74LV367PW,118 [NXP]
74LV367 - Hex buffer/line driver (3-State) TSSOP 16-Pin;
| 型号： | 74LV367PW,118 |
| 厂家： | 
NXP |
| 描述： | 74LV367 - Hex buffer/line driver (3-State) TSSOP 16-Pin 驱动 光电二极管 逻辑集成电路 |
| 文件： | 总12页 (文件大小：118K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
74LV367
Hex buffer/line driver (3-State)
Product specification
1998 May 29
Supersedes data of 1997 Mar 04
IC24 Data Handbook
Philips
Semiconductors
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV367
FEATURES
DESCRIPTION
The 74LV367 is a low-voltage CMOS device and is pin and function
compatible 74HC/HCT367.
• Optimized for Low Voltage applications: 1.0 to 3.6V
• Accepts TTL input levels between V = 2.7V and V = 3.6V
CC
CC
The 74LV367 is a hex non-inverting buffer/line driver with 3-State
outputs. The 3-State outputs (nY) are controlled by the output
enable inputs (1OE, 2OE).
• Typical V
(output ground bounce) t 0.8V @ V = 3.3V,
OLP
CC
T
amb
= 25°C
A HIGH on nOE, causes the outputs to assume a high impedance
OFF-state.
• Typical V
(output V undershoot) u 2V @ V = 3.3V,
OHV
OH
CC
T
= 25°C
amb
• Non-inverting outputs
• Output capability: bus driver
• I category: MSI
CC
QUICK REFERENCE DATA
GND = 0V; T
= 25°C; t = t v2.5 ns
amb
r f
SYMBOL
/t
PARAMETER
CONDITIONS
TYPICAL
UNIT
Propagation delay
nA to nY
C = 15pF
L
CC
t
8
ns
PHL PLH
V
= 3.3V
C
C
Input capacitance
3.5
30
pF
pF
I
Power dissipation capacitance per buffer
Notes 1 and 2
PD
NOTES:
1. C is used to determine the dynamic power dissipation (P in µW)
PD
D
2
2
P
= C V
f )S (C V
f ) where:
D
PD
CC
i
L
CC o
f = input frequency in MHz; C = output load capacitance in pF;
i
L
f = output frequency in MHz; V = supply voltage in V;
o
CC
2
S (C V
f ) = sum of the outputs.
L
CC
o
2. The condition is V = GND to V
I
CC
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE OUTSIDE NORTH AMERICA
NORTH AMERICA
74LV367 N
PKG. DWG. #
SOT38-4
16-Pin Plastic DIL
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
74LV367 N
74LV367 D
16-Pin Plastic SO
74LV367 D
SOT109-1
SOT338-1
SOT403-1
16-Pin Plastic SSOP Type II
16-Pin Plastic TSSOP Type I
74LV367 DB
74LV367 PW
74LV367 DB
74LV367PW DH
PIN DESCRIPTION
FUNCTION TABLE
PIN
INPUTS
OUTPUT
SYMBOL
NUMBER
FUNCTION
nOE
L
nA
L
nY
L
1, 15
1OE 2OE
Output enable inputs (active-LOW)
Data inputs
,
2, 4, 6, 10,
12, 14
1A to 6A
L
H
H
Z
H
X
3, 5, 7, 9, 11,
13
1Y to 6Y
GND
Data outputs
H = HIGH voltage level
L = LOW voltage level
X = Don’t care
8
Ground (0V)
16
V
CC
Positive supply voltage
Z = High impedance OFF-state
2
1998 May 29
853–1933 19466
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV367
PIN CONFIGURATION
LOGIC SYMBOL (IEEE/IEC)
1
1
2
3
4
5
6
1OE
1A
16
15
V
CC
EN
2OE
6A
2
3
1Y
2A
14
13
12
11
4
6
5
7
9
6Y
2Y
5A
10
3A
5Y
3Y
7
8
10
9
4A
4Y
15
EN
GND
12
14
11
13
SV00650
LOGIC SYMBOL
SV00652
1A
2A
1Y
2Y
3Y
4Y
3
5
7
2
4
FUNCTIONAL DIAGRAM
1A
1Y
2Y
3Y
4Y
3A
3
5
7
2
6
2A
4A
4
9
10
1
3A
1OE
5A
6
4A
5Y
6Y
9
10
12
14
15
11
13
1OE
1
6A
5A
5Y
6Y
2OE
12
11
13
6A
14
SV00651
2OE
15
SV00653
3
1998 May 29
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV367
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
MIN
1.0
0
TYP
3.3
–
MAX
UNIT
V
CC
DC supply voltage
Input voltage
See Note 1
3.6
V
V
V
V
I
V
CC
V
CC
V
O
Output voltage
0
–
See DC and AC
characteristics
–40
–40
+85
+125
T
amb
Operating ambient temperature range in free air
°C
–
–
–
–
V
CC
V
CC
V
CC
= 1.0V to 2.0V
= 2.0V to 2.7V
= 2.7V to 3.6V
–
–
–
500
200
100
t , t
r
Input rise and fall times
ns/V
f
NOTE:
1. The LV is guaranteed to function down to V = 1.0V (input levels GND or V ); DC characteristics are guaranteed from V = 1.2V to V = 3.6V.
