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933812310115 [NXP]

DIODE 0.6 A, 800 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS, 100H03, 2 PIN, Signal Diode;
933812310115
型号： 933812310115
厂家： NXP    NXP
描述：

DIODE 0.6 A, 800 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS, 100H03, 2 PIN, Signal Diode
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DISCRETE SEMICONDUCTORS  
DATA SHEET  
book, halfpage  
BYD37 series  
Fast soft-recovery  
controlled avalanche rectifiers  
Product specification  
1999 Nov 16  
Supersedes data of 1996 Jun 05  
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYD37 series  
FEATURES  
DESCRIPTION  
and fatigue free as coefficients of  
expansion of all used parts are  
matched.  
• Glass passivated  
Cavity free cylindrical glass package  
through Implotec (1) technology.  
This package is hermetically sealed  
• High maximum operating  
temperature  
(1) Implotec is a trademark of Philips.  
• Low leakage current  
• Excellent stability  
k
a
handbook, 4 columns  
• Guaranteed avalanche energy  
absorption capability  
MAM061  
• Smallest surface mount rectifier  
outline  
Fig.1 Simplified outline (SOD87) and symbol.  
• Shipped in 8 mm embossed tape.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VRRM  
repetitive peak reverse voltage  
BYD37D  
−
−
−
−
−
200  
400  
V
V
V
V
V
BYD37G  
BYD37J  
600  
BYD37K  
800  
BYD37M  
1000  
VR  
continuous reverse voltage  
BYD37D  
−
−
−
−
−
−
200  
400  
600  
800  
1000  
1.5  
V
V
V
V
V
A
BYD37G  
BYD37J  
BYD37K  
BYD37M  
IF(AV)  
average forward current  
Ttp = 105 °C; see Fig.2;  
averaged over any 20 ms period;  
see also Fig.6  
IF(AV)  
average forward current  
Tamb = 60 °C; PCB mounting (see  
Fig.11); see Fig.3;  
−
0.6  
A
averaged over any 20 ms period;  
see also Fig.6  
IFRM  
repetitive peak forward current  
Ttp = 105 °C; see Fig.4  
−
−
−
13  
5.5  
20  
A
A
A
Tamb = 60 °C; see Fig.5  
IFSM  
non-repetitive peak forward current  
t = 10 ms half sine wave; Tj = Tj max  
prior to surge; VR = VRRMmax  
1999 Nov 16  
2
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYD37 series  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
ERSM  
non-repetitive peak reverse  
avalanche energy  
L = 120 mH; Tj = Tj max prior to  
surge; inductive load switched off  
BYD37D to J  
−
10 mJ  
mJ  
BYD37K and M  
−
7
Tstg  
Tj  
storage temperature  
junction temperature  
−65  
−65  
+175 °C  
+175 °C  
see Fig.7  
ELECTRICAL CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
forward voltage  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VF  
IF = 1 A; Tj = Tj max  
see Fig.8  
;
−
−
1.1  
V
V
IF = 1 A;  
−
−
1.3  
see Fig.8  
V(BR)R  
reverse avalanche breakdown  
voltage  
IR = 0.1 mA  
BYD37D  
BYD37G  
300  
500  
700  
900  
1100  
−
−
−
−
−
−
−
−
−
−
V
V
BYD37J  
−
V
BYD37K  
−
V
BYD37M  
−
V
IR  
reverse current  
VR = VRRMmax; see Fig.9  
VR = VRRMmax  
1
µA  
µA  
;
−
100  
Tj = 165 °C; see Fig.9  
trr  
reverse recovery time  
BYD37D to J  
when switched from  
IF = 0.5 A to IR = 1 A;  
measured at IR = 0.25A;  
see Fig.12  
−
−
−
−
250  
300  
ns  
ns  
BYD37K and M  
Cd  
diode capacitance  
f = 1 MHz; VR = 0;  
see Fig.10  
−
20  
−
pF  
maximum slope of reverse recovery when switched from  
dIR  
--------  
dt  
current  
BYD37D to J  
BYD37K and M  
IF = 1 A to VR ≥ 30 V and  
dIF/dt = −1 A/µs;  
see Fig.13  
−
−
−
−
6
5
A/µs  
A/µs  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE  
UNIT  
Rth j-tp  
Rth j-a  
thermal resistance from junction to tie-point  
thermal resistance from junction to ambient  
30  
K/W  
K/W  
note 1  
150  
Note  
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.11.  
For more information please refer to the “General Part of associated Handbook”.  
1999 Nov 16  
3
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYD37 series  
GRAPHICAL DATA  
MGA854  
MGA855  
0.8  
3
handbook, halfpage  
handbook, halfpage  
I
F(AV)  
(A)  
I
F(AV)  
(A)  
0.6  
2
0.4  
0.2  
1
0
0
0
0
100  
200  
100  
200  
o
o
T
tp  
( C)  
T
( C)  
amb  
a = 1.42; VR = VRRMmax; δ = 0.5.  
a = 1.42; VR = VRRMmax; δ = 0.5.  
Device mounted as shown in Fig.11.  
Switched mode application.  
Switched mode application.  
Fig.2 Maximum permissible average forward  
current as a function of tie-point temperature  
(including losses due to reverse leakage).  
