74HCT257D,652 [NXP]

74HC(T)257 - Quad 2-input multiplexer; 3-state SOP 16-Pin;
74HCT257D,652
型号: 74HCT257D,652
厂家: NXP    NXP
描述:

74HC(T)257 - Quad 2-input multiplexer; 3-state SOP 16-Pin

光电二极管 逻辑集成电路
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74HC257; 74HCT257  
Quad 2-input multiplexer; 3-state  
Rev. 05 — 13 January 2010  
Product data sheet  
1. General description  
The 74HC257; 74HCT257 are high-speed Si-gate CMOS devices and are pin compatible  
with Low-power Schottky TTL (LSTTL).  
The 74HC257 and 74HCT257 have four identical 2-input multiplexers with 3-state outputs,  
which select 4 bits of data from two sources and are controlled by a common data select  
input (S).  
The data inputs from source 0 (1I0 to 4I0) are selected when input S is LOW and the data  
inputs from source 1 (1I1 to 4I1) are selected when S is HIGH. Data appears at the  
outputs (1Y to 4Y) in true (non-inverting) form from the selected inputs.  
The 74HC257 and 74HCT257 are the logic implementation of a 4-pole, 2-position switch,  
where the position of the switch is determined by the logic levels applied to S. The outputs  
are forced to a high-impedance OFF-state when OE is HIGH.  
The logic equations for the outputs are:  
1Y = OE • (1I1 S 1I0 S)  
2Y = OE • (2I1 S 2I0 S)  
3Y = OE • (3I1 S 3I0 S)  
4Y = OE • (4I1 S 4I0 S)  
Except for their non-inverting (true) outputs the 74HC257; 74HCT257 are identical to the  
74HC258.  
2. Features  
„ Non-inverting data path  
„ 3-state outputs interface directly with system bus  
„ Complies with JEDEC standard no. 7A  
„ ESD protection:  
‹ HBM JESD22-A114E exceeds 2000 V  
‹ MM JESD22-A115-A exceeds 200 V  
„ Multiple package options  
„ Specified from 40 °C to +85 °C and from 40 °C to +125 °C  
 
 
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
3. Ordering information  
Table 1.  
Type number Package  
Temperature range Name  
Ordering information  
Description  
plastic dual in-line package; 16 leads (300 mil)  
Version  
74HC257N  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
DIP16  
SOT38-4  
74HCT257N  
74HC257D  
SO16  
plastic small outline package; 16 leads; body width 3.9 mm SOT109-1  
74HCT257D  
74HC257DB  
74HCT257DB  
SSOP16  
plastic shrink small outline package; 16 leads;  
body width 5.3 mm  
SOT338-1  
SOT403-1  
74HC257PW 40 °C to +125 °C  
TSSOP16 plastic thin shrink small outline package; 16 leads;  
body width 4.4 mm  
74HCT257PW  
4. Functional diagram  
1
G1  
15  
EN  
1
S
2
1I0  
2
MUX  
1
1
4
7
1Y  
4
1I1  
3
5
3
2I0  
2I1  
5
6
2Y  
3Y  
4Y  
7
6
3I0  
3I1  
11  
10  
9
11  
10  
14  
13  
9
4I0  
4I1  
14  
13  
12  
12  
15  
OE  
mga835  
001aad467  
Fig 1. Logic symbol  
Fig 2. IEC logic symbol  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
2 of 17  
 
 
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
2
3
5
6
11 10  
3I0 3I1  
14 13  
4I0 4I1  
1I0 1I1  
2I0 2I1  
1
S
SELECTOR  
15 OE  
3-STATE MULTIPLEXER OUTPUTS  
1Y  
4
2Y  
7
3Y  
9
4Y  
12  
mgr280  
Fig 3. Functional diagram  
1I0  
1I1  
2I0  
2I1  
1Y  
2Y  
3Y  
4Y  
3I0  
3I1  
4I0  
4I1  
OE  
S
001aad468  
Fig 4. Logic diagram  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
3 of 17  
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
5. Pinning information  
5.1 Pinning  
74HC257  
74HCT257  
1
2
3
4
5
6
7
8
16 V  
CC  
S
1I0  
15  
14  
13  
12  
11  
10  
9
OE  
4I0  
4I1  
4Y  
1I1  
1Y  
2I0  
2I1  
3I0  
3I1  
3Y  
2Y  
GND  
001aad499  
Fig 5. Pin configuration DIP16, SO16, SSOP16 and TSSOP16  
5.2 Pin description  
Table 2.  
Symbol  
S
Pin description  
Pin  
Description  
1
common data select input  
data input from source 0  
data input from source 1  
3-state multiplexer output  
ground (0 V)  
1I0 to 4I0  
1I1 to 4I1  
1Y to 4Y  
GND  
2, 5, 11, 14  
3, 6, 10, 13  
4, 7, 9, 12  
8
OE  
15  
16  
3-state output enable input (active LOW)  
supply voltage  
VCC  
6. Functional description  
6.1 Function table  
Table 3.  
Function table[1]  
Control  
Input  
nl0  
X
Output  
OE  
H
L
S
X
H
H
L
nl1  
nY  
Z
X
L
X
L
L
X
H
X
X
H
L
L
L
L
L
H
H
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
4 of 17  
 
