74HCT4851_技术文档

74HC4851; 74HCT4851

8-channel analog multiplexer/demultiplexer with

injection-current effect control

Rev. 02 — 2 September 2008

Product data sheet

1. General description

The 74HC4851; 74HCT4851 are high-speed Si-gate CMOS devices and are speciﬁed in

compliance with JEDEC standard no. 7A.

The 74HC4851; 74HCT4851 are 8-channel analog multiplexers/demultiplexers with three

digital select inputs (S0 to S2), an active-LOW enable input (E), eight independent

inputs/outputs (Y0 to Y7) and a common input/output (Z). The devices feature

injection-current effect control, which has excellent value in automotive applications where

voltages in excess of the supply voltage are common.

With E LOW, one of the eight switches is selected (low impedance ON-state) by S0 to S2.

With E HIGH, all switches are in the high-impedance OFF-state, independent of S0 to S2.

The injection-current effect control allows signals at disabled analog input channels to

exceed the supply voltage without affecting the signal of the enabled analog channel.

This eliminates the need for external diode/resistor networks typically used to keep the

analog channel signals within the supply-voltage range.

2. Features

I Injection-current cross coupling < 1 mV/mA

I Wide supply voltage range from 2.0 V to 6.0 V for 74HC4851

I ESD protection:

N HBM JESD22-A114E exceeds 2000 V

N CDM JESD22-C101C exceeds 1000 V

I Latch-up performance exceeds 100 mA per JESD 78 Class II level A

I Low ON-state resistance:

N 400 Ω (typical) at V_CC= 2.0 V

N 215 Ω (typical) at V_CC= 3.0 V

N 120 Ω (typical) at V_CC= 3.3 V

N 76 Ω (typical) at V_CC= 4.5 V

N 59 Ω (typical) at V_CC= 6.0 V

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

3. Applications

I Analog multiplexing and demultiplexing

I Digital multiplexing and demultiplexing

I Signal gating

I Automotive application

4. Ordering information

Table 1.

Ordering information

Type number

Package

Temperature range Name

Description

Version

74HC4851D

−40 °C to +125 °C

SO16

plastic small outline package; 16 leads;

body width 3.9 mm

SOT109-1

74HC4851PW −40 °C to +125 °C

TSSOP16

plastic thin shrink small outline package; 16 leads;

body width 4.4 mm

SOT403-1

SOT763-1

74HC4851BQ

74HCT4851D

−40 °C to +125 °C

DHVQFN16 plastic dual in-line compatible thermal enhanced very

thin quad ﬂat package; no leads; 16 terminals;

body 2.5 × 3.5 × 0.85 mm

SO16

plastic small outline package; 16 leads;

body width 3.9 mm

SOT109-1

SOT403-1

SOT763-1

74HCT4851PW −40 °C to +125 °C

74HCT4851BQ −40 °C to +125 °C

TSSOP16

plastic thin shrink small outline package; 16 leads;

body width 4.4 mm

DHVQFN16 plastic dual in-line compatible thermal enhanced very

thin quad ﬂat package; no leads; 16 terminals;

body 2.5 × 3.5 × 0.85 mm

5. Functional diagram

11

0

7

10

9

8 X

2

6

G8

Y0

Y1

Y2

Y3

Y4

Y5

Y6

Y7

13

S0

MUX/DMUX

11

10

9

14

15

12

1

13

14

15

12

1

0

S1

S2

1

2

3

4

5

6

3

5

2

E

6

4

3

4

7

Z

001aad542

001aad541

Fig 1. Logic symbol

Fig 2. IEC logic symbol

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

2 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

V

CC

16

INJECTION

CURRENT

CONTROL

13

14

15

12

1

Y0

Y1

Y2

Y3

Y4

Y5

Y6

Y7

Z

INJECTION

CURRENT

CONTROL

11

10

9

S0

S1

S2

E

INJECTION

CURRENT

CONTROL

INJECTION

CURRENT

CONTROL

INJECTION

CURRENT

CONTROL

1-OF-8

DECODER

INJECTION

CURRENT

CONTROL

5

INJECTION

CURRENT

CONTROL

2

INJECTION

CURRENT

CONTROL

6

4

INJECTION

CURRENT

CONTROL

3

8

001aaf875

GND

Fig 3. Functional diagram

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

3 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

6. Pinning information

6.1 Pinning

74HC4851

74HCT4851

74HC4851

74HCT4851

terminal 1

index area

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

Y4

Y6

V

CC

Y2

Y1

Y0

Y3

S0

S1

S2

2

3

4

5

6

7

15

14

13

12

11

10

Y6

Y2

Y1

Y0

Y3

S0

S1

Z

Y7

Y5

E

Y7

Y5

(1)

GND

E

n.c.

