74LVCH32374AEC/G,5 [NXP]

74LVCH32374A - 32-bit edge-triggered D-type flip-flop with 5 V tolerant inputs/outputs; 3-state BGA 96-Pin;
74LVCH32374AEC/G,5
型号: 74LVCH32374AEC/G,5
厂家: NXP    NXP
描述:

74LVCH32374A - 32-bit edge-triggered D-type flip-flop with 5 V tolerant inputs/outputs; 3-state BGA 96-Pin

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74LVCH32374A  
32-bit edge-triggered D-type flip-flop with 5 V tolerant  
inputs/outputs; 3-state  
Rev. 3 — 18 December 2012  
Product data sheet  
1. General description  
The 74LVCH32374A is a 32-bit edge-triggered flip-flop featuring separate D-type inputs  
for each flip-flop and 3-state outputs for bus oriented applications. The device consists of  
4 sections of 8 edge-triggered flip-flops. A clock (pin nCP) input and an output enable  
input (pin nOE) are provided per 8-bit section. The flip-flops will store the state of their  
individual D-inputs that meet the set-up and hold time requirements on the LOW-to-HIGH  
nCP transition. When pin nOE is LOW, the contents of the flip-flops are available at the  
outputs. When pin nOE is HIGH, the outputs go to the high-impedance OFF-state.  
Operation of pin nOE does not affect the state of the flip-flops. The inputs can be driven  
from either 3.3 V or 5 V devices. In 3-state operation, the outputs can handle 5 V. These  
features allow the use of these devices in a mixed 3.3 V or 5 V environment.  
Bus hold on data inputs eliminates the need for external pull-up resistors to hold unused  
inputs.  
2. Features and benefits  
5 V tolerant inputs/outputs for interfacing with 5 V logic  
Wide supply voltage range from 1.2 V to 3.6 V  
CMOS low power consumption  
Multibyte flow-through standard pin-out architecture  
Multiple low inductance supply pins for minimum noise and ground bounce  
Direct interface with TTL levels  
All data inputs have bus hold  
High impedance when VCC = 0 V  
Latch-up performance exceeds 500 mA per JESD 78 Class II  
Complies with JEDEC standard:  
JESD8-7A (1.65 V to 1.95 V)  
JESD8-5A (2.3 V to 2.7 V)  
JESD8-C/JESD36 (2.7 V to 3.6 V)  
ESD protection:  
HBM JESD22-A114F exceeds 2000 V  
MM JESD22-A115-B exceeds 200 V  
CDM JESD22-C101E exceeds 1000 V  
Specified from 40 C to +85 C and 40 C to +125 C  
Packaged in plastic fine-pitch ball grid array package  
 
 
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74LVCH32374AEC 40 C to +125 C  
LFBGA96 plastic low profile fine-pitch ball grid array package;  
SOT536-1  
96 balls; body 13.5 5.5 1.05 mm  
4. Functional diagram  
1D0  
2D0  
1Q0  
2Q0  
D
Q
D
Q
CP  
FF 1  
CP  
FF 9  
1CP  
1OE  
2CP  
2OE  
to 7 other channels  
to 7 other channels  
3D0  
4D0  
3Q0  
4Q0  
D
Q
D
Q
CP  
CP  
FF 17  
FF 25  
3CP  
3OE  
4CP  
4OE  
to 7 other channels  
to 7 other channels  
coa012  
Fig 1. Logic symbol  
V
CC  
data  
input  
to internal circuit  
mna473  
Fig 2. Bus hold circuit  
74LVCH32374A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 18 December 2012  
2 of 15  
 