 
 
 
 
 
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
Parameter  
Conditions  
Min  
0.5  
-
Max  
+7  
Unit  
V
supply voltage  
IIK  
input clamping current  
VI < 0.5 V or  
±20  
mA  
VI > VCC + 0.5 V  
IOK  
output clamping current  
VO < 0.5 V or  
-
±20  
mA  
VO > VCC + 0.5 V  
IO  
output current  
VO = 0.5 V to VCC + 0.5 V  
-
±35  
+70  
70  
+150  
mA  
mA  
mA  
°C  
ICC  
IGND  
Tstg  
Ptot  
supply current  
-
ground current  
-
storage temperature  
total power dissipation  
DIP16 package  
65  
[1]  
[2]  
[3]  
[3]  
-
-
-
-
750  
500  
500  
500  
mW  
mW  
mW  
mW  
SO16 package  
SSOP16 package  
TSSOP16 package  
[1] For DIP16 packages: above 70 °C, Ptot derates linearly with 12 mW/K.  
[2] For SO16 packages: above 70 °C, Ptot derates linearly with 8 mW/K.  
[3] For SSOP16 and TSSOP16 packages: above 60 °C, Ptot derates linearly with 5.5 mW/K.  
8. Recommended operating conditions  
Table 5.  
Symbol  
Type 74HC257  
VCC  
Recommended operating conditions  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
supply voltage  
input voltage  
output voltage  
2.0  
5.0  
6.0  
V
VI  
0
-
VCC  
VCC  
625  
139  
83  
V
VO  
0
-
V
Δt/ΔV  
input transition rise and  
fall rates  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
ns  
ns  
ns  
°C  
-
1.67  
-
-
-
Tamb  
ambient temperature  
40  
+125  
Type 74HCT257  
VCC  
VI  
supply voltage  
4.5  
0
5.0  
5.5  
V
input voltage  
-
VCC  
VCC  
139  
V
VO  
output voltage  
0
-
V
Δt/ΔV  
input transition rise and  
fall rates  
VCC = 4.5 V  
-
1.67  
ns  
Tamb  
ambient temperature  
40  
-
+125  
°C  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
5 of 17  
 
 
 
 
 