GND

001aaf877

Transparent top view

001aaf876

(1) The die substrate is attached to this pad using

conductive die attach material. It can not be used as

a supply pin or input.

Fig 4. Pin conﬁguration SO16 and TSSOP16

Fig 5. Pin conﬁguration DHVQFN16

6.2 Pin description

Table 2.

Symbol

Y4

Pin description

1

Description

independent input/output

common input/output

independent input/output

enable input (active LOW)

not connected

Y6

2

Z

3

Y7

4

Y5

5

E

6

n.c.

GND

S2

7

8

ground (0 V)

9

select input

S1

10

11

12

13

14

15

16

select input

S0

select input

Y3

independent input/output

supply voltage

Y0

Y1

Y2

V_CC

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

4 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

7. Functional description

Table 3.

Function table^[1]

Input

Channel ON

E

L

H

S2

L

S1

L

S0

L

Y0 to Z

Y1 to Z

Y2 to Z

Y3 to Z

Y4 to Z

Y5 to Z

Y6 to Z

Y7 to Z

-

L

H

L

H

L

H

L

H

X

L

H

L

H

X

H

X

[1] H = HIGH voltage level;

L = LOW voltage level;

X = don’t care.

8. Limiting values

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol

V_CC

V_I

Parameter

Conditions

Min

Max

+7.0

V_CC+ 0.5

±20

Unit

V

supply voltage

−0.5

[1]

[2]

input voltage

−0.5

V

V_SW

I_IK

switch voltage

−0.5

V

input clamping current

switch clamping current

switch current

V_I< −0.5 V or V_I> V_CC+ 0.5 V

V_SW< −0.5 V or V_SW> V_CC+ 0.5 V

V_SW> −0.5 V or V_SW< V_CC+ 0.5 V

-

mA

°C

I_SK

-

±20

I_SW

-

±25

I_CC

supply current

-

50

I_GND

T_stg

P_tot

ground current

−50

−65

-

storage temperature

total power dissipation

+150

500

[3]

T_amb= −40 °C to +125 °C

mW

[1] The minimum and maximum input voltage rating may be exceeded if the input clamping current rating is observed.

[2] The minimum and maximum switch voltage rating may be exceeded if the switch clamping current rating is observed.

[3] For SO16 package: P_totderates linearly with 8 mW/K above 70 °C.

For TSSOP16 package: P_totderates linearly with 5.5 mW/K above 60 °C.

For DHVQFN16 packages: P_totderates linearly with 4.5 mW/K above 60 °C.

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

5 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

9. Recommended operating conditions

Table 5.

Symbol

Recommended operating conditions

Parameter

Conditions

74HC4851

74HCT4851

Typ

Unit

Min

Typ

-

Max

6.0

Min

Max

V_CC

V_I

supply voltage

input voltage

2.0

4.5

5.0

5.5

V

0

-

V_CC

+125

1000

800

500

400

0

-

V_CC

V_SW

T_amb

∆t/∆V

switch voltage

0

-

0

-

ambient temperature

−40

-

−40

-

+125 °C

input transition rise and

fall rate

V_CC= 2.0 V

V_CC= 3.0 V

V_CC= 3.3 V

V_CC= 4.5 V

V_CC= 6.0 V

-

6.0

-

ns/V

-

ns/V

-

500

-

6.0

-

10. Static characteristics

Table 6.

R_{ON resistance}

At recommended operating conditions; voltages are referenced to GND (ground 0 V); For test circuit see Figure 8.

