74LV374DB [NXP]

Octal D-type flip-flop; positive edge-trigger 3-State; 八路D型触发器;正边沿触发三态
74LV374DB
型号: 74LV374DB
厂家: NXP    NXP
描述:

Octal D-type flip-flop; positive edge-trigger 3-State
八路D型触发器;正边沿触发三态

总线驱动器 总线收发器 触发器 逻辑集成电路 光电二极管
文件: 总12页 (文件大小:115K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
74LV374  
Octal D-type flip-flop;  
positive edge-trigger (3-State)  
Product specification  
1997 Mar 20  
Supersedes data of 1996 Feb  
IC24 Data Handbook  
Philips  
Semiconductors  
Philips Semiconductors  
Product specification  
74LV374  
Octal D-type flip-flop; positive edge-trigger (3-State)  
FEATURES  
Wide operating voltage: 1.0 to 5.5V  
Optimized for Low Voltage applications: 1.0 to 3.6V  
DESCRIPTION  
The 74LV374 is a low-voltage Si-gate CMOS device and is pin and  
function compatible with 74HC/HCT374.  
The 74LV374 is an octal D-type flip–flop featuring separate D-type  
inputs for each flip-flop and 3-state outputs for bus oriented  
applications. A clock (CP) and an output enable (OE) input are  
common to all flip-flops.  
Accepts TTL input levels between V = 2.7V and V = 3.6V  
CC  
CC  
Typical V  
(output ground bounce) t 0.8V @ V = 3.3V,  
OLP  
CC  
T
= 25°C  
amb  
The eight flip-flops will store the state of their individual D-inputs that  
meet the set-up and hold times requirements on the LOW-to-HIGH  
CP transition.  
Typical V  
(output V undershoot) u 2V @ V = 3.3V,  
OHV  
OH  
CC  
T
= 25°C  
amb  
Common 3-State output enable input  
Output capability: bus driver  
When OE is LOW, the contents of the eight flip-flops is available at  
the outputs. When OE is HIGH, the outputs go to the high  
impedance OFF-state. Operation of the OE input does not affect the  
state of the flip-flops.  
I category: MSI  
CC  
QUICK REFERENCE DATA  
GND = 0V; T  
= 25°C; t =t v2.5 ns  
amb  
r f  
SYMBOL  
PARAMETER  
CONDITIONS  
TYPICAL  
UNIT  
C = 15pF  
L
Propagation delay  
CP to Q  
V
CC  
= 3.3V  
t
f
/t  
14  
ns  
PHL PLH  
n
Maximum clock frequency  
Input capacitance  
77  
3.5  
25  
MHz  
pF  
max  
C
C
I
Power dissipation capacitance per flip-flop  
Notes 1 and 2  
pF  
PD  
NOTES:  
1. C is used to determine the dynamic power dissipation (P in µW)  
PD  
D
2
2
P
= C   V  
x f )S (C   V  
  f ) where:  
D
PD  
CC  
i
L
CC o  
f = input frequency in MHz; C = output load capacity in pF;  
i
L
f = output frequency in MHz; V = supply voltage in V;  
o
CC  
2
S (C   V  
  f ) = sum of the outputs.  