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
9. Static characteristics  
Table 6.  
Static characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
25 °C  
40 °C to  
+85 °C  
40 °C to Unit  
+125 °C  
Min Typ Max Min Max Min Max  
74HC257  
VIH  
HIGH-level  
input voltage  
VCC = 2.0 V  
1.5  
1.2  
-
-
1.5  
-
-
1.5  
-
-
V
V
V
V
V
V
VCC = 4.5 V  
3.15 2.4  
3.15  
3.15  
VCC = 6.0 V  
4.2  
3.2  
0.8  
-
4.2  
-
4.2  
-
VIL  
LOW-level  
input voltage  
VCC = 2.0 V  
-
-
-
0.5  
-
-
-
0.5  
1.35  
1.8  
-
-
-
0.5  
1.35  
1.8  
VCC = 4.5 V  
2.1 1.35  
VCC = 6.0 V  
2.8  
1.8  
VOH  
HIGH-level  
VI = VIH or VIL  
output voltage  
IO = 20 μA; VCC = 2.0 V  
IO = 20 μA; VCC = 4.5 V  
IO = 20 μA; VCC = 6.0 V  
IO = 6.0 mA; VCC = 4.5 V  
IO = 7.8 mA; VCC = 6.0 V  
VI = VIH or VIL  
1.9  
4.4  
5.9  
2.0  
4.5  
6.0  
-
-
-
-
-
1.9  
4.4  
-
-
-
-
-
1.9  
4.4  
5.9  
3.7  
5.2  
-
-
-
-
-
V
V
V
V
V
5.9  
3.98 4.32  
5.48 5.81  
3.84  
5.34  
VOL  
LOW-level  
output voltage  
IO = 20 μA; VCC = 2.0 V  
IO = 20 μA; VCC = 4.5 V  
IO = 20 μA; VCC = 6.0 V  
IO = 6.0 mA; VCC = 4.5 V  
IO = 7.8 mA; VCC = 6.0 V  
-
-
-
-
-
-
-
0
0
0
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
0.1  
0.1  
0.1  
0.4  
0.4  
V
V
V
V
V
0.1  
0.15 0.26  
0.16 0.26  
0.33  
0.33  
II  
input leakage current VI = VCC or GND; VCC = 6.0 V  
-
-
±0.1  
±0.5  
±1.0 ±1.0 ±1.0 μA  
±5.0 ±10.0 ±10.0 μA  
IOZ  
OFF-state  
output current  
VI = VIH or VIL;  
VO = VCC or GND;  
VCC = 6.0 V  
ICC  
Ci  
supply current  
VI = VCC or GND; IO = 0 A;  
VCC = 6.0 V  
-
-
-
8.0  
-
-
80  
160  
160 μA  
input capacitance  
3.5  
pF  
74HCT257  
VIH  
HIGH-level  
input voltage  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
2.0  
-
1.6  
1.2  
-
2.0  
-
-
2.0  
-
-
V
V
VIL  
LOW-level  
0.8  
0.8  
0.8  
input voltage  
VOH  
HIGH-level  
output voltage  
VI = VIH or VIL; VCC = 4.5 V  
IO = 20 μA  
4.4  
4.5  
-
-
4.4  
-
4.4  
-
-
V
V
IO = 6 mA  
3.98 4.32  
3.84  
-
3.7  
VOL  
LOW-level  
output voltage  
VI = VIH or VIL; VCC = 4.5 V  
IO = 20 μA  
-
-
-
-
0.1  
0.33  
±1.0  
±5.0  
-
-
-
-
0.1  
0.4  
±1.0  
-
-
-
0
0.1  
V
V
IO = 6.0 mA  
0.15 0.26  
±0.1  
II  
input leakage current VI = VCC or GND; VCC = 5.5 V  
-
±10 μA  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
6 of 17  
 
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
Table 6.  
Static characteristics …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
25 °C  
40 °C to  
+85 °C  
40 °C to Unit  
+125 °C  
Min Typ Max Min Max Min Max  
IOZ  
OFF-state  
output current  
VI = VIH or VIL; VCC = 5.5 V;  
VO = VCC or GND per input  
pin; other inputs at VCC or  
GND; IO = 0 A  
-
-
±0.5  
-
80  
-
160 μA  
ICC  
supply current  
VI = VCC or GND; IO = 0 A;  
-
-
8.0  
μA  
VCC = 5.5 V  
ΔICC  
additional supply  
current  
VI = VCC 2.1 V;  
other inputs at VCC or GND;  
VCC = 4.5 V to 5.5 V; IO = 0 A  
per input pin; nI0, nI1 inputs  
per input pin; OE input  
per input pin; S input  
-
-
-
-
40  
144  
-
-
-
180  
608  
315  
-
-
-
196 μA  
662 μA  
343 μA  
pF  
135 486  
70  
252  
-
CI  
input capacitance  
3.5  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8.  
Symbol Parameter  
Conditions  
25 °C  
40 °C to 40 °C to Unit  
+85 °C  
+125 °C  
Typ  
Max  
Max  
Max  
74HC257  
[1]  
tpd  
propagation delay  
nl0 to nY or nl1 to nY;  
see Figure 6  
VCC = 2.0 V  
VCC = 4.5 V  
36  
13  
11  
10  
110  
22  
-
140  
28  
-
165  
33  
-
ns  
ns  
ns  
ns  
VCC = 5.0 V; CL = 15 pF  
VCC = 6.0 V  
19  
24  
28  
S to nY; see Figure 6  
VCC = 2.0 V  
47  
17  
14  
14  
150  
30  
-
190  
38  
-
225  
45  
-
ns  
ns  
ns  
ns  
VCC = 4.5 V  
VCC = 5.0 V; CL = 15 pF  
VCC = 6.0 V  
26  
33  
38  
[2]  
[3]  
ten  
enable time  
disable time  
OE to nY; see Figure 7  
VCC = 2.0 V  
33  
12  
10  
150  
30  
190  
38  
225  
45  
ns  
ns  
ns  
VCC = 4.5 V  
VCC = 6.0 V  
26  
33  
38  
tdis  
OE to nY; see Figure 7  
VCC = 2.0 V  
41  
15  
12  
150  
30  
190  
38  
225  
45  
ns  
ns  
ns  
VCC = 4.5 V  
VCC = 6.0 V  
26  
33  
38  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
7 of 17  
 