 
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
5. Pinning information  
5.1 Pinning  
001aah180  
6
5
4
3
2
1
1D1 1D3 1D5 1D7 2D1 2D3 2D5 2D6 3D1 3D3 3D5 3D7 4D1 4D3 4D5 4D6  
1D0 1D2 1D4 1D6 2D0 2D2 2D4 2D7 3D0 3D2 3D4 3D6 4D0 4D2 4D4 4D7  
V
V
V
V
V
V
V
V
1CP GND  
1OE GND  
GND GND  
GND GND  
GND 2CP 3CP GND  
GND 2OE 3OE GND  
GND GND  
GND GND  
GND 4CP  
GND 4OE  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
1Q0 1Q2 1Q4 1Q6 2Q0 2Q2 2Q4 2Q7 3Q0 3Q2 3Q4 3Q6 4Q0 4Q2 4Q4 4Q7  
1Q1 1Q3 1Q5 1Q7 2Q1 2Q3 2Q5 2Q6 3Q1 3Q3 3Q5 3Q7 4Q1 4Q3 4Q5 4Q6  
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Fig 3. Pin configuration  
5.2 Pin description  
Table 2.  
Symbol  
nOE (n = 1 to 4)  
nCP (n = 1 to 4)  
1D[0:7]  
Pin description  
Ball  
Description  
A3, H3, J3, T3  
A4, H4, J4, T4  
output enable input (active LOW)  
clock input  
A5, A6, B5, B6, C5, C6, D5, D6  
E5, E6, F5, F6, G5, G6, H6, H5  
J5, J6, K5, K6, L5, L6, M5, M6  
N5, N6, P5, P6, R5, R6, T6, T5  
A2, A1, B2, B1, C2, C1, D2, D1  
E2, E1, F2, F1, G2, G1, H1, H2  
J2, J1, K2, K1, L2, L1, M2, M1  
N2, N1, P2, P1, R2, R1, T1, T2  
data input  
2D[0:7]  
data input  
3D[0:7]  
data input  
4D[0:7]  
data input  
1Q[0:7]  
data output  
2Q[0:7]  
data output  
3Q[0:7]  
data output  
4Q[0:7]  
data output  
GND  
B3, B4, D3, D4, E3, E4, G3, G4, K3, K4, M3, ground (0 V)  
M4, N3, N4, R3, R4  
VCC  
C3, C4, F3, F4, L3, L4, P3, P4  
supply voltage  
74LVCH32374A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 18 December 2012  
3 of 15  
 
 
 
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
6. Functional description  
Table 3.  
Function table[1]  
Operating mode Input  
nOE  
Internal flip-flop  
Output  
nCP  
nDn  
nQn  
L
Load and read  
register  
L
l
L
L
h
l
H
L
H
Load register and  
disable outputs  
H
H
Z
h
H
Z
[1] H = HIGH voltage level  
L = LOW voltage level  
h = HIGH voltage level one set-up time prior to the HIGH-to-LOW CP transition  
l = LOW voltage level one set-up time prior to the HIGH-to-LOW CP transition  
Z = high-impedance OFF-state  
= LOW-to-HIGH CP transition  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V)[1]  
Symbol  
VCC  
IIK  
Parameter  
Conditions  
Min  
0.5  
50  
0.5  
-
Max  
+6.5  
-
Unit  
V
supply voltage  
input clamping current  
input voltage  
VI < 0  
mA  
V
[2]  
VI  
+6.5  
50  
IOK  
output clamping current  
output voltage  
VO > VCC or VO < 0  
output HIGH or LOW state  
output 3-state  
mA  
V
[3]  
[3]  
VO  
0.5  
0.5  
-
VCC + 0.5  
+6.5  
50  
V
IO  
output current  
VO = 0 V to VCC  
mA  
mA  
mA  
C  
ICC  
IGND  
Tstg  
Ptot  
supply current  
-
200  
ground current  
200  
65  
-
-
storage temperature  
total power dissipation  
+150  
1000  
[4]  
Tamb = 40 C to +125 C  
mW  
[1] All supply and ground pins connected externally to one voltage source.  
[2] The minimum input voltage ratings may be exceeded if the input current ratings are observed.  
[3] The output voltage ratings may be exceeded if the output current ratings are observed.  
[4] Above 70 C the value of Ptot derate linearly with 1.8 mW/K.  
74LVCH32374A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 18 December 2012  
4 of 15  
 
 
 
 
 
 
 