L
CC  
o
2. The condition is V = GND to V  
I
CC  
ORDERING INFORMATION  
PACKAGES  
TEMPERATURE RANGE OUTSIDE NORTH AMERICA  
NORTH AMERICA  
74LV374 N  
PKG. DWG. #  
SOT146-1  
SOT163-1  
SOT339-1  
20-Pin Plastic DIL  
–40°C to +125°C  
–40°C to +125°C  
–40°C to +125°C  
74LV374 N  
74LV374 D  
74LV374 DB  
20-Pin Plastic SO  
74LV374 D  
20-Pin Plastic SSOP Type II  
74LV374 DB  
PIN DESCRIPTION  
FUNCTION TABLE  
PIN  
INPUTS  
OUTPUTS  
SYMBOL  
NUMBER  
FUNCTION  
OPERATING  
MODES  
INTERNAL  
FLIP-FLOPS  
OE CP Dn  
Q0 to Q7  
1
OE  
Output enable input (active-LOW)  
3-State flip-flop outputs  
Load and read  
register  
L
L
l
h
L
H
L
H
2, 5, 6, 9, 12,  
15, 16, 19  
Q0 to Q7  
Load register and  
disable outputs  
H
H
l
h
L
H
Z
Z
3, 4, 7, 8, 13,  
14, 17, 18  
D0 to D7  
GND  
Data inputs  
Ground (0V)  
H
h
= HIGH voltage level  
= HIGH voltage level one set-up time prior to the  
LOW-to-HIGH CP transition  
10  
11  
20  
Clock input (LOW-to-HIGH, edge-  
triggered)  
CP  
L
l
=
=
LOW voltage level  
LOW voltage level one set-up time prior to the  
LOW-to-HIGH CP transition  
High impedance OFF-state  
V
CC  
Positive supply voltage  
Z
=
=
LOW–to–HIGH clock transition  
2
1997 Mar 20  
Philips Semiconductors  
Product specification  
74LV374  
Octal D-type flip-flop; positive edge-trigger (3-State)  
PIN CONFIGURATION  
LOGIC SYMBOL  
11  
OE  
Q0  
D0  
D1  
Q1  
Q2  
D2  
D3  
Q3  
1
2
3
4
5
6
7
8
9
20 V  
CC  
19 Q7  
18 D7  
17 D6  
16 Q6  
15 Q5  
14 D5  
13 D4  
12 Q4  
11 CP  
CP  
3
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
2
4
7
5
6
8
9
13  
12  
15  
16  
19  
14  
17  
18  
GND 10  
OE  
1
SV00338  
SV00339  
LOGIC SYMBOL (IEEE/IEC)  
11  
FUNCTIONAL DIAGRAM  
C1  
1
EN1  
3
4
7
D
D
D
D
D
D
D
D
Q
Q
Q
Q
Q
Q
Q
Q
2
5
0
1
2
0
1
2
3
2
1D  
6
4
7
8
5
6
9
8
9
12  
15  
16  
19  
3
4
3
4
FF1  
to  
FF8  
3-STATE  
OUTPUTS  
13  
14  
17  
18  
5
6
7
5
6
7
13  
12  
14  
17  
15  
16  
19  
18  
11  
1
CP  
OE  
SV00340  
SV00341  
D7  
LOGIC DIAGRAM  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
CP  
CP  
CP  
CP  
CP  
CP  
FF6  
CP  
FF7  
CP  
FF1  
FF2  
FF3  
FF4  
FF5  
FF8  
CP  
OE  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
SV00342  
3
1997 Mar 20  
Philips Semiconductors  
Product specification  
74LV374  
Octal D-type flip-flop; positive edge-trigger (3-State)  
1, 2  
ABSOLUTE MAXIMUM RATINGS  
In accordance with the Absolute Maximum Rating System (IEC 134)  
Voltages are referenced to GND (ground = 0V)  
SYMBOL  
PARAMETER  
DC supply voltage  
CONDITIONS  
RATING  
UNIT  
V
V
CC  
–0.5 to +7.0  
±I  
DC input diode current  
DC output diode current  
V < –0.5 or V > V + 0.5V  
20  
50  
mA  
mA  
IK  
I
I
CC  
±I  
OK  
V
O
< –0.5 or V > V + 0.5V  
O
CC  
DC output source or sink current  
– standard outputs  
– bus driver outputs  
25  
35  
±I  
O
–0.5V < V < V + 0.5V  
mA  
O
CC  
DC V or GND current for types with  
–standard outputs  
–bus driver outputs  
CC  
±I  
±I  
,
50  
70  
mA  
GND  
CC  
T
stg  
Storage temperature range  
–65 to +150  
°C  
Power dissipation per package  
–plastic DIL  
–plastic mini-pack (SO)  
for temperature range: –40 to +125°C  
above +70°C derate linearly with 12mW/K  
above +70°C derate linearly with 8 mW/K  
above +60°C derate linearly with 5.5 mW/K  
750  
500  
400  
P
TOT  
mW  
–plastic shrink mini-pack (SSOP and TSSOP)  
NOTES:  
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the  
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to  
absolute-maximum-rated conditions for extended periods may affect device reliability.  
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
RECOMMENDED OPERATING CONDITIONS  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
1.0  
0
TYP.  
3.3  
MAX  
UNIT  
V
CC  
DC supply voltage  
See Note1  
5.5  
V
V
V
V
I
Input voltage  
V
CC  
V
CC  
V
O
Output voltage  
0
Operating ambient temperature range in free  
air  
See DC and AC  
characteristics per device  
–40  
–40  
+85  
+125  
T
amb  
°C  
V
CC  
V
CC  
V
CC  
V
CC  
= 1.0V to 2.0V  
= 2.0V to 2.7V  
= 2.7V to 3.6V  
= 3.6V to 5.5V  
500  
200  
100  
50  
Input rise and fall times except for  
Schmitt-trigger inputs  
t , t  
r
ns/V  
f
NOTES:  
1. The LV is guaranteed to function down to V = 1.0V (input levels GND or V ); DC characteristics are guaranteed from V = 1.2V to V = 5.5V.  
