933498250113 [NXP]

DIODE 1 A, 1000 V, SILICON, SIGNAL DIODE, Signal Diode;


型号：	933498250113
厂家：	NXP
描述：	DIODE 1 A, 1000 V, SILICON, SIGNAL DIODE, Signal Diode 二极管
文件：	总5页 (文件大小：34K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DISCRETE SEMICONDUCTORS

DATA SHEET

handbook, 2 columns

M3D116

1N4001G to 1N4007G

Rectifiers

1996 May 24

Product speciﬁcation

Supersedes data of April 1992

Philips Semiconductors

Product speciﬁcation

Rectiﬁers

1N4001G to 1N4007G

This package is hermetically sealed

and fatigue free as coefficients of

expansion of all used parts are

matched.

FEATURES

DESCRIPTION

• Glass passivated

Rugged glass package, using a high

temperature alloyed construction.

• High maximum operating

temperature

• Low leakage current

• Excellent stability

2/3 page (Datasheet)

• Available in ammo-pack.

MAM047

Fig.1 Simplified outline (SOD57) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

V_RRM

repetitive peak reverse voltage

1N4001G

−

100

200

400

600

800

1N4002G

1N4003G

1N4004G

1N4005G

1N4006G

1N4007G

1000

V_R

continuous reverse voltage

1N4001G

−

100

1N4002G

1N4003G

200

1N4004G

400

1N4005G

600

1N4006G

800

1N4007G

1000

I_F(AV)

1.00 A

0.75 A

1.00 A

average forward current

averaged over any 20 ms

period; T_amb= 75 °C; see Fig.2

−

averaged over any 20 ms

period; T_amb= 100 °C; see Fig.2

I_F

continuous forward current

repetitive peak forward current

non-repetitive peak forward current

storage temperature

−

T_amb= 75 °C; see Fig.2

I_FRM

I_FSM

T_stg

T_j

half sinewave; 60 Hz

−

+175

−65

°C

junction temperature

1996 May 24

Philips Semiconductors

Product speciﬁcation

Rectiﬁers

1N4001G to 1N4007G

ELECTRICAL CHARACTERISTICS

T_j= 25 °C; unless otherwise speciﬁed.

SYMBOL

PARAMETER

forward voltage

CONDITIONS

I_F= 1 A; see Fig.3

MAX.

UNIT

V_F

1.1

0.8

V_F(AV)

I_R

full-cycle average forward voltage

reverse current

I_F(AV)= 1 A

V_R= V_Rmax

µA

V_R= V_Rmax; T_amb= 100 °C

V_R= V_RRMmax; T_amb= 75 °C

I_R(AV)

full-cycle average reverse current

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

R_{th j-tp}

R_{th j-a}

thermal resistance from junction to tie-point

thermal resistance from junction to ambient

lead length = 10 mm

note 1

K/W

100

Note

1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.4.

For more information please refer to the “General Part of associated Handbook”.

1996 May 24

Philips Semiconductors

Product speciﬁcation

Rectiﬁers

1N4001G to 1N4007G

GRAPHICAL DATA

MBH385

handbook, halfpage

MBH386

1.5

handbook, halfpage

(A)

0.5

(1)

(2)

(3)

−1

0.5

1.5

(V)

100

200

(°C)

amb

(1) T_amb= 100 °C.

(2) T_amb= 20 °C.

(3) T_amb= −50 °C.

Fig.2 Maximum forward current as a function of

ambient temperature.

Fig.3 Forward current as a function of forward

voltage; typical values.

handbook, halfpage

MGA200

Dimensions in mm.

Fig.4 Device mounted on a printed-circuit board.

1996 May 24

Philips Semiconductors

Product speciﬁcation

Rectiﬁers

1N4001G to 1N4007G

PACKAGE OUTLINE

handbook, full pagewidth

0.81

max

3.81

max

4.57

max

MBC880

28 min

Dimensions in mm.

Fig.5 SOD57.

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

1996 May 24

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