74LVTN16245BDGG [NXP]

3.3 V 16-bit transceiver; 3-state; 3.3 V 16位收发器;三态
74LVTN16245BDGG
型号: 74LVTN16245BDGG
厂家: NXP    NXP
描述:

3.3 V 16-bit transceiver; 3-state
3.3 V 16位收发器;三态

文件: 总16页 (文件大小:94K)
中文:  中文翻译
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74LVTN16245B  
3.3 V 16-bit transceiver; 3-state  
Rev. 01 — 29 July 2009  
Product data sheet  
1. General description  
The 74LVTN16245B is a high-performance BiCMOS product designed for VCC operation  
at 3.3 V.  
This device is a 16-bit transceiver featuring non-inverting 3-state bus compatible outputs  
in both send and receive directions. The control function implementation minimizes  
external timing requirements. The device features an output enable input (nOE) for easy  
cascading and a direction input (nDIR) for direction control.  
2. Features  
I 16-bit bus interface  
I 3-state buffers  
I Output capability: +64 mA and 32 mA  
I TTL input and output switching levels  
I Input and output interface capability to systems at 5 V supply  
I Power-up 3-state  
I Live insertion and extraction permitted  
I No bus current loading when output is tied to 5 V bus  
I Latch-up protection  
N JESD78 Class II exceeds 500 mA  
I ESD protection:  
N HBM JESD22-A114E exceeds 2000 V  
N MM JESD22-A115-A exceeds 200 V  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74LVTN16245BDGG 40 °C to +85 °C  
TSSOP48  
plastic thin shrink small outline package;  
48 leads; body width 6.1 mm  
SOT362-1  
74LVTN16245BBQ 40 °C to +85 °C  
HUQFN60U plastic thermal enhanced ultra thin quad flat  
package; no leads; 60 terminals; UTLP based;  
body 4 x 6 x 0.55 mm  
SOT1025-1  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
4. Functional diagram  
2DIR  
1DIR  
2OE  
2B0  
2B1  
2B2  
2B3  
2B4  
2B5  
2B6  
1OE  
1B0  
2A0  
2A1  
2A2  
2A3  
2A4  
2A5  
2A6  
2A7  
1A0  
1A1  
1A2  
1A3  
1A4  
1A5  
1A6  
1A7  
1B1  
1B2  
1B3  
1B4  
1B5  
1B6  
1B7  
2B7  
001aaa789  
Fig 1. Logic symbol  
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
2 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
1OE  
G3  
1DIR  
3EN1[BA]  
3EN2[AB]  
G6  
2OE  
2DIR  
6EN4[BA]  
6EN5[AB]  
1A0  
1
1B0  
2
1A1  
1A2  
1A3  
1A4  
1A5  
1A6  
1A7  
2A0  
1B1  
1B2  
1B3  
1B4  
1B5  
1B6  
1B7  
2B0  
4
5
2A1  
2A2  
2A3  
2A4  
2A5  
2A6  
2A7  
2B1  
2B2  
2B3  
2B4  
2B5  
2B6  
2B7  
001aak306  
Fig 2. IEC logic symbol  
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
3 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
5. Pinning information  
5.1 Pinning  
74LVTN16245B  
1
2
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
1DIR  
1OE  
1A0  
1A1  
GND  
1A2  
1A3  
1B0  
1B1  
GND  
1B2  
1B3  
3
4
5
6
7
V
CC  
V
CC  
8
1B4  
1B5  
GND  
1B6  
1B7  
2B0  
2B1  
GND  
2B2  
2B3  
1A4  
1A5  
GND  
1A6  
1A7  
2A0  
2A1  
GND  
2A2  
2A3  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
V
CC  
V
CC  
2B4  
2B5  
2A4  
2A5  
GND  
2A6  
2A7  
2OE  
GND  
2B6  
2B7  
2DIR  
001aak307  
Fig 3. Pin configuration SOT362-1 (TSSOP48)  
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
4 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
terminal 1  
index area  
D1  
A32  
D5  
A31  
A30  
A29  
A28  
A27  
D8  
D4  
B20  
B19  
B18  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
A10  
A26  
A25  
A24  
A23  
A22  
A21  
A20  
A19  
A18  
A17  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
B17  
B16  
B15  
B14  
B13  
B12  
B11  
74LVTN16245B  
(1)  
GND  
D6  
B8  
B9  
B10  
D7  
D2  
A11  
A12  
A13  
A14  
A15  
A16  
D3  
001aak308  
Transparent top view  
(1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input.  
Fig 4. Pin configuration SOT1025-1 (HUQFN60U)  
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
5 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
5.2 Pin description  
Table 2.  