Symbol Parameter

74HC4851

Conditions

25 °C

−40 °C to +85 °C −40 °C to +125 °C Unit

Min Typ Max

Min

Max

Min

Max

R_ON(peak)ONresistance V_I= V_CCto GND; E = V_IL

(peak)

V_CC= 2.0 V; I_SW= 2 mA

-

400 650

215 330

120 270

-

670

360

305

240

220

-

700

380

345

270

250

Ω

V_CC= 3.0 V; I_SW≤ 2 mA

V_CC= 3.3 V; I_SW≤ 2 mA

V_CC= 4.5 V; I_SW≤ 2 mA

V_CC= 6.0 V; I_SW≤ 2 mA

76

59

210

195

∆R_ON

ONresistance V_I= 0.5 × V_CC; E = V_IL

mismatch

between

channels

V_CC= 2.0 V; I_SW= 2 mA

-

4

2

3

10

8

-

15

12

13

-

20

16

18

Ω

V_CC= 3.0 V; I_SW≤ 2 mA

V_CC= 3.3 V; I_SW≤ 2 mA

V_CC= 4.5 V; I_SW≤ 2 mA

V_CC= 6.0 V; I_SW≤ 2 mA

8

9

74HCT4851

R_ON(peak)ONresistance V_I= V_CCto GND; E = V_IL

(peak)

V_CC= 4.5 V; I_SW≤ 2 mA

-

76

2

210

8

-

240

12

-

270

16

Ω

∆R_ON

ONresistance V_I= 0.5 × V_CC; E = V_IL

mismatch

between

channels

V_CC= 4.5 V; I_SW≤ 2 mA

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

6 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

Table 7.

Injection current coupling

At recommended operating conditions; voltages are referenced to GND (ground 0 V); For test circuit see Figure 9.

Symbol

Parameter

Conditions

74HC4851

74HCT4851

Unit

Min Typ^[1]Max

T_amb= −40 °C to +125 °C

[2][3]

∆V_O

output voltage

variation

|I_SW| ≤ 1 mA; R_S≤ 3.9 kΩ

V_CC= 3.3 V

-

0.05

0.03

1

-

mV

V_CC= 5.0 V

0.03

1

|I_SW| ≤ 10 mA; R_S≤ 3.9 kΩ

V_CC= 3.3 V

-

0.55

0.27

5

-

mV

V_CC= 5.0 V

0.27

5

|I_SW| ≤ 1 mA; R_S≤ 20 kΩ

V_CC= 3.3 V

-

0.04

0.03

2

-

mV

V_CC= 5.0 V

0.03

2

|I_SW| ≤ 10 mA; R_S≤ 20 kΩ

V_CC= 3.3 V

-

0.56

0.48

20

-

mV

V_CC= 5.0 V

0.48

20

[1] Typical values are measured at T_amb= 25 °C.

[2] ∆V_Ohere is the maximum variation of output voltage of an enabled analog channel when current is injected into any disabled channel.

[3] I_SW= total current injected into all disabled channels.

Table 8.

Static characteristics

At recommended operating conditions; voltages are referenced to GND (ground 0 V);

25 °C

−40 °C to +85 °C −40 °C to +125 °C

Symbol Parameter Conditions

74HC4851

Min Typ Max

Min

Max

Min

Max

Unit

V_IH

HIGH-level control inputs

input

voltage

V_CC= 2.0 V

1.5

2.1

-

1.5

2.1

-

1.5

2.1

-

V

V_CC= 3.0 V

V_CC= 3.3 V

V_CC= 4.5 V

V_CC= 6.0 V

2.3

3.15

4.2

3.15

4.2

3.15

4.2

V_IL

LOW-level

input

voltage

control inputs

V_CC= 2.0 V

V_CC= 3.0 V

V_CC= 3.3 V

V_CC= 4.5 V

V_CC= 6.0 V

-

0.5

0.9

-

0.5

0.9

-

0.5

0.9

V

1.0

1.35

1.8

1.35

1.8

1.35

1.8

I_I

input

control inputs;

leakage

current

V_I= GND or V_CC

V_CC= 6.0 V

-

±0.1

-

±0.1

-

±1.0

µA

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

7 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

Table 8.

Static characteristics …continued

At recommended operating conditions; voltages are referenced to GND (ground 0 V);

25 °C

−40 °C to +85 °C −40 °C to +125 °C

Symbol Parameter Conditions

Min Typ Max

Min

Max

Min

Max

Unit

I_S(OFF)

OFF-state

leakage

current

E = V_IH; V_I= GND or V_CC;

V_O= V_CCor GND;

V_CC= 6.0 V; see Figure 6

per channel

-

±0.1

±0.2

±0.1

-

±0.5

±2.0

±0.5

-

±1.0

±4.0

±1.0

µA

all channels

I_S(ON)

ON-state

leakage

current

E = V_IL; V_I= GND or V_CC;

V

_O= V_CCor GND;