CC
CC
CC
CC
1, 2
ABSOLUTE MAXIMUM RATINGS
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to GND (ground = 0V).
SYMBOL
PARAMETER
DC supply voltage
CONDITIONS
RATING
–0.5 to +4.6
20
UNIT
V
CC
V
±I
IK
DC input diode current
DC output diode current
V < –0.5 or V > V + 0.5V
mA
mA
I
I
CC
±I
OK
V
O
< –0.5 or V > V + 0.5V
50
O
CC
DC output source or sink current
– bus driver outputs
±I
O
–0.5V < V < V + 0.5V
35
mA
O
CC
DC V or GND current for types with
–bus driver outputs
CC
±I
±I
,
70
mA
GND
CC
T
stg
Storage temperature range
–65 to +150
°C
Power dissipation per package
–plastic DIL
–plastic mini-pack (SO)
for temperature range: –40 to +125°C
above +70°C derate linearly with 12mW/K
above +70°C derate linearly with 8 mW/K
above +60°C derate linearly with 5.5 mW/K
750
500
400
P
tot
mW
–plastic shrink mini-pack (SSOP and TSSOP)
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
4
1998 May 29
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV367
DC CHARACTERISTICS FOR THE LV FAMILY
Over recommended operating conditions. Voltages are referenced to GND (ground = 0V).
LIMITS
MAX
-40°C to +85°C
-40°C to +125°C
SYMBOL
PARAMETER
TEST CONDITIONS
UNIT
V
1
MIN
0.9
1.4
2.0
TYP
MIN
0.9
1.4
2.0
MAX
V
V
V
V
V
V
V
V
V
V
= 1.2V
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
HIGH level Input
voltage
= 2.0V
V
IH
= 2.7 to 3.6V
= 1.2V
0.3
0.6
0.8
0.3
0.6
0.8
LOW level Input
voltage
= 2.0V
V
IL
V
= 2.7 to 3.6V
= 1.2V; V = V or V –I = 100µA
1.2
2.0
2.7
3.0
I
IH
IL;
O
= 2.0V; V = V or V –I = 100µA
1.8
2.5
2.8
1.8
2.5
2.8
I
IH
IL;
O
HIGH level output
voltage; all outputs
V
V
V
V
V
V
OH
= 2.7V; V = V or V –I = 100µA
I
IH
IL;
O
= 3.0V; V = V or V –I = 100µA
I
IH
IL;
O
HIGH level output
voltage; BUS driver
outputs
V
CC
= 3.0V; V = V or V –I = 8mA
2.40
2.82
2.20
OH
I
IH
IL;
O
V
CC
V
CC
V
CC
V
CC
= 1.2V; V = V or V I
IL; O
= 100µA
= 100µA
= 100µA
= 100µA
0
0
0
0
I
IH
= 2.0V; V = V or V I
IL; O
0.2
0.2
0.2
0.2
0.2
0.2
I
IH
LOW level output
voltage; all outputs
V
V
OL
= 2.7V; V = V or V I
IL; O
I
IH
= 3.0V; V = V or V I
IL; O
I
IH
LOW level output
voltage; BUS driver
outputs
V
CC
= 3.0V; V = V or V I = 8mA
IL; O
0.20
0.40
0.50
OL
I
IH
Input leakage
current
I
V
= 3.6V; V = V or GND
1.0
5
1.0
10
µA
µA
µA
I
CC
CC
I
CC
3-State output
OFF-state current
V
V
= 3.6V; V = V or V
I IH IL;
I
OZ
CC
= V or GND
O
CC
Quiescent supply
current; MSI
I
V
CC
= 3.6V; V = V or GND; I = 0
20.0
160
I
CC
O
Additional
quiescent supply
current per input
∆I
CC
V
CC
= 2.7V to 3.6V; V = V – 0.6V
500
850
µA
I
CC
NOTE:
1. All typical values are measured at T
= 25°C.