Symbol  
Pin description  
Pin  
Description  
SOT362-1  
SOT1025-1  
1DIR, 2DIR  
1B0 to 1B7  
1, 24  
A30, A13  
direction control input  
data input/output  
2, 3, 5, 6, 8, 9, 11, 12  
B20, A31, D5, D1, A2, B2, B3,  
A5  
2B0 to 2B7  
GND  
13, 14, 16, 17, 19, 20, 22, 23  
4, 10, 15, 21, 28, 34, 39, 45  
A6, B5, B6, A9, D2, D6, A12, B8 data input/output  
A32, A3, A8, A11, A16, A19,  
A24, A27  
ground (0 V)  
VCC  
7, 18, 31, 42  
A1, A10, A17, A26  
A29, A14  
supply voltage  
1OE, 2OE  
2A0 to 2A7  
48, 25  
output enable input (active LOW)  
data input/output  
36, 35, 33, 32, 30, 29, 27, 26  
A21, B13, B12, A18, D3, D7,  
A15, B10  
1A0, to 1A7  
n.c.  
47, 46, 44, 43, 41, 40, 38, 37  
-
B18, A28, D8, D4, A25, B16,  
B15, A22  
data input/output  
not connected  
A4, A7, A20, A23, B1, B4, B7,  
B9, B11, B14, B17, B19  
6. Functional description  
Table 3.  
Function table [1]  
Control  
Input/output  
nOE  
L
nDIR  
nAn  
nBn  
L
output nAn = nBn  
input  
L
H
X
input  
Z
output nBx = nAx  
Z
H
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
VI  
Parameter  
Conditions  
Min  
0.5  
0.5  
0.5  
Max  
+4.6  
+7.0  
+7.0  
Unit  
V
supply voltage  
input voltage  
output voltage  
[1]  
[1]  
V
VO  
output in OFF-state or  
HIGH-state  
V
IIK  
IOK  
IO  
input clamping current  
output clamping current  
output current  
VI < 0 V  
50  
50  
-
-
mA  
mA  
mA  
mA  
°C  
VO < 0 V  
-
output in LOW-state  
output in HIGH-state  
128  
-
64  
65  
-
Tstg  
Tj  
storage temperature  
junction temperature  
+150  
150  
[2]  
°C  
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
6 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
Table 4.  
Limiting values …continued  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
Ptot  
total power dissipation  
Tamb = 40 °C to +85 °C  
TSSOP48 package  
HUQFN60U package  
[3]  
[4]  
-
-
500  
mW  
mW  
1000  
[1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.  
[2] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction  
temperatures which are detrimental to reliability.  
[3] Above 60 °C the value of Ptot derates linearly with 5.5 mW/K.  
[4] Above 70 °C the value of Ptot derates linearly with 1.8 mW/K.  
8. Recommended operating conditions  
Table 5.  
Symbol  
VCC  
VI  
Recommended operating conditions  
Parameter  
Conditions  
Min  
2.7  
0
Typ  
Max  
3.6  
5.5  
-
Unit  
V
supply voltage  
-
-
-
-
-
-
-
input voltage  
V
VIH  
HIGH-level input voltage  
LOW-level input voltage  
HIGH-level output current  
LOW-level output current  
2.0  
-
V
VIL  
0.8  
-
V
IOH  
32  
-
mA  
mA  
mA  
IOL  
none  
32  
64  
current duty cycle 50 %;  
fi 1 kHz  
-
Tamb  
ambient temperature  
in free-air  
40  
-
-
+85  
10  
°C  
t/V  
input transition rise and fall rate outputs enabled  
-
ns/V  
9. Static characteristics  
Table 6.  
Static characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
Min  
Typ[1]  
Max  
Unit  
Tamb = 40 °C to +85 °C  
VIK  
input clamping voltage  
VCC = 2.7 V; IIK = 18 mA  
1.2  
0.85  
-
-
-
-
V
V
V
V
VOH  
HIGH-level output voltage IOH = 100 µA; VCC = 2.7 V to 3.6 V  
VCC 0.2 VCC  
IOH = 8 mA; VCC = 2.7 V  
2.4  
2.0  
2.5  
2.3  
IOH = 32 mA; VCC = 3.0 V  
VOL  
LOW-level output voltage VCC = 2.7 V  
IOL = 100 µA  
-
-
0.07  
0.3  
0.2  
0.5  
V
V
IOL = 24 mA  
VCC = 3.0 V  
IOL = 16 mA  
-
-
-
0.25  
0.3  
0.4  
V
V
V
IOL = 32 mA  
0.5  
IOL = 64 mA  
0.4  
0.55  
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
7 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
Table 6.  