CC  
CC  
CC  
CC  
4
1997 Mar 20  
Philips Semiconductors  
Product specification  
74LV374  
Octal D-type flip-flop; positive edge-trigger (3-State)  
DC CHARACTERISTICS FOR THE LV FAMILY  
Over recommended operating conditions voltages are referenced to GND (ground = 0V)  
LIMITS  
MAX  
-40°C to +85°C  
-40°C to +125°C  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
= 1.2V  
UNIT  
1
MIN  
0.9  
1.4  
2.0  
TYP  
MIN  
0.9  
1.4  
2.0  
MAX  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 2.0V  
HIGH level Input  
voltage  
V
IH  
V
= 2.7 to 3.6V  
= 4.5 to 5.5V  
= 1.2V  
0.7*V  
0.7*V  
CC  
CC  
0.3  
0.6  
0.8  
0.3  
0.6  
0.8  
= 2.0V  
LOW level Input  
voltage  
V
IL  
V
V
= 2.7 to 3.6V  
= 4.5 to 5.5  
0.3*V  
0.3*V  
CC  
CC  
= 1.2V; V = V or V –I = 100µA  
1.2  
2.0  
2.7  
3.0  
4.5  
I
IH  
IL;  
O
= 2.0V; V = V or V –I = 100µA  
1.8  
2.5  
2.8  
4.3  
1.8  
2.5  
2.8  
4.3  
I
IH  
IL;  
O
HIGH level output  
voltage; all outputs  
= 2.7V; V = V or V –I = 100µA  
V
OH  
I
IH  
IL;  
O
= 3.0V; V = V or V –I = 100µA  
I
IH  
IL;  
O
= 4.5V;V = V or V –I = 100µA  
I
IH  
IL;  
O
HIGH level output  
voltage;  
STANDARD  
V
= 3.0V;V = V or V –I = 6mA  
2.40  
3.60  
2.82  
4.20  
2.20  
3.50  
CC  
CC  
I
IH  
IL;  
O
V
V
V
V
OH  
V
= 4.5V;V = V or V –I = 12mA  
I
IH  
IL;  
O
outputs  
HIGH level output  
voltage; BUS driver  
outputs  
V
V
= 3.0V;V = V or V –I = 8mA  
2.40  
3.60  
2.82  
4.20  
2.20  
3.50  
CC  
I
IH  
IL;  
O
OH  
= 4.5V;V = V or V –I = 16mA  
CC  
I
IH  
IL;  
O
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 1.2V; V = V or V I  
IL; O  
= 100µA  
= 100µA  
= 100µA  
0
0
0
0
0
I
IH  
= 2.0V; V = V or V  
I
0.2  
0.2  
0.2  
0.2  
0.2  
I
IH  
IL; O  
LOW level output  
voltage; all outputs  
= 2.7V; V = V or V  
I
0.2  
0.2  
0.2  
V
OL  
V
I
IH  
IL; O  
= 3.0V;V = V or V I  
= 100µA  
I = 100µA  
I
IH  
IL; O  
= 4.5V;V = V or V  
IL; O  
I
IH  
LOW level output  
voltage;  
STANDARD  
V
= 3.0V;V = V or V I = 6mA  
IL; O  
0.25  
0.35  
0.40  
0.55  
0.50  
0.65  
CC  
CC  
I
IH  
V
V
V
V
OL  
V
= 4.5V;V = V or V I = 12mA  
IL; O  
I
IH  
outputs  
LOW level output  
voltage; BUS driver  
outputs  
V
V
= 3.0V;V = V or V  
I
= 8mA  
0.20  
0.35  
0.40  
0.55  
0.50  
0.65  
CC  
I
IH  
IL; O  
OL  
= 4.5V;V = V or V  
I
= 16mA  
CC  
I
IH  
IL; O  
Input leakage  
current  
I
V
= 5.5V; V = V or GND  
1.0  
5
1.0  
10  
µA  
µA  
I
CC  
I
CC  
3-State output  
OFF-state current  
V
V
= 5.5V; V = V or V  
I IH IL;  
CC  
O
I
OZ  
= V or GND  
CC  
Quiescent supply  
current; SSI  
V
V
V
V
= 5.5V; V = V or GND; I = 0  
20.0  
20.0  
20.0  
500  
40  
CC  
I
CC  
O
I
I
µA  
CC  
Quiescent supply  
current; flip-flops  
= 5.5V; V = V or GND; I = 0  
80  
CC  
CC  
CC  
I
CC  
O
Quiescent supply  
current; MSI  
= 5.5V; V = V or GND; I = 0  
160  
1000  
I
CC  
O
µA  
µA  
CC  
Quiescent supply  
current; LSI  
= 5.5V; V = V or GND; I = 0  
I
CC  
O
Additional  
quiescent supply  
current per input  
I  
V
CC  
= 2.7V to 3.6V; V = V –0.6V  
500  
850  
CC  
I
CC  
NOTE:  
1. All typical values are measured at T  
= 25°C.  
