74LVC08APW-Q100,11 [NXP]

74LVC08A-Q100 - Quad 2-input AND gate TSSOP 14-Pin;
74LVC08APW-Q100,11
型号: 74LVC08APW-Q100,11
厂家: NXP    NXP
描述:

74LVC08A-Q100 - Quad 2-input AND gate TSSOP 14-Pin

光电二极管 逻辑集成电路
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74LV08-Q100  
Quad 2-input AND gate  
Rev. 1 — 31 July 2012  
Product data sheet  
1. General description  
The 74LV08-Q100 is a low-voltage Si-gate CMOS device that is pin and function  
compatible with 74HC08-Q100 and 74HCT08-Q100.  
The 74LV08-Q100 provides a quad 2-input AND function.  
This product has been qualified to the Automotive Electronics Council (AEC) standard  
Q100 (Grade 1) and is suitable for use in automotive applications.  
2. Features and benefits  
Automotive product qualification in accordance with AEC-Q100 (Grade 1)  
Specified from 40 C to +85 C and from 40 C to +125 C  
Wide operating voltage: 1.0 V to 5.5 V  
Optimized for low voltage applications: 1.0 V to 3.6 V  
Accepts TTL input levels between VCC = 2.7 V and VCC = 3.6 V  
Typical output ground bounce < 0.8 V at VCC = 3.3 V and Tamb = 25 C  
Typical HIGH-level output voltage (VOH) undershoot: > 2 V at VCC = 3.3 V and  
Tamb = 25 C  
ESD protection:  
MIL-STD-883, method 3015 exceeds 2000 V  
HBM JESD22-A114F exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )  
Multiple package options  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
40 C to +125 C SO14  
Description  
Version  
74LV08D-Q100  
plastic small outline package; 14 leads;  
body width 3.9 mm  
SOT108-1  
74LV08PW-Q100 40 C to +125 C  
TSSOP14 plastic thin shrink small outline package; 14 leads;  
body width 4.4 mm  
SOT402-1  
 
 
74LV08-Q100  
NXP Semiconductors  
Quad 2-input AND gate  
4. Functional diagram  
1
2
&
&
&
&
3
6
1
2
1A  
1B  
1Y  
2Y  
3Y  
3
6
8
4
5
4
5
2A  
2B  
A
B
Y
9
3A  
3B  
9
10  
8
10  
mna221  
12  
13  
4A  
4B  
4Y 11  
12  
13  
11  
mna222  
mna223  
Fig 1. Logic symbol  
Fig 2. IEC logic symbol  
Fig 3. Logic diagram (one gate)  
5. Pinning information  
5.1 Pinning  
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢄ  
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢄ  
ꢀꢅ  
ꢀꢈ  
ꢀꢇ  
ꢀꢀ  
ꢀꢐ  
ꢀꢁ  
ꢀꢄ  
ꢃꢃ  
ꢅꢄ  
ꢅꢁ  
ꢅꢆ  
ꢈꢄ  
ꢈꢁ  
ꢈꢆ  
ꢀꢅ  
ꢀꢈ  
ꢀꢇ  
ꢀꢀ  
ꢀꢐ  
ꢀꢁ  
ꢀꢄ  
ꢃꢃ  
ꢀꢆ  
ꢅꢄ  
ꢅꢁ  
ꢅꢆ  
ꢈꢄ  
ꢈꢁ  
ꢈꢆ  
ꢀꢆ  
ꢇꢁ  
ꢇꢁ  
ꢇꢄ  
ꢇꢄ  
ꢇꢆ  
ꢇꢆ  
ꢉꢊꢋ  
ꢉꢊꢋ  
ꢀꢀꢀꢁꢂꢂꢃꢄꢅꢆ  
ꢀꢀꢀꢁꢂꢂꢃꢄꢅꢇ  
Fig 4. Pin configuration SO14  
Fig 5. Pin configuration TSSOP14  
74LV08_Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 31 July 2012  
2 of 12  
 
 
 
74LV08-Q100  
NXP Semiconductors  
Quad 2-input AND gate  
5.2 Pin description  
Table 2.  
Pin description  
Symbol  
Pin  
Description  
data input  
1A, 2A, 3A, 4A  
1B, 2B, 3B, 4B  
1Y, 2Y, 3Y, 4Y  
GND  
1, 4, 9, 12  
2, 5, 10, 13  
3, 6, 8, 11  
7
data input  
data output  
ground (0 V)  
supply voltage  
VCC  
14  
6. Functional description  
Table 3.  
Function selection[1]  
Input  
nA  
L
Output  
nB  
X
nY  
L
X
L
L
H
H
H
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
IIK  
Parameter  
Conditions  
Min  
Max  
+7.0  
20  
50  
25  
50  
Unit  
V
supply voltage  
0.5  
[1]  
[1]  
input clamping current  
output clamping current  
output current  
VI < 0.5 V or VI > VCC + 0.5 V  
VO < 0.5 V or VO > VCC + 0.5 V  
VO = 0.5 V to (VCC + 0.5 V)  
-
mA  
mA  
mA  
mA  
mA  
C  
IOK  
-
IO  
-
ICC  
supply current  
-
IGND  
Tstg  
Ptot  
ground current  
50  
65  
-
-
storage temperature  
total power dissipation  
+150  
500  
[2]  
Tamb = 40 C to +125 C  
mW  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] For SO14 packages: above 70 C the value of Ptot derates linearly with 8 mW/K.  
For TSSOP14 packages: above 60 C the value of Ptot derates linearly with 5.5 mW/K.  
74LV08_Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 31 July 2012  
3 of 12  
 