_CC= 6.0 V; see Figure 7

I_CC

C_I

supply

current

V_I= GND or V_CC;V_CC= 6.0 V

-

2.0

10

-

5.0

10

-

20.0

10

µA

input

S0, S1, S2 and E

2

pF

capacitance

C_sw

switch

capacitance

Z; OFF-state

-

15

3

40

15

-

40

15

-

40

15

pF

Yn; OFF-state

74HCT4851

V_IH

V_IL

I_I

HIGH-level control inputs

input

voltage

V_CC= 4.5 V to 5.5 V

2.0

-

2.0

-

2.0

-

V

LOW-level

input

voltage

control inputs

V_CC= 4.5 V to 5.5 V

0.8

input

control inputs;

leakage

current

V_I= GND or V_CC

V_CC= 5.5 V

-

±0.1

-

±0.1

-

±1.0

µA

I_S(OFF)

OFF-state

leakage

current

E = V_IH; V_I= GND or V_CC;

V_O= V_CCor GND;

V_CC= 5.5 V; see Figure 6

per channel

-

±0.1

±0.2

±0.1

-

±0.5

±2.0

±0.5

-

±1.0

±4.0

±1.0

µA

all channels

I_S(ON)

ON-state

leakage

current

E = V_IL; V_I= GND or V_CC;

V

_O= V_CCor GND;

_CC= 5.5 V; see Figure 7

I_CC

supply

current

V_I= GND or V_CC

V_CC= 5.5 V

-

2.0

-

5.0

-

20.0

370

µA

∆I_CC

additional

supply

control inputs;

V_I= V_CC− 2.1 V;

300

370

current

other inputs at V_CCor GND;

V_CC= 4.5 V to 5.5 V; I_O= 0 A

C_I

input

S0, S1, S2 and E

-

2

10

-

10

-

10

pF

capacitance

C_sw

switch

capacitance

Z; OFF-state

-

15

3

40

15

-

40

15

-

40

15

pF

Yn; OFF-state

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

8 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

V

CC

selected

(1)

channel

Yn

I

S

V

I

Z

n.c.

V

CC

E

V

IL

E

V

IH

Yn

Z

any disabled

channel

I

S

V

GND

V

GND

I

O

001aaf878

001aaf879

(1) Channel is selected by S0, S1 and S2.

Fig 6. Test circuit for measuring OFF-state leakage

current

Fig 7. Test circuit for measuring ON-state leakage

current

V

CC

any disabled

channel

Yn

(1)

V

I

SW

V

SW

V

Z

E

V

CC

V

IL

(2)

E

V

IL

Yn

V

I

selected

channel

Yn

Z

(1)

R

S

GND

V

O

V

GND

I

SW

I

V

I

001aaf880

001aaf881

R_ON= V_SW/ I_SW

.

(1) Channel is selected by S0, S1 and S2.

V_I(1) < GND or V_I(1) > V_CC

GND < V_I(2) < V_CC

.

Fig 8. Test circuit for measuring ON resistance

Fig 9. Test circuit for injection current coupling

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

9 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

11. Dynamic characteristics

Table 9.

Dynamic characteristics

At recommended operating conditions; voltages are referenced to GND (ground 0 V); for load circuit see Figure 14.

Symbol Parameter

Conditions

25 °C

−40 °C to +85 °C −40 °C to +125 °C Unit

Min Typ Max

Min

Max

Min

Max

74HC4851

[1]

[2]

[3]

[4]

t_pd

propagation delay Z, Yn to Yn, Z;

see Figure 10

V_CC= 2.0 V

V_CC= 3.0 V

V_CC= 3.3 V

V_CC= 4.5 V

V_CC= 6.0 V

-

10.0

25

-

29

-

32

ns

6.0 15.5

5.0 14.5

4.0 11.5

17.5

16.5

12.5

11

19.5

18.5

13.5

12

3.0

10

Sn to Z, Yn;

see Figure 11

V_CC= 2.0 V

V_CC= 3.0 V

V_CC= 3.3 V

V_CC= 4.5 V

V_CC= 6.0 V

-

18.0

32

-

35

20

-

40

23

ns

9.5 17.5

8.5 16.5

19

22

6.5

13

15

17

5.0 12.5

14.5

16.5

t_en

enable time

E to Z, Yn;

see Figure 12

V_CC= 2.0 V

V_CC= 3.0 V

V_CC= 3.3 V

V_CC= 4.5 V

V_CC= 6.0 V

-

95

90

85

80

78

-

105

100

95

-

115

110

105

100

80

ns

90

80

t_dis

disable time

E to Z, Yn;

see Figure 12

V_CC= 2.0 V

V_CC= 3.0 V

V_CC= 3.3 V

V_CC= 4.5 V

V_CC= 6.0 V

-

99

90

85

80

78

-

105

100

95

-

115

110

105

100

80

ns

90

80

C_PD

power dissipation per channel;

capacitance

see Figure 12

V_CC= 3.3 V

V_CC= 5.0 V

-

28

33

-

pF

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

10 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

Table 9.

