74LVC2GU04GV-Q100 [NXP]

IC INVERT GATE, Gate;


型号：	74LVC2GU04GV-Q100
厂家：	NXP
描述：	IC INVERT GATE, Gate 栅光电二极管逻辑集成电路
文件：	总15页 (文件大小：122K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

74LVC2GU04-Q100

Dual inverter

Rev. 1 — 31 July 2012

Product data sheet

1. General description

The 74LVC2GU04 provides two inverters. Each inverter is a single stage with unbuffered

output.

The inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of

this device in a mixed 3.3 V and 5 V environment.

This product has been qualified to the Automotive Electronics Council (AEC) standard

Q100 (Grade 1) and is suitable for use in automotive applications.

2. Features and benefits

 Automotive product qualification in accordance with AEC-Q100 (Grade 1)

 Specified from 40 C to +85 C and from 40 C to +125 C

 Wide supply voltage range from 1.65 V to 5.5 V

 5 V tolerant input/output for interfacing with 5 V logic

 High noise immunity

 ESD protection:

 MIL-STD-883, method 3015 exceeds 2000 V

 HBM JESD22-A114F exceeds 2000 V

 MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )

 24 mA output drive (V_CC= 3.0 V)

 CMOS low power consumption

 Latch-up performance exceeds 250 mA

 Input accepts voltages up to 5 V

 Multiple package options

3. Ordering information

Table 1.

Ordering information

Type number

Package

Temperature range

Name

SC-88

TSOP6

Description

Version

SOT363

SOT457

74LVC2GU04GW-Q100 40 C to +125 C

74LVC2GU04GV-Q100 40 C to +125 C

plastic surface-mounted package; 6 leads

plastic surface-mounted package (TSOP6);

6 leads

74LVC2GU04-Q100

NXP Semiconductors

Dual inverter

4. Marking

Table 2.

Marking codes

Type number

Marking^[1]

74LVC2GU04GW-Q100

74LVC2GU04GV-Q100

VU4

[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.

5. Functional diagram

100 Ω

mnb106

mnb107

mna636

Fig 1. Logic symbol

Fig 2. IEC logic symbol

Fig 3. Logic diagram (one gate)

6. Pinning information

6.1 Pinning

ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢁꢉꢊꢋꢈꢈ

ꢀ

ꢆ

ꢇ

ꢈ

ꢋ

ꢌ

ꢀꢁ

ꢃꢄꢅ

ꢆꢁ

ꢀꢂ

ꢉ

ꢊꢊ

ꢆꢂ

ꢀꢀꢀꢁꢂꢂꢃꢂꢄꢅ

Fig 4. Pin configuration SOT363 and SOT457

74LVC2GU04_Q100

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6.2 Pin description

Table 3.

Symbol

Pin description

Description

data input

GND

ground (0 V)

data input

data output

supply voltage

data output

V_CC

7. Functional description

Table 4.

Function table^[1]

Input

Output

[1] H = HIGH voltage level; L = LOW voltage level.

8. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol

V_CC

I_IK

Parameter

Conditions

Min

0.5

50

0.5

50

0.5

Max

+6.5

Unit

supply voltage

input clamping current

input voltage

V_I< 0 V

[1]

V_I

+6.5

I_OK

output clamping current

output voltage

V_O< 0 V

[1][2]

V_O

Active mode

V_O= 0 V to V_CC

V_CC+ 0.5

50

100

I_O

output current

C

I_CC

supply current

I_GND

T_stg

P_tot

ground current

100

65

storage temperature

total power dissipation

+150

250

[3]

T_amb= 40 C to +125 C

[1] The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed.

[2] When V_CC= 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.

[3] For SC-88 and SC-74 packages: above 87.5 C the value of P_totderates linearly with 4.0 mW/K.

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9. Recommended operating conditions

Table 6.

Recommended operating conditions

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions

Min

Typ

Max

5.5

Unit

V_CC

V_I

supply voltage

input voltage

1.65

5.5

V_O

output voltage

ambient temperature

Active mode

V_CC

+125

T_amb

t/V

40

C

input transition rise and fall rate V_CC= 1.65 V to 2.7 V

V_CC= 2.7 V to 5.5 V

ns/V

10. Static characteristics

Table 7.