amb
5
1998 May 29
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV367
AC CHARACTERISTICS
GND = 0V; t = t ≤ 2.5ns; C = 50pF; R = 1KW
r
f
L
L
LIMITS
–40 to +85 °C
CONDITION
(V)
–40 to +125 °C
SYMBOL
PARAMETER
WAVEFORM
UNIT
1
V
CC
MIN
–
TYP
50
MAX
–
MIN
–
MAX
–
1.2
2.0
2.7
–
17
32
24
19
–
–
39
29
23
–
Propagation delay
nA to nY
t
t
Figure 1
Figure 2
Figure 2
ns
PHL/ PLH
–
13
–
2
3.0 to 3.6
1.2
–
10
–
–
80
27
20
–
3-State output
enable time
nOE to nY
2.0
–
51
38
30
–
–
60
44
36
–
t
t
ns
ns
PZH/ PZL
2.7
–
–
2
3.0 to 3.6
1.2
–
15
90
32
24
–
–
–
3-State output
disable time
nOE to nY
2.0
–
59
44
36
–
70
52
42
t
t
PHZ/ PLZ
2.7
–
–
2
3.0 to 3.6
–
19
–
NOTES:
1. All typical values are measured at T
= 25°C
amb
2. Typical values are measured at V = 3.3V
CC
AC WAVEFORMS
V
V
V
= 1.5V at V w 2.7V
M
CC
V
I
= 0.5V * V at V t 2.7V
M
CC
CC
and V are the typical output voltage drop that occur with the
OL
OH
V
nOE INPUT
GND
M
output load.
V
X
V
X
V
Y
V
Y
= V + 0.3V at V w 2.7V
OL
CC
= V
0.1V at V < 2.7V
t
t
PZL
OL
CC
CC
PLZ
V
CC
= V – 0.3V at V w 2.7V
OH
CC
OUTPUT
LOW–to–OFF
OFF–to–LOW
= V – 0.1V at V < 2.7V
OH
CC
CC
V
M
V
X
V
OL
V
I
t
PZH
t
PHZ
nA INPUT
V
M
V
OH
GND
V
Y
OUTPUT
HIGH–to–OFF
OFF–to–HIGH
t
t
PLH
PHL
V
M
V
OH
GND
V
nY OUTPUT
M
outputs
disabled
outputs
enabled
outputs
enabled
V
OL
SV00655
SV00654
Figure 2. 3-State enable and disable times.
Figure 1. Input (nA) to output (nY) propagation delays.
6
1998 May 29
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV367
TEST CIRCUIT
S
1
2 * V
V
CC
CC
Open
GND
R
R
= 1k
L
L
V
V
O
I
PULSE
GENERATOR
D.U.T.
50pF
R
= 1k
T
C
L
Test Circuit for switching times
DEFINITIONS
R
L
C
L
R
T
= Load resistor
= Load capacitance includes jig and probe capacitance
= Termination resistance should be equal to Z of pulse generators.
OUT
SWITCH POSITION
TEST
S
V
V
I
1
CC
t
t
Open
< 2.7V
V
CC
PLH/ PHL
t
t
t
2.7–3.6V
2.7V
PLZ/ PZL
2 < V
CC
t
GND
PHZ/ PZH
SV00895
Figure 3. Load circuitry for switching times.
7
1998 May 29
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV367
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
8
1998 May 29
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV367
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
9
1998 May 29
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV367
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
10
1998 May 29
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV367
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
11
1998 May 29
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV367
DEFINITIONS
Data Sheet Identification
Product Status
Definition
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
Objective Specification
Formative or in Design
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
Preliminary Specification
Product Specification
Preproduction Product
Full Production
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. PhilipsSemiconductorsmakesnorepresentationorwarrantythatsuchapplicationswillbesuitableforthespecifiedusewithoutfurthertesting
or modification.
LIFE SUPPORT APPLICATIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
orsystemswheremalfunctionofaPhilipsSemiconductorsandPhilipsElectronicsNorthAmericaCorporationProductcanreasonablybeexpected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Sunnyvale, California 94088–3409
Telephone 800-234-7381
print code
Date of release: 05-96
9397-750-04445
Document order number:
Philips
Semiconductors
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