 
 
 
 
74LV08-Q100  
NXP Semiconductors  
Quad 2-input AND gate  
8. Recommended operating conditions  
Table 5.  
Recommended operating conditions  
Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
Parameter  
supply voltage[1]  
Conditions  
Min  
Typ  
Max  
5.5  
Unit  
V
1.0  
3.3  
VI  
input voltage  
0
-
VCC  
VCC  
+125  
500  
200  
100  
50  
V
VO  
output voltage  
0
-
V
Tamb  
t/V  
ambient temperature  
input transition rise and fall rate  
40  
+25  
C  
VCC = 1.0 V to 2.0 V  
VCC = 2.0 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
VCC = 3.6 V to 5.5 V  
-
-
-
-
-
-
-
-
ns/V  
ns/V  
ns/V  
ns/V  
[1] The static characteristics are guaranteed from VCC = 1.2 V to VCC = 5.5 V, but LV devices are guaranteed to function down to  
VCC = 1.0 V (with input levels GND or VCC).  
9. Static characteristics  
Table 6.  
Static characteristics  
Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter Conditions  
40 C to +85 C  
40 C to +125 C Unit  
Min  
Typ[1]  
Max  
Min  
Max  
VIH  
HIGH-level input voltage  
VCC = 1.2 V  
0.9  
-
-
-
-
-
-
-
-
-
0.9  
-
V
V
V
V
V
V
V
V
VCC = 2.0 V  
1.4  
-
-
1.4  
-
-
VCC = 2.7 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
VCC = 1.2 V  
2.0  
2.0  
0.7VCC  
-
0.7VCC  
-
VIL  
LOW-level input voltage  
HIGH-level output voltage  
-
-
-
-
0.3  
0.6  
0.8  
0.3VCC  
-
-
-
-
0.3  
0.6  
0.8  
0.3VCC  
VCC = 2.0 V  
VCC = 2.7 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
VI = VIH or VIL  
VOH  
IO = 100 A; VCC = 1.2 V  
IO = 100 A; VCC = 2.0 V  
IO = 100 A; VCC = 2.7 V  
IO = 100 A; VCC = 3.0 V  
IO = 100 A; VCC = 4.5 V  
IO = 6 mA; VCC = 3.0 V  
IO = 12 mA; VCC = 4.5 V  
-
1.2  
2.0  
2.7  
3.0  
4.5  
2.82  
4.2  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
1.8  
2.5  
2.8  
4.3  
2.4  
3.6  
1.8  
2.5  
2.8  
4.3  
2.2  
3.5  
74LV08_Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 31 July 2012  
4 of 12  
 
 
 
74LV08-Q100  
NXP Semiconductors  
Quad 2-input AND gate  
Table 6.  
Static characteristics …continued  
Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
40 C to +85 C  
40 C to +125 C Unit  
Min  
Typ[1]  
Max  
Min  
Max  
VOL  
LOW-level output voltage  
VI = VIH or VIL  
IO = 100 A; VCC = 1.2 V  
IO = 100 A; VCC = 2.0 V  
IO = 100 A; VCC = 2.7 V  
IO = 100 A; VCC = 3.0 V  
IO = 100 A; VCC = 4.5 V  
IO = 6 mA; VCC = 3.0 V  
IO = 12 mA; VCC = 4.5 V  
VI = VCC or GND; VCC = 5.5 V  
-
-
-
-
-
-
-
-
-
0
-
-
-
-
-
-
-
-
-
-
-
V
0
0.2  
0.2  
0.2  
0.2  
0.2  
0.50  
0.65  
1.0  
40  
V
0
0.2  
V
0
0.2  
V
0
0.25  
0.35  
-
0.2  
V
0.40  
0.55  
1.0  
V
V
II  
input leakage current  
supply current  
A  
A  
ICC  
VI = VCC or GND; IO = 0 A;  
VCC = 5.5 V  
-
20.0  
ICC  
additional supply current  
input capacitance  
per input; VI = VCC 0.6 V;  
VCC = 2.7 V to 3.6 V  
-
-
-
500  
-
-
-
850  
-
A  
CI  
3.5  
pF  
[1] Typical values are measured at Tamb = 25 C.  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
GND = 0 V; For test circuit see Figure 7.  
Symbol Parameter Conditions  
40 C to +85 C  
Min  
Typ[1] Max  
40 C to +125 C  
Unit  
Min  
Max  
[2]  
tpd  
propagation delay nA, nB to nY; see Figure 6  
VCC = 1.2 V  
-
-
-
-
-
-
-
45  
15  
11  
7
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
pF  
VCC = 2.0 V  
26  
17  
-
33  
21  
-
VCC = 2.7 V  
[3]  
[3]  
VCC = 3.0 V to 3.6 V; CL = 15 pF  
VCC = 3.0 V to 3.6 V  
9.0  
-
15  
11  
-
19  
14  
-
VCC = 4.5 V to 5.5 V  
[4]  
CPD  
power dissipation CL = 50 pF; fi = 1 MHz;  
10  
capacitance  
VI = GND to VCC  
[1] All typical values are measured at Tamb = 25 C.  
[2] pd is the same as tPLH and tPHL  
t
.
[3] Typical values are measured at nominal supply voltage (VCC = 3.3 V).  
[4] CPD is used to determine the dynamic power dissipation (PD in W).  
PD = CPD VCC2 fi N + (CL VCC2 fo) where:  
fi = input frequency in MHz, fo = output frequency in MHz  
CL = output load capacitance in pF  
VCC = supply voltage in Volts  
N = number of inputs switching  
(CL VCC2 fo) = sum of the outputs.  
74LV08_Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 31 July 2012  
5 of 12  
 