Dynamic characteristics …continued

At recommended operating conditions; voltages are referenced to GND (ground 0 V); for load circuit see Figure 14.

Symbol Parameter

Conditions

25 °C

−40 °C to +85 °C −40 °C to +125 °C Unit

Min Typ Max

Min

Max

Min

Max

74HCT4851

[1]

[2]

[3]

[4]

t_pd

propagation delay Z, Yn to Yn, Z;

see Figure 10

V_CC= 4.5 V

1.6

3.2

4.2

3.7 11.5

1.1

2.3

3.0

28.2

-

12.5

15

30

90

-

1.1

2.3

3.0

28

-

13.5

17

ns

pF

Sn to Z, Yn;

see Figure 11

V_CC= 4.5 V

8.0

8.6

13

25

80

-

t_en

enable time

disable time

E to Z, Yn;

see Figure 12

V_CC= 4.5 V

35

t_dis

E to Z, Yn;

see Figure 12

V_CC= 4.5 V

28.5 64.7

100

-

C_PD

power dissipation per channel;

capacitance

see Figure 13

V_CC= 5.0 V

-

30

[1] t_pdis the same as t_PLHand t_PHL

[2] t_enis the same as t_PZHand t_PZL

[3] t_disis the same as t_PLZand t_PHZ

.

[4] C_PDis used to determine the dynamic power dissipation (P_Din µW):

P_D= C_PD× V_CC²× f_i+ ∑{(C_L+ C_sw) × V_CC²× f_o} where:

f_i= input frequency in MHz;

f_o= output frequency in MHz;

∑{(C_L+ C_sw) × V_CC²× f_o} = sum of outputs;

C_L= output load capacitance in pF;

C_sw= switch capacitance in pF;

V_CC= supply voltage in V.

12. Waveforms

V

CC

Z or Yn

input

0.5V

CC

t

GND

t

PLH

PHL

V

CC

Yn or Z

output

0.5V

CC

GND

001aah574

Fig 10. Input (Z, Yn) to output (Yn, Z) propagation delays

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

11 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

V

I

V

M

Sn input

GND

t

PHL

PLH

V

CC

Yn or Z

output

V

M

GND

001aah575

Measurement points are given in Table 10.

Fig 11. Input (Sn) to output (Yn, Z) propagation delays

V

I

E input

V

M

0 V

t

PZL

PLZ

V

CC

V

M

Z or Yn output

V

X

V

OL

t

PZH

PHZ

V

OH

V

Y

V

M

Z or Yn output

GND

switch ON

switch OFF

switch ON

001aah576

Measurement points are given in Table 10.

Logic levels: V_OLand V_OHare typical output voltage levels that occur with the output load.

Fig 12. Enable and disable times

Table 10. Measurement points

Type

Input

V_M

Output

V_M

V_I

V_X

V_Y

74HC4851

0.5V_CC

1.3 V

V_CC

3.0 V

0.5V_CC

V_OL+ 0.1(V_CC− V_OL

)

0.9V_OH

74HCT4851

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

12 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

V

CC

A

selected

channel

Yn

Sn

E

G

Z

n.c.

Yn

disabled

channel

GND

001aah577

Fig 13. Test circuit for measuring power dissipation capacitance

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

13 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

t

W

V

I

90 %

negative

pulse

V

M

10 %

0 V

t

r

f

t

f

r

V

I

90 %

positive

pulse

V

M

V

M

10 %

0 V

t

W

001aac221

a. Input pulse deﬁnition

switch

V

CC

V

open

CC

R

L

V

O

I

G

DUT

C

L

R

T

GND

001aaf883

Deﬁnitions for test circuit:

R_L= load resistance.

C_L= load capacitance including jig and probe capacitance.

R_T= termination resistance should be equal to the output impedance Z_oof the pulse generator.

b. Load circuit

Test data is given in Table 11.