Static characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter

Conditions

Min

Typ

Max

Unit

T_amb= 40 C to +85 C^[1]

V_IH

V_IL

HIGH-level input voltage V_CC= 1.65 V to 5.5 V

LOW-level input voltage V_CC= 1.65 V to 5.5 V

0.75  V_CC

0.25  V_CC

V_OH

HIGH-level output voltage V_I= V_IHor V_IL

I_O= 100 A;

V_CC 0.1

V_CC= 1.65 V to 5.5 V

I_O= 4 mA; V_CC= 1.65 V

I_O= 8 mA; V_CC= 2.3 V

I_O= 12 mA; V_CC= 2.7 V

I_O= 24 mA; V_CC= 3.0 V

I_O= 32 mA; V_CC= 4.5 V

1.2

1.9

2.2

2.3

3.8

V_OL

LOW-level output voltage V_I= V_IHor V_IL

I_O= 100 A;

0.1

V_CC= 1.65 V to 5.5 V

I_O= 4 mA; V_CC= 1.65 V

I_O= 8 mA; V_CC= 2.3 V

I_O= 12 mA; V_CC= 2.7 V

I_O= 24 mA; V_CC= 3.0 V

I_O= 32 mA; V_CC= 4.5 V

0.45

0.3

0.4

0.55

5

[2]

I_I

input leakage current

supply current

V_I= 5.5 V or GND;

V_CC= 0 V to 5.5 V

0.1

A

I_CC

C_I

V_I= 5.5 V or GND; I_O= 0 A;

V_CC= 1.65 V to 5.5 V

0.1

A

input capacitance

V_CC= 3.3 V; V_I= GND to V_CC

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Table 7.

Static characteristics …continued

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter

Conditions

Min

Typ

Max

Unit

T_amb= 40 C to +125 C

V_IH

V_IL

HIGH-level input voltage V_CC= 1.65 V to 5.5 V

LOW-level input voltage V_CC= 1.65 V to 5.5 V

0.8  V_CC

0.2  V_CC

V_OH

HIGH-level output voltage V_I= V_IHor V_IL

I_O= 100 A;

V_CC 0.1

V_CC= 1.65 V to 5.5 V

I_O= 4 mA; V_CC= 1.65 V

I_O= 8 mA; V_CC= 2.3 V

I_O= 12 mA; V_CC= 2.7 V

I_O= 24 mA; V_CC= 3.0 V

I_O= 32 mA; V_CC= 4.5 V

0.95

1.7

1.9

2.0

3.4

V_OL

LOW-level output voltage V_I= V_IHor V_IL

I_O= 100 A;

0.1

V_CC= 1.65 V to 5.5 V

I_O= 4 mA; V_CC= 1.65 V

I_O= 8 mA; V_CC= 2.3 V

I_O= 12 mA; V_CC= 2.7 V

I_O= 24 mA; V_CC= 3.0 V

I_O= 32 mA; V_CC= 4.5 V

0.7

0.45

0.6

0.8

20

I_I

input leakage current

supply current

V_I= 5.5 V or GND;

V_CC= 0 V to 5.5 V

A

I_CC

V_I= 5.5 V or GND; I_O= 0 A;

V_CC= 1.65 V to 5.5 V

A

[1] All typical values are measured at T_amb= 25 C.

[2] These typical values are measured at V_CC= 3.3 V.

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11. Dynamic characteristics

Table 8.

Dynamic characteristics

Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 6.

Symbol Parameter Conditions 40 C to +85 C

40 C to +125 C Unit

Min

Typ^[1]

Max

Min

Max

[2]

t_pd

propagation delay nA to nY; see Figure 5

V_CC= 1.65 V to 1.95 V

V_CC= 2.3 V to 2.7 V

0.5

0.3

2.3

1.8

2.6

2.3

1.7

7.8

5.0

4.0

4.5

3.7

3.0

0.5

0.3

6.3

5.0

5.6

4.5

3.8

V_CC= 2.7 V

V_CC= 3.0 V to 3.6 V

V_CC= 4.5 V to 5.5 V

[3]

C_PD

power dissipation V_I= GND to V_CC; V_CC= 3.3 V

capacitance

[1] Typical values are measured at T_amb= 25 C and V_CC= 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively.

[2] t_pdis the same as t_PLHand t_PHL

[3] C_PDis used to determine the dynamic power dissipation (P_Din W).

P_D= C_PD V_CC² f_i N + (C_L V_CC² f_o) where:

f_i= input frequency in MHz;

f_o= output frequency in MHz;

C_L= output load capacitance in pF;

V_CC= supply voltage in V;

N = number of inputs switching;

(C_L V_CC² f_o) = sum of outputs.

12. Waveforms

nA input

GND

PHL

PLH

nY output

mna344

Measurement points are given in Table 9.

V_OLand V_OHare typical output voltage levels that occur with the output load.

Fig 5. The input (nA) to output (nY) propagation delay times

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Table 9.