amb  
5
1997 Mar 20  
Philips Semiconductors  
Product specification  
74LV374  
Octal D-type flip-flop; positive edge-trigger (3-State)  
AC CHARACTERISTICS  
GND = 0V; t = t = 2.5ns; C = 50pF; R = 500Ω  
r
f
L
L
LIMITS  
–40 to +85 °C  
LIMITS  
–40 to +125 °C  
CONDITION  
(V)  
SYMBOL  
PARAMETER  
WAVEFORM  
UNIT  
V
CC  
MIN  
TYP  
90  
MAX  
MIN  
MAX  
1.2  
2.0  
2.7  
31  
39  
29  
23  
19  
49  
36  
29  
24  
Propagation delay  
CP to Qn  
23  
t
t
Figure 1  
Figure 2  
Figure 2  
ns  
PHL/ PLH  
2
3.0 to 3.6  
4.5 to 5.5  
1.2  
17  
75  
26  
19  
2.0  
34  
25  
20  
17  
43  
31  
25  
21  
Propagation delay  
OE to Qn  
2.7  
t
t
t
ns  
ns  
PZH/ PZL  
2
3.0 to 3.6  
4.5 to 5.5  
1.2  
14  
80  
29  
22  
2.0  
39  
29  
24  
20  
48  
36  
29  
24  
Propagation delay  
OE to Qn  
2.7  
t
PHZ/ PLZ  
2
3.0 to 3.6  
4.5 to 5.5  
2.0  
17  
12  
9
34  
25  
20  
41  
30  
24  
Clock pulse width  
HIGH or LOW  
2.7  
t
Figure 1  
Figure 3  
ns  
ns  
W
2
3.0 to 3.6  
1.2  
7
25  
9
2.0  
22  
16  
13  
26  
19  
15  
Set-up time  
Dn to CP  
t
su  
2.7  
6
2
3.0 to 3.6  
1.2  
5
–10  
–3  
2.0  
5
5
Hold time  
Dn to CP  
t
Figure 3  
Figure 2  
ns  
h
2.7  
5
–2  
5
2
3.0 to 3.6  
2.0  
5
–2  
5
15  
19  
24  
40  
58  
12  
16  
20  
Maximum clock  
pulse frequency  
2.7  
f
MHz  
max  
2
3.0 to 3.6  
70  
NOTE:  
1. Unless otherwise stated, all typical values are at T  
= 25°C.  
amb  
2. Typical value measured at V = 3.3V.  
CC  
3. Typical value measured at V = 5.0V.  
CC  
6
1997 Mar 20  
Philips Semiconductors  
Product specification  
74LV374  
Octal D-type flip-flop; positive edge-trigger (3-State)  
AC WAVEFORMS  
V
V
V
= 1.5V at V w 2.7V v 3.6V  
M
CC  
= 0.5V * V at V t 2.7V and w 4.5V  
M
CC  
CC  
and V are the typical output voltage drop that occur with the  
OL  
OH  
output load.  
V
I
(1)  
CP INPUT  
GND  
V
M
1/f  
max  
t
t
su  
su  
t
h
t
h
V
I
CP INPUT  
V
M
D
INPUT  
GND  
V
n
M
t
W
t
t
PLH  
PHL  
V
OH  
90%  
Q
n
OUTPUT  
V
M
V
M
OUTPUT  
Qn  
V
OL  
10%  
NOTE: the shaded areas indicate when the input is permitted to change  
for predictable output performance.  
t
t
TLH  
THL  
SV00345  
Figure 3. Waveforms showing the data set-up and hold times  
for the Dn input to the CP input  
SV00343  
NOTE:  
Figure 1. Waveforms showing the clock (CP) to output (Qn)  
propagation delays, the clock pulse width, output transition  
times and the maximum clock pulse frequency  
The shaded areas indicate when the input is permitted to change for  
predictable output performance.  
