933445280113 [NXP]

DIODE 1650 V, SILICON, RECTIFIER DIODE, Rectifier Diode;
933445280113
型号: 933445280113
厂家: NXP    NXP
描述:

DIODE 1650 V, SILICON, RECTIFIER DIODE, Rectifier Diode

二极管
文件: 总9页 (文件大小:72K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
BY228  
Damper diode  
1996 Sep 26  
Product specification  
Supersedes data of May 1996  
Philips Semiconductors  
Product specification  
Damper diode  
BY228  
This package is hermetically sealed  
and fatigue free as coefficients of  
expansion of all used parts are  
matched.  
FEATURES  
DESCRIPTION  
Glass passivated  
Rugged glass package, using a high  
temperature alloyed construction.  
High maximum operating  
temperature  
Low leakage current  
Excellent stability  
Available in ammo-pack  
k
a
Also available with preformed leads  
for easy insertion.  
MAM104  
APPLICATIONS  
Damper diode in high frequency  
horizontal deflection circuits up to  
16 kHz.  
Fig.1 Simplified outline (SOD64) and symbol.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
1650  
1650  
1500  
5
UNIT  
VRSM  
VRRM  
VR  
non-repetitive peak reverse voltage  
repetitive peak reverse voltage  
continuous reverse voltage  
working peak forward current  
V
V
V
A
IFWM  
Tamb = 75 °C; PCB mounting (see  
Fig.4); see Fig.2  
IFRM  
IFSM  
repetitive peak forward current  
10  
50  
A
A
non-repetitive peak forward current  
t = 10 ms half sinewave;  
Tj = Tj max prior to surge;  
VR = VRRMmax  
Tstg  
Tj  
storage temperature  
junction temperature  
65  
65  
+175  
+150  
°C  
°C  
ELECTRICAL CHARACTERISTICS  
Tj = 25 °C; unless otherwise specified.  
SYMBOL  
PARAMETER  
forward voltage  
CONDITIONS  
MAX.  
1.4  
1.5  
150  
1
UNIT  
VF  
IF = 5 A; Tj = Tj max; see Fig.3  
IF = 5 A; see Fig.3  
V
V
IR  
trr  
reverse current  
VR = VRmax; Tj = 150 °C  
µA  
µs  
reverse recovery time  
when switched from IF = 0.5 A to IR = 1 A;  
measured at IR = 0.25 A; see Fig.6  
tfr  
forward recovery time  
when switched to IF = 5 A in 50 ns;  
Tj = Tj max; Fig.7  
1
µs  
1996 Sep 26  
2
Philips Semiconductors  
Product specification  
Damper diode  
BY228  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE  
UNIT  
Rth j-tp  
Rth j-a  
thermal resistance from junction to tie-point  
thermal resistance from junction to ambient  
lead length = 10 mm  
note 1  
25  
75  
40  
K/W  
K/W  
K/W  
mounted as shown in Fig.5  
Note  
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 µm, see Fig.4.  
For more information please refer to the “General Part of associated Handbook”.  
1996 Sep 26  
3
Philips Semiconductors  
Product specification  
Damper diode  
BY228  
GRAPHICAL DATA  
MBH407  
MBH408  
1.25  
5
handbook, halfpage  
handbook, halfpage  
P
I
tot  
F
(W)  
(A)  
1.00  
4
0.75  
0.50  
0.25  
0
3
2
1
0
0
0
1
2
3
4
I
5
(A)  
1
2
V
(V)  
F
FWM  
Solid line: basic high-voltage E/W modulator circuit; see Fig.8.  
Dotted line: basic conventional horizontal deflection circuit; see Fig.9.  
Curves include power dissipation due to switching losses.  
Dotted line: Tj = 150 °C.  
Solid line: Tj = 25 °C.  
Fig.2 Maximum total power dissipation as a  
function of working peak forward current.  
Fig.3 Forward current as a function of forward  
voltage; maximum values.  
35  
handbook, halfpage  
10  
50  
handbook, halfpage  
25  
2
2
3 cm  
copper  
3 cm  
copper  
7
50  
30  
10  
2
3
MGA200  
MGA204  
25.4  
Dimensions in mm.  
Dimensions in mm.  
Fig.5 Mounting with additional printed circuit  
board for heat sink purposes.  
Fig.4 Device mounted on a printed-circuit board.  
1996 Sep 26  
4
Philips Semiconductors  
Product specification  
Damper diode  
BY228  
I
F
DUT  
(A)  
+
0.5  
t
rr  
25 V  
10 Ω  
1 Ω  
50 Ω  
0
0.25  
0.5  
t
I
R
(A)  
MAM057  
1.0  
Input impedance oscilloscope: 1 M, 22 pF; tr 7 ns.  
Source impedance: 50 ; tr 15 ns.  
Fig.6 Test circuit and reverse recovery time waveform and definition.  
MGD600  
handbook, halfpage  
V
F
90%  
100%  
t
t
fr  
I
F
10%  
t
Fig.7 Forward recovery time definition.  
1996 Sep 26  
5
Philips Semiconductors  
Product specification  
Damper diode  
BY228  
APPLICATION INFORMATION  
For horizontal deflection circuits, two basic applications are shown in Figs 8 and 9.  
The maximum allowable total power dissipation for the diode can be calculated from the thermal resistance Rth j-a and  
the difference between Tj max and Tamb max in the application. The maximum IFWM can then be taken from Fig.2.  
The basic application waveforms in Fig.10 relate to the circuit in Fig.8. In the circuit in Fig.9 the forward conduction time  
of the diode is shorter, allowing a higher IFWM (see Fig.2).  
handbook, halfpage  
horizontal  
deflection  
transistor  
horizontal  
deflection  
transistor  
handbook, halfpage  
D1  
L
Y
L
Y
D1  
C
f
C
s
+ (E-W)  
MBE934  
MBE935  
D1 = BY228.  
D1 = BY228.  
Fig.8 Application in basic high-voltage E/W  
modulator circuit.  
Fig.9 Application in basic horizontal deflection  
circuit.  
h
I
I
FRM  
F
I
FWM  
time  
V
RRM  
V
R
time  
t
p
MCD430 - 1  
T
Fig.10 Basic application waveforms.  
6
1996 Sep 26  
Philips Semiconductors  
Product specification  
Damper diode  
BY228  
PACKAGE OUTLINE  
k
a
1.35  
max  
4.5  
max  
MBC049  
28 min  
5.0 max  
28 min  
Dimensions in mm.  
The marking band indicates the cathode.  
Fig.11 SOD64.  
DEFINITIONS  
Data Sheet Status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 Sep 26  
7
Philips Semiconductors: Product information on BY228, Damper diode  
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BY228 Damper diode  
26-Sep-96  
Product  
Specification  
7
52  
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SOD64 Full productio  
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Standard  
Standard  
BY228  
Marking *  
9334 452 80133  
AMO  
SOD64 Full productio  
Ammopack,  
Axial, 52mm  
BY228  
BY228  
Standard  
BY228/20  
9336 215 80112 Marking * Bulk SOD64 Full productio  
Pack  
Standard  
BY228/21 BY228/21 9340 453 60112 Marking * Bulk SOD64 Full productio  
Pack  
Standard  
BY228/24  
9340 559 50112 Marking * Bulk SOD64 Full productio  
Pack  
Standard  
BY228/33 BY228/33 9340 153 20112 Marking * Bulk SOD64 Full productio  
Pack  
Standard  
BY228/40 BY228/40 9340 221 80112 Marking * Bulk SOD64 Full productio  
Pack  
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Philips Semiconductors: Product information on BY228, Damper diode  
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