 
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
8. Recommended operating conditions  
Table 5.  
Symbol  
VCC  
Recommended operating conditions  
Parameter  
Conditions  
Min  
1.65  
1.2  
0
Typ  
Max  
3.6  
3.6  
5.5  
VCC  
5.5  
Unit  
V
supply voltage  
-
-
-
-
-
-
-
-
functional  
V
VI  
input voltage  
V
VO  
output voltage  
output HIGH or LOW state  
output 3-state  
0
V
0
V
Tamb  
ambient temperature  
in free air  
40  
-
+125  
20  
C  
ns/V  
ns/V  
t/V  
input transition rise and fall rate VCC = 1.65 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
-
10  
9. Static characteristics  
Table 6.  
Static characteristics  
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
40 C to +85 C  
Min Max  
Typ[1]  
1.08  
40 C to +125 C  
Min Max  
1.08  
Unit  
VIH  
HIGH-level  
VCC = 1.2 V  
-
-
-
-
-
-
V
V
V
V
V
V
V
V
input voltage  
VCC = 1.65 V to 1.95 V  
0.65 VCC  
-
-
-
-
-
-
-
-
0.65 VCC  
VCC = 2.3 V to 2.7 V  
1.7  
-
1.7  
VCC = 2.7 V to 3.6 V  
VCC = 1.2 V  
2.0  
-
2.0  
VIL  
LOW-level  
-
-
-
-
0.12  
-
-
-
-
0.12  
input voltage  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
VI = VIH or VIL  
0.35 VCC  
0.7  
0.35 VCC  
0.7  
0.8  
0.8  
VOH  
HIGH-level  
output voltage  
IO = 100 A;  
VCC 0.2  
-
VCC 0.3  
-
V
VCC = 1.65 V to 3.6 V  
IO = 4 mA; VCC = 1.65 V 1.2  
IO = 8 mA; VCC = 2.3 V 1.8  
-
-
-
-
-
-
-
-
-
-
1.05  
1.65  
2.05  
2.25  
2.0  
-
-
-
-
-
V
V
V
V
V
IO = 12 mA; VCC = 2.7 V 2.2  
IO = 18 mA; VCC = 3.0 V 2.4  
IO = 24 mA; VCC = 3.0 V 2.2  
VI = VIH or VIL  
VOL  
LOW-level  
output voltage  
IO = 100 A;  
CC = 1.65 V to 3.6 V  
-
-
0.2  
-
0.3  
V
V
IO = 4 mA; VCC = 1.65 V  
IO = 8 mA; VCC = 2.3 V  
IO = 12 mA; VCC = 2.7 V  
IO = 24 mA; VCC = 3.0 V  
-
-
-
-
-
-
0.45  
0.6  
-
-
-
-
-
0.65  
0.8  
V
-
V
-
0.4  
0.6  
V
-
0.55  
5  
0.8  
V
II  
input leakage  
current  
VCC = 3.6 V;  
VI = 5.5 V or GND[2]  
0.1  
20  
A  
74LVCH32374A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 18 December 2012  
5 of 15  
 
 
 