Static characteristics …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
Min  
Typ[1]  
Max  
Unit  
II  
input leakage current  
control pins  
VCC = 3.6 V; VI = VCC or GND  
VCC = 0 V or 3.6 V; VI = 5.5 V  
input/output data pins; VCC = 3.6 V  
VI = 5.5 V  
-
-
0.1  
0.1  
±1  
µA  
µA  
10  
[2]  
-
0.1  
0.5  
0.1  
0.1  
75  
20  
µA  
µA  
µA  
µA  
µA  
VI = VCC  
-
10  
VI = 0 V  
5  
-
-
IOFF  
ILO  
power-off leakage current VCC = 0 V; VI or VO = 0 V to 4.5 V  
±100  
125  
output leakage current  
output in HIGH-state when VO > VCC  
VO = 5.5 V; VCC = 3.0 V  
;
-
[3]  
IO(pu/pd) power-up/power-down  
output current  
V
CC 1.2 V; VO = 0.5 V to VCC  
;
-
40  
±100  
µA  
VI = GND or VCC; nOE = don’t care  
ICC  
supply current  
VCC = 3.6 V; VI = GND or VCC; IO = 0 A  
output HIGH  
-
-
-
-
0.07  
4.0  
0.12  
6.0  
mA  
mA  
mA  
mA  
output LOW  
[4]  
[5]  
outputs disabled  
0.07  
0.1  
0.12  
0.2  
ICC  
additional supply current per input pin; VCC = 3.0 V to 3.6 V; one input  
at VCC 0.6 V other inputs at VCC or GND  
CI  
input capacitance  
pins nDIR and nOE, VO = 0 V or 3.0 V  
-
-
3
9
-
-
pF  
pF  
Cio(off)  
off-state input/output  
capacitance  
pins nAn and nBn, outputs disabled;  
VO = GND or VCC  
[1] Typical values are measured at VCC = 3.3 V and at Tamb = 25 °C.  
[2] Unused pins at VCC or GND.  
[3] This parameter is valid for any VCC between 0 V and 1.2 V with a transition time of up to 10 ms. From VCC = 1.2 V to VCC = 3.3 V ± 0.3 V  
a transition time of 100 µs is permitted. This parameter is valid for Tamb = 25 °C only.  
[4] ICC is measured with outputs pulled to VCC or GND.  
[5] This is the increase in supply current for each input at the specified voltage level other than VCC or GND.  
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
8 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7.  
Symbol  
Parameter  
Conditions  
Min  
Typ[1]  
Max  
Unit  
Tamb = 40 °C to +85 °C  
tPLH  
tPHL  
tPZH  
tPZL  
tPHZ  
tPLZ  
LOW to HIGH  
propagation delay  
nAn to nBn or nBn to nAn;  
see Figure 5  
VCC = 2.7 V  
-
-
3.5  
3.3  
ns  
ns  
VCC = 3.0 V to 3.6 V  
1.0  
1.9  
HIGH to LOW  
propagation delay  
nAn to nBn or nBn to nAn;  
see Figure 5  
VCC = 2.7 V  
-
-
3.5  
3.3  
ns  
ns  
VCC = 3.0 V to 3.6 V  
1.0  
1.7  
OFF-state to HIGH  
propagation delay  
nOE to nAn or nBn;  
see Figure 6  
VCC = 2.7 V  
-
-
5.3  
4.5  
ns  
ns  
VCC = 3.0 V to 3.6 V  
1.0  
2.8  
OFF-state to LOW  
propagation delay  
nOE to nAn or nBn;  
see Figure 6  
VCC = 2.7 V  
-
-
5.1  
4.1  
ns  
ns  
VCC = 3.0 V to 3.6 V  
1.0  
2.8  
HIGH to OFF-state  
propagation delay  
nOE to nAn or nBn;  
see Figure 6  
VCC = 2.7 V  
-
-
5.7  
5.1  
ns  
ns  
VCC = 3.0 V to 3.6 V  
1.5  
3.2  
LOW to OFF-state  
propagation delay  
nOE to nAn or nBn;  
see Figure 6  
VCC = 2.7 V  
-
-
4.6  
4.6  
ns  
ns  
VCC = 3.0 V to 3.6 V  
1.5  
3.0  
[1] Typical values are measured at VCC = 3.3 V and Tamb = 25 °C.  
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
9 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
11. Waveforms  
V
I
nAn, nBn  
input  
V
M
GND  
t
t
PHL  
PLH  
V
OH  
nBn, nAn  
output  
V
M
mna477  
V
OL  
Measurements points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 5. Propagation delay input (nAn, nBn) to output (nBn, nAn)  
V
I
nOE input  
V
M
t
0 V  
t
PZL  
PLZ  
3.0 V  
nAn or nBn  
output  
V
M
V
X
V
OL  
t
t
PHZ  
PZH  
V
OH  
V
Y
nBn or nAn  
output  
V
M
0 V  
001aaj658  
Measurements points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 6. Enable and disable times  
Table 8.  