 
 
 
74LV08-Q100  
NXP Semiconductors  
Quad 2-input AND gate  
11. Waveforms  
V
I
V
nA, nB input  
GND  
M
t
t
PLH  
PHL  
V
OH  
nY output  
V
M
V
OL  
mna224  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 6. The input (nA, nB) to output (nY) propagation delays  
Table 8.  
Measurement points  
Supply voltage  
VCC  
Input  
VM  
Output  
VM  
< 2.7 V  
0.5VCC  
1.5 V  
0.5VCC  
0.5VCC  
1.5 V  
0.5VCC  
2.7 V to 3.6 V  
4.5 V  
V
CC  
V
V
O
I
PULSE  
GENERATOR  
DUT  
C
50 pF  
R
L
1 kΩ  
L
R
T
001aaa663  
Test data is given in Table 9.  
Definitions test circuit:  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.  
RL = Load resistance.  
CL = Load capacitance including jig and probe capacitance.  
Fig 7. Load circuit for switching times  
Table 9.  
Test data  
Supply voltage  
VCC  
Input  
VI  
tr, tf  
< 2.7 V  
VCC  
2.7 V  
VCC  
2.5 ns  
2.5 ns  
2.5 ns  
2.7 V to 3.6 V  
4.5 V  
74LV08_Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 31 July 2012  
6 of 12  
 
74LV08-Q100  
NXP Semiconductors  
Quad 2-input AND gate  
12. Package outline  
SO14: plastic small outline package; 14 leads; body width 3.9 mm  
SOT108-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
7
e
detail X  
w
M
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
8.75  
8.55  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.75  
1.27  
0.05  
1.05  
0.25  
0.01  
0.25  
0.1  
0.25  
0.01  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.35  
0.014 0.0075 0.34  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches  
0.041  
0.01 0.004  
0.069  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT108-1  
076E06  
MS-012  
Fig 8. Package outline SOT108-1 (SO14)  
74LV08_Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 31 July 2012  
7 of 12  
 
74LV08-Q100  
NXP Semiconductors  
Quad 2-input AND gate  
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm  
SOT402-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
(A )  
3
A
2
A
A
1
pin 1 index  
θ
L
p
L
1
7
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
5.1  
4.9  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.72  
0.38  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT402-1  
MO-153  
Fig 9. Package outline SOT402-1 (TSSOP14)  
74LV08_Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 31 July 2012  
8 of 12  
74LV08-Q100  
NXP Semiconductors  
Quad 2-input AND gate  
13. Abbreviations  
Table 10. Abbreviations  
Acronym  
CMOS  
DUT  
Description  
Complementary Metal Oxide Semiconductor  
Device Under Test  
ESD  
ElectroStatic Discharge  
Human Body Model  
Machine Model  
HBM  
MM  
TTL  
Transistor-Transistor Logic  
MIL  
Military  
14. Revision history  
Table 11. Revision history  
Document ID  
Release date  
20120731  
Data sheet status  
Change notice  
Supersedes  
74LV08_Q100 v.1  
Product data sheet  
-
-
74LV08_Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 31 July 2012  
9 of 12  
 
 
74LV08-Q100  
NXP Semiconductors  
Quad 2-input AND gate  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use in automotive applications — This NXP  
15.2 Definitions  
Semiconductors product has been qualified for use in automotive  
applications. Unless otherwise agreed in writing, the product is not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer's own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
15.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
74LV08_Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 31 July 2012  
10 of 12  
 
 
 
 
74LV08-Q100  
NXP Semiconductors  
Quad 2-input AND gate  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74LV08_Q100  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 31 July 2012  
11 of 12  
 
 
74LV08-Q100  
NXP Semiconductors  
Quad 2-input AND gate  
17. Contents  
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
6
Functional description . . . . . . . . . . . . . . . . . . . 3  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Recommended operating conditions. . . . . . . . 4  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9  
7
8
9
10  
11  
12  
13  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 11  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2012.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 31 July 2012  
Document identifier: 74LV08_Q100  
 

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