 
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
Table 6.  
Static characteristics ...continued  
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
40 C to +85 C  
40 C to +125 C  
Unit  
Min  
Typ[1]  
Max  
Min  
Max  
20  
IOZ  
OFF-state  
output current  
VI = VIH or VIL; VCC = 3.6 V;  
VO = 5.5 V or GND[2]  
-
-
-
-
0.1  
5  
-
-
-
-
A  
A  
A  
A  
IOFF  
ICC  
power-off  
leakage current  
VCC = 0 V; VI or VO = 5.5 V  
0.1  
0.1  
5
10  
40  
20  
supply current VCC = 3.6 V;  
VI = VCC or GND; IO = 0 A  
160  
ICC  
additional  
supply current  
per input pin;  
VCC = 2.7 V to 3.6 V;  
500  
5000  
VI = VCC 0.6 V; IO = 0 A  
CI  
input  
capacitance  
VCC = 0 V to 3.6 V;  
VI = GND to VCC  
-
5.0  
-
-
-
pF  
IBHL  
bus hold LOW VCC = 1.65; VI = 0.58 V[3][4]  
10  
30  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
10  
25  
-
-
-
-
-
-
-
-
-
-
-
-
A  
A  
A  
A  
A  
A  
A  
A  
A  
A  
A  
A  
current  
VCC = 2.3; VI = 0.7 V  
VCC = 3.0; VI = 0.8 V  
bus hold HIGH VCC = 1.65; VI = 1.07 V[3][4]  
75  
60  
IBHH  
10  
30  
75  
200  
300  
500  
200  
300  
500  
10  
25  
60  
200  
300  
500  
200  
300  
500  
current  
VCC = 2.3; VI = 1.7 V  
VCC = 3.0; VI = 2.0 V  
bus hold LOW VCC = 1.95 V[3][5]  
IBHLO  
overdrive  
current  
VCC = 2.7 V  
VCC = 3.6 V  
IBHHO  
bus hold HIGH VCC = 1.95 V[3][5]  
overdrive  
current  
VCC = 2.7 V  
VCC = 3.6 V  
[1] All typical values are measured at VCC = 3.3 V and Tamb = 25 C.  
[2] The bus hold circuit is switched off when VI > VCC allowing 5.5 V on the input pin.  
[3] Valid for data inputs only. Control inputs do not have a bus hold circuit.  
[4] The specified sustaining current at the data input holds the input below the specified VI level.  
[5] The specified overdrive current at the data input forces the data input to the opposite logic input state.  
74LVCH32374A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 18 December 2012  
6 of 15  
 
 
 
 
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 7.  
Symbol Parameter  
Conditions  
40 C to +85 C  
40 C to +125 C Unit  
Min  
Typ[1]  
Max  
Min  
Max  
[2]  
[2]  
[2]  
tpd  
ten  
tdis  
propagation  
delay  
nCP to nQn; see Figure 4  
VCC = 1.2 V  
-
14  
6.9  
3.7  
3.4  
3.1  
-
-
-
ns  
ns  
ns  
ns  
ns  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V  
2.1  
1.5  
1.5  
1.5  
13.5  
6.7  
6.0  
5.4  
2.1  
1.5  
1.5  
1.5  
15.6  
7.7  
7.5  
7.0  
VCC = 3.0 V to 3.6 V  
nOE to nQn; see Figure 6  
VCC = 1.2 V  
enable time  
-
20  
5.9  
3.4  
3.6  
2.7  
-
-
-
ns  
ns  
ns  
ns  
ns  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V  
1.5  
1.5  
1.5  
1.0  
13.1  
6.9  
6.0  
5.2  
1.5  
1.5  
1.5  
1.0  
15.1  
8.0  
7.5  
6.5  
VCC = 3.0 V to 3.6 V  
nOE to nQn; see Figure 4  
VCC = 1.2 V  
disable time  
-
12  
4.6  
2.5  
3.4  
3.1  
-
-
-
ns  
ns  
ns  
ns  
ns  
VCC = 1.65 V to 1.95 V  
2.8  
1.0  
1.5  
1.5  
9.1  
4.9  
5.1  
4.9  
2.8  
1.0  
1.5  
1.5  
10.5  
5.7  
6.5  
6.5  
V
CC = 2.3 V to 2.7 V  
VCC = 2.7 V  
VCC = 3.0 V to 3.6 V  
nCP HIGH; see Figure 4  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V  
tW  
tsu  
th  
pulse width  
set-up time  
hold time  
5.0  
4.0  
3.0  
3.0  
-
-
-
-
-
-
5.0  
4.0  
3.0  
3.0  
-
-
-
-
ns  
ns  
ns  
ns  
-
VCC = 3.0 V to 3.6 V  
nDn to nCP; see Figure 5  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V  
1.5  
4.0  
3.0  
1.9  
1.9  
-
-
-
-
-
-
4.0  
3.0  
1.9  
1.9  
-
-
-
-
ns  
ns  
ns  
ns  
-
VCC = 3.0 V to 3.6 V  
nDn to nCP; see Figure 5  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V  
0.3  
3.0  
2.5  
1.1  
1.5  
-
-
-
-
-
3.0  
2.5  
1.1  
1.5  
-
-
-
-
ns  
ns  
ns  
ns  
-
-
VCC = 3.0 V to 3.6 V  
0.3  
74LVCH32374A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 18 December 2012  
7 of 15  
 