Fig.3 Maximum permissible average forward  
current as a function of ambient temperature  
(including losses due to reverse leakage).  
MLB268  
16  
I
FRM  
(A)  
δ
= 0.05  
12  
0.1  
0.2  
8
4
0
0.5  
1
2
1
2
3
4
10  
10  
1
10  
10  
10  
10  
t
(ms)  
p
Ttp = 105 °C; Rth j-tp = 30 K/W.  
VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 1000 V.  
Fig.4 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.  
1999 Nov 16  
4
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYD37 series  
MLB267  
6
I
δ
= 0.05  
FRM  
(A)  
4
0.1  
0.2  
2
0.5  
1
0
10  
2
1
2
3
4
10  
1
10  
10  
10  
10  
t
(ms)  
p
Tamb = 60 °C; Rth j-a = 150 K/W.  
VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 1000 V.  
Fig.5 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.  
MGA861  
MGA869  
2.4  
200  
handbook, halfpage  
handbook, halfpage  
a = 3 2.5  
2
1.57  
1.42  
P
(W)  
T
j
o
( C)  
1.6  
0.8  
100  
D
G
J
K
M
V
0
0
0
0
400  
800  
1200  
0.8  
1.6  
(V)  
R
I
(A)  
F(AV)  
a = IF(RMS)/IF(AV); VR = VRRMmax; δ = 0.5.  
Solid line = VR.  
Dotted line = VRRM; δ = 0.5.  
Fig.6 Maximum steady state power dissipation  
(forward plus leakage current losses,  
excluding switching losses) as a function  
of average forward current.  
Fig.7 Maximum permissible junction temperature  
as a function of reverse voltage.  
1999 Nov 16  
5
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYD37 series  
MGA853  
MGA850  
3
6
10  
handbook, halfpage  
handbook, halfpage  
I
I
R
F
(µA)  
(A)  
2
10  
4
10  
2
0
1
0
0
1
2
3
100  
200  
o
( C)  
V
(V)  
T
j
F
Dotted line: Tj = 175 °C.  
Solid line: Tj = 25 °C.  
VR = VRRMmax  
.
Fig.9 Reverse current as a function of junction  
temperature; maximum values.  
Fig.8 Forward current as a function of forward  
voltage; maximum values.  
MGA862  
2
10  
handbook, halfpage  
50  
C
d
(pF)  
4.5  
10  
50  
D, G, J  
K, M  
2.5  
1
1.25  
MSB213  
2
3
1
10  
10  
10  
V
(V)  
R
f = 1 MHz; Tj = 25 °C.  
Dimensions in mm.  
Fig.10 Diode capacitance as a function of reverse  
voltage; typical values.  
Fig.11 Printed-circuit board for surface mounting.  
1999 Nov 16  
6
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYD37 series  
I
F
DUT  
(A)  
+
0.5  
t
rr  
25 V  
10 Ω  
1 Ω  
50 Ω  
0
0.25  
0.5  
t
I
R
(A)  
MAM057  
1.0  
Input impedance oscilloscope: 1 MΩ, 22 pF; tr ≤ 7 ns.  
Source impedance: 50 Ω; tr ≤ 15 ns.  
Fig.12 Test circuit and reverse recovery time waveform and definition.  
I
ndbook, halfpage  
F
dI  
F
dt  
t
rr  
t
10%  
dI  
R
dt  
100%  
I
R
MGC499  
Fig.13 Reverse recovery definitions.  
1999 Nov 16  
7
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYD37 series  
PACKAGE OUTLINE  
Hermetically sealed glass surface mounted package;  
ImplotecTM(1) technology; 2 connectors  
SOD87  
k
a
(2)  
D
D
1
L
L
H
DIMENSIONS (mm are the original dimensions)  
D1  
L
D
H
UNIT  
0
1
2 mm  
scale  
2.1  
2.0  
2.0  
1.8  
3.7  
3.3  
mm  
0.3  
Notes  
1. Implotec is a trademark of Philips.  
2. The marking indicates the cathode.  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
99-03-31  
99-06-04  
SOD87  
100H03  
DEFINITIONS  
Data Sheet Status  
Objective specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Preliminary specification  
Product specification  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1999 Nov 16  
8
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYD37 series  
NOTES  
1999 Nov 16  
9
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYD37 series  
NOTES  
1999 Nov 16  
10  
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYD37 series  
NOTES  
1999 Nov 16  
11  
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,  
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
Tel. +64 9 849 4160, Fax. +64 9 849 7811  
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,  
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210  
Norway: Box 1, Manglerud 0612, OSLO,  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773  
Pakistan: see Singapore  
Belgium: see The Netherlands  
Brazil: see South America  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 68 9211, Fax. +359 2 68 9102  
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,  
Tel. +48 22 5710 000, Fax. +48 22 5710 001  
Portugal: see Spain  
Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381, Fax. +1 800 943 0087  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,  