 
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
Table 7.  
Dynamic characteristics …continued  
Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8.  
Symbol Parameter  
Conditions  
25 °C  
40 °C to 40 °C to Unit  
+85 °C  
+125 °C  
Typ  
Max  
Max  
Max  
[4]  
tt  
transition time  
see Figure 6  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
14  
5
60  
12  
10  
-
75  
15  
13  
90  
18  
15  
ns  
ns  
ns  
pF  
4
[5]  
[1]  
CPD  
power dissipation  
capacitance  
per multiplexer;  
VI = GND to VCC  
45  
74HCT257  
tpd  
propagation delay  
nl0 to nY or nl1 to nY;  
see Figure 6  
VCC = 4.5 V  
16  
13  
30  
-
38  
-
45  
53  
ns  
ns  
VCC = 5.0 V; CL = 15 pF  
S to nY; see Figure 6  
VCC = 4.5 V  
20  
17  
15  
35  
-
44  
ns  
ns  
ns  
VCC = 5.0 V; CL = 15 pF  
[2]  
[3]  
ten  
enable time  
disable time  
transition time  
OE to nY; VCC = 4.5 V;  
see Figure 7  
30  
38  
38  
15  
45  
45  
18  
tdis  
OE to nY; VCC = 4.5 V;  
see Figure 7  
16  
30  
ns  
[4]  
[5]  
tt  
VCC = 4.5 V; see Figure 6  
5
12  
-
ns  
CPD  
power dissipation  
capacitance  
per multiplexer;  
VI = GND to VCC  
45  
pF  
[1] tpd is the same as tPHL, tPLH  
[2] ten is the same as tPZH, tPZL  
[3] tdis is the same as tPHZ, tPLZ  
[4] tt is the same as tTHL, tTLH  
.
.
.
.
[5] CPD is used to determine the dynamic power dissipation (PD in μW).  
PD = CPD × VCC2 × fi × N + (CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in V;  
N = number of inputs switching;  
(CL × VCC2 × fo) = sum of outputs.  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
8 of 17  
 
 
 
 
 
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
11. Waveforms  
V
I
input  
S, nI0, nI1  
V
V
M
M
GND  
t
t
PHL  
PLH  
V
OH  
90 %  
output  
nY  
V
V
M
M
10 %  
V
OL  
t
t
TLH  
THL  
001aad477  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 6. Propagation delays input (S, nI0, nI1) to output (nY) and output (nY) transition times  
t
t
r
f
V
I
90 %  
OE input  
output  
V
M
10 %  
GND  
t
t
PZL  
PLZ  
V
CC  
LOW-to-OFF  
OFF-to-LOW  
V
M
10 %  
V
OL  
t
t
PHZ  
PZH  
V
OH  
90 %  
output  
HIGH-to-OFF  
OFF-to-HIGH  
V
M
GND  
outputs  
enabled  
outputs  
enabled  
outputs  
disabled  
001aac479  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 7. 3-state output enable and disable times  
Table 8.  
Type  
Measurement points  
Input  
VM  
Output  
VM  
74HC257  
0.5VCC  
1.3 V  
0.5VCC  
1.3 V  
74HCT257  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
9 of 17  
 