Input  
VM  
Measurement points  
Output  
VM  
VX  
VY  
1.5 V  
1.5 V  
VOL + 0.3 V  
VOH 0.3 V  
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
10 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
t
W
V
I
90 %  
negative  
pulse  
V
V
V
M
M
10 %  
0 V  
t
t
r
f
t
t
f
r
V
I
90 %  
positive  
pulse  
V
M
M
10 %  
0 V  
t
W
V
EXT  
V
CC  
R
L
V
V
O
I
PULSE  
GENERATOR  
DUT  
R
T
C
L
R
L
001aae235  
Test data is given in Table 9.  
Definitions test circuit:  
RL = Load resistance.  
CL = Load capacitance including jig and probe capacitance.  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.  
VEXT = External voltage for measuring switching times.  
Fig 7. Load circuit for measuring switching times  
Table 9.  
Input  
VI  
Test data  
Load  
CL  
VEXT  
fi  
tW  
tr, tf  
RL  
tPHZ, tPZH  
GND  
tPLZ, tPZL  
tPLH, tPHL  
2.7 V  
10 MHz  
500 ns  
2.5 ns  
50 pF  
500 Ω  
6 V  
open  
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
11 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
12. Package outline  
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm  
SOT362-1  
E
D
A
X
c
H
v
M
A
y
E
Z
48  
25  
Q
A
2
(A )  
3
A
A
1
pin 1 index  
θ
L
p
L
detail X  
1
24  
w
M
b
e
p
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions).  
A
(1)  
(2)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
8o  
0o  
0.15  
0.05  
1.05  
0.85  
0.28  
0.17  
0.2  
0.1  
12.6  
12.4  
6.2  
6.0  
8.3  
7.9  
0.8  
0.4  
0.50  
0.35  
0.8  
0.4  
mm  
1.2  
0.5  
1
0.25  
0.25  
0.08  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT362-1  
MO-153  
Fig 8. Package outline SOT362-1 (TSSOP48)  
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
12 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
HUQFN60U: plastic thermal enhanced ultra thin quad flat package; no leads  
60 terminals; UTLP based; body 4 x 6 x 0.55 mm  
SOT1025-1  
D
B
A
terminal 1  
index area  
E
A
A
1
detail X  
e
2
M
M
v
C A  
B
v
C A  
C
B
e
1
b
M
M
w
C
w
C
1/2 e  
e
y
y
C
1
L
1
D2  
D6  
D3  
D7  
A11  
A16  
B8  
B10  
L
eR  
A10  
B7  
A17  
e
B11  
E
e
3
e
4
h
1/2 e  
B1  
A1  
B17  
A26  
terminal 1  
index area  
D5  
D1  
D8  
D4  
B20  
B18  
A32  
A27  
D
h
X
k
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
UNIT  
A
1
b
D
D
h
E
E
e
e
1
e
2
e
3
e
4
eR  
k
L
L
v
w
y
y
1
h
1
max  
0.05 0.35 4.1  
0.00 0.25  
1.9  
1.8  
6.1  
5.9  
3.9  
3.8  
0.25 0.35 0.125  
0.15 0.25 0.025  
mm  
0.6  
0.5  
1
2.5  
3
4.5  
0.5  
0.07 0.05 0.08 0.1  
3.9  
REFERENCES  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
- - -  
JEDEC  
JEITA  
07-08-28  
07-11-14  
SOT1025-1  
- - -  
- - -  
Fig 9. Package outline SOT1025-1 (HUQFN60U)  
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
13 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
13. Abbreviations  
Table 10. Abbreviations  
Acronym  
BiCMOS  
DUT  
Description  
Bipolar Complementary Metal Oxide Semiconductor  
Device Under Test  
ESD  
Electrostatic Discharge  
HBM  
Human Body Model  
MM  
Machine Model  
TTL  
Transistor-Transistor Logic  
14. Revision history  
Table 11. Revision history  
Document ID  
Release date  
20090729  
Data sheet status  
Change notice  
Supersedes  
74LVTN16245B_1  
Product data sheet  
-
-
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
14 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
15.2 Definitions  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
15.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74LVTN16245B_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 29 July 2009  
15 of 16  
74LVTN16245B  
NXP Semiconductors  
3.3 V 16-bit transceiver; 3-state  
17. Contents  
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6  
6
Functional description . . . . . . . . . . . . . . . . . . . 6  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Recommended operating conditions. . . . . . . . 7  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14  
7
8
9
10  
11  
12  
13  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 15  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2009.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 29 July 2009  
Document identifier: 74LVTN16245B_1  

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