figure 14 and 15.

74HC1G14-Q100 and 74HCT1G14-Q100 used in relaxation oscillator circuit,

see Figure 16.

Remark: All values given are typical unless otherwise specified.

mna058

mna036

200

ΔI

CC(AV)

(μA)

CC(AV)

(μA)

150

100

150

100

positive-going

edge

positive-going

edge

negative-going

edge

negative-going

edge

2.0

4.0

6.0

(V)

Fig 14. I_CC(AV)for 74HC1G14-Q100 devices; linear

change of V_Ibetween 0.1  V_CCto 0.9  V_CC

Fig 15. I_CC(AV)for 74HCT1G14-Q100 devices; linear

change of V_Ibetween 0.1  V_CCto 0.9  V_CC

74HC_HCT1G14_Q100

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Product data sheet

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9 of 16

74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

mna035

-- -----------------

For 74HC1G14-Q100 and 74HCT1G14-Q100: f =



K  RC

For K-factor, see Figure 17

Fig 16. Relaxation oscillator

ꢀꢀꢀꢁꢂꢂꢃꢄꢂꢆ

ꢀꢀꢀꢁꢂꢂꢃꢄꢇꢂ

ꢋꢁꢓ

ꢔ

ꢊꢁꢋ

ꢊꢁꢓ

ꢓꢁꢕ

ꢓꢁꢒ

ꢓꢁꢎ

ꢓꢁꢋ

ꢓ

ꢔ

ꢊꢁꢍ

ꢊꢁꢓ

ꢓꢁꢍ

ꢓ

ꢋ

ꢌ

ꢎ

ꢍ

ꢒ

ꢎꢁꢍ

ꢍꢁꢓ

ꢍꢁꢍ

ꢃ

ꢏꢐꢃꢑ

ꢄꢄ

ꢃ

ꢏꢐꢃꢑ

ꢄꢄ

K-factor for 74HC1G14-Q100

K-factor for 74HCT1G14-Q100

Fig 17. Typical K-factor for relaxation oscillator

74HC_HCT1G14_Q100

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Product data sheet

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74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

16. Package outline

TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm

SOT353-1

(A )

w M

detail X

1.5

3 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)

UNIT

max.

0.1

1.0

0.8

0.30

0.15

0.25

0.08

2.25

1.85

1.35

1.15

2.25

2.0

0.46

0.21

0.60

0.15

7°

0°

1.1

0.65

1.3

0.15

0.425

0.3

0.1

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

00-09-01

03-02-19

SOT353-1

MO-203

SC-88A

Fig 18. Package outline SOT353-1 (TSSOP5)

74HC_HCT1G14_Q100

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Product data sheet

Rev. 2 — 27 December 2012

11 of 16

74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

Plastic surface-mounted package; 5 leads

SOT753

detail X

M B

2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

0.100

0.013

0.40

0.25

1.1

0.9

0.26

0.10

3.1

2.7

1.7

1.3

3.0

2.5

0.6

0.2

0.33

0.23

0.95

0.2

0.1

REFERENCES

JEDEC JEITA

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

02-04-16

06-03-16

SOT753

SC-74A

Fig 19. Package outline SOT753 (SC-74A)

74HC_HCT1G14_Q100

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Product data sheet

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74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

17. Abbreviations

Table 10. Abbreviations

Acronym

DUT

Description

Device Under Test

Transistor-Transistor Logic

TTL

18. Revision history

Table 11. Revision history

Document ID

Release date

Data sheet status

Change notice Supersedes

- 74HC_HCT1G14_Q100 v.1

74HC_HCT1G14_Q100 v.2 20121227

Product data sheet

Modifications:

• Table 3: Pin number Y output changed from 5 to 4 (errata).

74HC_HCT1G14_Q100 v.1 20120820

Product data sheet

74HC_HCT1G14_Q100

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Product data sheet

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13 of 16

74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

19. Legal information

19.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use in automotive applications — This NXP

19.2 Definitions

Semiconductors product has been qualified for use in automotive

applications. Unless otherwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer's own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

19.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

74HC_HCT1G14_Q100

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 27 December 2012

14 of 16

74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

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No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

19.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

20. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

74HC_HCT1G14_Q100

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 27 December 2012

15 of 16

74HC1G14-Q100; 74HCT1G14-Q100

NXP Semiconductors

Inverting Schmitt trigger

21. Contents

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

7.1

7.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

Functional description . . . . . . . . . . . . . . . . . . . 3

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Recommended operating conditions. . . . . . . . 3

Static characteristics. . . . . . . . . . . . . . . . . . . . . 4

Dynamic characteristics . . . . . . . . . . . . . . . . . . 5

Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Transfer characteristics waveforms. . . . . . . . . 7

Application information. . . . . . . . . . . . . . . . . . . 8

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13

Legal information. . . . . . . . . . . . . . . . . . . . . . . 14

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

19.1

19.2

19.3

19.4

Contact information. . . . . . . . . . . . . . . . . . . . . 15

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 27 December 2012

Document identifier: 74HC_HCT1G14_Q100

74HCT1G14GV-Q100H [NXP]

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