 
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
Table 7.  
Dynamic characteristics ...continued  
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 7.  
Symbol Parameter  
Conditions  
40 C to +85 C  
40 C to +125 C Unit  
Min  
Typ[1]  
Max  
Min  
Max  
fmax  
maximum  
frequency  
see Figure 4  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V  
100  
125  
150  
150  
-
-
-
80  
100  
120  
120  
-
-
ns  
-
-
-
-
-
ns  
-
300  
-
MHz  
MHz  
ns  
VCC = 3.0 V to 3.6 V  
VCC = 3.0 V to 3.6 V  
-
-
[3]  
[4]  
tsk(o)  
CPD  
output skew  
time  
1.0  
1.5  
power  
dissipation  
capacitance  
per input; VI = GND to VCC  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
-
-
-
14.1  
16.4  
18.5  
-
-
-
-
-
-
-
-
-
pF  
pF  
pF  
VCC = 3.0 V to 3.6 V  
[1] Typical values are measured at Tamb = 25 C and VCC = 1.2 V, 1.8 V, 2.5 V, 2.7 V and 3.3 V respectively.  
[2] tpd is the same as tPLH and tPHL  
ten is the same as tPZL and tPZH  
tdis is the same as tPLZ and tPHZ  
[3] Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.  
[4] PD is used to determine the dynamic power dissipation (PD in W).  
.
.
.
C
PD = CPD VCC2 fi N + (CL VCC2 fo) where:  
fi = input frequency in MHz; fo = output frequency in MHz  
CL = output load capacitance in pF  
VCC = supply voltage in Volts  
N = number of inputs switching  
(CL VCC2 fo) = sum of the outputs  
11. Waveforms  
1/f  
max  
V
I
nCP input  
V
t
V
M
M
GND  
t
W
t
PHL  
PLH  
V
OH  
V
nQn output  
M
001aaa256  
V
OL  
Measurement points are given in Table 8.  
VOL and VOH are typical output voltage levels that occur with the output load.  
Fig 4. Clock (nCP) to output (nQn) propagation delays, the clock pulse width and the maximum clock frequency  
74LVCH32374A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 18 December 2012  
8 of 15  
 
 
 
 
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
V
I
V
nCP input  
M
GND  
t
t
su  
su  
t
t
h
h
V
I
V
nDn input  
M
GND  
V
OH  
V
nQn output  
M
V
OL  
001aaa257  
Measurement points are given in Table 8.  
OL and VOH are typical output voltage levels that occur with the output load.  
V
Fig 5. Set-up and hold times for inputs (nDn) to inputs (nCP)  
V
I
nOE input  
V
M
GND  
t
t
PZL  
PLZ  
V
CC  
output  
LOW-to-OFF  
OFF-to-LOW  
V
M
V
X
V
OL  
t
t
PZH  
PHZ  
V
OH  
V
Y
output  
HIGH-to-OFF  
OFF-to-HIGH  
V
M
GND  
outputs  
enabled  
outputs  
enabled  
outputs  
disabled  
mna478  
Measurement points are given in Table 8.  
OL and VOH are typical output voltage levels that occur with the output load.  
V
Fig 6. 3-state output enable and disable times  
74LVCH32374A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 18 December 2012  
9 of 15  
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
Table 8.  
Measurement points  
Supply voltage  
VCC  
Input  
VI  
Output  
VM  
VM  
VX  
VY  
1.2 V  
VCC  
VCC  
VCC  
2.7 V  
2.7 V  
0.5 VCC  
0.5 VCC  
0.5 VCC  
1.5 V  
0.5 VCC  
0.5 VCC  
0.5 VCC  
1.5 V  
VOL + 0.15 V  
VOL + 0.15 V  
VOL + 0.15 V  
VOL + 0.3 V  
VOL + 0.3 V  
VOH 0.15 V  
VOH 0.15 V  
VOH 0.15 V  
VOH 0.3 V  
VOH 0.3 V  
1.65 V to 1.95 V  
2.3 V to 2.7 V  
2.7 V  
3.0 V to 3.6 V  
1.5 V  
1.5 V  
V
EXT  
V
CC  
R
L
L
V
V
O
I
G
DUT  
R
T
C
L
R
mna616  
Test data is given in Table 9. Definitions for test circuit:  
RL = Load resistance  
CL = Load capacitance including jig and probe capacitance  
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator  
Fig 7. Load circuitry for switching times  
Table 9.  
Test data  
Supply voltage  
Input  
VI  
Load  
CL  
VEXT  
tr, tf  
RL  
tPLH, tPHL  
open  
tPLZ, tPZL  
tPHZ, tPZH  
1.2 V  
VCC  
VCC  
VCC  
2.7 V  
2.7 V  
2 ns  
2 ns  
2 ns  
2.5 ns  
2.5 ns  
30 pF  
30 pF  
30 pF  
50 pF  
50 pF  
1 k  
1 k  
500   
500   
500   
2 VCC  
2 VCC  
2 VCC  
2 VCC  
2 VCC  
GND  
GND  
GND  
GND  
GND  
1.65 V to 1.95 V  
2.3 V to 2.7 V  
2.7 V  
open  
open  
open  
3.0 V to 3.6 V  
open  
74LVCH32374A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 18 December 2012  
10 of 15  
 