V
I
V
OE INPUT  
GND  
M
t
t
PLZ  
PZL  
V
CC  
OUTPUT  
LOW-to-OFF  
OFF-to-LOW  
V
M
V
X
V
OL  
t
PZH  
t
PHZ  
V
OH  
V
Y
OUTPUT  
HIGH-to-OFF  
OFF-to-HIGH  
V
M
GND  
outputs  
enabled  
outputs  
disabled  
outputs  
enabled  
SV00344  
Figure 2. Waveforms showing the 3-state enable and disable  
times  
7
1997 Mar 20  
Philips Semiconductors  
Product specification  
74LV374  
Octal D-type flip-flop; positive edge-trigger (3-State)  
TEST CIRCUIT  
t
W
V
I
90%  
S
90%  
1
V
cc  
V
Open  
GND  
S1  
V
V
M
M
NEGATIVE  
PULSE  
10%  
10%  
90%  
0V  
(t )  
R
R
= 1k  
L
L
V
V
O
t
t
(t )  
t
TLH  
l
THL  
TLH  
f
r
PULSE  
GENERATOR  
D.U.T.  
(t )  
r
t
(t )  
THL f  
V
= 1k  
R
T
I
90%  
M
C = 50pF  
L
POSITIVE  
PULSE  
V
V
M
10%  
10%  
t
W
0V  
Test Circuit for Outputs  
V
M
= 1.5V  
Input Pulse Definition  
DEFINITIONS  
SWITCH POSITION  
R = Load resistor  
L
TEST  
S
1
V
CC  
V
I
V
S1  
C = Load capacitance includes jig and probe capacitance  
L
t
t
Open  
< 2.7V  
2.7–3.6V  
4.5 V  
V
2 < V  
2 < V  
2 < V  
PLH/ PHL  
CC  
CC  
CC  
CC  
R = Termination resistance should be equal to Z  
T
of  
OUT  
t
t
V
S1  
2.7V  
PLZ/ PZL  
pulse generators.  
t
/t  
GND  
V
CC  
PHZ PZH  
SY00044  
Figure 4. Load circuitry for switching times  
8
1997 Mar 20  
Philips Semiconductors  
Product specification  
Octal D-type flip-flop; positive edge-trigger (3-State)  
74LV374  
DIP20: plastic dual in-line package; 20 leads (300 mil)  
SOT146-1  
9
1997 Mar 20  
Philips Semiconductors  
Product specification  
Octal D-type flip-flop; positive edge-trigger (3-State)  
74LV374  
SO20: plastic small outline package; 20 leads; body width 7.5 mm  
SOT163-1  
10  
1997 Mar 20  
Philips Semiconductors  
Product specification  
Octal D-type flip-flop; positive edge-trigger (3-State)  
74LV374  
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm  
SOT339-1  
11  
1997 Mar 20  
Philips Semiconductors  
Product specification  
Octal D-type flip-flop; positive edge-trigger (3-State)  
74LV374  
DEFINITIONS  
Data Sheet Identification  
Product Status  
Definition  
This data sheet contains the design target or goal specifications for product development. Specifications  
may change in any manner without notice.  
Objective Specification  
Formative or in Design  
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to make changes at any time without notice in order to improve design  
and supply the best possible product.  
Preliminary Specification  
Product Specification  
Preproduction Product  
Full Production  
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes  
at any time without notice, in order to improve design and supply the best possible product.  
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,  
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,  
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes  
only. PhilipsSemiconductorsmakesnorepresentationorwarrantythatsuchapplicationswillbesuitableforthespecifiedusewithoutfurthertesting  
or modification.  
LIFE SUPPORT APPLICATIONS  
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,  
orsystemswheremalfunctionofaPhilipsSemiconductorsandPhilipsElectronicsNorthAmericaCorporationProductcanreasonablybeexpected  
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips  
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully  
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.  
Philips Semiconductors  
811 East Arques Avenue  
P.O. Box 3409  
Copyright Philips Electronics North America Corporation 1997  
All rights reserved. Printed in U.S.A.  
Sunnyvale, California 94088–3409  
Telephone 800-234-7381  
print code  
Date of release: 05-96  
9397-750-04448  
Document order number:  
Philips  
Semiconductors  

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