 
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
t
W
V
I
90 %  
negative  
pulse  
V
V
V
V
M
M
10 %  
0 V  
t
t
r
f
t
r
t
f
V
I
90 %  
positive  
pulse  
M
M
10 %  
0 V  
t
W
V
V
CC  
CC  
V
V
O
I
R
S1  
L
G
open  
DUT  
R
C
L
T
001aad983  
Measurement points are given in Table 8 and test data is given in Table 9.  
Definitions test circuit:  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.  
CL = Load capacitance including jig and probe capacitance.  
RL = Load resistor.  
Fig 8. Test circuit for switching times  
Table 9.  
Type  
Test data  
Input  
VI  
Load  
CL  
Switch position  
tr, tf  
6 ns  
6 ns  
RL  
tPHL, tPLH  
open  
tPZH, tPHZ  
tPZL, tPLZ  
VCC  
74HC257  
VCC  
50 pF  
50 pF  
1 kΩ  
1 kΩ  
GND  
GND  
74HCT257  
3 V  
open  
VCC  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
10 of 17  
 
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
12. Package outline  
DIP16: plastic dual in-line package; 16 leads (300 mil)  
SOT38-4  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
b
2
16  
9
M
H
pin 1 index  
E
1
8
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
2
(1)  
(1)  
Z
1
w
UNIT  
mm  
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.  
min.  
max.  
max.  
1.73  
1.30  
0.53  
0.38  
1.25  
0.85  
0.36  
0.23  
19.50  
18.55  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.1  
7.62  
0.3  
0.254  
0.01  
0.76  
0.068 0.021 0.049 0.014  
0.051 0.015 0.033 0.009  
0.77  
0.73  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.02  
0.13  
0.03  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
95-01-14  
03-02-13  
SOT38-4  
Fig 9. Package outline SOT38-4 (DIP16)  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
11 of 17  
 
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
SO16: plastic small outline package; 16 leads; body width 3.9 mm  
SOT109-1  
D
E
A
X
v
c
y
H
M
A
E
Z
16  
9
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
8
e
w
M
detail X  
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
10.0  
9.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.05  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.39  
0.014 0.0075 0.38  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.020  
0.028  
0.012  
inches  
0.069  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT109-1  
076E07  
MS-012  
Fig 10. Package outline SOT109-1 (SO16)  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
12 of 17  
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm  
SOT338-1  
D
E
A
X
c
y
H
v
M
A
E
Z
9
16  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
8
1
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.  
8o  
0o  
0.21  
0.05  
1.80  
1.65  
0.38  
0.25  
0.20  
0.09  
6.4  
6.0  
5.4  
5.2  
7.9  
7.6  
1.03  
0.63  
0.9  
0.7  
1.00  
0.55  
mm  
2
0.25  
0.65  
1.25  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT338-1  
MO-150  
Fig 11. Package outline SOT338-1 (SSOP16)  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
13 of 17  
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm  
SOT403-1  
D
E
A
X
c
y
H
v
M
A
E
Z
9
16  
Q
(A )  
3
A
2
A
A
1
pin 1 index  
θ
L
p
L
1
8
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
5.1  
4.9  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.40  
0.06  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT403-1  
MO-153  
Fig 12. Package outline SOT403-1 (TSSOP16)  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
14 of 17  
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
13. Revision history  
Table 10. Revision history  
Document ID  
Release date  
20100113  
Data sheet status  
Change notice Supersedes  
74HC_HCT257_5  
Modifications:  
Product data sheet  
-
74HC_HCT257_4  
Table 7 “Dynamic characteristics”: changed 3OE to OE  
74HC_HCT257_4  
74HC_HCT257_3  
74HC_HCT257_CNV_2  
20090608  
20050920  
19980930  
Product data sheet  
Product data sheet  
Product specification  
-
-
-
74HC_HCT257_3  
74HC_HCT257_CNV_2  
-
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
15 of 17  
 
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
14. Legal information  
14.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
14.2 Definitions  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
14.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
14.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
15. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74HC_HCT257_5  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 05 — 13 January 2010  
16 of 17  
 
 
 
 
 
 
74HC257; 74HCT257  
NXP Semiconductors  
Quad 2-input multiplexer; 3-state  
16. Contents  
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
6
6.1  
7
Functional description . . . . . . . . . . . . . . . . . . . 4  
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Recommended operating conditions. . . . . . . . 5  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15  
8
9
10  
11  
12  
13  
14  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
14.1  
14.2  
14.3  
14.4  
15  
16  
Contact information. . . . . . . . . . . . . . . . . . . . . 16  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2010.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 13 January 2010  
Document identifier: 74HC_HCT257_5  
 

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