 
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
12. Package outline  
LFBGA96: plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm SOT536-1  
B
A
D
ball A1  
index area  
A
2
A
E
A
1
detail X  
e
1
C
1/2 e  
y
y
v M  
w M  
C
C
A B  
C
1
e
b
T
R
P
N
e
M
L
K
J
H
G
F
e
2
1/2 e  
E
D
C
B
A
ball A1  
index area  
1
2
3
4
5
6
X
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
UNIT  
A
A
b
e
e
e
v
w
y
y
1
D
E
1
2
1
2
max.  
0.41  
0.31  
1.2  
0.9  
0.51  
0.41  
5.6  
5.4  
13.6  
13.4  
mm  
1.5  
4
12  
0.1  
0.2  
0.8  
0.15  
0.1  
REFERENCES  
JEDEC JEITA  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
00-03-04  
03-02-05  
SOT536-1  
Fig 8. Package outline SOT536-1 (LFBGA96)  
74LVCH32374A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 18 December 2012  
11 of 15  
 
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
13. Abbreviations  
Table 10. Abbreviations  
Acronym  
CDM  
DUT  
Description  
Charged Device Model  
Device Under Test  
ESD  
ElectroStatic Discharge  
Human Body Model  
Machine Model  
HBM  
MM  
TTL  
Transistor-Transistor Logic  
14. Revision history  
Table 11. Revision history  
Document ID  
Release date  
20121218  
Data sheet status  
Change notice  
Supersedes  
74LVCH32374A v.3  
Modifications:  
Product data sheet  
-
74LVCH32374A v.2  
The format of this data sheet has been redesigned to comply with the new identity guidelines  
of NXP Semiconductors.  
Legal texts have been adapted to the new company name where appropriate.  
Table 4, Table 5, Table 6 , Table 7, Table 8 and Table 9: values added for lower voltage  
ranges.  
74LVCH32374A v.2  
74LVCH32374A v.1  
20040519  
19991124  
Product specification  
Product specification  
-
-
74LVCH32374A v.1  
-
74LVCH32374A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 18 December 2012  
12 of 15  
 
 
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
15.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
15.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
74LVCH32374A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 18 December 2012  
13 of 15  
 
 
 
 
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74LVCH32374A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 3 — 18 December 2012  
14 of 15  
 
 
74LVCH32374A  
NXP Semiconductors  
32-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state  
17. Contents  
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
6
Functional description . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 5  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12  
7
8
9
10  
11  
12  
13  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 14  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2012.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 18 December 2012  
Document identifier: 74LVCH32374A  
 

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