Measurement points

Supply voltage

V_CC

Input

Output

V_M

1.65 V to 1.95 V

2.3 V to 2.7 V

2.7 V

0.5  V_CC

1.5 V

0.5  V_CC

1.5 V

3.0 V to 3.6 V

4.5 V to 5.5 V

1.5 V

0.5  V_CC

EXT

DUT

mna616

Test data is given in Table 10.

Definitions for test circuit:

R_L= Load resistance.

C_L= Load capacitance including jig and probe capacitance.

R_T= Termination resistance should be equal to the output impedance Z_oof the pulse generator.

V_EXT= External voltage for measuring switching times.

Fig 6. Test circuit for measuring switching times

Table 10. Test data

Supply voltage

V_CC

Input

V_I

Load

C_L

V_EXT

t_r= t_f

R_L

t_PLH, t_PHL

open

1.65 V to 1.95 V

2.3 V to 2.7 V

2.7 V

V_CC

2.7 V

V_CC

 2.0 ns

 2.5 ns

30 pF

50 pF

1 k

500 

open

3.0 V to 3.6 V

4.5 V to 5.5 V

open

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mnb108

160

(mA/V)

120

= 560 kΩ

bias

0.47 μF

100 μF

input

output

mna638

(V)

T_amb= 25 C.

I_O

g_fs

--------

V_I

f_i= 1 kHz.

V_Ois constant.

Fig 7. Typical forward transconductance as a

function of supply voltage

Fig 8. Test set-up for measuring forward

transconductance

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13. Application information

Some applications are:

• Linear amplifier (see Figure 9)

• Crystal oscillator design (see Figure 10)

Remark: All values given are typical unless otherwise specified.

1 μF

U04

out

mna053

mna052

V_o(p-p)= V_CC 1.5 V centered at 0.5  V_CC

C1 = 47 pF (typical).

C2 = 22 pF (typical).

G_OL

A_u= –

-----------------------------------------

1 +

R1 = 1 M to 10 M (typical).

------

1 + G_OL

R2 optimum value depends on the frequency and

required stability against changes in V_CCor average

minimum I_CC(I_CCis typically 2 mA at V_CC= 3.3 V and

f = 10 MHz).

_OL= open loop gain.

A_u= voltage amplification.

R1  3 k, R2  1 M.

Z_L> 10 k; A_OL= 20 (typical).

Typical unity gain bandwidth product is 5 MHz.

Fig 9. Linear amplifier configuration

Fig 10. Crystal oscillator configuration

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14. Package outline

Plastic surface-mounted package; 6 leads

SOT363

pin 1

index

M B

detail X

2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

max

0.30

0.20

1.1

0.8

0.25

0.10

2.2

1.8

1.35

1.15

2.2

2.0

0.45

0.15

0.25

0.15

0.1

1.3

0.65

0.2

0.1

REFERENCES

JEDEC JEITA

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

04-11-08

06-03-16

SOT363

SC-88

Fig 11. Package outline SOT363 (SC-88)

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Plastic surface-mounted package (TSOP6); 6 leads

SOT457

pin 1

index

M B

detail X

2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

0.1

0.013

0.40

0.25

1.1

0.9

0.26

0.10

3.1

2.7

1.7

1.3

3.0

2.5

0.6

0.2

0.33

0.23

0.95

0.2

0.1

REFERENCES

JEDEC JEITA

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

05-11-07

06-03-16

SOT457

SC-74

Fig 12. Package outline SOT457 (TSOP6)

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15. Abbreviations

Table 11. Abbreviations

Acronym

CMOS

DUT

Description

Complementary Metal Oxide Semiconductor

Device Under Test

ESD

ElectroStatic Discharge

Human Body Model

Machine Model

HBM

MIL

Military

16. Revision history

Table 12. Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

74LVC2GU04_Q100 v.1 20120731

Product data sheet

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17. Legal information

17.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use in automotive applications — This NXP

17.2 Definitions

Semiconductors product has been qualified for use in automotive

applications. Unless otherwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer's own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

17.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

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No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

17.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

18. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

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19. Contents

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Ordering information. . . . . . . . . . . . . . . . . . . . . 1

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

Functional description . . . . . . . . . . . . . . . . . . . 3

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Recommended operating conditions. . . . . . . . 4

Static characteristics. . . . . . . . . . . . . . . . . . . . . 4

Dynamic characteristics . . . . . . . . . . . . . . . . . . 6

Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Application information. . . . . . . . . . . . . . . . . . . 9

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12

Legal information. . . . . . . . . . . . . . . . . . . . . . . 13

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14

17.1

17.2

17.3

17.4

Contact information. . . . . . . . . . . . . . . . . . . . . 14

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 31 July 2012

Document identifier: 74LVC2GU04_Q100

74LVC2GU04GV-Q100 [NXP]

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