Tel. +852 2319 7888, Fax. +852 2319 7700  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 755 6918, Fax. +7 095 755 6919  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,  
Colombia: see South America  
Czech Republic: see Austria  
Tel. +65 350 2538, Fax. +65 251 6500  
Slovakia: see Austria  
Slovenia: see Italy  
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,  
Tel. +45 33 29 3333, Fax. +45 33 29 3905  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,  
Tel. +27 11 471 5401, Fax. +27 11 471 5398  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. +358 9 615 800, Fax. +358 9 6158 0920  
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427  
South America: Al. Vicente Pinzon, 173, 6th floor,  
04547-130 SÃO PAULO, SP, Brazil,  
Tel. +55 11 821 2333, Fax. +55 11 821 2382  
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,  
Tel. +49 40 2353 60, Fax. +49 40 2353 6300  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 93 301 6312, Fax. +34 93 301 4107  
Hungary: see Austria  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745  
India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,  
Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2741 Fax. +41 1 488 3263  
Indonesia: PT Philips Development Corporation, Semiconductors Division,  
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,  
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,  
Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,  
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813  
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),  
Tel. +39 039 203 6838, Fax +39 039 203 6800  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,  
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +1 800 234 7381, Fax. +1 800 943 0087  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Middle East: see Italy  
Tel. +381 11 62 5344, Fax.+381 11 63 5777  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
68  
SCA  
© Philips Electronics N.V. 1999  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
135002/03/pp12  
Date of release: 1999 Nov 16  
Document order number: 9397 750 06274  
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Description  
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Automotive  
Consumer Multimedia  
Systems  
Cavity free cylindrical glass package through ImplotecÔ (1) technology. This package is hermetically sealed and fatigue free as coefficients  
of expansion of all used parts are matched.  
Communications  
PC/PC-peripherals  
(1) Implotec is a trademark of Philips.  
Cross reference  
Models  
Packages  
Features  
Application notes  
Selection guides  
Other technical documentation  
End of Life information  
Datahandbook system  
l Glass passivated  
l High maximum operating temperature  
l Low leakage current  
l Excellent stability  
l Guaranteed avalanche energy absorption capability  
l Smallest surface mount rectifier outline  
l Shipped in 8 mm embossed tape.  
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BYD37 series Fast soft-recovery controlled  
avalanche rectifiers  
16-Nov-99  
Product  
Specification  
12  
65  
Products, packages, availability and ordering  
North American  
Partnumber  
Order code  
(12nc)  
Partnumber  
BYD37D  
marking/packing  
package device status buy online  
BYD37D T/R  
BYD37D /T3  
BYD37G T/R  
BYD37G /T3  
BYD37J T/R  
BYD37J /T3  
BYD37K T/R  
9338 122 80115 Standard Marking * Reel Pack, SMD SOD87 Full production  
Standard Marking * Reel Pack, SMD,  
9338 122 80135  
SOD87 Full production  
Large  
BYD37G  
BYD37J  
BYD37K  
BYD37M  
9338 122 90115 Standard Marking * Reel Pack, SMD SOD87 Full production  
Standard Marking * Reel Pack, SMD,  
Large  
9338 122 90135  
SOD87 Full production  
9338 123 00115 Standard Marking * Reel Pack, SMD SOD87 Full production  
Standard Marking * Reel Pack, SMD,  
Large  
9338 123 00135  
SOD87 Full production  
9338 123 10115 Standard Marking * Reel Pack, SMD SOD87 Full production  
-
Standard Marking * Reel Pack, SMD,  
Large  
9338 123 10135  
SOD87 Full production  
BYD37M T/R  
BYD37M /T3  
9338 123 20115 Standard Marking * Reel Pack, SMD SOD87 Full production  
Standard Marking * Reel Pack, SMD,  
Large  
9338 123 20135  
SOD87 Full production  
Find similar products:  
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NXP