Fig 14. Input pulse deﬁnition and load circuit

Table 11. Test data

Test

Input

Control E, Sn

V_I^[1]

Output

Switch Z (Yn)

C_L

S1 position

Switch Yn (Z)

t_r, t_f

V_I

R_L

t_PHL,t_PLH

t_PHZ, t_PZH

t_PLZ, t_PZL

C_PD

V_CC

6 ns

50 pF

-

open

GND

V_CC

50 pF

10 kΩ

-

V_CC

50 pF

V_CC

0 pF

open

[1] For 74HCT4851: input voltage V_I= 3.0 V.

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

14 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

13. Package outline

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

D

E

A

X

v

c

y

H

M

A

E

Z

16

9

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

8

e

w

M

detail X

b

p

0

2.5

scale

5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

(1)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

10.0

9.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

mm

1.27

0.05

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.39

0.014 0.0075 0.38

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.020

0.028

0.012

inches

0.069

0.01 0.004

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-19

SOT109-1

076E07

MS-012

Fig 15. Package outline SOT109-1 (SO16)

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

15 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

D

E

A

X

c

y

H

v

M

A

E

Z

9

16

Q

(A )

3

A

2

A

1

pin 1 index

θ

L

p

L

1

8

detail X

w

M

b

p

e

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

(2)

(1)

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

Z

θ

1

2

3

p

E

p

max.

8^o

0^o

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

6.6

6.2

0.75

0.50

0.4

0.3

0.40

0.06

mm

1.1

0.65

0.25

1

0.2

0.13

0.1

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT403-1

MO-153

Fig 16. Package outline SOT403-1 (TSSOP16)

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

16 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;

16 terminals; body 2.5 x 3.5 x 0.85 mm

SOT763-1

B

A

D

A

1

E

c

detail X

terminal 1

index area

C

terminal 1

index area

e

1

y

e

b

v

M

C

A

B

C

1

w

M

2

7

L

1

8

9

E

h

e

16

15

10

D

h

X

0

2.5

scale

5 mm

DIMENSIONS (mm are the original dimensions)

(1)

A

(1)

UNIT

A

b

c

E

e

y

D

E

L

v

w

y

1

h

1

h

max.

0.05 0.30

0.00 0.18

3.6

3.4

2.15

1.85

2.6

2.4

1.15

0.85

0.5

0.3

mm

0.05

0.1

1

0.2

0.5

2.5

0.1

0.05

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

02-10-17

03-01-27

SOT763-1

- - -

MO-241

- - -

Fig 17. Package outline SOT763-1 (DHVQFN16)

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

17 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

14. Abbreviations

Table 12. Abbreviations

Acronym

CDM

Description

Charged Device Model

CMOS

DUT

Complementary Metal Oxide Semiconductor

Device Under Test

ESD

ElectroStatic Discharge

Human Body Model

HBM

MM

Machine Model

15. Revision history

Table 13. Revision history

Document ID

74HC_HCT4851_2

Modiﬁcations:

74HC4851_1

Release date

20080902

Data sheet status

Change notice

Supersedes

Product data sheet

-

74HC4851_1

• 74HCT4851 device added.

20070309 Product data sheet

-

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

18 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

16. Legal information

16.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

malfunction of an NXP Semiconductors product can reasonably be expected

16.2 Deﬁnitions

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

16.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

16.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

17. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

74HC_HCT4851_2

Product data sheet

Rev. 02 — 2 September 2008

19 of 20

74HC4851; 74HCT4851

NXP Semiconductors

8-channel analog MUX/DEMUX with injection-current effect control

18. Contents

1

2

3

4

5

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7

Functional description . . . . . . . . . . . . . . . . . . . 5

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

Recommended operating conditions. . . . . . . . 6

Static characteristics. . . . . . . . . . . . . . . . . . . . . 6

Dynamic characteristics . . . . . . . . . . . . . . . . . 10

Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 18

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18

8

9

10

11

12

13

14

15

16

Legal information. . . . . . . . . . . . . . . . . . . . . . . 19

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19

Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19

16.1

16.2

16.3

16.4

17

18

Contact information. . . . . . . . . . . . . . . . . . . . . 19

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 2 September 2008

Document identifier: 74HC_HCT4851_2


型号：	74HCT4851
厂家：	NXP
描述：	8-channel analog multiplexer/demultiplexer with injection-current effect control 8通道模拟多路复用器/多路分解器与注入电流效应控制复用器
文件：	总20页 (文件大小：114K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

74HCT4851 [NXP]

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