933812340115

 DIODE 0.85 A, 100 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS, SMD, 2 PIN, Signal Diode
NXP

933812340135

 DIODE 0.85 A, 100 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS, SMD, 2 PIN, Signal Diode
NXP

933812360115

 DIODE 0.85 A, 200 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS, SMD, 2 PIN, Signal Diode
NXP

933812380135

 DIODE 0.8 A, 300 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS, LLDL, 2 PIN, Signal Diode
NXP

933812390135

 DIODE 0.8 A, 400 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS, SMD, 2 PIN, Signal Diode
NXP

933812560602

 IC F/FAST SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDIP16, 0.300 INCH, PLASTIC, SOT-38-4, DIP-16, Multiplexer/Demultiplexer
NXP

933812570602

 IC F/FAST SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16, 3.90 MM, PLASTIC, MS-012AC, SOT-109-1, SO-16, Multiplexer/Demultiplexer
NXP

933812580602

 IC F/FAST SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDIP16, 0.300 INCH, PLASTIC, SOT-38-4, DIP-16, Multiplexer/Demultiplexer
NXP

933812590602

 IC F/FAST SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, 3.90 MM, PLASTIC, MS-012AC, SOT-109-1, SO-16, Multiplexer/Demultiplexer
NXP

933812590623

 IC F/FAST SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, 3.90 MM, PLASTIC, MS-012AC, SOT-109-1, SO-16, Multiplexer/Demultiplexer
NXP
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